CN101604640A - 一种新的紫外线胶筑坝封装芯片模块的方法 - Google Patents

一种新的紫外线胶筑坝封装芯片模块的方法 Download PDF

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CN101604640A
CN101604640A CNA200910054496XA CN200910054496A CN101604640A CN 101604640 A CN101604640 A CN 101604640A CN A200910054496X A CNA200910054496X A CN A200910054496XA CN 200910054496 A CN200910054496 A CN 200910054496A CN 101604640 A CN101604640 A CN 101604640A
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周宗涛
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Nuodeka (shanghai) Electronics Co Ltd
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Abstract

本发明涉及一种新的紫外线胶筑坝封装芯片模块的方法，采用与填料时相同的低粘度紫外线胶筑坝，在筑坝完成后对坝进行预固化，有效地控制边界封装尺寸，最后进行填料、固化。本发明方法由于采用同一种低粘度紫外线胶，坝与填料之间有着最佳的结合界面，采用本发明方法后，不仅能够控制边界封装尺寸，大幅度提高生产效率，降低生产成本，同时还可以避免规模生产时由于经常更换筑坝胶，而带来质量不稳定和产量损失的风险。

Description

一种新的紫外线胶筑坝封装芯片模块的方法
技术领域
本发明涉及一种芯片模块封装技术，尤其涉及一种新的紫外线胶筑坝封装芯片模块的方法。
背景技术
在智能卡芯片模块封装行业，由于紫外线胶封装模块的可靠，快速和封装精度高，所以通常都采用紫外线胶封装集成电路芯片。封装微处理器大芯片时，由于芯片面积较大，而且对封装的尺寸和厚度的精度要求很高。所以必须采用有效的方法来控制模块封装的边界尺寸。几乎在智能卡模块发展的初期，就有人采用将很薄的金属环固定住封装边界，以阻止紫外线胶的不规则的流动。由于该工艺的成本很高，灵活性差，很快就被淘汰。继而被印刷一圈聚合物所取代。但仍然很快被精确，可控并灵活的筑坝工艺所取代。
目前通常采用筑坝的方法，就是首先在芯片微模块四周，根据技术规范，采用高粘度紫外线胶精确地筑一个方形，圆形或其它形状的环形坝，这样就确定了封装的边界尺寸。采用高粘度(一般180,000mPa·s)紫外线胶，目的是防止紫外线胶在制造过程中较快改变形状，并形成一个对以后低粘度的紫外线填充封装起阻挡作用，我们也称之为“筑坝”。然后再用低粘度(一般4,000-6,000mPa·s)的紫外线胶，在坝内芯片填满的同时，将芯片和金丝完全包封住.这样就完成了整个筑坝工艺。筑坝工艺可以比较精确地界定封装尺寸，但也有明显的缺点：经常要更换筑坝胶，更换筑坝胶时，会带来气泡和不稳定。更换前后也浪费很多的胶水。而且，2种不同的胶水控制和使用麻烦，成本也高，生产效率低下。
发明内容
本发明的目的，就是为了解决上述问题而提供一种新的紫外线胶筑坝封装芯片模块的方法，解决了技术上的瓶颈，采用同一种低粘度的紫外线胶，既用作筑坝，也用作填料，降低了成本，提高了生产效率。
本发明是通过以下技术方案实现的：
一种新的紫外线胶筑坝封装芯片模块的方法，所述芯片模块包括设于衬底上的芯片、焊点和金丝，该方法包括以下步骤：
A、筑坝：用低粘度紫外线胶在被封装芯片模块四周围成一个坝，将所有焊点和金丝都围入其中；
B、预固化：将步骤A中被筑坝的芯片模块马上放入紫外线光源下照射；
C、填料：用步骤A中的低粘度紫外线胶将围坝内的芯片、焊点和金丝全部包封于一个模块中；
D、紫外线固化：将步骤C中填料好的芯片模块在紫外线照射下固化。
上述新的紫外线胶筑坝封装芯片模块的方法，其中，步骤A中所述的紫外线胶为紫外线固化环氧树脂。
上述新的紫外线胶筑坝封装芯片模块的方法，其中，步骤B中所述的紫外线光源为紫外线LED灯。
上述新的紫外线胶筑坝封装芯片模块的方法，其中，步骤A中所述低粘度紫外线胶的粘度为3,000～9,000mPa·s。
本发明方法由于采用同一种低粘度紫外线胶，坝与填料之间有着最佳的结合界面，采用本发明方法后，不仅能够控制边界封装尺寸，大幅度提高生产效率，降低生产成本，同时还可以避免规模生产时由于经常更换筑坝胶，而带来质量不稳定和产量损失的风险。
附图说明
下面通过具体地实施例并结合附图对本发明的技术方案进行说明：
图1是本发明方法流程图；
图2是被封装的芯片模块的结构示意图；
图3是图1中A-A方向示意图。
具体实施方式
图1为本发明方法的流程图，如图2和图3所示，本发明用于封装智能卡用芯片模块的方法，包括以下步骤：
其中，所述芯片模块包括设于衬底4上的芯片1、焊点2和金丝3。
步骤A：如图2和图3所示，用低粘度紫外线固化环氧树脂(粘度为3,000～9,000mPa·s)在被封装芯片模块的四周围成一个方形坝5，将所有焊点2和金丝3都围入其中。
步骤B：将步骤A中筑好坝的芯片模块快速移入紫外线LED灯下照射，在紫外线LED灯的照射下，紫外线固化环氧树脂的粘度迅速提高，形成高粘度的坝，防止了紫外线固化环氧树脂的进一步流动，有效控制了封装边界的尺寸；通过调整LED灯的紫外线照射能量，此步骤可控制坝体形成半固化或固化状态。
步骤C：用步骤A中的低粘度紫外线固化环氧树脂涂布在坝5内，将坝5内的芯片1、焊点2和金丝3包封于一个模块中，形成填料6。
步骤D：将步骤C中填料好的的芯片模块移入紫外线固化炉中完成最后的固化。
采用该方法后，不仅能够控制边界封装尺寸，大幅度提高生产效率，降低生产成本，同时还可以避免规模生产时由于经常更换筑坝胶，而带来质量不稳定和产量损失的风险。因此，该方法同时给大规模生产带来极大的灵活性和方便。
本发明方法也可用于其它各种微芯片模块的封装。
以上实施例仅供说明本发明之用，而非对本发明的限制，有关技术领域的技术人员，在不脱离本发明的精神和范围的情况下，还可以作出各种变换或变型，因此所有等同的技术方案也应该属于本发明的范畴，应由各权利要求所限定。

