CN101629059A - Adhesive composition, adhesive sheet and slicing chip attachment film - Google Patents
Adhesive composition, adhesive sheet and slicing chip attachment film Download PDFInfo
- Publication number
- CN101629059A CN101629059A CN200910166960A CN200910166960A CN101629059A CN 101629059 A CN101629059 A CN 101629059A CN 200910166960 A CN200910166960 A CN 200910166960A CN 200910166960 A CN200910166960 A CN 200910166960A CN 101629059 A CN101629059 A CN 101629059A
- Authority
- CN
- China
- Prior art keywords
- component
- binder composition
- film
- layer
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Abstract
The invention relates to an adhesive composition, an adhesive sheet and a slicing chip attachment film. The adhesive composition comprises (A) (meth)acrylate with the weight-average molecular weight of 50000-1500000 and having functional groups which represent reactivity to the following components (B) and (C); (B) epoxy resin with the weight-average molecular weight not greater than 5000; and (C) aromatic polyamine compounds. The adhesive composition not only has excellent adhesion, but also excellent embedding property and heat resistant property. The adhesive composition can be used as adhesive composition layer for adhering sheet or slicing chip attachment film.
Description
Technical field
The present invention relates to binder composition, it contains (methyl) acrylic resin and Resins, epoxy, and when joining to semi-conductor chip on the substrate, said composition can reduce the generation in space.The invention still further relates to the adhesive sheet and the slicing chip attachment film that use this binder composition.
Background technology
Semiconductor device is by following steps production: (i) the major diameter silicon wafer that will form the IC circuit thereon by section (cutting) is divided into the semi-conductor chip of reduced size; (ii) use curable liquid tackiness agent etc. by hot pressing is bonding small pieces to be joined on the lead frame, solidify this tackiness agent then, and chip is fixed (installation) to lead frame as the small pieces grafting material; (iii) counter electrode carries out wire-bonded (wired bonding); (iv) device is encapsulated with the raising operability, and protector avoids the influence of outside atmosphere.Adopting the transfer molding of resin is the most widely used packaging process, because cheap and be highly suitable for mass production.
In the last few years, caused need more highdensity encapsulation and the further microminiaturization that is used for fixing the carrier substrate (substrate material) of semi-conductor chip in the raising of performance of semiconductor devices.Background is opposite therewith, if use liquid adhesive as the small pieces grafting material, then in the process of fixed chip, tackiness agent may ooze out outside the semi-conductor chip edge, and contaminated electrode, perhaps the heterogeneity of binder layer thickness can cause chip to tilt, thereby causes the wire-bonded problem.In order to overcome the above problems the preferred adhesive film.
On the other hand, if use binder film to be used for the semi-conductor chip thermocompression bonded is connected to because of existing semiconductor element to wait the substrate with uneven surface as lead-in wire as small pieces grafting material (being the small pieces junction films), if any indenture of small pieces junction film on can not the completely filled substrate surface then, then unfilled part will stay as the space.Then, these holes can expand in the process of reflow ovens internal heating, cause the fracture of binder layer, cause the deterioration of semiconductor device reliability.In addition, in order to guarantee the consistency of itself and present lead-free solder, now need be under higher temperature the anti-backflow of (265 ℃), this has further improved the importance that prevents that hole from producing.In the following description, material is filled any indenture of substrate surface and the ability that do not stay any residual porosity is known as " embeddability properties ".
A possible method that is asked a question above solving can comprise uses the small pieces junction film with low melt viscosity that the semi-conductor chip thermocompression bonded is connected on the substrate, so that the small pieces junction film of fusing can flow in any indenture that exists on the substrate surface, thereby prevents to form any hole.Yet, prevent that fully hole from forming still very difficulty, but need the bonding and high pressure of long hot pressing that this has disadvantageous effect to productivity.In addition, this small pieces junction film may be significantly outstanding from the semi-conductor chip edge, causes the pollution of electrode.
The another kind of possible method of problem is the moulding that enforcement utilizes potting resin under high-temperature and high-pressure conditions above solving, and this means in the resin package step, and any hole all is heated, compression and volume reduce.Subsequently can be by absorbing again in the small pieces junction film or by implementing being heating and curing of small pieces junction film, and remove the hole that these volumes reduce.This method does not need special steps, thereby from the production angle, attractive.
Yet, the conventional tackiness agent of having developed that is used for above-mentioned small pieces joint technology is a low modulus of elasticity materials, it comprises acrylic resin with excellent adhesion and Resins, epoxy, as the resol and the catalyzer (for example, referring to patent documentation 1～3) of acrylic resin and epoxy curing agent.Yet, although these tackiness agents have excellent adhesive capacity, but owing to use the bonding film experience fast setting reaction of these tackiness agents, therefore, if these films are applied in the above-mentioned method of removing hole in the resin package step, then the heating of being implemented in the wire-bonding step process before the resin package step then can cause increasing substantially of film melt viscosity, and this makes and be difficult to remove hole in the resin package step.In other words, because the raising of melt viscosity, volume of voids can not be reduced satisfactorily, and hole can not be absorbed in the resin again.Therefore, adopt conventional tackiness agent to be difficult to fill satisfactorily the indenture of substrate surface, and need the further improvement of embeddability properties.
[patent documentation 1] JP10-163391A
[patent documentation 2] JP11-12545A
[patent documentation 3] JP2000-154361A
Summary of the invention
The object of the invention provides binder composition, it not only shows excellent bounding force, and have excellent embedding performance and thermotolerance, in addition, provide the adhesive sheet and the slicing chip attachment film (dicing die attach film) that use this binder composition.
As result to the various researchs of the binder composition that contains acrylic resin and Resins, epoxy, the present inventor finds that following described binder composition can keep the outstanding adhesive capacity of conventional binder composition, also provides excellent thermotolerance and favourable embeddability properties simultaneously.
In other words, a first aspect of the present invention provides binder composition, and it comprises:
(A) (methyl) acroleic acid resin, its weight-average molecular weight be 50,000～1, in 500,000 scopes, and contain with respect to following component (B) and component (C) one or the two show reactive functional group,
(B) Resins, epoxy, its weight-average molecular weight be no more than 5,000 and
(C) aromatic polyamine compound.
A second aspect of the present invention provides adhesive sheet, its comprise substrate material and place this substrate material top by above-mentioned binder composition form the layer.Even the layer that this binder composition forms is removed it from substrate material after, still can at room temperature keep film class state, and meet so-called bonding film.
A third aspect of the present invention provides slicing chip attachment film, its comprise section film that has substrate material and place the pressure-sensitive sense mixture layer on this substrate material and the pressure sensitive adhesive layer top that places this section film that forms by above-mentioned binder composition layer.
