JP2008021858A - Adhesive film for dicing/die bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide adhesive giving an adhesion layer superior in low temperature thermo-compression bonding property and superior in reliability, and to provide an adhesive film provided with the adhesion layer for dicing/die bonding. <P>SOLUTION: The film is provided with an adhesive layer 2 laminated on a base layer 1, an adhesive (A) layer 3 laminated on the adhesive layer 2, the base layer 4 laminated on the adhesive (A) layer 3, and an adhesive (B) layer 5 laminated on the base layer 4. Resin constituting the adhesive (A) layer is constituted of (a1) 60 to 95 mass% polyimide resin, and (b1) 40 to 5 mass% of epoxide resin. Resin constituting the adhesive (B) layer is constituted of (a2) 20 to 70 mass% of polyimide resin and (b2) 80 to 30 mass% of epoxide resin whose softening point measured by ring and ball method JIS-K 7234 is not more than 80°C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an improved film for dicing and die bonding in terms of the stickability to a wafer in a dicing process and the reliability of a semiconductor device obtained through the die bonding process.

  With the recent miniaturization of electronic devices, the semiconductor chip mounting substrate is required to be miniaturized, and the thickness of the semiconductor chip itself is also reduced. The adhesive film used to mount the chip on the substrate is required to be pressure-bonded at a low temperature and a low pressure so that the wafer does not warp or crack when it is attached to the wafer in the dicing process. Is done.

  In addition, when the substrate is made of resin, the adhesive layer formed on the substrate in the die bonding process absorbs moisture due to moisture that passes through the resin substrate, and is destroyed by the popcorn phenomenon (water vapor explosion) in the semiconductor device mounting process. Or it may peel from a board | substrate and may impair the reliability of a semiconductor device. Therefore, the adhesive is required to have a low water absorption rate.

  As adhesives, conventionally, siloxane-modified polyimide and polyamideimide in which a siloxane structure is introduced into polyimide or polyamideimide having excellent heat resistance have been proposed (Patent Documents 1 and 2). However, these resins do not have sufficient adhesive strength and heat resistance.

  Further, as a dicing die bond sheet, a sheet in which a thermoplastic polyimide resin is formed on a plastic film substrate is known (Patent Document 3). However, since it is a thermoplastic polyimide resin, it is inferior in crimping properties at low temperatures and low pressures, and has high humidity required for adhesion, particularly wire bonding, sealing, and solder reflow processes, which are semiconductor device manufacturing processes. There are problems such as inadequate adhesion after being placed, adhesion at high temperatures and insufficient strength.

  As a solution to the above problem, a heat-resistant adhesive film containing polyimide silicone and an epoxy resin has been proposed (Patent Documents 4 and 5). Since polyimide silicone does not have a functional group that undergoes a curing reaction, the adhesiveness is improved. Inferior.

  As a silicone resin having a functional group that undergoes a curing reaction, a heat-resistant adhesive film including a polyimide silicone having a phenolic hydroxyl group and an epoxy resin has been proposed (Patent Document 6).

Further, the present inventors have proposed an adhesive tape for dicing and die bonding in which an adhesive film containing polyimide silicone and an epoxy resin is laminated on an adhesive (Japanese Patent Application No. 2005-343957).
Japanese Patent Laid-Open No. 3-189127 JP-A-4-264003 JP 2002-256236 A Japanese Patent Laid-Open No. 7-224259 JP-A-8-27427 Japanese Patent No. 3221756

The dicing / die bonding adhesive is excellent in thermocompression bonding to various substrates at low temperatures. However, it has been found that there is room for further improvement in terms of water absorption. Then, an object of this invention is to provide the adhesive which gives the adhesive layer which is excellent in low-temperature thermocompression bonding property, and is excellent in reliability, and the dicing die-bonding adhesive film provided with this adhesive layer.

That is, the present invention is as follows.
Adhesive layer 2 laminated on base material layer 1, adhesive (A) layer 3 laminated on adhesive layer 2, base material layer 4 laminated on adhesive (A) layer 3, base An adhesive (B) layer 5 laminated on the material layer 4;
The resin constituting the adhesive (A) layer is
(A1) Polyimide resin 60-95 mass%
(B1) Epoxy resin 40-5 mass%
Consists of
The resin constituting the adhesive (B) layer is
(A2) Polyimide resin 20-70 mass%
(B2) Epoxy resin having a softening point of 80 ° C. or less as measured by the ring and ball method JIS-K7234
80-30% by mass
An adhesive film for dicing and die bonding, comprising:

The dicing / die-bonding adhesive film comprises two types of adhesive layers laminated on a pressure-sensitive adhesive layer with a base material layer interposed therebetween, so that low temperature thermocompression bonding to the base material and high reliability of the final semiconductor product can be achieved. Achieve both.

  The adhesive film for dicing and die bonding of the present invention will be described with reference to the drawings. In the present invention, the dicing die-bonding adhesive film includes a dicing die-bonding adhesive sheet and a tape. FIG. 1 is a cross-sectional view of the film of the present invention. In the figure, 1 is a base material layer for an adhesive layer, 2 is an adhesive layer, 3 is an adhesive (A) layer, 4 is an adhesive layer base layer, 5 is an adhesive (B) layer, and 6 is an adhesive layer. It is a cover film. In the dicing process, as shown in FIG. 2, the cover film 6 of FIG. 1 is peeled off, and a silicon wafer is fixed onto the adhesive layer 5 by thermocompression bonding. The cut chips are taken out in a state where the adhesive (A) layer 3, the base material layer 4, and the adhesive (B) layer 5 are attached in the pickup process.

The resin constituting the adhesive (A) layer 3 is
(A1) Polyimide resin 60-95 mass%
(B1) Epoxy resin 40-5 mass%
Consists of
The resin constituting the adhesive (B) layer 5 is:
(A2) Polyimide resin 20-70 mass%
(B2) Epoxy resin having a softening point of 80 ° C. or less as measured by the ring and ball method JIS-K7234 80 to 30% by mass
Consists of.

  The adhesive (A) layer 3 contains (b1) an epoxy resin at 40% by mass, preferably 30% by mass or less, so that the water absorption rate of the adhesive layer after curing is low, and high reliability of the semiconductor product is achieved. be able to. Furthermore, since the base material layer 4 suppresses moisture permeation, moisture permeation to the adhesive layer (B) can be further suppressed. On the other hand, the resin having a softening point of 80 ° C. or less constituting the adhesive (B) layer is contained in an amount of 30 mass or more. The resin also includes a liquid at 25 ° C. By using such a low softening point resin in a predetermined amount or more, it can be pressure-bonded to a silicon wafer at a temperature of 100 ° C. or less. Thus, the dicing die-bonding adhesive film of the present invention achieves both low temperature thermocompression bonding and highly reliable adhesive.

