CN101578025A - 散热装置 - Google Patents

散热装置 Download PDF

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CN101578025A
CN101578025A CN200810066966.XA CN200810066966A CN101578025A CN 101578025 A CN101578025 A CN 101578025A CN 200810066966 A CN200810066966 A CN 200810066966A CN 101578025 A CN101578025 A CN 101578025A
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heat abstractor
fan
base
radiating fin
wall
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CN101578025B (zh
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李伟
吴宜强
陈俊吉
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Dou Wentao
Han Chao
Jia Zhili
Wu Wenzhuan
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置,用于散发一电子元件产生的热量,该散热装置包括与该电子元件接触的底座、形成于底座上的若干散热鳍片及安装于该底座上的一风扇,所述若干散热鳍片开设有一收容所述风扇的容置空间,所述风扇与所述散热鳍片相隔设置。与现有技术相比,该散热装置使用时,风扇产生的气流除了从散热鳍片之间的空隙流走之外,还从散热鳍片上的通孔流走,增加了散热装置的散热效率;风扇直接安装在底座上,且收容在散热鳍片的容置空间内,避免与散热鳍片直接接触。这样,风扇在振动过程中不会频繁地与散热鳍片相碰而产生噪音,也不会因为风扇与散热鳍片接触而造成散热鳍片的振动,从而降低本发明散热装置的噪音。