Claims (4)

1.一种新的紫外线胶筑坝封装芯片模块的方法，所述芯片模块包括设于衬底上的芯片、焊点和金丝，该方法包括以下步骤：
A、筑坝：用低粘度紫外线胶在被封装芯片模块四周围成一个坝，将所有焊点和金丝都围入其中；
B、预固化：将步骤A中被筑坝的芯片模块马上放入紫外线光源下照射；
C、填料：用步骤A中的低粘度紫外线胶将围坝内的芯片、焊点和金丝全部包封于一个模块中；
D、紫外线固化：将步骤C中填料好的芯片模块在紫外线照射下固化。
2.如权利要求1所述新的紫外线胶筑坝封装芯片模块的方法，其特征在于，步骤A中所述的紫外线胶为紫外线固化环氧树脂。
3.如权利要求1所述新的紫外线胶筑坝封装芯片模块的方法，其特征在于，步骤B中所述的紫外线光源为紫外线LED灯。
4.如权利要求1所述新的紫外线胶筑坝封装芯片模块的方法，其特征在于，步骤A中所述低粘度紫外线胶的粘度为3,000～9,000mPa·s。
CNA200910054496XA 2009-07-07 2009-07-07 一种新的紫外线胶筑坝封装芯片模块的方法 Pending CN101604640A (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102166877A (zh) * 2010-12-10 2011-08-31 林英志 Uv胶贴合方法
CN102270627A (zh) * 2010-06-02 2011-12-07 英特明光能股份有限公司 发光二极管封装结构
CN103057244A (zh) * 2011-10-24 2013-04-24 比亚迪股份有限公司 一种用于触控面板的点胶方法及触控面板
CN114823371A (zh) * 2022-06-28 2022-07-29 南通泓金贝电子科技有限公司 一种电源芯片的点胶封装装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102270627A (zh) * 2010-06-02 2011-12-07 英特明光能股份有限公司 发光二极管封装结构
CN102166877A (zh) * 2010-12-10 2011-08-31 林英志 Uv胶贴合方法
CN102166877B (zh) * 2010-12-10 2013-07-24 林英志 Uv胶贴合方法
CN103057244A (zh) * 2011-10-24 2013-04-24 比亚迪股份有限公司 一种用于触控面板的点胶方法及触控面板
CN114823371A (zh) * 2022-06-28 2022-07-29 南通泓金贝电子科技有限公司 一种电源芯片的点胶封装装置
CN114823371B (zh) * 2022-06-28 2022-09-02 南通泓金贝电子科技有限公司 一种电源芯片的点胶封装装置

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Application publication date: 20091216