The adhesive (B) layer 5 has a 180 degree peeling force (measured at a peeling speed of 300 mm / min) between the silicon wafer and 180 degree peeling between the adhesive layer 2 and the adhesive (A) layer 3. Since it is configured to be larger than the force (peeling speed 300 mm / min), the diced silicon wafer can be successfully picked up. After the pickup, the adhesive (A) layer 3 is pressure-bonded on the substrate and then cured to bond and fix the silicon chip to the substrate.

  The 180-degree peeling force between the pressure-sensitive adhesive layer 2 and the adhesive (A) layer 3 is preferably 0.05 to 0.7 N / 25 mm, more preferably 0.1 to 0.1 to facilitate chip removal. 0.4 N / 25 mm. If it is smaller than the lower limit value, chip skipping occurs in the dicing process, and if the upper limit value is exceeded, the chip may not be taken out. Note that the 180 degree peel force between the adhesive (B) layer 5 and the silicon wafer is larger than the 180 degree peel force between the adhesive layer 2 and the adhesive (A) layer 3. This can be confirmed by the observation of cohesive failure.

  Examples of the base material layer 4 for the adhesive layer include polyester films such as polyethylene terephthalate films and polybutylene terephthalate films; (meth) acrylic acid copolymer films, vinyl acetate copolymer films, polyether ketones, polyether ether ketones. Polyether sulfone film, polyamide film, polyimide film, polyetherimide film, polycarbonate film, polystyrene film and the like can be used. Those obtained by plasma or corona treatment on the surface of these films, or those obtained by laminating a plurality of types of films may be used. A polyester film and a polyimide film are preferable. These films have low moisture permeability, high heat resistance, and good adhesion to the adhesive (A) layer and (B) layer. The thickness of the film is preferably 1 to 50 μm, more preferably 5 to 30 μm.

  The polyimide resins (a1) and (a2) may be the same. The polyimide resin is represented by the following formula (1).

（式中、Ｘは芳香族又は脂肪族の四価の有機基、Ｙは二価の有機基、ｑは１〜３００の整数である。）

(In the formula, X is an aromatic or aliphatic tetravalent organic group, Y is a divalent organic group, and q is an integer of 1 to 300.)

The polyimide resin may be a polyamic acid resin which is a precursor of the above (1) represented by the following formula (2). However, it is preferable to use the polyimide resin of the above formula (1) because water may be produced as a by-product due to imidization (dehydration ring closure) during heat-curing in the die-bonding process, and peeling of the adhesive surface may occur.

（式中、Ｘは芳香族又は脂肪族の四価の有機基、Ｙは二価の有機基、ｑは１〜３００の整数である。）

(In the formula, X is an aromatic or aliphatic tetravalent organic group, Y is a divalent organic group, and q is an integer of 1 to 300.)

  In the above formulas (1) and (2), q is an integer of 1 to 300, preferably an integer of 2 to 300, particularly an integer of 5 to 300. When q is less than the lower limit, the adhesive strength to the substrate is insufficient, while when the upper limit is exceeded, thermocompression bonding is insufficient.

  The polyamic acid resin represented by the formula (2) has the following structural formula (3)

（但し、Ｘは上記と同様の意味を示す。）
で表されるテトラカルボン酸二無水物と、下記構造式（４）
Ｈ₂Ｎ−Ｙ−ＮＨ₂ （４）
（但し、Ｙは上記と同様の意味を示す。）
で表されるジアミンとを常法に従ってほぼ等モルで有機溶剤中で反応させることによって得られる。

(However, X has the same meaning as described above.)
A tetracarboxylic dianhydride represented by the following structural formula (4)
_{H 2 N-Y-NH 2} (4)
(However, Y has the same meaning as described above.)
It is obtained by reacting the diamine represented by the formula (1) with an approximately equimolar amount in an organic solvent according to a conventional method.

  The following are mentioned as an example of the tetracarboxylic dianhydride represented by the said Formula (3), These 2 or more types of mixtures may be sufficient.

  Among the diamines represented by the above formula (4), preferably 1 to 80 mol%, more preferably 1 to 50 mol% is the following structural formula (5).

（式中、Ｒ²は炭素原子数３〜９の二価の有機基、Ｒ³、Ｒ⁴は、互いに独立に、炭素原子数１〜８の非置換又は置換の一価炭化水素基、ｍは１〜２００の整数である。）
で表されるジアミノシロキサン化合物であることが、有機溶剤への溶解性、基材に対する接着性、柔軟性の点から好ましい。

Wherein R ² is a divalent organic group having 3 to 9 carbon atoms, R ³ and R ⁴ are each independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 8 carbon atoms, m Is an integer from 1 to 200.)
It is preferable from the point of the solubility to an organic solvent, the adhesiveness with respect to a base material, and a softness | flexibility to be represented by these.

R ^{2 in} formula (5) is, for example, — (CH ₂ ) ₃ —, — (CH ₂ ) ₄ —, —CH ₂ CH (CH ₃ ) —, — (CH ₂ ) ₆ —, — (CH _2). ) ₈ - alkylene group such as, following an arylene group,

、これらを組み合わせたベンジレン基等のアルキレン・アリーレン基、−（ＣＨ₂）₃−Ｏ−，−（ＣＨ₂）₄−Ｏ−等のオキシアルキレン基、下記オキシアリーレン基、

, Alkylene / arylene groups such as a benzylene group in combination of these, oxyalkylene groups such as — (CH ₂ ) ₃ —O—, — (CH ₂ ) ₄ —O—, the following oxyarylene groups,

下記オキシアルキレン・アリーレン基、

The following oxyalkylene / arylene group,

等、エーテル結合を含んでもよい二価炭化水素基が挙げられる。

And a divalent hydrocarbon group which may contain an ether bond.

Examples of R ³ and R ⁴ include alkyl groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, hexyl group, cyclohexyl group, 2-ethylhexyl group, and octyl group. , Vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, hexenyl group and other alkenyl groups, phenyl group, tolyl group, xylyl group and other aryl groups, benzyl group, phenylethyl group and other aralkyl groups A group in which some or all of the hydrogen atoms bonded to the carbon atoms of these groups are substituted with halogen atoms such as fluorine, bromine and chlorine, such as chloromethyl, bromoethyl, 3,3,3-tri Examples include halogen-substituted alkyl groups such as a fluoropropyl group. Among them, a methyl group and a phenyl group are preferable. m is an integer of 1 to 200, preferably an integer of 1 to 100, more preferably an integer of 1 to 80.

  Examples of the siloxane diamine compound represented by the general formula (5) include those shown below, and a combination of two or more of these may be used.