In binder composition of the present invention, suppressed to this means that by any raising of implementing the caused melt viscosity of heating in the wire-bonding step said composition has kept being enough to remove satisfactorily the melt viscosity of hole in the resin package step process.Thus, hole can be by easily, remove satisfactorily, this means that this binder composition has outstanding embeddability properties.In addition, after being heating and curing, this binder composition has formed tackiness agent cured product layer, and this cured product layer not only all shows excellent bonding strength for the substrate material of form of ownership, and has lower Young's modulus and excellent thermotolerance.Therefore, this binder composition is very useful when the semiconductor device of preparation high reliability.
Description of drawings
Fig. 1 is presented at the localized figure of silicon in the embeddability properties test.
Embodiment
The description more detailed to the present invention is provided below.In this article, term " weight-average molecular weight " is represented with reference to polystyrene standard, by the molecular weight of gel permeation chromatography (GPC) mensuration.
Binder composition of the present invention comprises above-mentioned component (A)～(C), can at room temperature keep its shape, this means that it can form film, and the plastics plastic state that employing can keep for a long time after heating this means that said composition also shows the excellent embedding performance.For the substrate material of form of ownership, the cured product of said composition shows excellent bounding force, but also has low elastic modulus and excellent thermotolerance.
[(A) (methyl) acrylic resin]
Component (A) is (methyl) acroleic acid resin, and its weight-average molecular weight is 50,000～1, in 500,000 scopes, and contain with respect to following component (B) and component (C) one or the two show reactive functional group.In this article, term " (methyl) acrylic resin " refers to the polymkeric substance that comprises derived from the monomeric unit of (methyl) Acrylic Acid Monomer, and wherein said (methyl) Acrylic Acid Monomer is formed by vinylformic acid, acrylic acid derivative, methacrylic acid and/or methacrylic acid derivative.Component (A) can use single resin maybe can adopt the combination of two or more different resins.In the situation of using two or more different resins combinations, component (A) can also be the combination that contains (methyl) acrylic resin of above-mentioned functional group and do not contain (methyl) acrylic resin of these functional groups.
The example of component (A) comprises the homopolymer or the multipolymer of above-mentioned (methyl) Acrylic Acid Monomer type, and (methyl) Acrylic Acid Monomer and other monomeric multipolymers, and the weight-average molecular weight of this component (A) is 50,000 to 1,500, in 000 scope, and contain with respect to following component (B) and (C) one or the two show reactive functional group.For the situation of (methyl) acrylic resin and other monomer copolymers, with respect to all monomeric units that constitute component (A), derived from other monomeric monomeric unit amount preferably in 0～50 mole of % scope, more preferably 0～30 mole of %.In (methyl) Acrylic Acid Monomer and other monomeric multipolymers, every kind of monomer can be the simplification compound, also can be two or more different combination of compounds.
The example of aforesaid propylene acid derivative comprises alkyl acrylate, as methyl acrylate, ethyl propenoate, butyl acrylate, isobutyl acrylate, 2-EHA and vinylformic acid dodecane ester; Hydroxyalkyl acrylate is as Hydroxyethyl acrylate and Propylene glycol monoacrylate; The acrylate that contains aromatic hydrocarbyl is as benzyl acrylate; Acrylamide is as DMAA; The acrylate that contains imide group is as imide acrylate TO-1492 (ProductName is made by Toagosei company limited); The acrylate that contains epoxide group is as glycidyl acrylate; And vinyl cyanide.
The example of above-mentioned methacrylic acid derivative comprises alkyl methacrylate, as methyl methacrylate, Jia Jibingxisuanyizhi, butyl methacrylate, Propenoic acid, 2-methyl, isobutyl ester, methacrylic acid 2-ethylhexyl and methacrylic acid dodecane ester; Hydroxyalkyl methacrylate is as hydroxyethyl methylacrylate and Rocryl 410; The methacrylic ester that contains aromatic hydrocarbyl is as benzyl methacrylate; Methacrylamide is as dimethylmethacryl amide; The methacrylic ester that contains imide group is as the imide methacrylic ester; And contain the methacrylic ester of epoxide group, as glycidyl methacrylate.
Above-mentioned other monomeric examples comprise vinylbenzene, divinyl and allyl deriv (as vinyl carbinol and allyl acetate).
In the preferred embodiment of the present invention, component (A) is for comprising unitary multipolymer shown in the following formula.
This multipolymer can prepare as monomer by using vinyl cyanide.In the case, with respect to whole monomeric total amounts, the amount of vinyl cyanide preferably in 1～50 mole of % scope, more preferably 3～40 moles of %, further preferred 5～30 moles of %.
For the adhesive capacity of acquisition tackiness agent cured product layer, the functional group in the component (A) preferably includes epoxy group(ing), carboxyl or its combination.Functional group in the component (A) can be for example by when synthetic this component (A), use the monomer that comprises described functional group to be used as the monomer of raw material and introduce as at least a portion.The examples of monomers that contains functional group comprises vinylformic acid, methacrylic acid, contain the acrylic acid derivative (as glycidyl acrylate) of epoxide group and contain the methacrylic acid derivative (as glycidyl methacrylate) of epoxide group.These monomeric any one all can use separately, also can use the combination of two or more different monomers.
Every 100g component (A), in the component (A) amount of functional group preferably in 0.002～0.1 molar range, more preferably 0.005～0.05 mole.As long as this content in 0.002 to 0.1 molar range, then obtains the tackiness agent cured product layer that has the composition of gratifying embeddability properties and have gratifying bonding strength easily.
The weight average molecular weight range of component (A) is typically 50,000～1, in 500,000 scopes, and preferred 100,000～1,000,000.If molecular weight is lower than 50,000, then the intensity of adhesive capacity and the tackiness agent cured product layer that obtained is with deterioration.If molecular weight surpasses 1,500,000, then the viscosity of composition will become too high, and this causes the deterioration of processing property.
In addition, measure by thermo-mechanical analysis (TMA), the second-order transition temperature (Tg) of (methyl) acrylic resin of component (A) is preferably-40 ℃ to 100 ℃, more preferably-10 ℃ to 70 ℃.
[(B) Resins, epoxy]
Component (B) is that weight-average molecular weight is no more than 5,000, preferred 150～3,000 Resins, epoxy.Preferably, this Resins, epoxy contains at least two epoxide groups in each molecule.If molecular weight surpasses 5,000, then component (B) in component (A) solubleness and dispersing property one of or both tend to deficiency, it is big that these two kinds of isolating probabilities of component also just become.Component (B) can adopt single resin, also can adopt the combination of two or more different resins.
In addition, binder composition of the present invention is being used under the situation of adhesive sheet, especially treating under the thin situation of bonding silicon wafer, component (B) preferably at room temperature is in a liquid state, perhaps have by what the ring and ball method described in the JIS K 7234 was measured and be no more than 100 ℃ softening temperature, this produced can be under lesser temps and lower pressure the adhesive sheet of compacted bonding (compression bonded), this means to prevent fracture and distortion.
