CN101600292A - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN101600292A
CN101600292A CNA2008103019339A CN200810301933A CN101600292A CN 101600292 A CN101600292 A CN 101600292A CN A2008103019339 A CNA2008103019339 A CN A2008103019339A CN 200810301933 A CN200810301933 A CN 200810301933A CN 101600292 A CN101600292 A CN 101600292A
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China
Prior art keywords
circuit board
heat dissipating
dissipating layer
radiating
edge
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CNA2008103019339A
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CN101600292B (zh
Inventor
郑明君
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2008103019339A priority Critical patent/CN101600292B/zh
Priority to US12/193,777 priority patent/US8008579B2/en
Publication of CN101600292A publication Critical patent/CN101600292A/zh
Priority to US13/197,912 priority patent/US8759686B2/en
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Publication of CN101600292B publication Critical patent/CN101600292B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种电路板，包括基板层和设于基板层表面上的散热层。散热层表面上设有若干彼此分离的散热块。该电路板具有散热设计较为灵活，适用范围较广的优点。

Description

电路板
技术领域
本发明涉及一种电路板，尤其涉及一种带有散热设计的电路板。
背景技术
由于电子产品体积日益缩小及芯片频率的不断提升，使得PCB(Printed Circuit Board，印刷电路板)的组装密度不断增加，因而所产生的散热问题也越来越严重。良好的PCB散热设计可有效提升散热效能，降低成本并提升元件寿命。为了加强PCB的散热功能，目前大多采用的是在PCB上增加散热孔、镀上金属薄膜、在PCB背面加装金属块、直接涂覆散热膏等方式来进行散热。
一种电路板，其包括绝缘基板层、设于基板层上的铜箔层及覆盖在铜箔层之上的绿漆。其中，铜箔层表面未被绿漆所覆盖处形成裸露的横向与纵向交错设置的金属表面。当该电路板过锡炉时，焊锡能够附着在裸露的金属表面形成十字或井字形实心焊锡条，达到散热的效果。
然而，由于上述十字或井字形的焊锡条的设计会占用较大的面积，而实际电路板上的元件数量大，密集度高，位置关系复杂，有可能找不到一片完全空白的铜箔区域用于布设上述焊锡条，因此该散热设计有较大的局限性，较难应用于一些元件较多较密的电路板。
发明内容
鉴于上述状况，有必要提供一种散热设计较为灵活，适用范围较广的电路板。
一种电路板，包括基板层和设于基板层表面上的散热层。散热层表面上设有若干彼此分离的散热块。
由于该电路板使用了若干彼此分离的散热块来达到散热的效果，可根据电路板上各元件的布局合理确定散热块的位置，因而能够适应电路板上元件较多，分布较复杂等情况的散热需求。
附图说明
图1是本发明的实施例一的电路板的平面示意图；
图2是图1所示电路板沿II-II的剖面图；
图3是本发明的实施例二的电路板的平面示意图。
具体实施方式
下面将结合附图及实施例对本发明的电路板作进一步的详细说明。
请参见图1及图2，本发明实施例一的电路板10包括：以绝缘材料所制成的基板层11、设于该基板层11表面上的散热层12、覆盖在该散热层12表面上的一层绝缘绿漆13、若干彼此分离的散热块14及若干用于焊接电子元件的焊盘15。其中，散热层12可为铜箔、铝箔或其他导热金属所构成，优选为铜箔，散热块14为焊锡所构成。
散热块14的制造方法是先在该散热层12表面覆盖上一整层绿漆13，然后除去部分绿漆13以使其底部的散热层12部分表面裸露在外而形成裸铜121。当电路板10过锡炉时，液态的锡料能够附着在裸铜121上冷却后形成实心且有隆起表面的散热块14。裸铜121的形状可为若干彼此分离的圆、椭圆或多边形，例如三角形、正方形等。在本实施例中，为使焊锡的内聚力最为均匀化，裸铜121的形状优选为若干彼此分离的圆；为了节省设计时间，更为优选的方案为若干彼此分离且直径相等的圆，散热块14优选为形状相同、体积相等的近半球体。
当电路板10上各焊盘15的间隔较大，形成了一定面积的空白绿漆13时，裸铜121的排列分布可为如图1所示的整齐间隔排列。组成裸铜121的圆的直径D的大小能够直接影响散热块14的散热效果。如果直径D太小，造成散热块14的表面积过小，影响散热；如果直径D太大，在有限的面积内圆的个数将下降，因此会造成散热块14的总表面积下降，影响散热，因此，综合考虑实际的散热情况，圆的直径D在1.2毫米至2.0毫米之间。在本实施例中，直径D等于1.6毫米。而且，为了防止散热块14排列过密而在过锡炉时出现锡桥或锡料过高等现象，相邻圆边缘至边缘的最近的距离L1以大于等于0.5毫米较佳。
图3为本发明的较佳实施例二所提供的电路板。由图3可知，当电路板10上元件较多，焊盘15排布比较密集，无法找到一大片空白绿漆13时，散热块14还可分布于多个焊盘15之间的间隙处，如此便可在不改变电路板原设计布局的情况下充分利用空间散热。为了防止在过锡炉时焊料从裸铜121中溢出与零件脚短接，组成裸铜121的圆的边缘与焊盘15的边缘之间的最近的距离L2以大于等于0.3毫米较佳。
电路板10在使用过程中，发热元件所产生的热量能够通过散热层12迅速地转移到各形状规则的散热块14的隆起表面而散逸至空气中。由于若干彼此分离的散热块14可以较为灵活地穿插设于电路板10各焊盘15之间，而不会对电路板10上原设计布局产生干扰，因此本发明的散热设计适用于一些元件数量较多，密集度较高的电路板。
另外，本领域技术人员还可在本发明精神内做其它变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围内。

Claims (10)

1.一种电路板，包括基板层和设于该基板层表面的散热层，其特征在于：该散热层表面设有若干彼此分离的散热块。
2.如权利要求1所述的电路板，其特征在于：该散热层部分表面覆盖有绝缘材料，其余表面为若干裸露的金属表面，该若干散热块附着在该若干金属表面上。
3.如权利要求2所述的电路板，其特征在于：该若干金属表面的形状为若干彼此分离的圆、椭圆和多边形中的一种或几种。
4.如权利要求2所述的电路板，其特征在于：该若干金属表面的形状为若干彼此分离且直径相等的圆，该直径为1.2至2.0毫米。
5.如权利要求4所述的电路板，其特征在于：该若干圆中相邻圆边缘至边缘的最近的距离大于等于0.5毫米。
6.如权利要求5所述的电路板，其特征在于：该电路板还包括若干焊接用的焊盘，该若干圆的边缘到该若干焊盘的边缘的最近的距离大于等于0.3毫米。
7.如权利要求1所述的电路板，其特征在于：该若干散热块的形状相同、体积相等。
8.如权利要求7所述的电路板，其特征在于：该散热块的形状为近半球体。
9.如权利要求1所述的电路板，其特征在于：该散热层为铜箔与铝箔之一。
10.如权利要求1所述的电路板，其特征在于：该散热块为焊锡所构成。
CN2008103019339A 2008-06-02 2008-06-02 电路板 Expired - Fee Related CN101600292B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008103019339A CN101600292B (zh) 2008-06-02 2008-06-02 电路板
US12/193,777 US8008579B2 (en) 2008-06-02 2008-08-19 Printed circuit board providing heat dissipation
US13/197,912 US8759686B2 (en) 2008-06-02 2011-08-04 Printed circuit board providing heat dissipation

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Application Number Priority Date Filing Date Title
CN2008103019339A CN101600292B (zh) 2008-06-02 2008-06-02 电路板

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CN101600292A true CN101600292A (zh) 2009-12-09
CN101600292B CN101600292B (zh) 2012-06-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105170502A (zh) * 2015-08-08 2015-12-23 常州安泰诺特种印制板有限公司 除尘型pcb板
CN109756076A (zh) * 2017-11-01 2019-05-14 德昌电机(深圳)有限公司 电机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391038B (zh) * 2010-02-01 2013-03-21 Avermedia Tech Inc 具有散熱構造之電路板及其製造方法
WO2014136735A1 (ja) * 2013-03-04 2014-09-12 ピーエスフォー ルクスコ エスエイアールエル 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258887A (en) * 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
US5930117A (en) * 1996-05-07 1999-07-27 Sheldahl, Inc. Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer
US7007833B2 (en) * 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
JP2000100814A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd 半導体装置
US6664483B2 (en) * 2001-05-15 2003-12-16 Intel Corporation Electronic package with high density interconnect and associated methods
US6621705B1 (en) * 2002-04-12 2003-09-16 Cisco Technology, Inc. Miniature surface mount heatsink element and method of use
TW560698U (en) * 2002-09-09 2003-11-01 Via Tech Inc Structure of chip package
JP2004146650A (ja) * 2002-10-25 2004-05-20 Sumitomo Metal Electronics Devices Inc パワーモジュール用基板
US6930885B2 (en) * 2002-12-23 2005-08-16 Eastman Kodak Company Densely packed electronic assemblage with heat removing element
CN2603595Y (zh) * 2003-01-29 2004-02-11 博大科技股份有限公司 电路板导热结构
US7538440B2 (en) * 2003-04-30 2009-05-26 Intel Corporation Method for improved high current component interconnections
KR100541394B1 (ko) * 2003-08-23 2006-01-10 삼성전자주식회사 비한정형 볼 그리드 어레이 패키지용 배선기판 및 그의제조 방법
JP3855992B2 (ja) * 2003-12-17 2006-12-13 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
TWI271129B (en) 2005-05-13 2007-01-11 Hon Hai Prec Ind Co Ltd Printed circuit board having improved pads
CN2927605Y (zh) * 2006-04-08 2007-07-25 技嘉科技股份有限公司 电路板及其散热金属表面排列形状
TW200906260A (en) * 2007-07-20 2009-02-01 Siliconware Precision Industries Co Ltd Circuit board structure and fabrication method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105170502A (zh) * 2015-08-08 2015-12-23 常州安泰诺特种印制板有限公司 除尘型pcb板
CN109756076A (zh) * 2017-11-01 2019-05-14 德昌电机(深圳)有限公司 电机

Also Published As

Publication number Publication date
US8759686B2 (en) 2014-06-24
US8008579B2 (en) 2011-08-30
US20090294154A1 (en) 2009-12-03
CN101600292B (zh) 2012-06-20
US20110284272A1 (en) 2011-11-24

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