CN101564795A - Correcting unit, correction method and controlling means - Google Patents
Correcting unit, correction method and controlling means Download PDFInfo
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- CN101564795A CN101564795A CNA2009101309740A CN200910130974A CN101564795A CN 101564795 A CN101564795 A CN 101564795A CN A2009101309740 A CNA2009101309740 A CN A2009101309740A CN 200910130974 A CN200910130974 A CN 200910130974A CN 101564795 A CN101564795 A CN 101564795A
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Abstract
The invention provides a correcting unit, a correction method and a controlling means thereof, can detect residual defects automatically and accurately. An image processing unit (12) detects defects according to a defect image obtained by shooting a glass basal plate (2) by a camera unit (11), and recognizes defect position and range; a laser oscillator (14) outputs laser for correcting the detected defects; A DMD unit (17) performs spatial light modulation to the laser to irradiate onto the defects; the driver (20) for driving the DMD unit (17) is controlled by a control unit (19) which outputs the laser shape of control signal according to the data from the image processing unit (12); a residual defect detecting unit (22) obtains the height information about the height of the glass basal plate (2) in defect range, and judging whether residual defects for correction still exist after defect correction according to the height information; if the judging result is yes, the laser irradiation is performed on both the defects and the residual defects.
Description
Technical field
The present invention relates to the technology of correction substrate defective.
Background technology
At LCD (LCD; Liquid Crystal Display) and in the manufacturing of PDP FPD (Flat Panel Display) substrate, semiconductor wafer (wafer), printed base plate and photomask various substrates such as (photomask) such as (Plasma DisplayPanel), need carry out the inspection and the correction of substrate.For example after substrate being processed, carry out about whether having defective that diminishes functional substrate or the inspection that the processing of ensuing process B is brought dysgenic defective, and carry out the correction of defective as required by operation A.
To checking the lip-deep concavo-convex technology of checking of object, known have the technology of using the illumination that repeats LO-pattern and passed through the light of calibration (collimate) and used the technology (for example referring to patent documentation 1～2) of the length of formed shadow from oblique irradiation as usually.In addition, as measuring small concavo-convex technology, also known confocal microscope (for example referring to patent documentation 3～5).
In addition, thus the known means for correcting that has by the defective on the rejected region irradiating laser correction substrate on the substrate also is called laser-adjusting (laser repair) device.
Yet, even if the laser-adjusting device has carried out being used for the laser irradiation of defect correcting, also defect correcting fully sometimes.For example under the situation of having shone to defective than the laser a little less than in fact removing the required output of defective, a part of sometimes defective can not be removed and residual time.Below so residual defective is called " residual defects ".
Therefore, require to judge whether to exist residual defects, if having residual defects then proofread and correct again.The known method that has use optical concentration (monochrome information) or image to detect residual defects, also known have the tracer of use to register the method (for example referring to patent documentation 6～8) in the zone of residual defects by manual operation.
But, according to the photographed images of after initial detected defective having been carried out the laser irradiation substrate having been made a video recording and having obtained, judge whether to exist in the method for residual defects, be difficult to use the laser-adjusting device automatically, need inspection personnel's intervention.Its reason is, although in fact there is not residual defects, also can wrong detection arrive residual defects sometimes.The following exemplary of describing wrong detection.
If the laser-adjusting device to the defect area irradiating laser as the substrate of checking object, then may produce the burning trace at substrate surface or substrate with height output.Burn trace also may surface attached to residual defects on, also may be removed in substrate surface afterwards or the substrate fully attached to defective itself.
Judging whether exist under the situation of residual defects according to photographed images, be difficult to accurately distinguish and burn trace and residual defects.This is owing to the brightness of burning trace and residual defects in the photographed images is similar.Therefore, the laser-adjusting device can detect as residual defects mistakenly with burning trace sometimes.Although in fact removed defective fully by irradiating laser, cause it to be detected owing to burning trace as residual defects, its result can be shone unwanted laser, will burn trace again and detect as residual defects.Prevent from unrestrictedly to repeat the detection of residual defects and the needs that laser shines so just produced, for example the laser-adjusting device is set the upper limit number of times that repeats.But in this case, also can repeat to reach the detection and the irradiation of unwanted laser of the residual defects till the upper limit number of times, thereby can consume the extra time.