The example of component (B) comprises two (4-hydroxyphenyl) methane and 2, the polycondensation product (as so-called bisphenol F epoxy resin and bisphenol A epoxide resin) of the diglycidylether of 2 '-two (4-hydroxyphenyl) propane or its halides and this class diglycidylether; Divinyl diepoxide and vinyl cyclohexene dioxide; Diglycidylether, as 1,2-dihydroxy-benzene diglycidylether, resorcinol diglycidyl ether, 1, two (2, the 3-glycidoxy) benzene, 4 of 4-, 4 '-two (2, the 3-glycidoxy) diphenyl ether and 1, two (2, the 3-glycidoxy) tetrahydrobenzene of 4-; Two (3,4-epoxy-6-methyl cyclohexane ylmethyl) adipic acid ester; The many glycidyl esters class that obtains by polyphenol or polyvalent alcohol and Epicholorohydrin condensation reaction; By the epoxy-Novolak resin (that is, phenolic resin varnish type epoxy resin such as phenol phenolic resin varnish and cresols phenolic resin varnish) that phenolic varnish resol (as phenol phenolic varnish or cresols phenolic varnish or halogenation phenolic varnish resol) and Epicholorohydrin condensation are obtained; By adopting the peroxidation method to carry out epoxidised epoxy polyolefine or epoxy polyhutadiene; Naphthalene-ring containing Resins, epoxy, xenyl Resins, epoxy; Phenol aralkyl Resins, epoxy; Xenyl aralkyl Resins, epoxy; With cyclopentadiene Resins, epoxy.
For component (B), mono-epoxy compounds also can with aforesaid per molecule in contain at least two epoxide groups Resins, epoxy be used in combination.The example of this mono-epoxy compounds comprises Styrene oxide 98min., cyclohexene oxide, propylene oxide, methyl glycidyl ether, ethyl ether, phenyl glycidyl ether, glycidyl allyl ether, octylene oxide and oxidation dodecylene.
In various feasible programs, component (B) is bisphenol F epoxy resin, bisphenol A epoxide resin, resorcinol type epoxy or its combination preferably.
Per 100 mass parts components (A), the combined amount of component (B) preferably in 5～300 mass parts scopes, more preferably 10～200 mass parts.As long as combined amount is in 5～300 mass parts scopes, then can obtain to have the composition of satisfactory embeddability properties easily, show excellent bonding strength and gratifying flexibility with the tackiness agent cured product layer that forms by said composition, and suppressed any raising of Young's modulus simultaneously.
[(C) aromatic polyamine compound]
The aromatic polyamine compound of component (C) is for containing aromatic nucleus, and has the compound of at least two amino that directly link to each other with aromatic nucleus.The function of this aromatic polyamine compound performance curing agent for epoxy resin and catalyzer.This aromatic polyamine compound has fusing point, and owing to be solid-state under the heating condition that this compound is adopted in wire-bonding step, the curing reaction that therefore comprises this aromatic polyamine compound compositions only slowly carries out.Therefore, use said composition, the viscosity that causes that can effectively suppress to be heating and curing increases.Having the aromatic polyamine compound that surpasses typically as the fusing point of 170 ℃ of Heating temperatures in the wire-bonding step is special expectation.The cured product that obtains by the composition that contains aromatic polyamine compound component (C) is heating and curing shows excellent thermotolerance.Therefore, compare with conventional composition, the present invention contains component (C) aromatic polyamine compound compositions and shows outstanding embeddability properties, and can show outstanding thermotolerance after curing.Component (C) can be used single compound, also can use the different combination of compounds of two or more.
Aromatic nucleus in the component (C) can be the aromatic hydrocarbon ring, also can be aromatic heterocycle.The example of aromatic hydrocarbon ring comprises phenyl ring, naphthalene nucleus or anthracene nucleus.The example of aromatic heterocycle comprises pyridine ring, quinoline ring or isoquinoline 99.9 ring.
Component (C) aromatic polyamine compound is not particularly limited,,, preferably contains the aromatic polyamine compound of alkylsulfonyl although consider from the stable on heating angle of resultant cured product as long as it can possess the function of epoxy curing agent and catalyzer.
Between the object lesson of component (C) comprises-phenylenediamine, p-phenylenediamine, 1, the 2-diaminobenzene, 4,4 '-diaminodiphenyl-methane, 2, two (4-aminophenyl) propane of 2-, two (4-(4-amino-benzene oxygen) phenyl) sulfone, two (4-(3-amino-benzene oxygen) phenyl) sulfone, 4,4 '-diamino-diphenyl propane, 4,4 '-diamino-diphenyl sulfide, 4,4 '-diamino diphenyl sulfone, 3,3 '-diamino diphenyl sulfone, 3,4 '-diamino-diphenyl ether, 4,4 '-diamino-diphenyl ether, 4,4 '-two (4-amino-benzene oxygen) biphenyl, 2, the 6-diamino-pyridine, two (3-aminophenyl) diethylsilane, 4,4 '-diamino-diphenyl diethylsilane, p-diaminodiphenyl, 3,3 '-dichloro-p-diaminodiphenyl, 3,3 '-dimethoxy benzidine, 4,4 '-diaminobenzophenone, N, two (4-the aminophenyl)-n-Butyl Amine 99s of N-, N, two (4-aminophenyl) methylamines of N-, 1, the 5-diaminonaphthalene, 3,3 '-dimethyl-4,4 '-benzidine, 4-aminophenyl-3-Aminobenzoate, N, two (4-aminophenyl) aniline of N-, two (right-beta-amino-the trimethylphenylmethane base) ether, right-two (the amino amyl group of 2-methyl-4-) benzene, right-two (1, the amino amyl group of 1-dimethyl-5-) benzene, 1, two (4-amino-benzene oxygen) benzene of 3-, m-xylylenediamine, right-benzene dimethylamine, 4,4 '-diamino-diphenyl ether phosphine oxide, 4,4 '-diamino-diphenyl N-methylamine and 4,4 '-diamino-diphenyl N-phenyl amine.In above material, consider that from gained cured product thermotolerance angle the aromatic polyamine compound that preferably contains alkylsulfonyl is as 4,4 '-diamino diphenyl sulfone or 3,3 '-diamino diphenyl sulfone.These aromatic polyamine compounds are known epoxy curing agents, and can adopt the product of commercially available acquisition.
The combined amount of component of the present invention (C) preferably be enough to make in the component (C) amino with respect in the present composition all the mol ratio of epoxy group(ing) in the 0.6-1.4 scope, 0.8-1.2 more preferably.As long as component (C) joins in the present composition to guarantee the amount of above-mentioned mol ratio in the 0.6-1.4 scope, then can take place full cross-linked in the composition, this means that the gained cured product is easier to show favourable solidified nature, can make that simultaneously cured product bonding strength and anti-solder reflow are improved effectively.In addition, with the amount in the above-mentioned scope, the residual volume of component (C) unlikely remains in the solidifying product as unreacted material, has prevented waste like this, and improves resource utilization and economic effectiveness.
Except the Resins, epoxy of component (B), composition of the present invention can also comprise that containing epoxide group contains the component of epoxide group as the component (A) of functional group and/or other, therefore the epoxide group in statement " the whole epoxide groups in the present composition " the expression components (B), any summation that contains epoxy group(ing) as the epoxide group in any component that contains epoxy group(ing) of the epoxide group in the component (A) of functional group and other.Epoxide group in the component (B) and contain epoxy group(ing) as the mol ratio of whole epoxide groups in the summation of the epoxide group in any component (A) of functional group and the present composition preferably in 0.6～1 scope, more preferably 0.8～1.In addition, the epoxide group in the component (B) and the mol ratio of the whole epoxide groups of the present composition are preferred 0.6～1, more preferably 0.8-0.95.For except component (B) and any component (A) that contains epoxide group, the present composition does not comprise that other contain the situation of the component of epoxide group, the combined amount of component (C) preferably be enough to make amino in the component (C) and the epoxide group in the component (B) and any contain epoxy group(ing) as the mol ratio of the epoxide group summation in the component (A) of functional group in 0.6～1.4 scope, more preferably 0.8～1.2.In addition, for the present composition except component (B), do not comprise that other contain the situation of the component of epoxide group, the combined amount of component (C) preferably is enough to make the mol ratio of amino in the component (C) and the epoxide group in the component (B) in 0.6～1.4 scope, more preferably 0.8～1.2.
[other components]
Composition of the present invention except aforesaid component (A) to component (C), can also comprise other components, as long as these other components are not damaged the performance of binder composition of the present invention.The example of these other components comprises the catalyzer that is different from component (C), the solidifying agent that is different from component (C), filler, bonding agent, tinting material such as pigment and dyestuff, wetting enhancer (wetting improver), oxidation inhibitor and thermo-stabilizer.
[catalyzer that is different from component (C)]
Can adopt conventional catalyst as the catalyzer that is different from component (C), the example of these conventional catalysts comprises that phosphorus is catalyst based as triphenylphosphine and imidazolyl catalyzer such as 2-phenyl-4,5-hydroxymethyl-imidazole.The described catalyzer that is different from component (C) can be the combination of single catalyst or two or more different catalysts.
[solidifying agent that is different from component (C)]
The solidifying agent that is different from component (C) is not particularly limited, and various conventional solidifying agent all can use.These solidifying agent can use separately, also can two or more different solidifying agent be used in combination according to they curing performances separately.Various conventional solidifying agent all can use, object lesson comprises the amino-complex that is different from component (C), as diethylenetriamine, Triethylenetetramine (TETA), diethyl amino propylamine, N-aminoethyl piperazine, two (4-amino-3-methylcyclohexyl) methane, m-xylylenediamine, methane diamines (menthanediamine) and 3, two (the 3-aminopropyls)-2 of 9-, 4,8,10-four oxa-volutions (5,5) undecane (3,9-bis (3-aminopropyl)-2,4,8,10-tetraoxaspiro (5,5) undecane); The modified aliphatic polyamines is as Resins, epoxy diethylenetriamine affixture, amine ethylene oxide adduct and cyanoethyl polyamines; Per molecule contains the resol of at least two phenolic hydroxyl groups, comprise dihydroxyphenyl propane, trishydroxymethyl allyloxy phenol, low polymerization degree novolac resin, epoxidation or butylation resol and can the commercially available resol of following commodity: Super Beckacite 1001 (producing), Hitanol4010 (producing), Scado form by Hitachi company by Japanese Reichhold Chemicals company L.9 (produce) by Dutch Scado Zwoll, Methylon75108 (producing) by General Electric Apparatus Co.(U.S.A.); Can the commercially available carbon resin of following trade(brand)name: Beckamine P.138 (produce) by Japanese Reichhold Chemicals company, Melan (producing) and U-Van 10R (by the production of Tokyo Koatsu Kogyo company) by Hitachi company; Aminoresin such as melamine resin and aniline resin; Per molecule has the polysulfide resin of at least two sulfydryls, as the polysulfide resin of following chemical formulation: HS (C
2H
4OCH
2OC
2H
4SS)
LC
2H
4OCH
2OC
2H
4SH, wherein L represents 1～10 integer; With organic acid and acid anhydrides thereof, as Tetra hydro Phthalic anhydride, hexahydrophthalic anhydride, Tetra Hydro Phthalic Anhydride, pyromellitic dianhydride, methyl Na Dike acid (methyl nadic acid), dodecyl succinic anhydride and chlorendic anhydride.In these solidifying agent, preferred resol (especially novolac resin), this is because resol can be given the good processability of resultant composition (moldability), give the humidity resistance of resulting cured product excellence, and it is nontoxic and price is relatively cheap.
Be different from use under the situation of solidifying agent of component (C), per 100 mass parts component (B) Resins, epoxy, the employed amount of other solidifying agent is preferably in 0.1～50 mass parts scope.Consumption in this 0.1～50 mass parts scope gives resultant binder composition more favourable embeddability properties.
[filler]
Can add filler in the present composition.Have no particular limits for filler, can use conventional fillers.Can use single filler, also can add the combination of two or more different fillers.The component of per 100 mass parts (A)～(C), the combined amount of filler is preferably 0～900 mass parts, further preferred 0～500 mass parts.
The example of filler comprises mineral filler, as fine silica (fine silica powder), aluminum oxide, titanium oxide, carbon black and other electroconductive particles such as silver particles; Organic filler is as the siloxanes particulate.Wherein, preferred fine silica and siloxanes particulate.Below fine silica and siloxanes particulate are elaborated.
-fine silica
Fine silica can suitably improve the cambial melt viscosity of binder composition of the present invention, suppresses chip flowing in the resin package step process, reduces the water-intake rate and the coefficient of linear expansion of resulting tackiness agent cured product layer.Be not particularly limited for fine silica, can use conventional powder.Consider from the mobile angle of resultant composition, fine silica is preferably is carried out the surface-treated powder by silicoorganic compound, wherein said silicoorganic compound such as organic organoalkoxysilane, organic chlorosilane, organosilazanes or low-molecular-weight siloxane.This fine silica can be used the powder of single type, also can use the combination of two or more different powder.
The median size of fine silica preferably is no more than 10 μ m, more preferably 5 μ m or littler.As long as its median size is no more than 10 μ m, then can easily keep the surface smoothness of adhesive sheet of the present invention.In addition, the fine silica maximum particle diameter preferably is no more than 20 μ m.Among the present invention, " median size " refers to volume that corresponding cumulative distribution reaches 50% numerical value with reference to median size (volume referenced average particle), wherein adopts laser diffractometry by size distribution analysis-e/or determining median size.In addition, " maximum particle diameter " refers to the maximum value of particle diameter in the cumulative distribution measured when measuring above-mentioned median size.
The example of fine silica comprises enhancement type silicon-dioxide such as pyrogenic silica and precipitated silica, and crystalline silica such as quartz.Object lesson comprises the product of commercially available acquisition: Aerosil R972, R974 and R976 that Nippon Aerosil company produces, SE-2050, SC-2050, SE-1050, SO-E1, SO-C1, SO-E2, SO-C2, SO-E3, SO-C3, SO-E5 and SO-C5 that Admatechs company produces, and the Musil 120A and the Musil 130A of the production of Shin-Etsu Chemical company.