Description

散热装置
技术领域
本发明涉及一种散热装置,尤其涉及一种具有风扇固定装置的散热装置。
背景技术
随着电子信息业不断发展,电子元件运行频率和速度也在不断提升。高频高速将使电子元件产生的热量越来越多,温度也越来越高,严重影响着电子元件运行时的性能和稳定性,为了确保电子元件能正常运行,必须及时排出电子元件运行所产生的大量热量。为此,业界通常在这些发热电子元件表面安装一散热装置,以辅助其散热。
美国专利第6,667,884号揭示了一种散热装置组合,其包括安装于电子元件上的散热器及将散热器固定于电路板上的扣具。当电子元件工作时,其产生的热量经由散热器散发至周围的空气中,从而确保其正常工作。
为了进一步提高散热器的散热效率,还在散热器顶部加装一风扇,通过风扇产生的高速气流而迅速地将散热器所吸收的热量带走。
众所周知,风扇在工作的过程中会产生振动,增加风扇运转的噪音或异音,由于上述散热装置组合的风扇是通过一风扇固定件直接固定至散热器的顶部,风扇在工作时产生的振动会作用于散热器上,加大散热装置组合的噪音。因此,上述散热装置组合需要进一步改进。
发明内容
有鉴于此,实有必要提供一种具有风扇固定装置且能够降低噪音的散热装置。
一种散热装置,用于散发一电子元件产生的热量,该散热装置包括与该电子元件接触的底座、形成于底座上的若干散热鳍片及安装于该底座上的一风扇,所述若干散热鳍片开设有一收容所述风扇的容置空间,所述风扇与所述散热鳍片相隔设置。
与现有技术相比,本发明散热装置使用时,风扇产生的气流除了从散热鳍片之间的空隙流走之外,还从散热鳍片上的通孔流走,增加了散热装置的散热效率;上述风扇直接安装在底座上,且收容在散热鳍片的容置空间内,避免与散热鳍片直接接触。这样,风扇在振动过程中不会频繁地与散热鳍片相碰而产生噪音,也不会因为风扇与散热鳍片接触而造成散热鳍片的振动,从而降低本发明散热装置的噪音。
下面参照附图结合实施例对本发明作进一步的描述。
附图说明
图1是本发明散热装置的立体分解图。
图2是本发明散热装置的扣具及底座的立体图。
图3是本发明散热装置的部分组装图。
图4是本发明散热装置的立体组装图。
具体实施方式
请参阅图1,本发明散热装置用于对一电子元件(图未示)散热,其包括一与该电子元件接触的底座10、一置于该底座10的风扇20、一将风扇20固定至底座10的扣具30、安装于底座10上的若干热管40及置于底座10上且供热管40穿设的一散热鳍片组50。
上述底座10包括一大致呈方形的本体12、一自本体12一端向外水平延伸的一连接板14及自该连接板14的相对两端且垂直于连接板14水平向外继续延伸的二安装板16。
请同时参阅图2,上述底座10的本体12上开设有一矩形开口(图未示)用以收容一基板122。该基板122靠近底座10的本体12的一侧边而远离本体12的另一相对侧边,该基板122大致中心位置开设有一方形孔(图未示)用以收容一基座124。该基座124的底面与电子元件贴合用以吸收该电子元件产生的热量。该基座124的顶部开设有若干平行于该基座124一侧边的沟槽1240用以收容所述热管40。该底座10的本体12离所述其中一安装板16较远的侧边自其底部弯折形成一卡板126,该卡板126平行于本体12的侧边且与该侧边形成一矩形开槽1260,该卡板126的延伸长度与本体12侧边的长度相当,该卡板126的顶部设有一挡止槽1262。
上述连接板14的顶面超出上述底座10本体12的顶面,在其他实施例中,连接板14的顶面可以不超出上述本体12的顶面。在本实施例中,二呈三角形状的挡块142自连接板14的顶面相对两端垂直向上延伸且垂直抵靠于所述安装板16,二挡块142的前端面在一个平面内以与上述风扇20贴合。二凸柱144分别自二挡块142的前侧面垂直向外延伸形成,每一凸柱144与其对应的安装板16相隔设置以方便安装上述风扇20。
上述安装板16的顶面超出上述连接板14的顶面。该安装板16远离连接板14的一端开设有一用以与扣具30插合的缺口162。二圆柱形杆体18对应插入所述缺口162内。该缺口162的两侧形成有二相对的安装壁164。位于连接板14左端的一缺口162的其中一安装壁164开设有一安装孔166,另一安装壁164内侧对应该安装孔166的位置开设有一盲孔168。其中一杆体18穿过安装孔166后,插入或者铆入对应该安装孔166的盲孔168内。另一杆体18位于连接板14右端的一缺口162的两安装壁164之间。位于连接板14左端的杆体18的长度大于位于连接板14右端的杆体18的长度,以免位于连接板14左端的杆体18脱离安装孔166。
上述扣具30由金属片材一体冲压成型,其用以安装于位于所述底座10本体12一端的安装板16上,该扣具30包括一抵压壁32及自该抵压壁32两端相对抵压壁32向外倾斜(即向远离底座10的本体12的方向)延伸形成二弹性壁33。每一弹性壁33末端朝向安装板16延伸形成一钩壁34。其中对应位于上述连接板14左端的杆体18的钩壁34自由端向内弯折延伸出一卷筒35以套置于该杆体18上。另一对应位于连接板14右端的杆体18的钩壁34自由端向内弯折延伸出一扣钩36,该扣钩36用以与该杆体18扣合。
上述热管40的数量为三,且每一热管40大致呈“U”形设置。每一热管40具有一水平的吸热段42及与吸热段42相连且竖直向上延伸的二放热段44。这些吸热段42相互靠近且平行设置。这些吸热段42对应收容在设于上述基座124顶部的沟槽1240内用以吸收该基座124的从电子元件上吸收来的热量。上述放热段44则相互隔开且平行设置,以穿设于散热鳍片组50中。
上述散热鳍片组50包括若干第一散热鳍片52、若干第二散热鳍片54和一第三散热鳍片56。这些散热鳍片52、54、56的位置关系是:第一散热鳍片52在最上层;第二散热鳍片56在最下层;第二散热鳍片54在第一散热鳍片52和第三散热鳍片56的中间位置。
这些散热鳍片52、54、56是大致呈矩形的金属片,均具有一大小相同且相互平行的本体520、540、560,这些散热鳍片52、54、56的本体520、540、560上均开设有若干通孔51以供上述热管40的放热段44穿设和若干圆形通孔53。这些本体520、540、560的前部靠近右侧边开设有一长方形通孔55。这些散热鳍片52、54的本体520、540自两相对的较长边缘分别垂直一体向下延伸一短折缘58。该短折缘58将这些散热鳍片52、54以相同距离间隔。
上述第三散热鳍片56的本体560自两相对的较长边缘分别垂直一体向下延伸一长折缘59,该长折缘59的宽度比上述短折缘58宽。其中一长折缘59的底面卡置于上述底座10的本体12卡板126的挡止槽1262内以限制散热鳍片56的垂直方向的移动且起到支撑散热鳍片组50的作用。
上述每一散热鳍片54、56的本体540、560靠近前部开设有一容置孔562,这些容置孔562共同形成一容置空间510以收容所述风扇20。上述风扇20的扇框22的四角落分别开设有一定位孔24。
请同时参阅图3和图4,装配时,首先将上述热管40的吸热段42焊设在所述底座10的本体12基座124的沟槽1240内,热管40的放热段44对应穿入这些散热鳍片52、54、56本体520、540、560的通孔51内使第三散热鳍片56的其中一长折缘59嵌置于底座10的本体12卡板126的挡止槽1262内;上述位于连接板14左端的杆体18穿过安装孔166后,进一步穿入上述扣具30的的卷筒35内,然后插入或铆入对应该安装孔166的盲孔168内;所述风扇20自下而上穿入散热鳍片组50的容置空间510内,并使底座10连接板14的凸柱144对应插入风扇20下端的二定位孔24内,同时推动扣具30的自由端向风扇20靠近,并使扣具30的扣钩36与位于连接板14右端的杆体18相卡扣,此时,扣具30的抵压壁32抵靠在风扇20的扇框22上以防止风扇20脱落。这样,本发明散热装置组装完成。
与现有技术相比,在本发明散热装置的使用过程中,风扇20产生的气流除了从散热鳍片组50的空隙流走之外,还从散热鳍片52、54、56上的通孔53、55流走,增加了散热装置的散热效率;上述风扇20直接安装在底座10上,且收容在散热鳍片组50的容置空间510内,避免与散热鳍片52、54、56直接接触。这样,风扇20在振动过程中不会频繁地与散热鳍片52、54、56相碰而产生噪音,也不会因为风扇20与散热鳍片52、54、56接触而造成散热鳍片52、54、56的振动,从而降低本发明散热装置的噪音。