Therefore adopted following application method.That is, the laser-adjusting device shows photographed images on monitor.Observe monitor by the inspection personnel then, the detected residual defects of final decision is actual residual defects or burning trace.If being judged to be is residual defects, then the inspection personnel can carry out the correction operation in residual defects zone, the zone of registration residual defects, and indication is proofreaied and correct again to the laser-adjusting device.
[patent documentation 1] TOHKEMY 2003-329428 communique
[patent documentation 2] TOHKEMY 2005-274256 communique
[patent documentation 3] TOHKEMY 2000-275530 communique
[patent documentation 4] TOHKEMY 2004-184342 communique
[patent documentation 5] international open WO97/31282 communique
[patent documentation 6] Japanese kokai publication hei 1-219751 communique
[patent documentation 7] TOHKEMY 2005-103581 communique
[patent documentation 8] TOHKEMY 2007-29983 communique
Detect defective and the viewpoint of needed time of defect correcting based on shortening, expectation eliminates the necessity that the inspection personnel gets involved the means for correcting of correction substrate defective.And, need distinguish actual residual defects automatically and exactly and burn trace by means for correcting for this reason.
Shining the defective of proofreading and correct by laser is the defective that has the kind of unnecessary material on substrate, is proofreaied and correct by using the laser irradiation that unnecessary material is removed from substrate.For example, the residue at resist (resist) film has caused that under the situation of the electrical short in the circuit that is formed on the substrate, the residue of resist film just becomes the material that remove.
No matter that is to say, be " initial detected defective " or " residual defects ", all is certain the unnecessary material that is present on the substrate, thereby belong to than outstanding highly more originally part.Relative therewith, can change on appearance color though burn trace, yet can not bring the variation on the height.Therefore, if the information of use and height correlation just can be distinguished residual defects and burn trace.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of by using the information with height correlation, thereby detect residual defects exactly, can be as required from the means for correcting of dynamic(al) correction residual defects.
A mode of the present invention provides the 1st means for correcting.The 1st means for correcting has: defect detection unit, and it detects the defective that should proofread and correct on the substrate of checking object, discerns the position and the scope of above-mentioned defective; The residual defects detecting unit, it obtains the relevant elevation information of height with the interior aforesaid substrate of the above-mentioned scope of above-mentioned defective, judge after detected above-mentioned defective has carried out proofreading and correct to above-mentioned defect detection unit according to above-mentioned elevation information, at the local of the above-mentioned scope of above-mentioned defective or all whether also there are the residual defects that proofread and correct; Laser oscillator, it exports laser, and this laser is used for proofreading and correct above-mentioned defective when above-mentioned defect detection unit detects above-mentioned defective, and when being judged as by above-mentioned residual defects detecting unit when having above-mentioned residual defects, proofreaies and correct above-mentioned residual defects; And two-dimensional space light-modulating cell, its above-mentioned position and above-mentioned scope according to above-mentioned defective is carried out spatial light modulation to above-mentioned laser, so that be radiated at by on the detected above-mentioned defective of above-mentioned defect detection unit by the above-mentioned laser of above-mentioned laser oscillator output, the two-dimensional space light-modulating cell also carries out spatial light modulation to above-mentioned laser, so that be radiated on the above-mentioned residual defects on the aforesaid substrate by the above-mentioned laser of above-mentioned laser oscillator output.
Other modes of the present invention provide a kind of bearing calibration of the 2nd means for correcting, realize and above-mentioned the 1st means for correcting identical functions by the 2nd means for correcting, the 2nd means for correcting possesses the laser oscillator of the laser of exporting the defective on the substrate that is used for the rectifying inspection object, and has the function that any range on aforesaid substrate is shone above-mentioned laser.
