KR20100002160A

KR20100002160A - Adhesive composition, adhesive film and dicing.die attach film

Info

Publication number: KR20100002160A
Application number: KR1020090056345A
Authority: KR
Inventors: 쇼우헤이 고자까이; 사또시 오나이
Original assignee: 신에쓰 가가꾸 고교 가부시끼가이샤
Priority date: 2008-06-25
Filing date: 2009-06-24
Publication date: 2010-01-06
Also published as: TW201005057A; JP2010006912A

Abstract

The present invention provides an adhesive cured product layer having a low modulus of elasticity and a low water absorption, and has an excellent adhesive composition (filling performance) for filling recesses on a substrate without leaving voids, and an adhesive film and dicing die attach using the composition. Provide a film.

According to this invention, (A) (meth) acrylic-type resin which has a weight average molecular weight of polystyrene conversion is 10,000-1,500,000, and contains the functional group which is reactive with one or both of following (B) and (C) component, (B ) An adhesive composition comprising an organopolysiloxane structure-containing compound having a phenolic hydroxyl group or an epoxy group and (C) a curing catalyst and / or a curing agent; An adhesive film having a substrate and a layer comprising the composition provided on the substrate; It provides the dicing die attach film provided with the base material and the dicing film which has the adhesive layer provided on it, and the layer containing the said composition provided on the adhesive layer of the said dicing film.

Description

Adhesive composition, adhesive film and dicing die attach film {ADHESIVE COMPOSITION, ADHESIVE FILM AND DICING, DIE ATTACH FILM}

The present invention relates to a preferred adhesive composition for bonding a semiconductor chip to a substrate, and in particular, by including an organopolysiloxane structure-containing compound having a phenolic hydroxyl group or an epoxy group, to provide a cured adhesive layer of low elastic modulus and low water absorption The present invention also relates to an adhesive composition capable of adhering a semiconductor chip to a substrate without generating voids, and to an adhesive film and a dicing die attach film using the adhesive composition.

The semiconductor device comprises (i) cutting a large-diameter silicon wafer on which an IC circuit is formed into a semiconductor chip in a dicing (cutting) process, and (ii) heat the chip onto a lead frame with a curable liquid adhesive (die bond material) or the like. It is manufactured by pressing and fixing (mounting), (iii) after wire bonding between electrodes, and (iv) sealing for improved handleability and protection from the external environment. Forms of sealing include hermetic sealing such as metal sealing and ceramic sealing and non-sealing sealing with resin. At present, the latter method, in particular, the transfer mold method using a resin is most commonly used because it is excellent in mass productivity and inexpensive.

Since the liquid adhesive easily protrudes from the chip ends or causes wire bonding due to the inclination of the chip due to uneven thickness, a die-bonding film having an adhesive layer formed on the film is recently used. .

The adhesive transferred to the lead frame is cured after the mounting step and exposed to heat in a step such as wire bonding or resin sealing. The semiconductor package is miniaturized year by year as shown in a packaging structure (CSP) having the same size as a chip, a packaging structure in which chips are stacked (stacked CSP, SiP), and the like. Is becoming very high.

On the other hand, the uneven part by circuit elements, such as wiring, exists in a board | substrate, and when an adhesive film as a die-bonding material, ie, a die-bonding film, does not completely fill in a recessed part, when thermocompression bonding a semiconductor chip to this board | substrate, it will not be embedded. The portion remains as a void, which may expand upon heating in the reflow furnace, destroy the adhesive layer, and impair the reliability of the semiconductor device. In particular, in recent years, reflow property is required at a high temperature (265 ° C) corresponding to lead-free solder, and the importance of preventing the formation of voids is increasing. Hereinafter, the performance of embedding the concave portion on the substrate without leaving voids is referred to as " embedded performance. &Quot;

In order to solve the above problem, the semiconductor chip is thermocompressed with a die bond film having a low melt viscosity so that the molten die bond film enters and is embedded in the recess existing on the substrate, so as not to form voids as much as possible. Although it is thought that it is impossible to completely eliminate the formation of voids, there is a problem that adversely affects productivity because it requires a long time for thermocompression bonding or high pressure. Moreover, there exists a problem that a die-bonding film protrudes largely from a chip | tip edge, and causes contamination of an electrode.

As another method for solving the above problem, since a mold made of a sealing resin is performed at a high temperature and high pressure, the remaining voids are heated and compressed in the resin sealing step to further die bond in a state where the volume of the voids is made small. There exists a method of removing a space | gap by heat-hardening a die-bonding film in the state which made it absorb in a film, or made the volume of a space small. This method does not require a special process and is advantageous in manufacturing.

By the way, as said adhesive agent for conventional die bonds, the adhesive material containing a plastic resin, an epoxy resin hardening | curing agent, and a catalyst is specifically developed (for example, patent documents 1-5). However, although these adhesive materials are excellent in adhesiveness, their hardened | cured material tends to have high elasticity modulus and water absorption. Moreover, since the adhesive film using the said adhesive material advances hardening reaction rapidly, when it applies to the said method of removing a space | gap in a resin sealing process, the rate of rise of a film melt viscosity by heating in the wire bonding process before a resin sealing process is carried out. Since it becomes faster, it is difficult to remove a space | gap in a resin sealing process. That is, as a result of the increased melt viscosity, the volume of the voids cannot be made sufficiently small and the voids cannot be absorbed in the resin. Therefore, it is difficult for a conventional adhesive to fully fill in the recessed part on a board | substrate, and improvement of the embedding performance is calculated | required.

[Patent Document 1] Japanese Patent Application Laid-Open No. 7-224259

[Patent Document 2] Japanese Patent Application Laid-Open No. 8-27427

[Patent Document 3] Japanese Unexamined Patent Publication No. 10-163391

[Patent Document 4] Japanese Patent Application Laid-Open No. 11-12545

[Patent Document 5] Japanese Patent Application Laid-Open No. 2000-154361

An object of the present invention is to provide an adhesive cured product layer having a low modulus of elasticity and a low water absorption, and to provide an adhesive composition having excellent embedding performance, an adhesive film and a dicing die attach film using the adhesive composition.

The present inventors have found that the above object is achieved by an adhesive composition comprising a specific organopolysiloxane structure-containing compound having a phenolic hydroxyl group or an epoxy group.

That is, this invention is the (meth) acrylic-type resin which contains the functional group which the weight average molecular weight of (A) polystyrene conversion is 10,000-1,500,000 first, and has reactivity to one or both of following (B) and (C) component firstly It provides an adhesive composition comprising (B) a compound containing an organopolysiloxane structure represented by the following formula (1), and (C) a curing catalyst and / or a curing agent.

[Wherein, R ₁ is a hydrogen atom or an unsubstituted or substituted aliphatic monovalent hydrocarbon group having 1 to 4 carbon atoms, X is a hydrogen atom or a glycidyl group, and Z is an organopolysiloxane structure It is a divalent organic group to contain, and m is 1 or more number]

The present invention secondly provides an adhesive film having a substrate and a layer comprising the adhesive composition provided on the substrate.

A third aspect of the present invention provides a dicing die attach film having a dicing film having a substrate and an adhesive layer provided thereon and a layer comprising the adhesive composition provided on the adhesive layer of the dicing film. .

Since the adhesive composition of this invention has the melt viscosity which can suppress the increase of melt viscosity by the heating in a wire bonding process, and can fully lose a space | gap in a resin sealing process, since an air gap can be removed easily and fully, , Has excellent landfill performance. Moreover, the said adhesive composition has high adhesive force with respect to various base materials by heat-hardening, and provides the adhesive hardened | cured material layer of low elastic modulus and low water absorption. Thus, the adhesive composition is useful for producing highly reliable semiconductor devices.

Hereinafter, the present invention will be described in detail.

[(A) component]

The component (A) is a (meth) acrylic resin having a weight average molecular weight (Mw) in terms of polystyrene of 10,000 to 1,500,000 and containing a functional group having reactivity with one or both of the following components (B) and (C). In this specification, a (meth) acrylic-type resin means the polymer containing the monomeric unit derived from the (meth) acrylic-type monomer which consists of acrylic acid, an acrylic acid derivative, methacrylic acid, and a methacrylic acid derivative. (A) A component can also be used individually by 1 type or in combination of 2 or more type. When using in combination of 2 or more type, (A) component may be a mixture of (meth) acrylic-type resin containing the said functional group, and (meth) acrylic-type resin which does not contain the said functional group.

As (A) component, it is the homopolymer or copolymer of the said (meth) acrylic-type monomer, or the copolymer of the said (meth) acrylic-type monomer and another monomer, for example, The weight average molecular weight of polystyrene conversion is 10,000-1,500,000, And polymers containing a functional group having reactivity with one or both of the following (B) and (C) components. In the copolymer of the (meth) acrylic monomer and other monomers, the content of monomer units derived from other monomers is preferably 5 to 50 mol%, more preferably based on the total monomer units in the component (A). Preferably it is 10-30 mol%. In the copolymer of a (meth) acrylic monomer and other monomers, these monomers may be used alone, or two or more thereof may be used in combination.

As said acrylic acid derivative, For example, alkyl acrylates, such as methyl acrylate, ethyl acrylate, butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate; Acrylic acid alkyl alkyl esters such as hydroxyl ethyl acrylate and hydroxyl propyl acrylate; Aromatic hydrocarbon group-containing acrylic acid esters such as benzyl acrylate; Acrylic acid amides such as dimethyl acrylic acid amide; Imide group-containing acrylic esters such as imide acrylate TO-1492 (trade name, manufactured by Toagosei Kogyo Co., Ltd.); Epoxy-group containing acrylic acid ester, such as glycidyl acrylate, is mentioned.

Examples of the methacrylic acid derivatives include alkyl methacrylates such as methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate and lauryl methacrylate. ester; Methacrylic acid hydroxyl alkyl esters such as methacrylic acid hydroxylethyl and methacrylic acid hydroxylpropyl; Aromatic hydrocarbon group-containing methacrylic acid esters such as benzyl methacrylate; Methacrylic acid amides such as dimethyl methacrylate amide; Imide group-containing methacrylic acid esters such as imide methacrylate; Epoxy-group containing methacrylic acid ester, such as glycidyl methacrylate, is mentioned.

As said other monomer, an acrylonitrile, styrene, butadiene, an allyl derivative (allyl alcohol, allyl acetate, allyl phenyl ether, allyl benzyl ether, allyl benzoic acid, etc.) is mentioned, for example.

In a preferred embodiment of the present invention, the component (A) is a copolymer containing a monomer unit represented by the following formula. This copolymer can be manufactured by using acrylonitrile as said other monomer.

It is preferable that a functional group in (A) component is an epoxy group, a carboxyl group, or its combination from an adhesive viewpoint of the adhesive agent hardened | cured material layer obtained. A functional group in (A) component can be introduce | transduced in (A) component by synthesize | combining (A) component using the monomer containing the said functional group as at least a part of the monomer used as a raw material of (A) component, for example. have. As a monomer containing the said functional group, acrylic acid, methacrylic acid, the acrylic acid derivative containing an epoxy group (for example, glycidyl acrylate), the methacrylic acid derivative containing an epoxy group (for example, glyco Cyl methacrylate), and these monomers may be used alone or in combination of two or more thereof.

The content of the functional group in the component (A) is preferably 0.002 to 0.1 mol, more preferably 0.005 to 0.05 mol, per 100 g of the component (A). If the said content is in this range, the composition which has sufficient embedding performance, and the adhesive agent hardened | cured material layer which has sufficient adhesive force can be obtained easily.

The weight average molecular weight of polystyrene conversion of (A) component is 10,000-1,500,000 normally, Preferably it is 50,000-1,500,000, More preferably, it is 100,000-1,000,000. When the said molecular weight is less than 10,000, the adhesiveness and intensity | strength of the adhesive agent hardened | cured material layer obtained may fall. When the said molecular weight exceeds 1,500,000, the composition obtained may be too high in viscosity, and inferior to handleability.

Moreover, as for the (meth) acrylic-type resin of (A) component, the glass transition point (Tg) measured by thermomechanical analysis (TMA) becomes like this. Preferably it is -40 degreeC-100 degreeC, More preferably, it is -10-70 degreeC to be.

[(B) component]

(B) component is an organopolysiloxane structure containing compound represented by the said General formula (1). (B) A component can also be used individually by 1 type or in combination of 2 or more type. The composition of this invention provides the hardened | cured material layer with low elasticity modulus and water absorption by containing (B) component.

In addition, when X is a hydrogen atom in the said General formula (1), the phenolic hydroxyl group in (B) component is suppressed in reactivity with an epoxy group compared with the phenolic hydroxyl group in a normal phenolic compound. On the other hand, when X is a glycidyl group in the said Formula (1), the epoxy group in (B) component is suppressed in reactivity with phenolic hydroxyl group compared with the epoxy group in a normal epoxy compound. Therefore, by using the component (B) in the composition of the present invention, good embedding performance is achieved.

In Formula 1, R ¹ is independently a hydrogen atom or an unsubstituted or substituted aliphatic monovalent hydrocarbon group having 1 to 4, preferably 1 to 2 carbon atoms. As said aliphatic monovalent hydrocarbon group, For example, Alkyl groups, such as a methyl group, an ethyl group, a propyl group, isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert- butyl group; A group in which part or all of the hydrogen atoms bonded to carbon atoms of these groups are substituted with halogen atoms such as fluorine atom, bromine atom, chlorine atom, etc., for example, chloromethyl group, bromoethyl group, 3,3,3-trifluoro Halogen-substituted alkyl groups, such as a ropropyl group, etc. are mentioned. Among these, a hydrogen atom and a methyl group are particularly preferable.

In Chemical Formula 1, Z is a divalent organic group containing an organopolysiloxane structure, may be linear, branched, or may have a cyclic structure. As Z, the diorganopolysiloxane structure represented by following General formula (3) is mentioned, for example.

[In formula, R <_2> , R <_3> , R <_4> and R <_5> is an unsubstituted or substituted C1-C8 monovalent hydrocarbon group each independently containing no aliphatic unsaturated bond, n is 0-50 Can be]

In Chemical Formula 3, R ₂ , R ₃ , R _4, and R ₅ are each independently an unsubstituted or substituted carbon atom having 1 to 8 carbon atoms, preferably 1 to 6 carbon atoms, without containing an aliphatic unsaturated bond. Qi. As R ₂ , R ₃ , R ₄ and R ₅ , for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, hexyl group, 2-ethyl Alkyl groups, such as a hexyl group and an octyl group; Cycloalkyl groups such as cyclopentyl group and cyclohexyl group; Aryl groups, such as a phenyl group, tolyl group, and xylyl group; Aralkyl groups such as benzyl and phenylethyl; A group in which part or all of the hydrogen atoms bonded to carbon atoms of these groups are substituted with halogen atoms such as fluorine atom, bromine atom, chlorine atom, etc., for example, chloromethyl group, bromoethyl group, 3,3,3-trifluoro Halogen-substituted alkyl groups, such as a ropropyl group, etc. are mentioned, Especially, a methyl group and a phenyl group are preferable.

In Chemical Formula 3, n is a number of 0 to 50, preferably 0 to 20.

In Chemical Formula 1, m is one or more, preferably 1 to 200, more preferably 1 to 50, still more preferably 1 to 20.

In a preferred embodiment of the present invention, the component (B) is a compound in which the Z is a diorganopolysiloxane structure represented by the formula (3). This compound is produced by providing, for example, an allyl group-containing compound represented by the following formula (4) and an organohydrogenpolysiloxane represented by the following formula (5) to a hydrosilylation addition reaction in the presence of a platinum group metal catalyst. The allyl group-containing compound represented by the following formula (4), the organohydrogenpolysiloxane and the platinum group metal catalyst represented by the following formula (5) may be used alone or in combination of two or more. Moreover, the compound which has two alkenyl groups other than following formula (4), for example, 1, 5- hexadiene, ethylene glycol diallyl ether, butanediol diallyl ether, diallyl benzene, 2, 2-bis (4-allyloxy Phenyl) propane etc. can also be used together.

[Wherein, R ₁ and X are as defined above]

[Wherein, R ₂ , R ₃ , R ₄ , R ₅ and n are as described above]

The hydrosilylation addition reaction may be performed in the absence of a solvent, or may be performed in the presence of a solvent such as toluene. Reaction temperature is 50-150 degreeC normally. In this reaction, the addition amount of the allyl group-containing compound represented by the formula (4) is preferably 1 to 2 mol to 1 mol of the organohydrogenpolysiloxane represented by the formula (5). As the platinum group metal catalyst, conventionally known ones can be used. Specific examples thereof include carbon powder carrying platinum metal, platinum black, platinum dichloride, platinum chloride acid, reaction product of chloroplatinic acid with monohydric alcohol, platinum chloride and Platinum-based catalysts such as complexes with olefins and platinum bisacetoacetate; Palladium-based catalysts; Rhodium-based catalysts. The addition amount of a platinum group metal catalyst should just be an effective amount which can accelerate the said addition reaction.

[(C) component]

The hardening catalyst and / or hardening | curing agent of (C) component are components mix | blended in order to harden the composition of this invention. As (B) component, when X in the said General formula (1) is a hydrogen atom, since an epoxy group does not exist in (B) component, although (c3) mentioned later can also be used as (C) component, (c1) Combinations of epoxy resins and (c2) epoxy resin curing catalysts are preferably used. In addition, as (B) component, when X in the said General formula (1) is glycidyl group, since a phenolic hydroxyl group does not exist in (B) component, (c) component (c3) epoxy resin hardening | curing agent is preferable. Is used. Moreover, (c2) component can also be used together.

(C1) epoxy resin

As the epoxy resin of the component (c1), one having at least two epoxy groups in one molecule is preferable. (c1) A component can also be used individually by 1 type or in combination of 2 or more type. As the epoxy resin of the component (c1), for example, diglycidyl ether of bis (4-hydroxyphenyl) methane, 2,2'-bis (4-hydroxyphenyl) propane or a halide thereof and these axes Polymers (so-called bisphenol F-type epoxy resins, bisphenol A-type epoxy resins, etc.); Butadiene diepoxide; Vinylcyclohexene dioxide; Diglycidyl ether of 1,2-dihydroxybenzene, diglycidyl ether of resorcinol, 1,4-bis (2,3-epoxypropoxy) benzene, 4,4'-bis (2, Diglycidyl ethers such as 3-epoxypropoxy) diphenyl ether and 1,4-bis (2,3-epoxypropoxy) cyclohexene; Bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate; Polyglycidyl ether obtained by condensation of polyhydric phenol or polyhydric alcohol with epichlorohydrin; Epoxy novolac obtained by condensing novolak-type phenol resins such as phenol novolak and cresol novolak or halogenated novolak-type phenol resins with epichlorohydrin (i.e., phenol novolak-type epoxy resins, cresol novolak-type epoxy resins, etc.) Novolac type epoxy resin); Epoxidized polyolefins or epoxidized polybutadienes epoxidized by peroxidation; Naphthalene ring-containing epoxy resins; Biphenyl type epoxy resins; Phenol aralkyl type epoxy resins; Biphenyl aralkyl type epoxy resins; Cyclopentadiene type epoxy resin etc. are mentioned. Moreover, a silicone modified epoxy resin can also be used. Since the adhesive composition obtained can be crimped at lower temperature and lower pressure, the epoxy resin whose softening temperature is 100 degrees C or less is preferable, and a liquid epoxy resin may be sufficient. The softening temperature can be measured, for example, by a ball mouth method (JIS K 7234).