The combined amount of fine silica should be adjusted so that add filler total amount in the afore mentioned rules scope, but be preferably the 5-80 quality % of composition total mass, more preferably 10-60 quality %.As long as the combined amount of fine silica satisfies this 5～80 quality % scope, then can effectively reduce the water-intake rate and the linear expansivity of resultant tackiness agent cured product layer, and can easily suppress any raising of Young's modulus.
-siloxanes particulate
Can use the siloxanes particulate to reduce the Young's modulus and the water-intake rate of the tackiness agent cured product layer that obtains, especially when itself and aforementioned fine silica are united use.Be not particularly limited for the siloxanes particulate, can use conventional material.Example comprises silicon rubber particulate and silicone resin particulate.The siloxanes particulate can be the particle of single type, also can be two or more dissimilar particulate combinations.
The average particle size range of siloxanes particulate preferably in 0.1～10 mu m range, more preferably 0.5～5 μ m.As long as its median size in 0.1～10 mu m range, then can easily keep the surface smoothness of adhesive sheet of the present invention.In addition, the maximum particle diameter of siloxanes particulate preferably is no more than 20 μ m, more preferably 10 μ m or littler.
The siloxanes particulate is the composite silicone rubber particulate preferably.The composite silicone rubber particulate refers to the particle that the silicon rubber microparticle surfaces is covered by very tiny poly organic silicon sesquioxyalkane resin (polyorganosilsesquioxaneresin) particle to small part, and wherein said poly organic silicon sesquioxyalkane resin particle is formed on its surface by polyreaction.Can adopt the method for for example in JP07-196815A, describing to prepare this class composite silicone rubber particulate.Promptly, in median size is to add alkaline matter or alkaline moisture solution and organotrialkoxysilane in the silicon rubber microsphere particle aqueous dispersion of 0.1～10 μ m, organotrialkoxysilane is hydrolyzed, and in spherical silicon rubber microparticle surfaces generation polymerization, subsequently product is carried out drying, this has produced the particulate of composite silicone rubber.Per 100 mass parts silicon rubber microballoons, the amount of poly organic silicon sesquioxyalkane resin preferably in 1～500 mass parts scope, more preferably 2～100 mass parts.As long as the consumption of poly organic silicon sesquioxyalkane resin satisfies 1～500 mass parts, then the composite silicone rubber particulate just shows favourable dispersing property in the acquisition binder composition, and obtains to form the adhesive sheet of homogeneous easily.The raising of Young's modulus that in addition, can the resultant cured product layer of easier inhibition.
Can comprise KMP-600, KMP-605 and the X-52-7030 that Shin-Etsu Chemical company produces as the object lesson of composite silicone rubber microparticle material.
The combined amount of siloxanes particulate should be adjusted so that add filler total amount in the afore mentioned rules scope, but be preferably 5～30 quality % of composition total mass, more preferably 10～20 quality %.As long as the combined amount of siloxanes particulate satisfies this 5～30 quality % scope, then can effectively reduce the Young's modulus and the water-intake rate of resultant tackiness agent cured product layer, can suppress any raising or the strength degradation of linear expansivity simultaneously easily.
＜tackiness agent auxiliary agent 〉
In order to improve adhesive capacity, can add the tackiness agent auxiliary agent in the present composition.This tackiness agent auxiliary agent can be single material, also can be two or more combinations of different materials.The example of spendable tackiness agent auxiliary agent comprises and contains silicone couplet (silane coupling agent).The commercial product example of buying as bonding agent comprises KBM-403, KBM-402, KBM-803, KBM-802, KBM-903, KBM-902, KBM-503, KBM-5103 and the X-12-414 of Shin-Etsu Chemical company production or the partial hydrolysis condensation product of above material.
[preparation of compositions]
Can aforementioned component (A)～(C) and other any optional components of selecting at room temperature be mixed by adopting conventional mixing device, prepare binder composition of the present invention.
[application of composition]
Binder composition of the present invention can be used for for example bonding two adherends.Have no particular limits for these adherends, although the example of an adherend comprises silicon, glass or pottery etc., the example of other adherend comprises resin substrate such as BT substrate, the lead frame (lead frame) substrate or the silicon substrate that are formed by gold and silver, copper or nickel etc.
Such as, can be as following with as described in two adherends bond together: binder composition of the present invention is dissolved in the suitable concentration of formation in the solvent, the solution that obtains is coated on the adherend, make the solution drying, bonding another adherend is bonded to coated adhesive composition layer on first adherend by compressing, then the described binder composition of thermofixation.The example of above-mentioned solvent comprises inert polar solvents such as methylethylketone, toluene, pimelinketone and N-Methyl pyrrolidone (NMP).Drying typically in ℃ scope of room temperature～200, under preferred 80～150 ℃ temperature, was implemented preferred 3～10 minutes 1 minute～1 hour.Compress bondingly preferably at 0.01～10MPa, more preferably the pressure of 0.05～2MPa is implemented down.Be heating and curing preferably in 100～200 ℃ of scopes, more preferably implemented 30 minutes～8 hours more preferably 1 hour～7 hours under 120～180 ℃ the temperature.
The binder composition that the present invention is shaped to film also can be used for bonding two adherends.Such as, described two adherends can be bonded in together by using adhesive sheet, the layer (after this being also referred to as " adhesive composition layer ") that places the substrate material top that wherein said adhesive sheet contains substrate material and formed by binder composition of the present invention.More specifically, described two kinds of adherends are bonded in as following together: shift out adhesive composition layer from the substrate material of adhesive sheet, this adhesive composition layer is clipped between two adherends, compress bonding and be heating and curing then.Compressing bonding and the condition of being heating and curing can be identical with aforementioned condition.
Described adhesive sheet obtains as following: in the same manner as described above binder composition of the present invention is dissolved in the suitable concentration of formation in the solvent, the solution that obtains is coated on the substrate material, then with the solution drying to form adhesive composition layer.The example of solvent for use and the drying conditions of employing are with aforementioned consistent.Although the preferred adhesive layer thickness preferably in 10～500 mu m ranges, more preferably 15～100 μ m, the not special restriction of binder layer thickness of the present invention, this can select according to its desired use.Substrate material typically is film material.The object lesson of substrate material comprises polyethylene film, polypropylene screen, polyester film, polyamide membrane, polyimide film, polyamide-imide film, polyetherimde films, poly tetrafluoroethylene, paper, reaches tinsel etc.Also can use surface treated such as above-mentioned substrate material.The thickness of substrate material preferably in 10～100 mu m ranges, more preferably 25～50 μ m.