  Furthermore, examples of the diamine represented by the above formula (4) other than the above diaminosiloxane compound include p-phenylenediamine, m-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 2 , 2′-bis (4-aminophenyl) propane, 4,4′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl sulfide, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis ( 4-aminophenoxy) benzene, 1,4-bis (p-aminophenylsulfonyl) benzene, 1,4-bis (m-aminophenylsulfonyl) benzene, 1,4-bis (p-aminophenylthioether) benzene, 1 , 4-bis (m-aminophenylthioether) benzene, 2,2-bis [4- ( -Aminophenoxy) phenyl] propane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3-chloro-4- (4-aminophenoxy) phenyl] Propane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3-methyl-4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3- Chloro-4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3,5-dimethyl-4- (4-aminophenoxy) phenyl] ethane, bis [4- (4-aminophenoxy) phenyl] Methane, bis [3-methyl-4- (4-aminophenoxy) phenyl] methane, bis [3-chloro-4- (4-aminophenoxy) phenyl] methane, bis [3,5- Fragrances such as methyl-4- (4-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] sulfone, 2,2-bis [4- (4-aminophenoxy) phenyl] perfluoropropane Group ring-containing diamines and the like, preferably p-phenylenediamine, m-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl ] Propane and the like.

  Moreover, it is preferable that this polyimide resin has a phenolic hydroxyl group from an adhesive point. This hydroxyl group can be obtained by using the thing which has the phenolic hydroxyl group illustrated below as a diamino compound of Formula (4).

（式中、Ｒ⁵は、互いに独立に水素原子又はフッ素、臭素、よう素等のハロゲン原子、あるいは炭素原子数１〜８のアルキル基、アルケニル基、アルキニル基、トリフルオロメチル基、フェニル基等の非置換又は置換の一価炭化水素基である。ここでｎは０〜５の整数である。Ａ，Ｂはそれぞれ２種以上であってもよい。Ｒは水素原子、ハロゲン原子又は非置換もしくは置換の一価炭化水素基である。）

(In the formula, R ⁵ is independently a hydrogen atom or a halogen atom such as fluorine, bromine or iodine, or an alkyl group having 1 to 8 carbon atoms, an alkenyl group, an alkynyl group, a trifluoromethyl group, a phenyl group, etc. In the formula, n is an integer of 0 to 5. A and B may each be two or more, and R is a hydrogen atom, a halogen atom or an unsubstituted group. Or a substituted monovalent hydrocarbon group.)

Examples of R ⁵ include the same as those exemplified for R ³ and R ⁴ above, and alkynyl groups such as ethynyl group, propynyl group, butynyl group, and hexynyl group. R can also be exemplified by those similar to those exemplified for R ⁵ above.

  In addition, it is preferable that the usage-amount of the diamine compound which has this phenolic hydroxyl group is 5-60 mass% of the whole diamine compound, especially 10-40 mass%. If the amount is too small, the adhesive strength may be low, and if it is too large, the strength of the adhesive layer may be insufficient.

  Moreover, a monoamine can also be used for introduction | transduction of a phenolic hydroxyl group, and the following structure can be illustrated.

（式中、Ｒ⁵は上述のとおりであり、Ｄは２種の混合であってもよい。また、ｐは１〜３の整数である。）

(Wherein R ⁵ is as described above, D may be a mixture of two kinds, and p is an integer of 1 to 3).

  The polyamic acid resin and the polyimide resin are formed by dissolving the above-mentioned starting materials in a solvent under an inert atmosphere and usually reacting at 80 ° C. or lower, preferably 0 to 40 ° C. to synthesize a polyamic acid resin. . By heating the obtained polyamic acid resin to 100 to 200 ° C., preferably 150 to 200 ° C., the acid amide portion of the polyamic acid resin can be dehydrated and cyclized to synthesize the target polyimide resin. .

The organic solvent used for the reaction may not be one that can completely dissolve the starting material as long as it does not react with the polyamic acid obtained. Examples include tetrahydrofuran, 1,4-dioxane, cyclopentanone, cyclohexanone, γ-butyrolactone, N-methylpyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide and dimethyl sulfoxide, preferably aprotic Polar solvents, particularly preferably N-methylpyrrolidone, cyclohexanone and γ-butyrolactone. These solvents can be used alone or in combination of two or more.

  In order to facilitate the dehydration ring closure, it is desirable to use an azeotropic dehydrating agent such as toluene or xylene. Further, dehydration ring closure can be performed at a low temperature using an acetic anhydride / pyridine mixed solution.

  In order to adjust the molecular weight of the resin, dicarboxylic anhydrides such as maleic anhydride and phthalic anhydride and / or aniline, n-butylamine, and monoamines having the above-described phenolic hydroxyl groups may be added. . However, the addition amount of dicarboxylic acid anhydride is usually 0 to 2 parts by mass per 100 parts by mass of dicarboxylic dianhydride, and the addition amount of monoamine is usually 0 to 2 parts by mass per 100 parts by mass of diamine. It is.

  The adhesive (A) layer contains the polyimide resin in an amount of 60 to 95% by mass, preferably 70 to 90% by mass, based on the total mass of the resin constituting the layer. The adhesive (B) layer is contained in an amount of 20 to 70% by mass, preferably 30 to 60% by mass, based on the total mass of the resin constituting the layer.

  As the (b1) epoxy resin contained in the resin constituting the adhesive (A) layer 3, a wide variety of epoxy resins can be used, and an epoxy resin having a softening point exceeding 80 ° C. may be used. (B2) is also included. For example, bis (4-hydroxyphenyl) methane, 2,2′-bis (4-hydroxyphenyl) propane or diglycidyl ether of this halide and polycondensates thereof (so-called bisphenol F type epoxy resin, bisphenol A type epoxy) Resin), butadiene diepoxide, vinylcyclohexene dioxide, resorcin diglycidyl ether, 1,4-bis (2,3-epoxypropoxy) benzene, 4,4′-bis (2,3-epoxypropoxy) diphenyl ether, 1,4-bis (2,3-epoxypropoxy) cyclohexene, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 1,2-dioxybenzene or resorcinol, polyhydric phenol or polyhydric alcohol and epichlorohydrin Epoxy novolac (ie, novolak type) obtained by condensing novolak-type phenolic resin (or halogenated novolak-type phenolic resin) such as epoxy glycidyl ether or polyglycidyl ester, phenol novolak, cresol novolak, etc. obtained by condensation of Epoxy resin), epoxidized polyolefin epoxidized by peroxidation method, epoxidized polybutadiene, epoxy resin containing naphthalene ring, biphenyl type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, cyclopentadiene type epoxy resin and these A mixture is mentioned. Preferably, a resin having at least two epoxy groups in one molecule is used.