As a component (c1), a monoepoxy compound can also be used together in addition to the epoxy resin which has at least two epoxy groups in the said 1 molecule. Examples of the monoepoxy compound include styrene oxide, cyclohexene oxide, propylene oxide, methylglycidyl ether, ethylglycidyl ether, phenylglycidyl ether, allyl glycidyl ether, octylene oxide, Dodecene oxide and the like.

Especially, bisphenol-A epoxy resin, cresol novolak-type epoxy resin, or its combination is preferable.

(C2) epoxy resin curing catalyst

There is no restriction | limiting in particular in the kind of epoxy resin curing catalyst of (c2) component, A well-known thing can be used. (c2) A component may be used individually by 1 type or in combination of 2 or more types. As (c2) component, a phosphorus catalyst, an amine catalyst, etc. are mentioned, for example.

As a phosphorus catalyst, the triphenyl phosphine, the triphenyl phosphonium triphenyl borate, the tetraphenyl phosphonium tetraphenyl borate, and the compound represented by the following formula are mentioned, for example.

(Wherein R is independently from each other a hydrogen atom; a halogen atom such as a fluorine atom, a bromine atom, a chlorine atom, an iodine atom; an unsubstituted or substituted monovalent hydrocarbon group having 1 to 8 carbon atoms; or 1 carbon atom) An alkoxy group of 8 to 8, all may be the same, some may be the same, or each may be different)

As said monovalent hydrocarbon group, For example, the alkyl group, cycloalkyl group, and aryl group similar to what was illustrated about said R <_2> -R <_5>; Alkenyl groups such as vinyl group and allyl group; Alkynyl group of an ethynyl group and a propargyl group; A group in which part or all of the hydrogen atoms bonded to carbon atoms of these groups are substituted with halogen atoms such as fluorine atom, bromine atom, chlorine atom, etc., for example, chloromethyl group, trifluoromethyl group, bromoethyl group, 3,3 Halogen substituted alkyl groups, such as a 3-trifluoro propyl group, etc. are mentioned.

As said alkoxy group, alkoxy groups, such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, butoxy group, etc. are mentioned, for example.

As an amine catalyst, for example, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 2-phenyl-4,5-dihydride And imidazole derivatives such as oxymethylimidazole. Preferably 2-phenyl-4,5-dihydroxymethylimidazole is used.

(C3) epoxy resin curing agent

There is no restriction | limiting in particular in the epoxy resin hardener of (c3) component, Various conventionally well-known things can be used. A component (c3) may be used individually by 1 type, or may be used in combination of 2 or more type according to hardening performance etc.

As an epoxy resin hardening | curing agent of (c3) component, For example, Aliphatic amines, such as diethylene triamine, triethylene tetramine, diethylaminopropylamine; N-aminoethylpiperazine, bis (4-amino-3-methylcyclohexyl) methane, mentandiamine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro (5, 5) alicyclic amines such as undecane; Meta-phenylenediamine, para-phenylenediamine, 1,2-diaminebenzene, 4,4'-diaminodiphenylmethane, 2,2-bis (4-aminophenyl) propane, bis (4- (4- Aminophenoxy) phenyl) sulfone, bis (4- (3-aminophenoxy) phenyl) sulfone, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenylsulfide, 4,4 ' -Diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 3,4'-diaminodiphenylether, 4,4'-diaminodiphenylether, 4,4'-bis (4-amino Phenoxy) biphenyl, 2,6-diaminopyridine, bis (3-aminophenyl) diethylsilane, 4,4'-diaminodiphenyldiethylsilane, benzidine, 3,3'-dichlorobenzidine, 3, 3'-dimethoxybenzidine, 4,4'-diaminobenzophenone, N, N-bis (4-aminophenyl) -n-butylamine, N, N-bis (4-aminophenyl) methylamine, 1, 5-diaminonaphthalene, 3,3'-dimethyl-4,4'-diaminobiphenyl, 4-aminophenyl-3-aminobenzoate, N, N-bis (4-aminophenyl) aniline, bis (p Beta-amino-t-butylphenyl) Ether, p-bis-2- (2-methyl-4-aminopentyl) benzene, p-bis (1,1-dimethyl-5-aminopentyl) benzene, (1,3-bis (4-aminophenoxy) ) Benzene, m-xylylenediamine, p-xylylenediamine, 4,4'-diaminodiphenyletherphosphineoxide, 4,4'- diamino diphenyl N-methylamine, 4,4'- Aromatic amines such as diaminodiphenyl N-phenylamine; Modified aliphatic polyamines such as epoxy resin-diethylenetriamine adduct, amine-ethylene oxide adduct and cyanoethylated polyamine; Bisphenol A, trimethylolallyloxyphenol, low-polymerization phenol novolak resin, epoxidized or butylated phenol resin or Super Beckcite 1001 (manufactured by Reichshold Kagaku Kogyo Co., Ltd.), Hitanol ) 4010 (manufactured by Hitachi Seisakusho Co., Ltd.), Scado form L.9 (manufactured by Scado Zwoll, The Netherlands), methylon 75108 (manufactured by General Electric, Inc. of the United States) Phenolic resin containing two or more phenolic hydroxyl groups in molecules, such as a phenol resin known by brand names, such as these; Beckamine P.138 (manufactured by Nippon Reichhold Kagaku Kogyo Co., Ltd.), Meran (Hitachi Seisakusho Co., Ltd.), U-Van 10R (manufactured by Toyo Koatsu Kogyo Co., Ltd.) Carbon resins known under the trade names; Amino resins such as melamine resins and aniline resins; Chemical formula: HS (C ₂ H ₄ OCH ₂ OC ₂ H ₄ SS) _L C ₂ H ₄ OCH ₂ OC ₂ H ₄ SH (In the formula, 1) such as polysulfide resin represented by Polysulfide resins having at least two mercapto groups in a molecule; Organic acids or anhydrides thereof (acid anhydrides) such as phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride, methylnadic acid, dodecyl succinic anhydride, and chloric anhydride; Dicyandiamide, etc. are mentioned. Among these, while providing good molding workability to the composition from which a phenolic resin (especially a phenol novolak resin) and dicyanidiamide are obtained, the hardened | cured material layer obtained provides the outstanding moisture resistance, is also nontoxic, and is comparatively cheap Since it is preferable.