Another mode of the present invention provides a kind of control device, and this control device is controlled the 3rd means for correcting, and the 3rd means for correcting has: the laser of exporting the defective on the substrate that is used for the rectifying inspection object; And the two-dimensional space light-modulating cell that the above-mentioned laser of being exported is carried out spatial light modulation.This control device is controlled above-mentioned the 3rd means for correcting, similarly plays a role with above-mentioned the 1st means for correcting.
In above-mentioned arbitrary mode, all judge whether to exist residual defects according to elevation information, therefore can distinguish the residual defects of burning trace that does not possess height and the reality that possesses height exactly.Therefore can detect residual defects exactly.Thereby can carry out to automation the detection of defective, the correction of defective, the detection of residual defects and this a series of operation of correction of residual defects.
Description of drawings
Fig. 1 is the pie graph of the laser-adjusting device 101 of the 1st embodiment.
Fig. 2 is the flow chart of action of the laser-adjusting device 101 of expression the 1st embodiment.
Fig. 3 is the figure of example that expression the 1st embodiment is used for the image of defects detection.
Fig. 4 is the pie graph of the laser-adjusting device 102 of the 2nd embodiment.
Fig. 5 is the figure that expression is used for the example of the image that residual defects detects in the 2nd embodiment.
Fig. 6 is the pie graph of the laser-adjusting device 103 of the 3rd embodiment.
Fig. 7 is the figure that the residual defects of explanation the 3rd embodiment detects.
Fig. 8 is the figure of the example of the projection pattern used in the 3rd embodiment of expression.
Fig. 9 is the pie graph of the laser-adjusting device 104 of the 4th embodiment.
Figure 10 is the flow chart of action of the laser-adjusting device 104 of expression the 4th embodiment.
Figure 11 is the figure that the residual defects of explanation the 4th embodiment detects.
Figure 12 is the figure that is illustrated in the example of the confocal aperture portion that uses in the variation of the 4th embodiment.
Figure 13 is the pie graph of laser-adjusting device 105 in the variation of expression the 4th embodiment.
Figure 14 is the figure of the variation of explanation the 5th embodiment.
Symbol description
1,1d workbench; 2 glass substrates; 3,3d moves/drive control part; 4 base board checking devices; 5 lighting sources; 6,18,24 relay lens; 7,8,15,28,34 optical splitters; 9 object lens; 10 imaging lens; 11 image pickup parts; 12,12b～12e image processing part; 13 monitors; 14 laser oscillators; 16,27 eyeglasses; The 17DMD unit; 19 laser shape control unit; 20 drivers; 21 correction positions confirm to use light source; 22 residual defects test sections; 23 lighting sources; 25 projection pattern gratings; 26 LASER Light Sources; 29 two-dimentional scanning mechanisms; 30,31 collector lenses; 32 pinhole plates; The 32a pin hole; 33 photodetectors; 35 rotating panels; 51,52,59 slit plates; 53,60,65 peristomes; 61,63,66,68 light shielding parts; 62 slit portions; 64 pin hole dishes; 67 pin hole drafting departments at random; 101～105 laser-adjusting devices; C1～C6 circuit pattern; Da, Dk defect image; The Db benchmark image; Dc, Df error image; Dd defect shape image; De, Dh, Dm, Dn residual defects image; Dg shadow shape image; Di pattern light shape image; Dj pattern light shape benchmark image; The D1 contour map; G, G2 defective part; Gb, G3～G5 residual defects portion; H shadow portion; Ia, Ib pattern; The L section; Pa～Pd projection pattern; The Q profile; R1～R7 zone
The specific embodiment
Describe embodiments of the present invention with reference to the accompanying drawings in detail.Below for convenience of explanation, with the laser-adjusting device that main glass substrate (below be referred to as glass substrate) carried out defect inspection and defect correction is that example illustrates each embodiment, wherein main glass substrate is FPD to be carried out repeatedly chamfering form, yet object substrate is so long as semiconductor wafer and printed base plate etc. are formed with the substrate of circuit pattern gets final product.