  As the (b2) epoxy resin component of the adhesive (B) layer, a resin having a softening temperature of 80 ° C. or lower including an epoxy resin that is liquid at 25 ° C. is used. Examples of these resins include the aforementioned bis (4-hydroxyphenyl) methane, 2,2′-bis (4-hydroxyphenylpropane), bisphenol F type epoxy resin, bisphenol A type epoxy resin, etc .; resorcin, hydroquinone and methyl Diglycidyl ethers such as resorcin; 1,4-bis (2,3-epoxypropoxy) benzene, 4,4′-bis (2,3-epoxypropoxy) diphenyl ether and hydrogenated products thereof, butadiene diepoxide, vinylcyclohexene Dioxide, 1,4-bis (2,3-epoxypropoxy) cyclohexene, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 1,2-dioxybenzene or resorcinol, and mixtures thereof It is done.

  The amount of the (b1) epoxy resin in the adhesive (A) layer 3 is preferably 5 to 40% by mass, more preferably 10%, based on the total mass of (a1) the polyimide resin and (b) the epoxy resin. -30 mass%. If the blending amount of the epoxy resin is less than the lower limit value, the adhesive strength may be inferior, and if it exceeds the upper limit value, the water absorption rate may increase and the reliability of the semiconductor product may be impaired. Moreover, the compounding quantity of (b2) epoxy resin of the adhesive agent (B) layer 5 is 80-30 mass% with respect to the total mass part of the polyimide resin of (a2) component, and the epoxy resin of (b2) component. Preferably, it is 70 to 40% by mass. When the blending amount of the epoxy resin is less than the lower limit value, the low temperature thermocompression bonding property and the adhesive strength may be inferior, and when the upper limit value is exceeded, the reliability of the semiconductor product may be impaired.

  Incidentally, (b1) epoxy resin and (b2) epoxy resin may be used in combination with a monoepoxy compound as appropriate. Examples of the monoepoxy compound include styrene oxide, cyclohexene oxide, propylene oxide, methyl glycidyl ether, and ethyl glycidyl ether. , Phenyl glycidyl ether, allyl glycidyl ether, octylene oxide, dodecene oxide and the like. Moreover, the epoxy resin to be used is not necessarily limited to only one type, and two or more types can be used in combination.

Moreover, you may add the hardening | curing agent of an epoxy resin to the adhesives (A) and (B) of this invention to such an extent that the characteristic is not impaired. As this curing agent, conventionally known various curing agents for epoxy resins can be used, for example, diethylenetriamine, triethylenetetramine, diethylaminopropylamine, N-aminoethylpiperazine, bis (4-amino). Amine compounds such as -3-methylcyclohexyl) methane, metaxylyleneamine, menthanediamine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro (5,5) undecane Epoxy resins-modified aliphatic polyamines such as diethylenetriamine adducts, amine-ethylene oxide adducts, cyanoethylated polyamines; bisphenol A, trimethylolallyloxyphenol, low polymerization degree phenol novolac resins, epoxidized or butylated pheno Resin or “Super Beckite 1001”, manufactured by Nippon Reichhold Chemical Co., Ltd., “Hitanol 4010”, manufactured by Hitachi, Ltd., “Scado form L.9”, manufactured by Scado Zwoll, Netherlands, “Methylon 75108”, USA A phenolic resin containing at least two phenolic hydroxyl groups in the molecule, such as a phenolic resin known by a trade name such as that manufactured by General Electric Co., Ltd .; “Beckamine P.138”, manufactured by Nippon Reichhold Chemical Co., Ltd. , “Melan”, manufactured by Hitachi, Ltd., “U-Van 10R”, manufactured by Toyo Koatsu Kogyo Co., Ltd., and other carbon resins; amino resins such as melamine resins and aniline resins; HS (C ₂ H ₄ OCH ₂ OC ₂ H ₄ SS) _n C ₂ H ₄ OCH ₂ A polysulfide resin having at least two mercapto groups in one molecule as represented by OC ₂ H ₄ SH (n = 1 to 10); phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, pyro Examples include merit acid, methyl nadic acid, organic acid such as dodecyl succinic anhydride and chlorendic anhydride, or anhydrides thereof (acid anhydrides). Among the curing agents described above, the phenolic resin (phenol novolac resin) gives good molding workability to the composition of the present invention, provides excellent moisture resistance, is non-toxic and relatively inexpensive. Is desirable. The above-described curing agents are not necessarily limited to one type in use, and two or more types may be used in combination according to the curing performance of the curing agents. The blending amount is not particularly limited as long as the desired physical properties can be obtained.

  As the (c) epoxy resin curing catalyst used in the present invention, any one can be used. For example, examples of the phosphorus catalyst include triphenylphosphine, triphenylphosphonium triphenylborate, tetraphenylphosphonium tetraphenylborate and the following compounds.

（式中、Ｒ⁶〜Ｒ¹³は、互いに独立に、水素原子又はフッ素、臭素、よう素などのハロゲン原子、あるいは炭素原子数１〜８のアルキル基、アルケニル基、アルキニル基、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基等の炭素数１〜８のアルコキシ基、トリフルオロメチル基、フェニル基などの非置換もしくは置換の一価炭化水素基である。）

(In the formula, R ^{6 to} R ¹³ are each independently a hydrogen atom or a halogen atom such as fluorine, bromine or iodine, or an alkyl group, alkenyl group, alkynyl group, methoxy group, ethoxy group having 1 to 8 carbon atoms. An unsubstituted or substituted monovalent hydrocarbon group such as an alkoxy group having 1 to 8 carbon atoms such as a group, a propoxy group, an isopropoxy group or a butoxy group, a trifluoromethyl group or a phenyl group.)

  Examples of the amine catalyst include imidazole derivatives such as dicyandiamide, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole. It is done.

  The epoxy resin curing catalyst in the present invention can be used alone or in combination of two or more thereof. In addition, the compounding quantity of (c) epoxy resin curing catalyst can be made into a catalyst quantity, and is 0.05-10 mass parts normally with respect to 100 mass parts of resin components, Preferably it is 0.5-5 mass parts. .

  Furthermore, the adhesive composition includes fillers such as silica fine powder, alumina, titanium oxide, carbon black, silicone fine particles, and conductive particles, inorganic or organic, within a range not impairing the effects of the present invention. Colorants such as pigments and dyes, additives such as wetting improvers, antioxidants and heat stabilizers can be added depending on the purpose.

The fine silica powder is preferably spherical and has an average particle size of 0.1 μm to 10 μm, preferably 5 μm to 0.5 μm, and a maximum particle size of 20 μm or less. The silica particles are preferably surface-treated with an organosilicon compound having an epoxy group. For example, SE-2050, SC-2050, SC-2050, SE-1050, SO-E1, SO-C1, SO-E2, SO-C2, SO-E3, SO-C3, SO, manufactured by Admatechs Co., Ltd. -E5, SO-C5 and the like are exemplified, and a mixture thereof may be used. The compounding amount of the silica particles is preferably 20 to 70% by mass, particularly 30 to 65% by mass, based on the total mass of the composition.

Preferably, composite silicone rubber fine particles are contained together with silica fine powder. The composite silicone fine particles can be prepared, for example, according to the method described in JP-A-7-196815. That is, an alkaline substance or an alkaline aqueous solution and an organotrialkoxysilane are added to an aqueous dispersion of spherical silicone rubber fine particles having an average particle size of 0.1 to 10 μm, and the organotrialkoxysilane is added on the surface of the spherical silicone rubber fine particles. Hydrolyze and polymerize, then dry it. As the composite silicone fine particles, for example, KMP-600, KMP-605, X-52-7030 and the like manufactured by Shin-Etsu Chemical Co., Ltd. can be used. A mixture of two or more of these can also be used. The composite silicone fine particles have an average particle size of 0.1 to 10 μm, preferably 0.5 to 5 μm. If the average particle size exceeds this range, the smoothness of the surface state of the adhesive film of the present invention may be impaired. The compounding quantity of a composite silicone particle is 5-30 mass% of a composition total mass, Preferably it is 10-20 mass%. Outside these ranges, it is difficult for the adhesive to be pressure-bonded at low temperatures and low pressures, and the linear expansion coefficient of the cured product may increase.

  The composition for an adhesive layer can be prepared by mixing each of the above polyimide resins, each epoxy resin, an epoxy resin curing catalyst, and, if necessary, other components according to a conventional method.

A solution obtained by dissolving the adhesive composition obtained above in an aprotic polar solvent such as toluene, cyclohexanone, or NMP at an appropriate concentration is applied to both sides of the film constituting the base material layer 4, respectively. ) Layer 3 and adhesive (B) can be applied to prepare an adhesive layer. The adhesive (A) layer 3 and the adhesive (B) may be applied simultaneously or in any order. Alternatively, each adhesive composition is placed on a release substrate such as polyethylene, polypropylene, polyester, polyamide, polyimide, polyamideimide, polyetherimide, polytetrafluoroethylene, paper, or metal foil whose surface has been release-treated. The composition can be applied, dried, and then laminated onto the film of the base layer 4. The release substrate used when laminating the five layers of the adhesive (B) may be left as a protective film 6. The film thickness of the adhesive (B) layer 5 is usually 10 to 100 μm. Moreover, as drying conditions of each adhesive composition, it is preferable to set it as normal temperature -200 degreeC, especially 80-150 degreeC for 1 minute-1 hour, especially 3-10 minutes.

  In the adhesive film for dicing / die bonding of the present invention, an adhesive film having the adhesive (A) and (B) layers on both sides is laminated on a base material 1 on an adhesive layer 2. As the base material layer 1, polyolefin films such as polyethylene, polypropylene, polybutadiene film, polybutene film, polymethylpentene film, polyvinyl chloride film, and copolymer films thereof; polyester such as polyethylene terephthalate film and polybutylene terephthalate film Film; (meth) acrylic acid copolymer film, vinyl acetate copolymer film, polyether ketone film, polyether ether ketone film, polyether sulfone film, polyamide film, polyimide film, polyetherimide film, polycarbonate film, A polystyrene film or the like can be used. Moreover, what cross-linked these, the thing which plasma or corona-treated the surface, and laminated | stacked these films or another film may be used. Among these, a polyethylene film, a polypropylene film, and a copolymer thereof are preferable in that the base material is stretched (expanded) after the dicing step so that the cut chip can be easily isolated. . Although the film thickness of this base film is suitably adjusted depending on the kind of film and the drawability requested | required, it is typically 20-400 micrometers, Preferably it is 30-150 micrometers.

  The pressure-sensitive adhesive layer 2 laminated on the base material layer 1 has adhesiveness with a dicing frame so that chip skipping does not occur in the dicing process, and as described above, the adhesive layer (A) and The 180 degree peeling force between them is preferably 0.05 to 0.7 N / 25 mm, more preferably 0.1 to 0.4 N / 25 mm. This adhesive layer 2 can be comprised from the well-known adhesive with the said adhesiveness and peelability. Examples of the pressure-sensitive adhesive include rubber-based pressure-sensitive adhesives, acrylic pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, and silicone-based pressure-sensitive adhesives. Alternatively, an adhesive whose adhesive strength is reduced by ultraviolet irradiation may be used. Preferably, an acrylic adhesive, a urethane adhesive, or a silicone adhesive is used. Moreover, it is preferable that the thickness of the adhesion layer is 5-100 micrometers, More preferably, it is 10-50 micrometers.

The dicing frame may be a commonly used stainless steel product. If the adhesive strength is less than the lower limit, the pressure-sensitive adhesive layer 2 and the dicing frame may be peeled off during pressure bonding to the wafer and dicing. Preferably, the adhesive strength is 0.8 N / 25 mm or more.

As the silicone-based pressure-sensitive adhesive, a heat-curable pressure-sensitive adhesive containing a linear organopolysiloxane and a solid silicone resin can be used. As the thermosetting silicone adhesive, there are an organic peroxide curing type and a platinum addition curing type.

The organic peroxide curable silicone pressure-sensitive adhesive is composed of a linear organopolysiloxane, a (R ¹ ₃ SiO _1/2 ) unit and a (SiO ₂ ) unit (R ¹ is a substituted or unsubstituted monovalent hydrocarbon. A mixture of an organopolysiloxane copolymer resin (having a molar ratio of (R ¹ ₃ SiO _1/2 ) units to (SiO ₂ ) units of 0.5 to 1.5), and a crosslinking curing agent It contains an organic peroxide such as benzoyl peroxide, bis (4-methylbenzoyl) peroxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane. The platinum addition type silicone pressure sensitive adhesive includes linear vinyl group-containing organopolysiloxane, the organopolysiloxane copolymer resin, organohydrogenpolysiloxane containing silicon-bonded hydrogen atoms as a crosslinking curing agent, and catalyst. It contains a platinum group metal catalyst such as chloroplatinic acid, alcohol-modified chloroplatinic acid, platinum olefin complex, platinum and vinylsiloxane complex. It is preferable to use a platinum addition-curing type silicone pressure-sensitive adhesive that is relatively curable at a low temperature. By controlling the degree of curing, the adhesive force with the adhesive can be controlled.

  The manufacturing method of the adhesive sheet for dicing die-bonding of this invention is demonstrated. First, the above-mentioned pressure-sensitive adhesive is applied onto the film substrate 1, and dried or cured by heat to form the pressure-sensitive adhesive layer 2 (hereinafter referred to as a pressure-sensitive adhesive film).

  The pressure-sensitive adhesive layer 2 surface of the pressure-sensitive adhesive film thus obtained and the adhesive film provided with the adhesive layer on both sides obtained as described above were cut into a circle whose outer diameter was smaller than the inner diameter of the dicing frame. The adhesive film for dicing and die bonding of the present invention can be obtained by facing the surface of the adhesive layer (A) of the material and pressing it. Here, the conditions for pressure-bonding the adhesive film and the adhesive film are preferably 0.01 to 2 MPa, particularly 0.1 to 1 MPa at room temperature. The adhesive film does not need to be circular as long as the wafer is fixed, and the shape of the adhesive film is circular as long as it fits within the dicing frame and can be fixed during the dicing process. There is no need to be.

  In the method of using the adhesive film for dicing / die bonding according to the present invention, if there is a cover film 6 on the adhesive (B) layer 5, it is peeled off, the adhesive (B) layer 5 is applied to the wafer, and the adhesive layer. 2 is fixed to the dicing frame by pressure bonding or thermocompression bonding. The thermocompression bonding conditions can be selected depending on the composition of the adhesive (B) layer 5, but is usually 100 ° C. or lower. Desirably, it is 80 degrees C or less. Next, after fixing to the dicing apparatus and picking up the cut chip after dicing, the chip is peeled off at the interface between the adhesive (A) layer 3 and the pressure-sensitive adhesive layer 2, and the chip to which the adhesive film is attached is taken out. The chip is bonded to the semiconductor device substrate by thermocompression and then heat-cured. The thermocompression bonding conditions can be 80 ° C to 250 ° C. Moreover, although heat-hardening conditions can be selected with the composition of an adhesive bond layer, it is 120-250 degreeC normally. Alternatively, after the chip is thermocompression-bonded, wire-bonded, and resin-sealed to a semiconductor device substrate, it can be simultaneously cured by post-curing of the sealing resin. This temperature is 150-250 ° C.

The adhesive film for dicing and die bonding of the present invention can be used not only in the production of semiconductor devices but also in the production processes of various devices involving adhesion and dicing.

EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples and comparative examples, but the present invention is not limited to the following examples.

で示されるジメチルジアミノポリシロキサン−１ ５１．２８質量部（アミン当量６４１）を、２−メチルピロリドン５０質量部に分散させた溶液を滴下して室温にて１時間撹拌反応させることにより、酸無水物リッチのアミック酸オリゴマーを合成した。 Synthesis of polyimide resin-I Into a 1 L separable flask equipped with a 25 ml water quantitative receiver, thermometer, and stirrer connected to a reflux condenser, 3, 3 ', 4 as acid anhydride , 4'-benzophenonetetracarboxylic dianhydride 150 parts by mass of 2-methylpyrrolidone was charged using 32.2 parts by mass as a reaction solvent, and the acid anhydride was dispersed by stirring. Following formula

A solution obtained by dispersing 51.28 parts by mass of dimethyldiaminopolysiloxane-1 represented by the formula (amine equivalent 641) in 50 parts by mass of 2-methylpyrrolidone was added dropwise and reacted by stirring at room temperature for 1 hour, thereby allowing acid anhydride. A product-rich amic acid oligomer was synthesized.

に示すフェノール性水酸基を有する芳香族ジアミン（フェノールジアミン−１）２９．６８質量部と２−メチルピロリドン１４０質量部を滴下した後、室温で１６時間撹拌し、ポリアミック酸溶液を合成した。その後、トルエン８０ｍｌを投入してから温度を上げ、約１８０℃で４時間還流させた。水分定量受器に所定量の水がたまっていること、水の流出が見られなくなっていることを確認し、水分定量受器にたまっている流出液を除去しながら、１８０℃でトルエンを除去した。反応終了後、大過剰のメタノール中に得られた反応液を滴下してポリマーを析出させ、減圧乾燥して骨格中にフェノール性の水酸基を有するポリイミド樹脂−Ｉを得た。得られた樹脂の赤外吸光スペクトルを測定したところ、未反応の官能基があることを示すポリアミック酸に基づく吸収は現れず、１７８０ｃｍ^-1及び１７２０ｃｍ^-1にイミド基に基づく吸収を確認し、３５００ｃｍ^-1にフェノール性水酸基に基づく吸収を確認した。テトラヒドロフランを溶媒とするゲル浸透クロマトグラフィー（ＧＰＣ）にて本樹脂の重量平均分子量（ポリスチレン換算）を測定したところ、５６，０００であった。 Next, the following formula

After dropping 29.68 parts by mass of an aromatic diamine having a phenolic hydroxyl group (phenol diamine-1) and 140 parts by mass of 2-methylpyrrolidone, the mixture was stirred at room temperature for 16 hours to synthesize a polyamic acid solution. Thereafter, 80 ml of toluene was added, the temperature was raised, and the mixture was refluxed at about 180 ° C. for 4 hours. After confirming that a predetermined amount of water has accumulated in the moisture meter and that no water has flowed out, remove toluene at 180 ° C while removing the effluent accumulated in the meter. did. After completion of the reaction, the reaction solution obtained in a large excess of methanol was added dropwise to precipitate a polymer, which was dried under reduced pressure to obtain a polyimide resin-I having a phenolic hydroxyl group in the skeleton. When the infrared absorption spectrum of the obtained resin was measured, absorption based on polyamic acid indicating that there was an unreacted functional group did not appear, and absorption based on an imide group was confirmed at 1780 cm ⁻¹ and 1720 cm ⁻¹ . Absorption based on a phenolic hydroxyl group was confirmed at 3500 cm ⁻¹ . It was 56,000 when the weight average molecular weight (polystyrene conversion) of this resin was measured by the gel permeation chromatography (GPC) which uses tetrahydrofuran as a solvent.

Synthesis of polyimide resin-II In Synthesis Example 1, instead of 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, 6FDA (2,2-bis (3,4-dicarboxyphenyl) was used. ) Hexafluoropropane) 44.4 parts by mass, instead of dimethyldiaminopolysiloxane-1, dimethyldiaminopolysiloxane-2 (amine equivalent 407) 56.98 parts by mass of phenoldiamine-1 having a phenolic hydroxyl group Instead, as an aromatic diamine: 12.3 parts by mass of BAPP (2,2-bis [4- (4-aminophenoxy) phenyl] propane) and 340 parts by mass of 2-methylpyrrolidone as a reaction solvent ( According to Synthesis Example 1 except that the total amount) was used, polyimide resin-II having no phenolic hydroxyl group in the skeleton was obtained. . Similarly, the molecular weight was measured and found to be 72,000.

Preparation of polyimide resin solution 40 parts by mass of polyimide resins 1 and 2 obtained in Synthesis Examples 1 and 2 were dissolved in 60 parts by mass of cyclohexanone to obtain a polyimide resin solution.

In the preparation solution of the adhesive composition, the epoxy resin, catalyst, silica, and composite silicone rubber fine particles shown in Table 1 below are blended in the amounts shown in the same table, and a rotating / revolving mixer (manufactured by Sinky Corporation). To prepare each composition of the adhesive (A) layer and the adhesive (B) layer.

Production of Adhesive Film Each of the adhesives (A) and (B) obtained above was applied to a 50 μm thick PET film coated with a fluorosilicone release agent, and heated and dried at 120 ° C. for 15 minutes. About 20 μm of adhesive (A) and (B) layers were formed. These adhesive layers were thermocompression bonded to both surfaces of the film of the base material layer 1 in the combinations shown in Table 1 to produce an adhesive film. These adhesive films I to IX are used. Without peeling off the PET film, the adhesive (A) layer side is peeled off when bonded to an adhesive film to be described later, and the adhesive (B) side is peeled off as a protective film when a silicon wafer is thermocompression bonded. It peeled.

Preparation of silicone adhesives I-II [Preparation Example 1]
33.33 parts by mass of a toluene solution containing 60% by mass of a methylpolysiloxane resin consisting of 1.1 mol of (CH ₃ ) ₃ SiO _1/2 units and 1 mol of SiO ₂ units, 100 g of vinyl groups at the ends and side chains 80 parts by mass of raw rubber-like dimethylpolysiloxane having a degree of polymerization of 2,000 having 0.002 mol per mole and 172 parts by mass of toluene are dissolved until uniform, and then silicon-bonded hydrogen atoms having the following structure are added to this mixed solution. An organopolysiloxane compound having 0.68 parts by mass and 3-methyl-1-butyn-3-ol 0.24 parts by mass as a reaction inhibitor were mixed, and then the mixture was mixed with chloroplatinic acid such that the platinum amount was 40 ppm. A silicone pressure-sensitive adhesive composition-I was prepared by mixing with 2-ethylhexanol-modified solution.

[Preparation Example 2]
According to Preparation Example 1, 50 parts by mass of a toluene solution containing 60% by mass of a methylpolysiloxane resin consisting of 1.1 mol of (CH ₃ ) ₃ SiO _1/2 units and 1 mol of SiO ₂ units, terminal and side chains 70 parts by weight of a raw rubber-like dimethylpolysiloxane having a degree of polymerization of 2,000 having 0.002 moles of vinyl groups per 100 g, 165.7 parts by weight of toluene, and an organopolysiloxane compound having a silicon atom-bonded hydrogen atom having the above structure. A silicone adhesive composition comprising 64 parts by mass, 0.24 parts by mass of 3-methyl-1-butyn-3-ol as a reaction inhibitor and a 2-ethylhexanol-modified solution of chloroplatinic acid so that the platinum amount is 40 ppm. Product-II was prepared.

Production of pressure-sensitive adhesive film The silicone pressure-sensitive adhesive compositions I and II were each applied onto 100 μm-thick unstretched polyethylene (LDP) and heated at 100 ° C. for 10 minutes to form a 15 μm-thick silicone pressure-sensitive adhesive layer. Silicone adhesive films I and II were prepared.

Preparation of dicing die bond sheet (Examples 1-6, Reference Examples 1-3)
The dicing die-bonding films were prepared by pressing the pressure-sensitive adhesive layer surface of the silicone pressure-sensitive adhesive film obtained above and the adhesive (A) layer surface of the adhesive film with a combination shown in Table 1 with a load of 2 kg and a width of 300 mm.

Comparative Example 1
On the pressure-sensitive adhesive layer I, a dicing die-bonding film made of only one adhesive layer made of the resin shown in Table 1 was prepared.

  Measurement of glass transition point, Young's modulus, and moisture absorption rate of cured product obtained from adhesives (A) and (B) alone, and thermocompression bonding to wafer using each dicing die bond sheet, silicon substrate And adhesion to the BT substrate, 180 degree peeling force between the pressure-sensitive adhesive layer 2 and the adhesive (A) layer, dicing and chip removal, and reliability evaluation of the package after resin sealing, respectively, as shown below Went according to. Tables 1 and 2 show these results.

Release property of adhesive layer (B) from silicon wafer The composition (B) of each adhesive layer obtained above was applied onto a polyimide film (Kapton) having a thickness of 50 μm, and the adhesive layer (B) was 15 at 120 ° C. Heat drying for minutes to form an adhesive layer of about 20 μm. The tape was cut into a 25 mm width, and these adhesive layers were thermocompression bonded to a silicon wafer at 60 ° C. to prepare test samples. The sample was allowed to stand for 24 hours under constant temperature and humidity of 25 ± 2 ° C. and 50 ± 5% RH, and then the peel strength at 180 ° was measured at a peel rate of 300 mm / min. Those showing cohesive failure were marked with “◯”, and those not showing with “x”.

Moisture absorption rate Each adhesive composition was molded to a thickness of 100 μm, and five adhesive layers were laminated by thermocompression bonding so as to have a thickness of about 0.5 mm, followed by heat curing at 175 ° C. for 4 hours. A 50 mm × 50 mm × 0.5 mm film was cut out from the cured product and held for 168 hours under the condition of 85 ° C./85% RH, and then the moisture absorption rate was measured by mass change.

Glass transition point,
The adhesive film was heat treated at 175 ° C. for 2 hours, dried and cured. For each of the adhesive layers (A) and (B), a 20 mm × 5 mm × 50 μm film was cut out and the glass transition point was measured. For the measurement, a thermomechanical measuring device, TMA-2000 (manufactured by ULVAC-RIKO) is used, and in a tensile mode, glass is measured under conditions of a distance between chucks of 15 mm, a measuring temperature of 25 to 300 ° C., a heating rate of 5 ° C./min and a measuring load of 3 g The transition point was measured.

Young's modulus Each adhesive layer obtained above was cured by heating at 175 ° C. for 4 hours. A 40 mm × 10 mm × 50 μm film was cut out, and the Young's modulus was measured using a dynamic viscoelasticity measuring device in a tensile mode under conditions of a distance between chucks of 10 mm, a measurement temperature of 25 ° C., and a measurement frequency of 1 Hz.

Adhesion Test A dicing die bond film was thermocompression bonded to a 450 μm 6-inch silicon wafer and then diced to 2 mm × 2 mm. A silicon chip with an adhesive film on the back surface is taken out, and a 10 mm × 10 mm resist AUS303 (manufactured by Unitechno Co., Ltd.) is applied and cured on a BT substrate and a silicon substrate under the conditions of 170 ° C. and 0.1 MPa, respectively. It was fixed by thermocompression for 2 seconds. The obtained test body was heated at 175 ° C. for 4 hours to cure the adhesive layer, and an adhesive test piece was produced. The shear adhesive strength at 240 ° C. was measured with a bond tester (manufactured by DAGE, 4000PXY).

Measurement of 180 degree peeling force (peeling force A) between the pressure-sensitive adhesive layer 2 and the adhesive (A) layer The dicing / die-bonding sheet obtained above was cut into a tape having a width of 25 mm, and the adhesive layer ( The cover film (PET) on the B) side was peeled off, and the adhesive layer (B) surface was thermocompression bonded to the wafer m) at 60 ° C. and 0.01 MPa for 5 seconds. After leaving this test body under constant temperature and humidity of 25 ± 2 ° C. and 50 ± 5% RH for 24 hours, the end of the adhesive film was peeled off from the adhesive layer and turned back to 180 °, and at a speed of 300 mm / min. The peel force when peeled off was measured.

Dicing and chip removal test The cover film on the adhesive layer (B) side of the adhesive film of the dicing die bond sheet obtained above was peeled off (PET), and the film pasting device (FM-114) manufactured by Technovision And thermocompression bonded to a 75 μm 8-inch wafer at 60 ° C. (roll pressure, 2 kg). This was diced into 10 mm square chips, and the chips were taken out with a die bonder device (BESTEM-D02-TypeC) manufactured by NEC Machinery. In the table, “o” indicates that the chip did not fly during dicing, “o” indicates that the chip could be removed without any problem, and “x” indicates that the chip was not removed.

Thermocompression bonding The dicing die-bonding film obtained above was cut into a width of 25 mm × 200 mm, and this was thermocompression bonded to the mirror surface side of the wafer with a roll at a temperature of 60 ° C. Next, the pressure-sensitive adhesive layer 2 was peeled from the adhesive (A) layer, and the presence or absence of peeling of the adhesive (B) layer from the wafer surface was confirmed. When the pressure-sensitive adhesive layer is peeled off, the film from which the adhesive layer is also peeled off means that the thermocompression bonding property to the wafer is poor. This is represented by “x” in Table 1. When the adhesive layer is peeled off, the film peeled off from the interface with the adhesive layer can be taken out with the adhesive layer attached to the chip when the chip is taken out. It means that it is suitable as. This is represented by “◯” in Table 1.

Reliability of Package After Resin Sealing The dicing die bond film was thermocompression bonded to a 75 μm 8-inch silicon wafer, then diced to cut the silicon wafer into 8 mm × 8 mm. This silicon chip is thermocompression-bonded on a 250 μm resin substrate (BT substrate on which resist AUS303 has been applied and cured) in a map at 0.1 MPa and 170 ° C. for 1 second, and then 600 μm thick from the resin substrate. The resin was sealed with a molding material KMC2500VA-T1 (manufactured by Shin-Etsu Chemical Co., Ltd.) (175 ° C., sealing pressure 6.9 MPa, 90 seconds), and then heat-cured at 175 ° C. for 4 hours. A total of 10 separated packages were held for 192 hours under the condition of 60 ° C./60% RH, then passed through a reflow furnace at 260 ° C. three times, and then the presence or absence of peeling was observed with an ultrasonic image measuring device.

Resins and the like in Table 1 are as follows.
Epoxy resin 1: RE-310S (Nippon Kayaku Co., Ltd.): Liquid resin epoxy resin 2: NC-7000L (Nippon Kayaku Co., Ltd.): Softening point 83-93 ° C
Epoxy resin 3: NC-3000 (manufactured by Nippon Kayaku Co., Ltd.): Softening point 53-63 ° C
Dicyandiamide (Japan Epoxy Resin)
Spherical silica: SE-2050MA (manufactured by Admatechs, average particle size 0.5 μm)
Silicone rubber powder: X-52-7030 (manufactured by Shin-Etsu Chemical Co., Ltd., average particle size 0.7 μm)

  Comparative Example 1 has a single-layer structure including an epoxy resin, and has no base material layer 4. Therefore, the hygroscopic property is high and the reliability is inferior. In Reference Example 1, the content of (b2) epoxy resin was too small to achieve the desired thermocompression bonding property. In Reference Example 2, the amount of (b1) epoxy resin was too large, and the desired reliability was not obtained. In Reference Example 3, the softening point of the epoxy resin in the adhesive (B) was high, and the desired thermocompression bonding property could not be achieved. On the other hand, the dicing die-bonding film of the example showed thermocompression bonding property and reliability.

The dicing die bond film of the present invention has both low temperature thermocompression bonding and package reliability and is suitable for semiconductor manufacturing.

It is sectional drawing which shows an example of the dicing die-bonding film of this invention. It is sectional drawing which shows an example of the state which fixed the silicon wafer and the dicing frame to the dicing die-bonding film of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material layer 2 Adhesive layer 3 Adhesive (A) layer 4 Base material layer 5 Adhesive (B) layer 6 Protective film 7 Wafer 8 Dicing frame

Claims (9)

Adhesive layer 2 laminated on base material layer 1, adhesive (A) layer 3 laminated on adhesive layer 2, base material layer 4 laminated on adhesive (A) layer 3, base An adhesive (B) layer 5 laminated on the material layer 4;
The resin constituting the adhesive (A) layer is
(A1) Polyimide resin 60-95 mass%
(B1) Epoxy resin 40-5 mass%
Consists of
The resin constituting the adhesive (B) layer is
(A2) Polyimide resin 20-70 mass%
(B2) Epoxy resin having a softening point of 80 ° C. or less as measured by the ring and ball method JIS-K7234
80-30% by mass
An adhesive film for dicing and die bonding, comprising:   (B2) The adhesive film for dicing and die bonding according to claim 1, wherein the epoxy resin having a softening point of 80 ° C. or less measured by the ring and ball method JIS-K7234 is a liquid resin at 25 ° C.   The adhesive (A) contains 0.05 to 10 parts by mass of (c) an epoxy resin curing catalyst with respect to 100 parts by mass in total of (a1) polyimide resin and (b1) epoxy resin. The adhesive film for dicing and die bonding according to 2.   The adhesive (B) contains 0.05 to 10 parts by mass of (c) an epoxy resin curing catalyst with respect to 100 parts by mass in total of (a2) polyimide resin and (b2) epoxy resin. 4. The adhesive film for dicing / die bonding according to any one of 3 above. The adhesive film for dicing and die bonding according to claim 1, wherein the base material layer 4 is made of a polyimide film or a polyester film. The adhesive film for dicing and die bonding according to any one of claims 1 to 5, wherein the thickness of the base material layer 4 is 30 µm or less. The adhesive film for dicing / die bonding according to any one of claims 1 to 6, wherein (a1) polyimide resin and / or (a2) polyimide resin is a polyimide silicone resin having a phenolic hydroxyl group. The 180 degree peeling force measured at a peeling speed of 300 mm / min between the pressure-sensitive adhesive layer 2 and the adhesive (A) layer 3 is 0.05 to 0.7 N / 25 mm. The adhesive film for dicing and die bonding according to any one of the preceding claims.   The adhesive film for dicing and die bonding according to any one of claims 1 to 8, wherein the adhesive (B) layer 5 is thermocompression bonded to the substrate surface at a temperature of 100 ° C or lower.

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