At the semiconductor device production field, the layer (being bonding film) that can use binder composition formation of the present invention is as so-called small pieces junction film, and this film is used for joining the silicon small pieces to substrate.Using bonding film that the silicon small pieces are engaged on the substrate, implementing wire-bonding step and encapsulation step then and produce under the situation of semiconductor device, the abundant embedding of bonding film may not can take place in some zone between the small pieces joint conditioning time.In these zones, substrate and trend towards reduction when bonding strength between the tackiness agent cured product layer that bonding film obtains is implemented heating in wire-bonding step through solidifying.Be filled in these bonding films encapsulation process that fully embedded portion is not implemented after wire-bonding step.Show favourable reliability in order to ensure the resin encapsulated semiconductor that makes by this way, necessary is to keep gratifying on the whole bonding strength, even this structure comprises the relatively poor zone of bonding strength between tackiness agent cured product layer and the substrate.When measuring down for 260 ℃, be used to guarantee that the bonding strength of this gratifying integral adhesive intensity typically is 1MPa at least.Therefore, under the heating condition of bonding film in wire-bonding step that will be clipped between two adherends such as silicon and the substrate, heat, hot pressing is bonding under the heating of the encapsulation step that adopts the semiconductor packages resin and pressure condition, and make it thermofixation then when forming solidifying product (tackiness agent solidifying product layer), should typically be at least 1MPa at shear bond strength that record under 260 ℃ of conditions, between two adherends.Heating condition during the wire-bonding step is variable, heats at least 30 minutes down but typically be included in 170 ℃.In addition, adopting heating and pressure condition typically to be included under 160～180 ℃ of temperature, the 5～10MPa pressure during the encapsulation step of using the semiconductor packages resin heated 10～150 seconds.Be heating and curing condition as mentioned above.
Binder composition of the present invention can be used for slicing chip attachment film of the present invention.In other words, slicing chip attachment film of the present invention comprises the section film that has substrate material and place the pressure sensitive adhesive layer on the substrate material, and by the binder composition of the present invention at the pressure sensitive adhesive layer top that places section film forms layer.Substrate material typically is film material, and object lesson comprises polytetrafluoroethylene (PTFE) film, polyethylene terephthalate (PET) film, polyethylene (PE) film, polypropylene (PP) film, polyimide film and above-mentioned film is carried out the resulting plastic film of modification.The thickness of substrate material preferably in 60～500 mu m ranges, more preferably 80～200 μ m.The example that is used to form the pressure sensitive adhesive of pressure sensitive adhesive layer comprises typical pressure sensitive adhesive, and is keeping bonding strength before the ultraviolet irradiation but the experience bonding strength descends behind ultraviolet irradiation pressure sensitive adhesive.The thickness of pressure sensitive adhesive layer preferably in 2～10 mu m ranges, more preferably 5～10 μ m.
Can be for example be laminated on the pressure sensitive adhesive layer of section film and prepare slicing chip attachment film of the present invention by adhesive composition layer with the invention described above adhesive sheet.In addition, can also as following, obtain slicing chip attachment film of the present invention: binder composition of the present invention is dissolved in obtains suitable concentration in the solvent in the same manner as described above, the solution that obtains is coated on the pressure sensitive adhesive layer of section film, drying solution is to form adhesive composition layer then.The example of solvent for use, the drying conditions of employing, and the thickness of adhesive composition layer is all as hereinbefore.The example of section film comprises pressure sensitive section film and uv-curing type section film.
Binder composition of the present invention not only can be applied to the production of electronic unit such as semiconductor device, also can be applicable to the production that all need the parts of adhesion step, as the production of LED element, transmitter and liquid crystal cell.
Embodiment
Below adopt a series of embodiment and Comparative Examples that the present invention is explained in more detail, yet the present invention also is subject to these embodiment never in any form.
[preparation of binder composition]
According to (the unit: mass parts) of combined amount shown in the following table 1, following component (A)～(D) and other component are placed rotation/rotary type agitator (being produced by Thinky Corporation), add enough methylethylketone, toluene or pimelinketone with said components concentration adjustment to 20 quality %, the vigorous stirring mixture is finished the preparation of binder composition then.
(A) (methyl) acrylic resin
-SG-P3: contain the acrylonitrile group resin (being produced by Nagase ChemteX Corporation) of epoxide group, wherein the content of epoxide group is 0.021mol/100g, Tg=12 ℃, and weight-average molecular weight=850,000.
-SG-P3-43: contain the acrylonitrile group resin (being produced by Nagase ChemteX Corporation) of epoxide group, wherein the content of epoxide group is 0.050mol/100g, Tg=12 ℃, and weight-average molecular weight=850,000.
(B) Resins, epoxy
-RE-310S: bisphenol A epoxide resin (by Japan Epoxy Resins Co., Ltd. produces), weight-average molecular weight is 600.
-EOCN-1020: cresols phenolic resin varnish (by Nippon Kayaku Co., Ltd. produces), weight-average molecular weight is 1,200.
(C) aromatic polyamine compound
-4,4 '-DDS:4,4 '-diamino diphenyl sulfone (by Wakayama Seika Kogyo Co., Ltd produce) contains the aromatics polyamine of alkylsulfonyl.
-3,3 '-DDS:3,3 '-diamino diphenyl sulfone (by Wakayama Seika Kogyo Co., Ltd produce) contains the aromatics polyamine of alkylsulfonyl.
-DDM:4,4 '-diaminodiphenyl-methane (by Wakayama Seika Kogyo Co., Ltd produces), aromatics polyamine.
(other components): the catalyzer that is different from the aromatic polyamine compound
-2PHZ:2-phenyl-4,5-hydroxymethyl-imidazole (producing) by Shikoku Corporation.
(other components): the solidifying agent that is different from the aromatic polyamine compound
-resol: KA-1160 (producing) by DIC Corporation
(other components): filler
-fine silica: SE-2050 (by Admatechs Co., Ltd produces), spherical silicon dioxide, median size is 0.5 μ m.
-composite silicone rubber particulate: X-52-7030 (by Shin-Etsu Chemical Co., Ltd produces), median size is 0.7 μ m.
(other components): tackiness agent auxiliary agent
-coupling agent: X-12-414 (by Shin-Etsu Chemical Co., Ltd produces), mercaptosilane coupling agents.
[preparation of adhesive sheet]
Subsequently, every kind of binder composition is coated on the PET film of the thick 50 μ m that cover with fluorine-based silicone release, then with composition 110 ℃ dry 10 minutes down, have the adhesive sheet that thickness is approximately the adhesive composition layer of 25 μ m thereby form.
[test]
The adhesive sheet for preparing is carried out following test.The results are shown in table 1.
(1) Young's modulus
Shift out adhesive composition layer from 8 kinds of adhesive sheet PET films, these 8 kinds of binder combination layers are piled up, under 70 ℃, carry out heated lamination, solidified 6 hours in 175 ℃ then.The film of 40mm * 10mm * 200 μ m sizes is downcut as testing plate, use the tension mode of dynamic viscoelastic tester to measure Young's modulus, its measuring condition comprises folder apart from 10mm, and probe temperature is-80 ℃～300 ℃, and survey frequency is 1Hz.