[(D) component]

In order to reduce the elasticity modulus, water absorption, and linear expansion rate of the adhesive agent hardened | cured material layer obtained, you may mix | blend the filler of (D) component with an arbitrary component to the composition of this invention. There is no restriction | limiting in particular in the filler of (D) component, A well-known thing can be used. (D) component may be used individually by 1 type or in combination of 2 or more type.

The average particle diameter of (D) component becomes like this. Preferably it is 10 micrometers or less (for example, 0.1-10 micrometers), More preferably, it is 5 micrometers or less (for example, 0.5-5 micrometers). When the said average particle diameter exceeds 10 micrometers, the surface smoothness of the adhesive film of this invention may be impaired. Moreover, it is preferable that the largest particle diameter of (D) component is 20 micrometers or less, More preferably, it is 10 micrometers or less. In addition, in this specification, "average particle diameter" means the average particle diameter of the volume reference | standard corresponded to 50% of the cumulative distribution calculated | required by the particle size distribution measuring apparatus using the laser beam diffraction method. In addition, "maximum particle diameter" is the maximum value of the particle diameter in the cumulative distribution measured when the average particle diameter was calculated | required above.

Examples of the component (D) include inorganic fillers such as conductive fine metal particles such as fine silica powder, alumina, titanium oxide, carbon black and silver particles; Organic fillers, such as silicone microparticles | fine-particles, are mentioned. Among these, fine silica powder and silicon fine particles are preferable. Hereinafter, the fine silica powder and the silicon fine particles will be described in more detail.

Silica Fine Powder

There is no restriction | limiting in particular in a fine silica powder, A well-known thing can be used. The fine silica powder may be used alone or in combination of two or more thereof. The average particle diameter and the maximum particle diameter of the fine silica powder are the same as those described generally for the component (D). From the viewpoint of fluidity of the composition to be obtained, the fine silica powder is preferably surface-treated with organosilicon compounds such as organoalkoxysilane, organochlorosilane, organosilazane, and low molecular weight siloxane.

As a fine silica powder, For example, reinforced silica, such as fumed silica and precipitated silica; Crystalline silica, such as quartz, is mentioned. Specifically, Nisbon Aerosil Co., Ltd. Aerosil R972, R974, R976; SE-2050, SC-2050, SC-2050, SE-1050, SO-E1, SO-C1, SO-E2, SO-C2, SO-E3, SO-C3, SO -E5, SO-C5; Shinsil Kagaku Kogyo Co., Ltd. Musil 120A, Mussil 130A, etc. are illustrated.

Silicon fine particles

There is no restriction | limiting in particular in silicone microparticles | fine-particles, A well-known thing can be used, For example, silicone rubber microparticles | fine-particles, silicone resin microparticles | fine-particles, etc. are mentioned. Silicone microparticles | fine-particles may be used individually by 1 type, or may be used in combination of 2 or more type. Although only silicon microparticles | fine-particles can be used as (D) component, since the elasticity modulus and water absorption of the hardened | cured material layer obtained can be reduced more effectively, it is preferable to use silicon microparticles in combination with the said fine silica powder. The average particle diameter and maximum particle diameter of silicone microparticles | fine-particles are the same as what was generally demonstrated about (D) component.

As silicone microparticles | fine-particles, composite silicone rubber microparticles | fine-particles are preferable. The composite silicone rubber fine particles are particles in which microstructures of the polyorganosilsesquioxane resin produced by the polymerization reaction on the surface are present on at least a part of the surface of the silicone rubber fine particles. Composite silicone rubber fine particles can be produced according to the method described, for example, in Japanese Patent Laid-Open No. 7-196815. That is, the alkaline substance itself or its alkaline aqueous solution and organotrialkoxysilane are added to the aqueous dispersion of the spherical silicone rubber fine particles having an average particle diameter of 0.1 to 10 mu m, and the organotrialkoxysilane is formed on the surface of the spherical silicone rubber fine particles. It hydrolyzes and superposes | polymerizes, and then it is dried and composite silicone rubber fine particles are obtained. It is preferable that content of polyorgano silsesquioxane resin is 1-500 mass parts with respect to 100 mass parts of spherical silicone rubber fine particles, More preferably, it is 2-100 mass parts. When the said content is less than the said lower limit, the dispersibility in the adhesive composition obtained by a composite silicone rubber microparticle will deteriorate, and there exists a possibility that a composition may become nonuniform in the adhesive film obtained. On the other hand, when the said content increases more than the said upper limit, there exists a tendency for the elasticity modulus of the hardened | cured material layer obtained to become high.

As composite silicone rubber microparticles | fine-particles, KMP-600, KMP-605, X-52-7030, etc. by Shin-Etsu Chemical Co., Ltd. can be used, for example.

[Other Ingredients]

In addition, in the composition of the present invention, in addition to the above-mentioned (A) to (C) components, and optionally (D) component, various additives can be mix | blended as other components in the range which does not impair the objective of this invention. . As an additive, a wettability improving agent, antioxidant, a heat stabilizer, etc. are mentioned, for example.

[Production of composition]

The adhesive composition of this invention can be manufactured by mixing the said (A)-(C) component and if needed, (D) component and other components with a mixer etc. according to a conventional method. The compounding quantity of (A)-(D) component is as follows.

First, the case where the organopolysiloxane structure containing compound whose X in the said General formula (1) is a hydrogen atom is used as (B) component is demonstrated. In this case, the compounding quantity of the sum total of (B) component and (c1) component becomes like this. Preferably it is 10-200 mass parts, More preferably, it is 20-150 mass parts with respect to 100 mass parts of (A) component. The compounding quantity of (c1) component becomes like this. Preferably it is 5-70 mass%, More preferably, it is 10-50 mass% with respect to (B) component. The compounding quantity of the epoxy resin hardening catalyst of (c2) component should just be an effective amount as a catalyst, and is 0.005-10 mass%, especially 0.01-5 mass% with respect to the adhesive composition of this invention normally. When using (c3) component, the compounding quantity can be made into the compounding quantity similar to what is mentioned later about the case where X in the said General formula (1) is glycidyl group.