At first the 1st embodiment is described with reference to Fig. 1～Fig. 3.
Fig. 1 is the pie graph of the laser-adjusting device 101 of the 1st embodiment.Among Fig. 1, solid line represents to control the flow direction with data, and dotted line is represented light path.Also be same in following accompanying drawing.
Laser-adjusting device 101 has: image pickup optical system, the laser illuminating optical system that is used to proofread and correct the defective on the glass substrate 2 and the monitor 13 of observing and making a video recording amplified in maintenance and carrying as the workbench 1 of the glass substrate 2 of inspection and calibration object, to glass substrate 2.Image pickup optical system and laser illuminating optical system can have a part of optical element, in the 1st embodiment, and their total optical splitter 8 and object lens 9.
In addition, laser-adjusting device 101 also has the inscape of carrying out various data processing or control, also possesses the residual defects test section 22 that detects residual defects.
In the following description, so-called " residual defects " be meant detected defective on the glass substrate 2 carried out after the initial correction, fails to proofread and correct and defective under residual.For example under the situation of the laser output deficiency of proofreading and correct usefulness for initial detected defective, a part of defective can not proofread and correct and stay as residual defects.In addition, below in the situation that abbreviates " defective " as, short of specializing do not comprise residual defects.And,, then also the defective before proofreading and correct can be expressed as " initial defective " if the defective and the residual defects contrast that correspond to each other are described.
Below, for convenience of explanation, FPD being formed rectangle with glass substrate 2, the rectangle long side direction is the x axle, short side direction is the y axle.In addition, establish direction perpendicular to glass substrate 2 surfaces, be that the short transverse of glass substrate 2 is the z axle.
Laser-adjusting device 101 has the function that glass substrate 2 and the relative position of object lens 9 on x direction and y direction are moved.That is, as long as can on x direction and y direction, relatively move the workbench 1 of bearing glass substrate 2 and the object lens 9 of image pickup optical system.In the present embodiment, can be on x direction and y direction the workbench 1 of mobile bearing glass substrate 2, yet also can stationary work-table 1, dollying optical system and laser illuminating optical system on x direction and y direction.Be according to moving in the 1st embodiment as the relative position of following realization.
Workbench 1 has motor (motor) or the actuator (actuator) that is used for the optional position travelling table 1 on x direction and y direction, laser-adjusting device 101 has mobile/drive control part 3.In addition, image pickup optical system and laser illuminating optical system are fixed on the beam (horizontal arm section) of crane boom (gantry), and crane boom is fixed on the pallet in the mode of crossing over the workbench 1 that moves on the x-y direction and forms the bridge shape.Amount of movement on mobile/3 pairs of workbench of drive control part, 1 indication x direction and the y direction, the position of control workbench 1 on x direction and y direction.Therefore, glass substrate 2 can move arbitrarily on x direction and y direction with respect to the relative position of object lens 9.
In addition, in the 1st embodiment, as the base board checking device 4 of the external device (ED) of laser-adjusting device 101 by network or directly be connected with laser-adjusting device 101.Base board checking device 4 is a kind of so automatic macro inspection apparatus: it is made a video recording to glass substrate 2 by for example line sensor (line sensor) etc., the position and the defect kind of the defective on the image detection glass substrate 2 that obtains according to shooting.In addition, base board checking device 4 also can be following observation and inspection device: it is by micro heads such as microscopes, amplifies according to from the defect information of this macro inspection apparatus and detected each rejected region, confirms whether be to need the defective of proofreading and correct.Mobile/drive control part 3 is accepted the defective locations data relevant with detected defective locations from base board checking device 4, according to the amount of movement of defective locations data computation workbench 1 on x direction and y direction of accepting, thus control workbench 1.
Consequently, substrate 2 relatively moves on x direction and y direction with respect to object lens 9, thereby makes and to locate on the optical axis of object lens 9 by the defective on the base board checking device 4 detected glass substrates 2.That is to say, be positioned in by base board checking device 4 detected defectives in the visual field of image pickup optical system in the heart, and be positioned on the irradiation position of the laser that the laser illuminating optical system sends.