(2) initial bonding strength
With thickness is the wafer that the silicon wafer of about 450 μ m cuts into 2mm * 2mm size, and adhesive sheet is connected to the bottom surface of cut crystal 100 ℃ of following thermocompression bonded, and wherein the adhesive composition layer of adhesive sheet contacts with wafer.Subsequently, adhesive sheet is cut into shape with the wafer unanimity, thereby forms the silicon that has the adhesive bonding sheet material.Subsequently by shifting out the silicon that the PET film obtains having adhesive composition layer from each silicon.The silicon that will have adhesive composition layer then place be of a size of 10mm * 10mm, be capped resist AUS308 (Taiyo Ink Mfg.Co. on it, Ltd production) on the BT substrate or silicon substrate, wherein adhesive composition layer and substrate contacts, and by under 170 ℃ and 0.1MPa, implementing bonding 2 seconds bonding resulting structures of hot pressing.Then with resulting on it substrate of bonding silicon in 175 ℃ of heating 6 hours, thereby the curable adhesive composition layer and is finished the preparation of testing plate (adhesion testing plate).Use this adhesion testing plate, with the shear bond strength between 260 ℃ of following bonding cured product layers of bonding tester (4000PXY, DAGE Holdings produces) measurement and the substrate.
(3) heat and make moist after bonding strength
The adhesion testing plate that will adopt the method identical with above-mentioned (2) preparation was placed 168 hours under the condition of 85 ℃ and 60%RH, then with the reflow ovens of sample by 260 ℃ three times.Then, adopt the mode identical to measure the shear bond strength of this testing plate under 260 ℃ with above-mentioned (2).
(4) embeddability properties
Adhesive sheet is connected to a surface of the silicon wafer of 8 inches of diameters, thickness 75 μ m, wherein the adhesive composition layer contact wafer of adhesive sheet in 70 ℃ of following thermocompression bonded.Shift out the PET film from the bonding adhesive sheet of hot pressing, formation has the wafer of adhesive bonding agent composition layer, subsequently pressure-sensitive section film is bonded to the surface of adhesive composition layer, wherein the pressure sensitive adhesive layer of pressure-sensitive section film contacts with adhesive composition layer.Adopt following dicing method, the silicon wafer that obtains is cut into 9mm
2Silicon.Each 9mm that will obtain then
2Silicon peel off from the pressure sensitive adhesive layer of pressure-sensitive cutting sheet material, wherein pressure-sensitive cutting sheet material has the adhesive composition layer that has that still is bonded in the wafer bottom surface.Engage instrument (BESTEM-D02-C type with small pieces, NEC Machinery Corporation produces), silicon is placed on the resin substrate of 50mm * 50mm * thick 250 μ m, this substrate has the striated circuit pattern (having formed the BT substrate of AUS308 resist cured layer on it) of wide 5～15 μ m that form thereon, so that it is the adhesive composition layer of each chip and substrate contacts, bonding to its hot pressing of carrying out 1 second under 130 ℃ and 0.1MPa condition then.Below based on Fig. 1 (it is for being presented at the localized figure of silicon in the embeddability properties test) this technology is described in more detail.That is, will be that 16 square silicons 1 of 9mm are positioned at along on the square resin substrate 2 of the long 50mm of a side with 4 row * 4 row and the patterns of spacing 3mm along a side length, wherein the spacing between outermost silicon wafer 1 and resin substrate 2 outer most edge is 2.5mm.This is had thermocompression bonded connect the resin substrate of silicon thereon in 170 ℃ of heating 90 minutes, the temperature of Heating temperature when this temperature is represented corresponding wire-bonding step, use formed material KMC2500LM1B (by Shin-Etu chemical Co. then, Ltd produces) enforcement resin package (condition: 175 ℃, encapsulation pressure 6.9MPa, 90 seconds), wherein the thickness of formed material is from resin substrate 600 μ m.Then moulding material was heating and curing 4 hours in 175 ℃.Survey the existence of the semiconductor package body internal void that this mode of employing obtains by ultra sonic imaging and measuring apparatus.
Further, repeat above-mentioned test, wherein the heating process length of implementing under 170 of Heating temperature ℃ of temperature in corresponding to wire-bonding step became 150 minutes from 90 minutes, and adopted mode same as described above that resulting package is surveyed hole.
If adopt the detection of ultra sonic imaging and test set to show that semiconductor package body inside does not have hole, then estimate embeddability properties for good.On the contrary, there is hole, then estimates embeddability properties for poor if ultra sonic imaging and test set detect in the semiconductor packages thing.In the table 1, the embeddability properties that symbol " zero " expression is good, symbol " * " represents that then embeddability properties is poor.
The section condition:
Section instrument: DAD-341 (DISCO Corporation)
Cut mode: single cutting
The rotating shaft speed of rotation: 40,000rpm
Section blade: NBC-ZH 104F 27HEEE (DISCO Corporation)
(5) package reliability
The silicon of resin package in above-mentioned (4) is cut into single chip, and 16 packagies that obtain were subsequently placed 168 hours under 85 ℃ and 60%RH condition, reached top temperature then with passing through for its three times and be 260 ℃ solder reflow furnace.Observe the separation between the silicon and substrate in each package with ultra sonic imaging and test set.In the table 1, symbol " zero " is illustrated in all 16 packagies and observes separation in all not having.On the contrary, symbol " * " is illustrated in observes separation, even have only one in 16 packagies.
[table 1]
In the present composition (embodiment 1～8), adopt the aromatic polyamine compound as catalyzer and solidifying agent, yet in Comparative Examples 1 and 2, replace the aromatic polyamine compound as catalyzer and do not use solidifying agent with imidazole catalyst, in the Comparative Examples 3, replace the aromatic polyamine compound as catalyzer with imidazole catalyst, replace the aromatic polyamine compound as solidifying agent with resol.As what table 1 proved, the present composition is compared with Comparative Examples 1～3, show outstanding embeddability properties, and compare with the cured product layer that obtains by Comparative Examples 1～3 composition, under the moisture absorption condition, show higher package reliability by the cured product layer that the present composition obtains.
[industrial practicality]
Adhesive composition of the present invention shows excellent embeddability properties, by gluing that this adhesive composition forms Mixture solidifies product layer and shows excellent bonding property, low elastic modulus and excellent heat resistance. Therefore, originally The invention adhesive composition can be used as the adhesive composition layer in adhesive sheet or the slicing chip attachment film, uses The semiconductor package body that has outstanding reliability in production.
Claims (10)
1. binder composition, it comprises:
(A) (methyl) acroleic acid resin, its weight-average molecular weight be 50,000～1, in 500,000 scopes, and contain with respect to following component (B) and component (C) one or the two show reactive functional group;
(B) Resins, epoxy, its weight-average molecular weight is no more than 5,000; With
(C) aromatic polyamine compound.
2. binder composition according to claim 1, wherein the functional group in the component (A) is epoxy group(ing), carboxyl or their combination.
