CN101649164B - 化学机械抛光组合物及其相关方法 - Google Patents

化学机械抛光组合物及其相关方法 Download PDF

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Publication number
CN101649164B
CN101649164B CN2009101611783A CN200910161178A CN101649164B CN 101649164 B CN101649164 B CN 101649164B CN 2009101611783 A CN2009101611783 A CN 2009101611783A CN 200910161178 A CN200910161178 A CN 200910161178A CN 101649164 B CN101649164 B CN 101649164B
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CN
China
Prior art keywords
weight
mechanical polishing
chemical mechanical
polishing composition
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101611783A
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English (en)
Chinese (zh)
Other versions
CN101649164A (zh
Inventor
T·高希
T·M·托马斯
王红雨
S·A·伊比特森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
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Filing date
Publication date
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Publication of CN101649164A publication Critical patent/CN101649164A/zh
Application granted granted Critical
Publication of CN101649164B publication Critical patent/CN101649164B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN2009101611783A 2008-08-04 2009-08-03 化学机械抛光组合物及其相关方法 Expired - Fee Related CN101649164B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/185,600 US8540893B2 (en) 2008-08-04 2008-08-04 Chemical mechanical polishing composition and methods relating thereto
US12/185,600 2008-08-04

Publications (2)

Publication Number Publication Date
CN101649164A CN101649164A (zh) 2010-02-17
CN101649164B true CN101649164B (zh) 2013-02-13

Family

ID=41226060

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101611783A Expired - Fee Related CN101649164B (zh) 2008-08-04 2009-08-03 化学机械抛光组合物及其相关方法

Country Status (6)

Country Link
US (2) US8540893B2 (enExample)
EP (1) EP2151482A1 (enExample)
JP (1) JP5543148B2 (enExample)
KR (1) KR101044304B1 (enExample)
CN (1) CN101649164B (enExample)
TW (1) TWI458817B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101974297A (zh) * 2010-11-12 2011-02-16 大连三达奥克化学股份有限公司 核/壳型复合纳米磨料铜化学机械抛光液
US8440097B2 (en) 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
US8435896B2 (en) 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
WO2014045937A1 (ja) * 2012-09-18 2014-03-27 株式会社フジミインコーポレーテッド 研磨用組成物
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
US20150104940A1 (en) * 2013-10-11 2015-04-16 Air Products And Chemicals Inc. Barrier chemical mechanical planarization composition and method thereof
CN105097425A (zh) * 2014-04-18 2015-11-25 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨的方法
US9834704B2 (en) 2014-10-21 2017-12-05 Cabot Microelectronics Corporation Cobalt dishing control agents
EP3209815B1 (en) 2014-10-21 2021-12-29 CMC Materials, Inc. Corrosion inhibitors and related compositions and methods
US9944828B2 (en) 2014-10-21 2018-04-17 Cabot Microelectronics Corporation Slurry for chemical mechanical polishing of cobalt
KR102538575B1 (ko) * 2014-10-21 2023-06-01 씨엠씨 머티리얼즈 엘엘씨 코발트 연마 가속화제
KR101943702B1 (ko) * 2016-05-12 2019-01-29 삼성에스디아이 주식회사 구리 연마용 cmp 슬러리 조성물 및 이를 이용한 연마 방법
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
US12297375B2 (en) * 2020-05-28 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Slurry composition and method for polishing and integrated circuit
WO2026088791A1 (ja) * 2024-10-25 2026-04-30 大塚化学株式会社 無機粒子を含有する水性組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715311A (zh) * 2004-07-01 2006-01-04 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及有关的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1102821A4 (en) 1998-06-10 2004-05-19 Rodel Inc COMPOSITION AND METHOD FOR CMP POLISHING METAL
US6443812B1 (en) 1999-08-24 2002-09-03 Rodel Holdings Inc. Compositions for insulator and metal CMP and methods relating thereto
EP1385915A1 (en) 2001-04-12 2004-02-04 Rodel Holdings, Inc. Polishing composition having a surfactant
US6632259B2 (en) * 2001-05-18 2003-10-14 Rodel Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US6615717B1 (en) * 2001-06-18 2003-09-09 Xerox Corporation Symmetrical parallel duplex paper path device
US20030119692A1 (en) 2001-12-07 2003-06-26 So Joseph K. Copper polishing cleaning solution
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
TW200521217A (en) 2003-11-14 2005-07-01 Showa Denko Kk Polishing composition and polishing method
TWI288046B (en) 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
WO2005049674A1 (de) 2003-11-20 2005-06-02 Basf Aktiengesellschaft Wasserlösliche copolymere von monoethylenisch ungesättigten polyalkylenoxidmonomeren und mindestens ein stickstoffatom enthaltenden dipolaren monomeren
US20050136671A1 (en) * 2003-12-22 2005-06-23 Goldberg Wendy B. Compositions and methods for low downforce pressure polishing of copper
US7384871B2 (en) * 2004-07-01 2008-06-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US7435356B2 (en) 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto
US7086935B2 (en) 2004-11-24 2006-08-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cellulose-containing polishing compositions and methods relating thereto
US7842192B2 (en) * 2006-02-08 2010-11-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-component barrier polishing solution
TWI402335B (zh) * 2006-09-08 2013-07-21 Kao Corp 研磨液組合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715311A (zh) * 2004-07-01 2006-01-04 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及有关的方法

Also Published As

Publication number Publication date
US20100029079A1 (en) 2010-02-04
JP5543148B2 (ja) 2014-07-09
TW201006916A (en) 2010-02-16
JP2010045351A (ja) 2010-02-25
US20130217230A1 (en) 2013-08-22
CN101649164A (zh) 2010-02-17
KR20100015289A (ko) 2010-02-12
US8540893B2 (en) 2013-09-24
US8563436B2 (en) 2013-10-22
KR101044304B1 (ko) 2011-06-29
TWI458817B (zh) 2014-11-01
EP2151482A1 (en) 2010-02-10

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB03 Change of inventor or designer information

Inventor after: Laganella David

Inventor after: Thomas Terence M.

Inventor after: Wang Hongyu

Inventor after: Ibbitson Scott A.

Inventor before: Laganella David

Inventor before: Thomas Terence M.

Inventor before: Wang Hongyu

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: GHOSH TIRTHANKAR THOMAS TERENCE M. WANG HONGYU TO: GHOSH TIRTHANKAR THOMAS TERENCE M. WANG HONGYU IBBITSON SCOTT A.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130213

Termination date: 20160803

CF01 Termination of patent right due to non-payment of annual fee