In addition, in other embodiments, also can carry out relatively moving of glass substrate 2 and object lens 9 by additive method.For example, laser-adjusting device 101 has crane boom (gantry), and crane boom possesses the upwardly extending beam in y side, moves on the y direction along the beam of crane boom by making image pickup optical system and laser illuminating optical system, workbench 1 is moved on the x direction, thereby can relatively move.In addition, workbench 1 is fixing and make image pickup optical system and laser illuminating optical system under the situation that x direction and y direction move, crane boom is set to and can moves on the x direction along workbench 1, by image pickup optical system and laser illuminating optical system are moved on the y direction along the horizontal arm section of this crane boom, thereby can relatively move.Workbench 1 both can constitute direct bearing glass substrate 2, also can constitute to make glass substrate 2 float the workbench that floats to both take the altitudes from blowing air down.
Inscape relevant with the shooting of defective in the laser-adjusting device 101 then is described.The image pickup optical system that laser-adjusting device 101 is possessed has lighting source 5, relay lens 6, optical splitter 7, optical splitter 8, object lens 9, imaging len 10, image pickup part 11.Be sent to image processing part 12 by image pickup part 11 captured view data and handle, and be presented on the monitor 13.
The lighting source 5 that usefulness is observed in reflection penetrates the glass substrate 2 required illumination light of making a video recording.Relay lens 6, optical splitter 7, optical splitter 8 and object lens 9 are configured in illumination light and arrive on the light path of glass substrate 2.That is to say that penetrate after the illumination light that arrives optical splitter 7 by relay lens 6 is reflected by optical splitter 7 from lighting source 5, optical splitter 8 is crossed in transmission, is radiated on the glass substrate 2 via object lens 9.
From the reverberation of glass substrate 2 via object lens 9 and passed through optical splitter 8 and optical splitter 7 after, utilize imaging len 10 imaging on the photo detector of image pickup part 11, carry out the shooting of glass substrate 2 thus.
The following describes in the laser-adjusting device 101 inscape of proofreading and correct about defective and residual defects.The laser illuminating optical system that laser-adjusting device 101 is had has laser oscillator 14, optical splitter 15, eyeglass 16, DMD (Digital Micromirror Device) unit 17, relay lens 18, optical splitter 8 and object lens 9.
In addition, laser-adjusting device 101 also has the correction position that direct light is projected on the glass substrate 2 to be confirmed with light source 21, and its purpose is to confirm the irradiation position of laser that defect correction is used.It for example is LED (Light Emitting Diode) light source that correction position is confirmed with light source 21, can not apply the influences physically such as resist film sensitization that make on the glass substrate 2.
And DMD unit 17 is driven device 20 and drives, and driver 20 is by 19 controls of laser shape control unit.In other words, laser shape control unit 19 and driver 20 play a role as the modulation control module, with the DMD unit 17 of control as the two-dimensional space light-modulating cell.In addition, in the control that laser shape control unit 19 is carried out, according to the defect image of being handled by image processing part 12, conduction and cut-off (ON/OFF) is controlled each small eyeglass, makes the reflection shape of DMD unit 17 become the shape identical with defect correcting.
Cross optical splitter 15 backs in eyeglass 16 reflections, with set angle θ from the laser-transmitting that laser oscillator 14 penetrates
InIncide DMD unit 17.DMD unit 17 is a kind of of the two dimensional spatial light modulator that is controlled to be arbitrary shape of the section shape with laser, also can use the two dimensional spatial light modulator of other kinds of having used porjection type liquid crystal or reflective liquid crystal to replace DMD unit 17.In addition, for only to the position and the scope irradiates light of expectation, except two dimensional spatial light modulator, the beam-shaping slit that can also use the shadow shield by iris diaphragm that can change peristome or L word shape to constitute according to the shape of defect correcting.To comprise this two dimensional spatial light modulator and beam-shaping and be called the laser forming unit at parts interior, that form the beam shape of laser according to defect correcting with slit.