Next, the case where the organopolysiloxane structure containing compound whose X in the said General formula (1) is glycidyl group is used as (B) component is demonstrated. In this case, the compounding quantity of the sum total of (B) component and (c3) component becomes like this. Preferably it is 10-200 mass parts, More preferably, it is 20-150 mass parts with respect to 100 mass parts of (A) component. The blending amount of the component (c3) is preferably 1 to 80 mass%, more preferably 3 to 60 mass%, particularly preferably 1 to 10 mass% with respect to the component (B). Moreover, when mix | blending the epoxy resin curing catalyst of (c2) component with the composition of this embodiment, the quantity becomes like this. Preferably it is 0.005-10 mass% with respect to the said composition, Especially preferably, it is 0.01-5 mass%.

It is preferable that the compounding quantity of (D) component is 5-80 mass%, especially 10-60 mass% with respect to the adhesive composition of this invention. When the said compounding quantity is less than 5 mass%, the water absorption and / or linear expansion rate of the adhesive agent hardened | cured material layer obtained may be difficult to decrease. When the said compounding quantity exceeds 80 mass%, the elasticity modulus may increase in the adhesive agent hardened | cured material layer obtained. Especially when mix | blending silicone microparticles | fine-particles as (D) component, the compounding quantity becomes like this. Preferably it is 5-30 mass% with respect to the adhesive composition of this invention, More preferably, it is 10-20 mass%. If the said compounding quantity is in this range, the adhesive hardened | cured material layer obtained will become hard to increase elasticity modulus, water absorption, and / or a linear expansion rate, and will be hard to fall strength.

Moreover, in the composition of this invention, molar ratio with all the functional groups (for example, a hydroxyl group, a carboxyl group, a mercapto group, an amino group, etc.) which react with all the epoxy groups and epoxy groups which exist in a composition: (all functional groups reacting with an epoxy group) / (all It is preferable that the value of the epoxy group) is 0.5-1.5, and it is especially preferable that it is 0.8-1.2. In the composition of this invention, a hydroxyl group is contained as a phenolic hydroxyl group, for example in (B) component when X in the said General formula (1) is a hydrogen atom, (c3) component when it is a phenol resin. A carboxyl group is contained in (A) component when a functional group is a carboxyl group, for example. An epoxy group is contained, for example in (A) component in case a functional group is an epoxy group, (B) component in case X in the said General formula (1) is glycidyl group, epoxy resin of (c1) component, etc.

[Use of composition]

The adhesive composition of the present invention can be used, for example, to adhere an adherend to a substrate. As an adherend, a silicon chip, an LED chip, etc. are mentioned, for example. As a board | substrate, resin substrates, such as a BT board | substrate, are mentioned, for example.

For example, after dissolving the adhesive composition of the present invention in a suitable concentration in a solvent and applying it on a substrate, and drying, the adherend is pressed onto the substrate surface to which the adhesive composition is applied, and the adhesive composition is cured by heat. The adherend and the substrate can be bonded. As said solvent, an aprotic polar solvent, such as toluene, cyclohexanone, N-methylpyrrolidone (NMP), is mentioned, for example. It is preferable to perform drying at normal temperature-200 degreeC, especially 80-150 degreeC for 1 minute-1 hour, especially 3 to 10 minutes. Pressing is preferably performed at a pressure of 0.01 to 10 MPa, in particular 0.1 to 2 MPa. Heat curing is preferably carried out at a temperature of 100 to 200 ° C., especially 120 to 180 ° C., for 30 minutes to 5 hours, in particular 1 to 5 hours.

Moreover, the said to-be-adhered body can also be adhere | attached on the said board | substrate using the adhesive film provided with the base material and the layer (henceforth an adhesive composition layer) containing the adhesive composition of this invention provided on the said base material. For example, the adherend and the substrate may be adhered by peeling the adhesive composition layer from the adhesive film, sandwiching the adhesive composition layer between the adherend and the substrate, and compressing and heat curing. The conditions of crimping | bonding and heat hardening are the same as the above.

The adhesive film can be obtained by dissolving the adhesive composition of the present invention in a solvent in an appropriate concentration in the same manner as described above, applying it onto a substrate, and drying it to form an adhesive composition layer. Examples of the solvent and the conditions of drying are the same as above. Although the film thickness of an adhesive composition layer does not have a restriction | limiting in particular, Although it can select according to the objective, it is preferable that it is 10-100 micrometers, and it is especially preferable that it is 15-50 micrometers. The said base material is a film form normally, for example, a polyethylene film, a polypropylene film, a polyester film, a polyamide film, a polyimide film, a polyamideimide film, a polyetherimide film, a polytetrafluoroethylene film, paper, a metal foil, etc. The base material of the said or the said base material which carried out the mold release process of the surface can be used, and the said base material which carried out the mold release process of the surface especially is preferable. The thickness of the said base material becomes like this. Preferably it is 5-200 micrometers, More preferably, it is 10-100 micrometers.

The adhesive composition of this invention can be used for the dicing die attach film of this invention. That is, the dicing die attach film of this invention is equipped with the dicing film which has a base material and the adhesive layer provided on it, and the layer containing the adhesive composition of this invention provided on the adhesive layer of the said dicing film. It is a dicing die attach film. The said base material is a film form normally, for example, polyethylene, a polypropylene, polyvinyl chloride, and these copolymers can be used. The thickness of the said base material becomes like this. Preferably it is 50-200 micrometers, More preferably, it is 70-150 micrometers. As an adhesive which forms the said adhesive layer, an acrylic adhesive, a rubber adhesive, a urethane type adhesive, a silicone type adhesive etc. are mentioned, for example. The thickness of the pressure-sensitive adhesive layer is preferably 1 to 20 µm, more preferably 5 to 10 µm.

The dicing die attach film of this invention can be manufactured by laminating | stacking the adhesive composition layer in the adhesive film of this invention, for example on the adhesive layer of the said dicing film. Moreover, the adhesive composition of this invention can also be obtained by melt | dissolving in a solvent in the moderate density | concentration similar to the above, apply | coating on the adhesive layer of the said dicing film, and drying, and forming an adhesive composition layer. Examples of the solvent, drying conditions and the film thickness of the adhesive composition layer are the same as above. As a dicing film, a dicing film of a pressure reduction type and a dicing film of an ultraviolet curing type can be used, for example.

The adhesive composition of the present invention can be used not only in the manufacture of electronic components such as semiconductor devices, but also in the production of various products including an adhesion process, for example, in the manufacture of LED components, sensors, liquid crystal components and the like.

Hereinafter, although an Example and a comparative example are given and this invention is demonstrated concretely, this invention is not limited to the following Example.

[Production of Adhesive Composition]

The following (A)-(D) component is thrown into the mixing machine (made by Shinki Corporation) of a rotating and revolving system by the compounding quantity (mass part) shown in following Table 1 or 2, and further (A)-(D) Methyl ethyl ketone or cyclohexanone was added and mixed so that the total concentration of the components might be 20% by mass to prepare an adhesive composition.

(A) (meth) acrylic resin

(A) component was mix | blended as the resin solution obtained by melt | dissolving 40 mass parts of each following resin individually in 60 mass parts of cyclohexanone. In addition, the compounding quantity of (A) component shown in Table 1 or 2 is the value converted into the compounding quantity of resin itself instead of the compounding quantity of resin solution.

Acrylic resin A: SG-P3, epoxy functional group 0.021 mol / 100 g, Tg 12 ° C, Mw 850,000, manufactured by Nagase Chemtech Co., Ltd.

Acrylic resin B: SG-708-6, epoxy functional group 0.016 mol / 100 g, Tg 4 ° C, Mw 700,000, manufactured by Nagase Chemtech Co., Ltd.

(B) organopolysiloxane structure-containing compound

Compound A (average structural formula)

(Wherein X is a glycidyl group and m = 5)

Compound B (average structural formula)

(Wherein X is a glycidyl group, on average p is 7, q is 3, n is 7.76)

Compound C (average structural formula)

(In formula, m = 5)

Compound D (average structural formula, weight average molecular weight [polystyrene equivalent] = 4,600)

(In formula, p is 7.54, q is 1.0, n is 7.4)

(C) curing catalysts and / or curing agents

(c1) epoxy resin

Epoxy resin 1: RE-310S, liquid epoxy resin, manufactured by Nippon Kayaku Co., Ltd.

Epoxy Resin 2: EOCN-1020, manufactured by Nippon Kayaku Co., Ltd.

Epoxy Resin 3: jER-1002, manufactured by Japan Epoxy Resin Co., Ltd.

(c2) epoxy resin curing catalyst

2PHZ (2-phenyl-4,5-dihydroxymethylimidazole): manufactured by Shikoku Kasei Co., Ltd.

(c3) epoxy resin curing agent

Dicyandiamide: Japan epoxy resin

KA-1160: A phenol novolak resin and the Dainippon Ink & Chemicals Corporation make

MEH-7800: Phenolic resin, Meiwa Kasei Kogyo Co., Ltd.

(D) filler

Fine silica powder: SE-2050, spherical silica, average particle diameter of 0.5 mu m, manufactured by Admatex Co., Ltd.

Composite silicone rubber fine particles: X-52-7030, average particle diameter 0.7 mu m, manufactured by Shin-Etsu Chemical Co., Ltd.

[Production of Adhesive Film]

Subsequently, each adhesive composition was applied on a PET film having a thickness of 50 μm coated with a fluorine-based silicone release agent, and heated and dried at 110 ° C. for 10 minutes to prepare an adhesive film having an adhesive composition layer having a thickness of about 25 μm.

[exam]

The following test was done about each obtained adhesive film. The results are shown in Table 1 or 2.

(1) Young's modulus

The remaining 8 layers of the adhesive composition layer from which the PET film was peeled from the adhesive film were superimposed, thermally laminated at 90 ° C, and cured by heating at 175 ° C for 2 hours. A film of 40 mm × 10 mm × 200 μm was cut out to be a test piece, and the Young's modulus was measured under a condition of a distance of 10 mm between chucks, a measuring temperature of -80 ° C. to 300 ° C., and a measuring frequency of 1 Hz using a dynamic viscoelasticity measuring device. It was.

(2) water absorption

The remaining 8 layers of the adhesive composition layer from which the PET film was separated from the adhesive film were superimposed, thermally laminated at 90 ° C, and then dried and cured by heat treatment at 175 ° C for 4 hours. The test piece of 50 mmx50 mmx200 micrometer shape was cut out and immersed in water. After 168 hours, the test piece was taken out from the water, and the adhered water on the surface thereof was wiped off to measure the weight (W) of the test piece. Subsequently, the test piece was dried at 120 ° C. for 4 hours, and its weight was measured (Wo). The water absorption was calculated by the following equation.

Water absorption rate (%) = [(WW ₀ ) / W] x 100

(3) initial adhesion

A silicon wafer having a thickness of 450 mu m was diced on a chip of 2 mm x 2 mm, and the adhesive film was thermocompressed at 100 deg. C so that the adhesive composition layer was in contact with the back surface of the diced wafer. Subsequently, the adhesive film was cut into the shape similar to a chip | tip, and the silicon chip with an adhesive film was extracted. The PET film was peeled off from this silicon chip to obtain a silicon chip with an adhesive composition layer. Next, on the 10 mm x 10 mm BT substrate or silicon substrate to which the resist AUS303 (manufactured by Unitech Co., Ltd.) was applied and cured, the surface on which the adhesive composition layer was adhered contacted the silicon chip with the adhesive composition layer obtained. It was put up so that it was fixed by thermocompression bonding at 170 degreeC and 0.1 MPa for 2 second. Thus, the board | substrate with which the silicon chip was fixed was heated at 175 degreeC for 4 hours, hardening an adhesive composition layer, and the test piece (adhesion test piece) was produced. Using this adhesion test piece, the shear adhesive force between the adhesive cured product layer and the board | substrate was measured at 260 degreeC by the bond tester (4000PXY by DAGE Co., Ltd.).

(4) adhesiveness after moist heat

The adhesion test piece of (2) was held for 168 hours under the condition of 85 ° C / 60% RH, and then passed through a reflow furnace at 260 ° C three times, and then the shear adhesive force was maintained at 260 ° C as in the above (3). Measured.

(5) landfill performance

The adhesive film was thermocompression-bonded at 70 degreeC so that the adhesive composition layer might contact one side of the silicon wafer of 8 inches diameter and 75 micrometers in thickness. The pressure-sensitive dicing film was adhered to the pressure-sensitive adhesive layer of the pressure-sensitive dicing film on the adhesive composition layer surface of the wafer with the adhesive composition layer obtained by peeling the PET film from the adhesive film that was thermally compressed. The silicon wafer was diced on a 9 mm side silicon chip under the following dicing conditions. Subsequently, the 9-mm-side silicon chip obtained in this way was peeled from the adhesive layer of the said pressure-sensitive dicing film in the state which the adhesive composition layer adhered to the back surface. This silicon chip was formed by a die bonder device (BESTEM-D02-TypeC) manufactured by NEC Machinery Co., Ltd., a resin substrate having a thickness of 50 mm x 50 mm x thickness 250 m, on which a stripe circuit pattern having a width of 5 to 15 m was formed (resist AUS303). On this application-hardened BT substrate), an adhesive composition layer was placed in contact with each other, and thermally compressed for 1 second under conditions of 130 ° C and 0.1 MPa. This point is concretely demonstrated based on FIG. 1 (it is a figure which shows the arrangement | positioning of the silicon chip in a buried performance test). The square silicon chip 1 whose one side is 9 mm is 50 mm square by one side. 16 pieces were arranged on the resin substrate 2 in four rows and four columns at intervals of 3 mm, and the interval between the outer edges of the silicon chip 1 and the resin substrate 2 disposed on the outermost side was 2.5 mm. In this way, the resin substrate thermocompression-bonded with the silicon chip is heated at 170 ° C. for 30 minutes, which corresponds to the heating temperature in the wire bonding step, and then, the mold material KMC2500VA-T1 (Shin-Etsu Chemical Co., Ltd.) has a thickness of 600 μm from the resin substrate. The resin material was sealed (175 degreeC, sealing pressure 6.9 MPa, 90 second) by the high school company, and the said mold material was heat-hardened at 175 degreeC for 4 hours. The interface between the cured adhesive layer and the resin substrate was observed with an ultrasonic image measuring device to investigate the presence or absence of voids.

In addition, the presence or absence of the space | gap was investigated similarly to the above except having changed the heating time in 170 degreeC corresponding to the heating temperature in a wire bonding process from 30 minutes to 90 minutes.

If no voids were observed, the buried performance was evaluated as sufficient. On the other hand, when voids were observed, the buried performance was evaluated as insufficient. In Table 1 and 2, "(circle)" shows that embedding performance is sufficient, and "x" shows that embedding performance is insufficient.

Dicing Condition:

Dicing apparatus: Dicer DAD341 (manufactured by Disco Co., Ltd.)

Cutting method: single cutting

Dicing Blades:

Z1: NBC-ZH 104F 27HEEE (manufactured by Disco Corporation)

Dicing Blade Speed: 40000 rpm

(6) package reliability

The resin-sealed silicon chip was separated in (5), and the total 16 packages obtained were kept for 168 hours under the condition of 85 ° C / 60% RH, and then passed three times through a reflow furnace at 260 ° C. The presence or absence of peeling between a silicon chip and a board | substrate was observed with the image measuring apparatus. In Tables 1 and 2, "no" indicates that no peeling was observed in all 16 packages, and "yes" indicates that peeling was observed even in one of the 16 packages.

The compositions of Examples 1 to 5 contain Compound A or B having glycidyl groups. Comparing Examples 1 to 5 with Comparative Examples 1 and 2, the compositions of Examples 1 to 5 were excellent in embedding performance, and the cured product layers obtained from these compositions tend to have low Young's modulus, low water absorption, and package reliability. This is excellent.

The compositions of Examples 6-9 contain Compound C or D with phenolic hydroxyl groups. Comparing Examples 6-9 with Comparative Examples 3 and 4, the compositions of Examples 6-9 had excellent embedding performance, and the cured product layers obtained from these compositions tend to have low Young's modulus, low water absorption, and package reliability. This is excellent.

Industrial availability

The adhesive composition of this invention is excellent in the embedding performance, the adhesive agent cured material layer obtained from the said adhesive composition is excellent in adhesive force, and is low elasticity rate and low water absorption. Therefore, the said adhesive composition is useful as an adhesive composition layer in the adhesive film and dicing die attach film for manufacturing a highly reliable semiconductor device.

1 is a diagram showing the arrangement of silicon chips in a buried performance test.

1: silicon chip

2: resin substrate

Claims

(A) (meth) acrylic resin which has a weight average molecular weight of polystyrene conversion of 10,000-1,500,000, and contains the functional group which is reactive with one or both of following (B) and (C) component,

(B) a compound containing an organopolysiloxane structure represented by the following formula (1), and

(C) curing catalysts and / or curing agents

Adhesive composition comprising a.

The adhesive composition of Claim 1 whose said X is a hydrogen atom, and (C) component is a combination of (c1) epoxy resin and (c2) epoxy resin curing catalyst.

The adhesive composition of Claim 2 whose epoxy resin of (c1) component is a bisphenol-A epoxy resin, a cresol novolak-type epoxy resin, or a combination thereof.

The adhesive composition of Claim 1 whose said X is glycidyl group and (C) component is (c3) epoxy resin hardening | curing agent.

The adhesive composition according to claim 4, further comprising an epoxy resin curing catalyst of component (c2).

The adhesive composition according to any one of claims 1 to 5, wherein in the formula (1), Z is a diorganopolysiloxane structure represented by the following formula (3).

The adhesive composition according to any one of claims 1 to 5, wherein component (A) comprises a monomer unit represented by the following formula.

The adhesive composition according to any one of claims 1 to 5, wherein the functional group in the component (A) is an epoxy group, a carboxyl group, or a combination thereof.

The adhesive composition according to any one of claims 1 to 5, further comprising (D) a filler in an amount of 5 to 80 mass% with respect to the present adhesive composition.

The adhesive composition according to claim 9, wherein the component (D) is fine silica powder, silicon fine particles or a combination thereof.

An adhesive film provided with a base material and the layer which consists of an adhesive composition of any one of Claims 1-5 provided on the said base material.

Dicing die provided with the base material and the dicing film which has an adhesive layer provided on it, and the layer which consists of an adhesive composition of any one of Claims 1-5 provided on the adhesive layer of the said dicing film. Attach film.