3. binder composition according to claim 1, wherein component (A) contains the unit shown in the following formula,
4. binder composition according to claim 1, wherein component (C) contains alkylsulfonyl.
5. binder composition according to claim 1, wherein component (C) is 4,4 '-diamino diphenyl sulfone, 3,3 '-diamino diphenyl sulfone or their combination.
6. binder composition according to claim 1, wherein component (C) surpasses 170 ℃ aromatic polyamine compound for fusing point.
7. according to each described binder composition in the claim 1～6, it is formed as film.
8. binder composition according to claim 7, it is sandwiched between two adherends as layer, and it is bonding to carry out hot pressing under heating and pressure, and described two adherends are bonded together.
9. adhesive sheet, the layer that places described substrate material top that it comprises substrate material and is formed by each described binder composition in the claim 1 to 6.
10. slicing chip attachment film, its comprise the section film that has substrate material and place the pressure sensitive adhesive layer on the substrate material and the pressure sensitive adhesive layer top that places described section film that forms by each described binder composition of claim 1～6 layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008166958 | 2008-06-26 | ||
| JP2008166958A JP2010006929A (en) | 2008-06-26 | 2008-06-26 | Adhesive composition, adhesive sheet, and dicing die attach film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101629059A true CN101629059A (en) | 2010-01-20 |
Family
ID=41574343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910166960A Pending CN101629059A (en) | 2008-06-26 | 2009-06-25 | Adhesive composition, adhesive sheet and slicing chip attachment film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010006929A (en) |
| KR (1) | KR20100002187A (en) |
| CN (1) | CN101629059A (en) |
| TW (1) | TW201012887A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107954393A (en) * | 2011-08-24 | 2018-04-24 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Sensor with unique electric supporting part |
| CN112175546A (en) * | 2019-07-03 | 2021-01-05 | 德莎欧洲股份公司 | Heat-curable adhesive and adhesive tape produced therefrom |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4778078B2 (en) * | 2009-02-06 | 2011-09-21 | 信越化学工業株式会社 | Adhesive composition, adhesive sheet, dicing die attach film, and semiconductor device |
| JP5680330B2 (en) * | 2010-04-23 | 2015-03-04 | 株式会社東芝 | Manufacturing method of semiconductor device |
| JP6013416B2 (en) * | 2014-08-26 | 2016-10-25 | 株式会社タムラ製作所 | Adhesive composition and method for joining electronic parts |
| WO2023100917A1 (en) * | 2021-11-30 | 2023-06-08 | 三菱マテリアル株式会社 | Metal paste for joining, and method for manufacturing joined body and method for manufacturing insulated circuit board |
| WO2023100939A1 (en) * | 2021-11-30 | 2023-06-08 | 三菱マテリアル株式会社 | Temporary fastening material, and manufacturing method for joined body |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03221578A (en) * | 1990-01-26 | 1991-09-30 | Sumitomo Electric Ind Ltd | Adhesive composition for flexible printed wiring board |
| JP3465276B2 (en) * | 1992-10-08 | 2003-11-10 | 住友電気工業株式会社 | Adhesive composition for flexible printed wiring boards |
| JP4359954B2 (en) * | 1999-03-25 | 2009-11-11 | 東レ株式会社 | Adhesive sheet for semiconductor device, component using the same, and semiconductor device |
| JP2002121520A (en) * | 2000-10-05 | 2002-04-26 | Saehan Ind Inc | Adhesive tape for electronic part |
| JP2006176764A (en) * | 2004-11-24 | 2006-07-06 | Toray Ind Inc | Adhesive composition for electronic equipment, adhesive sheet for electronic equipment, and electronic part and electronic equipment using the same |
| JP5109572B2 (en) * | 2006-10-20 | 2012-12-26 | 日立化成工業株式会社 | Adhesive composition, adhesive composition semi-cured product, adhesive film, laminated adhesive film, and production method thereof |
-
2008
- 2008-06-26 JP JP2008166958A patent/JP2010006929A/en active Pending
-
2009
- 2009-06-25 KR KR1020090056842A patent/KR20100002187A/en not_active Application Discontinuation
- 2009-06-25 TW TW98121394A patent/TW201012887A/en unknown
- 2009-06-25 CN CN200910166960A patent/CN101629059A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107954393A (en) * | 2011-08-24 | 2018-04-24 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Sensor with unique electric supporting part |
| CN107954393B (en) * | 2011-08-24 | 2021-06-22 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Sensor with single electric support |
| CN112175546A (en) * | 2019-07-03 | 2021-01-05 | 德莎欧洲股份公司 | Heat-curable adhesive and adhesive tape produced therefrom |
| CN112175546B (en) * | 2019-07-03 | 2022-11-22 | 德莎欧洲股份公司 | Heat curable adhesive and adhesive tape made therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100002187A (en) | 2010-01-06 |
| JP2010006929A (en) | 2010-01-14 |
| TW201012887A (en) | 2010-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7488539B2 (en) | Adhesive composition and sheet having an adhesive layer of the composition | |
| TWI384046B (en) | An adhesive composition and a sheet having an adhesive layer made of an adhesive | |
| TWI460249B (en) | Adhesive composition, adhesive film, and method of producing semiconductor device | |
| CN101629059A (en) | Adhesive composition, adhesive sheet and slicing chip attachment film | |
| KR20070056979A (en) | Adhesive tape for dicing and die bond | |
| KR101856914B1 (en) | Film adhesive, semiconductor package using film adhesive and method for manufacturing same | |
| KR20060046464A (en) | Adhesive tape for dicing and die bond | |
| TW201104738A (en) | Semiconductor chip manufacturing method | |
| JP2007051215A (en) | Adhesive composition and adhesive film | |
| CN102812066A (en) | Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer | |
| TW201343774A (en) | Protective film for semiconductor wafer, and method for manufacturing semiconductor chip | |
| JP2010265338A (en) | Adhesive composition, adhesive sheet, and dicing die attach film | |
| JP2008248114A (en) | Adhesive composition | |
| JP2008021858A (en) | Adhesive film for dicing/die bonding | |
| KR20100002160A (en) | Adhesive composition, adhesive film and dicing.die attach film | |
| JP5311534B2 (en) | Adhesive composition and adhesive film | |
| JP2008308618A (en) | Adhesive composition and adhesive film | |
| JP2013091680A (en) | Thermally conductive adhesive composition and adhesive sheet and thermally conductive dicing die-attach film using the same | |
| JP4235808B2 (en) | Adhesive composition and adhesive film | |
| JP5183076B2 (en) | Manufacturing method of semiconductor device | |
| KR20100090654A (en) | Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device | |
| JP5541613B2 (en) | Thermally conductive adhesive composition, adhesive sheet, and thermally conductive dicing die attach film | |
| JP4586966B2 (en) | Adhesive composition and adhesive film | |
| JP2008308552A (en) | Adhesive composition and adhesive film | |
| JP2009062413A (en) | Adhesive composition and die bond film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100120 |