With above-mentioned set angle θ
InThe incident light of the small eyeglass incident under conducting state with respect to DMD unit 17 with set angle θ
OutReflection.But under conducting state and cut-off state, because the inclination angle difference of the eyeglass face of small eyeglass, therefore by identical set angle θ
InThe incident light of the small eyeglass incident under conducting state can be reflected to and be different from set angle θ
OutDirection.For example the difference at the inclination angle of small eyeglass is 10 degree under conducting state and the cut-off state.Surface and DMD unit 17 that the laser illuminating optical system constitutes glass substrate 2 are on the position of conjugation.
Therefore, only arrive optical splitter 8 via relay lens 18, shone again on the glass substrate 2 by object lens 9 optically focused by optical splitter 8 reflection backs by the small eyeglass laser light reflected under the conducting state.
In addition, after correction position confirms that the direct light that penetrates with light source 21 is reflected by optical splitter 15, project on the glass substrate 2 via the light path identical with the laser that penetrates from laser oscillator 14.Therefore, drive under the state of each small eyeglass in the mode that forms with the identical shaped pattern of defect correcting in DMD unit 17, confirm to shine direct light via same optical path from correction position, thereby can confirm the range of exposures of laser by direct light with light source 21.By to shining low level laser, thereby can not bring physically influence, can confirm range of exposures glass substrate 2 for the scope of proofreading and correct the laser of preparing to shine high level.
As above, made a video recording by the defective on the detected glass substrate 2 of 11 pairs of base board checking devices of image pickup part 4, image processing part 12 detects defective, the accurate position and the scope of defect recognition according to image.That is to say that in the 1st embodiment, image pickup part 11 and image processing part 12 play a role as defect detection unit.
And, the position and the shape of the defect correcting that laser-adjusting device 101 is discerned according to image processing part 12, each small eyeglass to DMD unit 17 carries out conduction and cut-off control, confirm to confirm laser irradiating position by correction position with light source, the position that should proofread and correct and scope irradiating laser from 14 pairs of glass substrates 2 of laser oscillator then, defect correcting.
And then laser-adjusting device 101 judges whether to exist residual defects by residual defects test section 22 after defect correcting having been carried out proofread and correct, if at the defect correcting region memory at residual defects, then similarly residual defects is proofreaied and correct with the correction of defective.
At this moment, the elevation information of the height correlation in 22 acquisitions of residual defects test section and the defect correcting zone judges whether to exist residual defects according to elevation information.The hardware of the preparation method of elevation information and realization residual defects test section 22 constitutes varied according to embodiment, describes object lesson later in detail at the 2nd embodiment.
As mentioned above, use the reason of elevation information to be: the burning trace that the laser irradiation causes does not possess height, yet the residual defects of failing to utilize laser to remove has height.
In addition, if there is residual defects, then according to the definition of residual defects, the position of residual defects and scope are limited to the local or whole of initial indicated range.Therefore, residual defects test section 22 will should carry out the scope that elevation information obtains and be defined as by image processing part 12 detected indicated ranges for detecting residual defects, thereby can detect residual defects effectively.
Therefore, exist under the situation of residual defects, if laser-adjusting device 101 to the scope irradiating laser identical with initial defective, then must be, thereby also can carry out the correction of residual defects to the residual defects irradiating laser.
As mentioned above, the concrete formation of residual defects test section 22 and action can be carried out various changes, but as long as residual defects test section 22 detects residual defects, then following correction residual defects.
Whether residual defects test section 22 has detected residual defects to image processing part 12 notices.In addition, residual defects test section 22 is notified position and the shape that is identified to image processing part 12 under the situation of the position of also having identified residual defects and shape.Notifying under the situation that detects residual defects, image processing part 12 generates to be used for being designated as to driver 20 by laser shape control unit 19 proofreaies and correct residual defects and the required data of the scope of irradiating laser output to laser shape control unit 19 with these data.
