CN101635258A - 一种防止新鲜高温氧化表面光致抗蚀剂翘曲的方法 - Google Patents
一种防止新鲜高温氧化表面光致抗蚀剂翘曲的方法 Download PDFInfo
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- CN101635258A CN101635258A CN200910052796A CN200910052796A CN101635258A CN 101635258 A CN101635258 A CN 101635258A CN 200910052796 A CN200910052796 A CN 200910052796A CN 200910052796 A CN200910052796 A CN 200910052796A CN 101635258 A CN101635258 A CN 101635258A
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101964307A (zh) * | 2010-07-30 | 2011-02-02 | 上海宏力半导体制造有限公司 | 刻蚀图形的形成方法 |
CN102194652A (zh) * | 2010-03-11 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | 防止晶圆翘曲的方法以及由该方法得到的晶圆 |
CN103915340A (zh) * | 2013-01-07 | 2014-07-09 | 北大方正集团有限公司 | 一种功率器件分压环的制作方法 |
CN104835721A (zh) * | 2015-03-31 | 2015-08-12 | 上海华力微电子有限公司 | 改善ArF光阻在硅片表面上的黏附性的方法 |
CN109062010A (zh) * | 2018-09-12 | 2018-12-21 | 上海华力集成电路制造有限公司 | 改善光刻胶表面粗糙度的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0792195A4 (en) * | 1994-11-22 | 1999-05-26 | Complex Fluid Systems Inc | NON-AMINIC PHOTOSENSITIVE RESIN ADHESION PROMOTERS FOR MICROELECTRONIC APPLICATIONS |
US6251804B1 (en) * | 2000-05-22 | 2001-06-26 | United Microelectronics Corp. | Method for enhancing adhesion of photo-resist to silicon nitride surfaces |
KR100415091B1 (ko) * | 2002-03-26 | 2004-01-13 | 주식회사 하이닉스반도체 | 미세패턴 형성 방법 |
KR100633994B1 (ko) * | 2005-07-26 | 2006-10-13 | 동부일렉트로닉스 주식회사 | 반도체 소자의 웰 포토레지스트 패턴 및 그 형성 방법 |
KR100840498B1 (ko) * | 2007-05-29 | 2008-06-23 | 주식회사 동부하이텍 | 반도체소자의 패턴 붕괴 방지 방법 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194652A (zh) * | 2010-03-11 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | 防止晶圆翘曲的方法以及由该方法得到的晶圆 |
CN102194652B (zh) * | 2010-03-11 | 2013-04-10 | 中芯国际集成电路制造(上海)有限公司 | 防止晶圆翘曲的方法以及由该方法得到的晶圆 |
CN101964307A (zh) * | 2010-07-30 | 2011-02-02 | 上海宏力半导体制造有限公司 | 刻蚀图形的形成方法 |
CN103915340A (zh) * | 2013-01-07 | 2014-07-09 | 北大方正集团有限公司 | 一种功率器件分压环的制作方法 |
CN103915340B (zh) * | 2013-01-07 | 2016-12-28 | 北大方正集团有限公司 | 一种功率器件分压环的制作方法 |
CN104835721A (zh) * | 2015-03-31 | 2015-08-12 | 上海华力微电子有限公司 | 改善ArF光阻在硅片表面上的黏附性的方法 |
CN109062010A (zh) * | 2018-09-12 | 2018-12-21 | 上海华力集成电路制造有限公司 | 改善光刻胶表面粗糙度的方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140520 |
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Effective date of registration: 20140520 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Zhangjiang hi tech Park No. 818 Patentee before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |