CN101578025A - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN101578025A CN101578025A CN200810066966.XA CN200810066966A CN101578025A CN 101578025 A CN101578025 A CN 101578025A CN 200810066966 A CN200810066966 A CN 200810066966A CN 101578025 A CN101578025 A CN 101578025A
- Authority
- CN
- China
- Prior art keywords
- heat abstractor
- fan
- base
- radiating fin
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004308 accommodation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810066966.XA CN101578025B (zh) | 2008-05-07 | 2008-05-07 | 散热装置 |
US12/406,082 US20090277615A1 (en) | 2008-05-07 | 2009-03-17 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810066966.XA CN101578025B (zh) | 2008-05-07 | 2008-05-07 | 散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101578025A true CN101578025A (zh) | 2009-11-11 |
CN101578025B CN101578025B (zh) | 2013-09-04 |
Family
ID=41265926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810066966.XA Expired - Fee Related CN101578025B (zh) | 2008-05-07 | 2008-05-07 | 散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090277615A1 (zh) |
CN (1) | CN101578025B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102238847A (zh) * | 2010-04-28 | 2011-11-09 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN104654849A (zh) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | 换热装置及具有其的半导体制冷冰箱 |
CN114895765A (zh) * | 2022-05-16 | 2022-08-12 | 南京蓝洋智能科技有限公司 | 一种多芯片pcie拓展卡主动散热装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102762055A (zh) * | 2011-04-26 | 2012-10-31 | 富准精密工业(深圳)有限公司 | 连接件 |
CN102970851B (zh) * | 2012-11-16 | 2015-07-22 | 东莞汉旭五金塑胶科技有限公司 | 热管散热器 |
CN105407686A (zh) * | 2014-09-12 | 2016-03-16 | 奇鋐科技股份有限公司 | 手持装置散热结构 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100322468B1 (ko) * | 1997-02-12 | 2002-04-22 | 윤종용 | 컴퓨터의팬고정장치와컴퓨터의팬고정장치를사용하는휴대용컴퓨터 |
WO2002013266A1 (en) * | 2000-08-03 | 2002-02-14 | Fujitsu Limited | Device and method for placing on and fixing to substrate semiconductor device and heat sink disposed on the semiconductor device |
US6344971B1 (en) * | 2000-12-18 | 2002-02-05 | Ted Ju | Retainer for a retaining seat of a radiator |
US6435889B1 (en) * | 2000-12-29 | 2002-08-20 | Compaq Information Technologies Group, L.P. | Reduced complexity hot plug blind mate fan assembly and connector therefor |
CN2544329Y (zh) * | 2002-04-28 | 2003-04-09 | 林世仁 | 散热片扣件结构 |
US6618253B1 (en) * | 2002-05-09 | 2003-09-09 | Hon Hai Precision Ind. Co., Ltd. | Retainer device for heat sink assembly |
TW584260U (en) * | 2002-06-28 | 2004-04-11 | Hon Hai Prec Ind Co Ltd | Heat sink device |
US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
US6648664B1 (en) * | 2002-08-13 | 2003-11-18 | Hon Hai Precision Ind. Co., Ltd. | Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector |
CN2664180Y (zh) * | 2003-11-03 | 2004-12-15 | 技嘉科技股份有限公司 | 散热装置 |
CN2736848Y (zh) * | 2004-09-15 | 2005-10-26 | 鸿富锦精密工业(深圳)有限公司 | 风扇固定装置 |
US7230826B2 (en) * | 2005-03-11 | 2007-06-12 | Dell Products L.P. | Method and apparatus for mounting a fan |
US7174951B1 (en) * | 2005-08-30 | 2007-02-13 | Asia Vital Component Co., Ltd. | Radiator module structure |
US20070119566A1 (en) * | 2005-11-30 | 2007-05-31 | Xue-Wen Peng | Heat dissipation device |
US7215548B1 (en) * | 2006-03-20 | 2007-05-08 | Foxconn Technology Co., Ltd. | Heat dissipating device having a fin also functioning as a fan duct |
CN101060762A (zh) * | 2006-04-19 | 2007-10-24 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20080115915A1 (en) * | 2006-11-16 | 2008-05-22 | Ryan Chen | Heat sink |
TWI306385B (en) * | 2006-12-01 | 2009-02-11 | Delta Electronics Inc | Heat dissipating module and heat sink thereof |
TWI314033B (en) * | 2007-01-23 | 2009-08-21 | Sunonwealth Electr Mach Ind Co | Mini heat dissipating module |
CN101610657B (zh) * | 2008-06-20 | 2012-03-14 | 富准精密工业(深圳)有限公司 | 散热装置 |
-
2008
- 2008-05-07 CN CN200810066966.XA patent/CN101578025B/zh not_active Expired - Fee Related
-
2009
- 2009-03-17 US US12/406,082 patent/US20090277615A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102238847A (zh) * | 2010-04-28 | 2011-11-09 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN104654849A (zh) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | 换热装置及具有其的半导体制冷冰箱 |
CN114895765A (zh) * | 2022-05-16 | 2022-08-12 | 南京蓝洋智能科技有限公司 | 一种多芯片pcie拓展卡主动散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090277615A1 (en) | 2009-11-12 |
CN101578025B (zh) | 2013-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20141210 Owner name: NANTONG FLY WHALE GENERATING EQUIPMENT CO., LTD. Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20141210 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 226500 NANTONG, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141210 Address after: 226500, No. 9, former South Road, lower Town, Rugao, Jiangsu Patentee after: NANTONG FLYWHALE GENERATING EQUIPMENT CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Patentee before: Foxconn Precision Industry Co., Ltd. |
|
CB03 | Change of inventor or designer information |
Inventor after: Han Chao Inventor after: Dou Wentao Inventor after: Wu Wenzhuan Inventor after: Jia Zhili Inventor before: Li Wei Inventor before: Wu Yiqiang Inventor before: Chen Junji |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171226 Address after: The 063100 Hebei province Tangshan City Guye District Zhenlu Zhaogezhuang Jiudong floor 8 floor No. 25 Co-patentee after: Dou Wentao Patentee after: Han Chao Co-patentee after: Wu Wenzhuan Co-patentee after: Jia Zhili Address before: 226500, No. 9, former South Road, lower Town, Rugao, Jiangsu Patentee before: NANTONG FLYWHALE GENERATING EQUIPMENT CO., LTD. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20180507 |
|
CF01 | Termination of patent right due to non-payment of annual fee |