Claims (11)

1.一种散热装置,用于散发一电子元件产生的热量,该散热装置包括与该电子元件接触的底座、形成于底座上的若干散热鳍片及安装于该底座上的一风扇,其特征在于:所述若干散热鳍片开设有一收容所述风扇的容置空间,所述风扇与所述散热鳍片相隔设置。
2.如权利要求1所述的散热装置,其特征在于:所述每一散热鳍片包括一平行于底座的本体,若干热管连接底座及散热鳍片的本体。
3.如权利要求1所述的散热装置,其特征在于:所述底座包括一本体、一自本体一侧向外水平延伸的一连接板及自该连接板的相对两端且垂直于连接板水平向外继续延伸的二安装板。
4.如权利要求3所述的散热装置,其特征在于:所述连接板的相对两端形成有二挡块,该二挡块自连接板的顶面垂直向上延伸且垂直于安装板。
5.如权利要求4所述的散热装置,其特征在于:二凸柱分别自二挡块的一侧面垂直向外延伸形成,所述凸柱插入所述风扇底部。
6.如权利要求3所述的散热装置,其特征在于:所述扣具一端与其中一安装板枢接,另一端与另一安装板卡扣以抵压所述风扇底部。
7.如权利要求3所述的散热装置,其特征在于:所述二安装板远离所述连接板的一端开设有缺口,二杆体对应插入所述缺口内。
8.如权利要求7所述的散热装置,其特征在于:所述扣具由金属片材一体冲压成型,其包括一抵压壁及自该抵压壁两端相对抵压壁向外倾斜延伸形成二弹性壁,每一弹性壁末端朝向安装板延伸形成一钩壁。
9.如权利要求8所述的散热装置,其特征在于:所述一钩壁的自由端向内弯折延伸出一扣钩,另一钩壁自由端向内弯折延伸出一卷筒,该卷筒套置在其中一杆体,所述扣钩与另一杆体相卡扣,所述抵压壁抵靠在风扇上。
10.如权利要求2所述的散热装置,其特征在于:所述若干散热鳍片中靠近所述底座的一散热鳍片自该散热鳍片的本体的两相对较长边缘分别垂直一体向下延伸一长折缘。
11.如权利要求10所述的散热装置,其特征在于:所述底座的本体离所述其中一安装板较远的侧边自其底部弯折形成一卡板,该卡板的顶部设有一挡止槽,所述长折缘卡置于该挡止槽内。
CN200810066966.XA 2008-05-07 2008-05-07 散热装置 Expired - Fee Related CN101578025B (zh)

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