CN101661134B - 光电复合柔性布线板及其制造方法 - Google Patents

光电复合柔性布线板及其制造方法 Download PDF

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Publication number
CN101661134B
CN101661134B CN 200910151605 CN200910151605A CN101661134B CN 101661134 B CN101661134 B CN 101661134B CN 200910151605 CN200910151605 CN 200910151605 CN 200910151605 A CN200910151605 A CN 200910151605A CN 101661134 B CN101661134 B CN 101661134B
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China
Prior art keywords
optical waveguide
packaging material
pattern
basement membrane
wiring board
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Expired - Fee Related
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CN 200910151605
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Chinese (zh)
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CN101661134A (zh
Inventor
赤间史朗
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Nippon Mektron KK
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Nippon Mektron KK
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CN 200910151605 2008-08-26 2009-06-22 光电复合柔性布线板及其制造方法 Expired - Fee Related CN101661134B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-217118 2008-08-26
JP2008217118 2008-08-26
JP2008217118A JP5160346B2 (ja) 2008-08-26 2008-08-26 光電複合フレキシブル配線板およびその製造方法

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CN101661134A CN101661134A (zh) 2010-03-03
CN101661134B true CN101661134B (zh) 2012-12-26

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CN 200910151605 Expired - Fee Related CN101661134B (zh) 2008-08-26 2009-06-22 光电复合柔性布线板及其制造方法

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CN (1) CN101661134B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101118905B1 (ko) 2009-07-23 2012-03-07 삼성전기주식회사 광도파로용 인쇄회로기판 및 그 제조방법
JP5754130B2 (ja) * 2010-12-22 2015-07-29 日立化成株式会社 光電気複合基板及びその製造方法
WO2012093462A1 (ja) * 2011-01-07 2012-07-12 パナソニック株式会社 光電気複合フレキシブル配線板
JP5870489B2 (ja) * 2011-01-24 2016-03-01 日立化成株式会社 光導波路、光電気複合基板、光導波路の製造方法、及び光電気複合基板の製造方法
JP6098917B2 (ja) * 2011-12-28 2017-03-22 パナソニックＩｐマネジメント株式会社 光電気複合フレキシブル配線板
JP5964143B2 (ja) 2012-05-31 2016-08-03 日本メクトロン株式会社 光電気混載フレキシブルプリント配線板の製造方法
WO2024162008A1 (ja) * 2023-01-30 2024-08-08 京セラ株式会社 光電気配線基板および光電気配線基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2578846Y (zh) * 2002-09-26 2003-10-08 上海讯桥通信技术有限公司 一种2芯配线模块
CN101093263A (zh) * 2006-06-19 2007-12-26 富士施乐株式会社 光波导及其制造方法以及光通信模块
CN101206288A (zh) * 2006-12-22 2008-06-25 富士施乐株式会社 光电复合布线模块及信息处理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146684A (ja) * 1990-10-08 1992-05-20 Matsushita Electric Ind Co Ltd 回路基板およびその作製方法
JP2002228876A (ja) * 2001-02-07 2002-08-14 Japan Aviation Electronics Industry Ltd 光導波路ケーブル及びその接続方法
US7130511B2 (en) * 2004-03-30 2006-10-31 Motorola, Inc. Flexible active signal cable
JP2007033688A (ja) * 2005-07-25 2007-02-08 Fuji Xerox Co Ltd 光導波路フィルム、及び光送受信モジュール
JP4735435B2 (ja) * 2006-03-08 2011-07-27 日立化成工業株式会社 光・電気複合配線への光素子の接続方法
JP2007293239A (ja) * 2006-03-31 2007-11-08 Hitachi Chem Co Ltd 光モジュール
JP2009080451A (ja) * 2007-09-05 2009-04-16 Toshiba Corp フレキシブル光電気配線及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2578846Y (zh) * 2002-09-26 2003-10-08 上海讯桥通信技术有限公司 一种2芯配线模块
CN101093263A (zh) * 2006-06-19 2007-12-26 富士施乐株式会社 光波导及其制造方法以及光通信模块
CN101206288A (zh) * 2006-12-22 2008-06-25 富士施乐株式会社 光电复合布线模块及信息处理装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2004-215494A 2004.07.29

Also Published As

Publication number Publication date
JP5160346B2 (ja) 2013-03-13
CN101661134A (zh) 2010-03-03
JP2010054617A (ja) 2010-03-11

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