Particularly, when residual defects test section 22 when image processing part 12 has been notified the recognition result of the position of residual defects and scope, image processing part 12 will represent that the position notified and the data of scope output to laser shape control unit 19.And, residual defects test section 22 only detects whether there is residual defects, there is residual defects if notified, then do not change the conduction and cut-off control of DMD unit 17 and restart laser oscillator 14, to the area illumination laser identical, thereby also can carry out the correction of residual defects with defect correcting.
About the detection and the correction of residual defects, consider the influence of substrate and preferably carry out 1 time, but also can repeat the detection and the correction of residual defects, till not detecting residual defects.
The detailed formation of laser-adjusting device 101 of the 1st embodiment and the summary of action more than have been described.Then, describe the action of laser-adjusting device 101 in detail according to flow process with reference to Fig. 2 and suitably with reference to Fig. 3.
Fig. 2 is the flow chart of action of the laser-adjusting device 101 of expression the 1st embodiment.A series of processing is the processing about 1 sheet glass substrate 2 among Fig. 2.In addition, Fig. 3 is the example of the image that uses in the detection of defective of expression the 1st embodiment.
In step S101, glass substrate 2 is moved into laser-adjusting device 101, is placed on both allocations of workbench 1.In addition, from base board checking device 4 the defective locations data relevant with glass substrate 2 are sent to mobile/drive control part 3.The defective locations data comprise and base board checking device 4 detected N (N is the integer more than or equal to 1) information that defective position each other is relevant.
So, among the step S101, also select untreated 1 defective in N the defective, read the defective locations data relevant with selected defective by mobile/drive control part 3.Mobile/drive control part 3 utilizes the method that Fig. 1 is described, carries out the control that relatively moves of workbench 1 according to the data that read.
The result that workbench 1 relatively moves is, by move/defective that drive control part 3 is selected on the common optical axis as the image pickup optical system of laser-adjusting device 101 and laser illuminating optical system, be mobile on the optical axis of object lens 9.That is, by workbench 1 is moved on the x-y direction, thereby with defect location on the visual field of object lens 9.
Then, in step S102, the image that is located in the defective in the visual field of object lens 9 by 11 pairs of image pickup parts is made a video recording, and this picture signal is outputed to image processing part 12.Thus, image processing part 12 obtains for example data of the defect image Da of Fig. 3.Defect image Da comprises the defective part G that becomes the short circuit reason that crosses over 2 circuit pattern C1 and C2, belongs to the defect correcting that needs are proofreaied and correct.
Then, in next step S103, image processing part 12 is according to the defective of following extraction as calibration object.
That is, image processing part 12 obtains the benchmark image Db that does not have defective part shown in Figure 3, more captured defect image Da and benchmark image Db.That is, image processing part 12 calculates the poor of brightness on defect image Da and the benchmark image Db, generates error image Dc shown in Figure 3.
In step S103,12 couples of error image Dc of image processing part carry out 2 values to be handled, and generates the defect shape image Dd after 2 values.The result that 2 values are handled is, the part that defect image Da goes up and the difference of the brightness of benchmark image Db is bigger is extracted out as the defective part G on the defect shape image Dd.That is, by a series of processing among the step S103, image processing part 12 identifies defective, identifies defective locations (defect coordinate) and defect shape on the glass substrate 2 corresponding with the defective part G of defect shape image Dd.
And, in the example of Fig. 3, in defect shape image Dd, represent defective part G with black, represent the background area with white.In addition, defect shape image Dd is used for the control of DMD unit 17, and this point will be described in detail in the back.
When extracting defective part G according to as above generating defect shape image Dd by image processing part 12, then in step S103, image processing part 12 outputs to laser shape control unit 19 with the data of defect shape image Dd.In addition, image processing part 12 also can be represented the scope that is extracted out as defective part G among the defect shape image Dd with particular color, generates the image that overlaps on the defect image Da, and the image that is generated is outputed to monitor 13.
In step S104, the data of the defect shape image Dd that laser shape control unit 19 will receive from image processing part 12 are converted to the control signal of the control usefulness of driver 20.That is to say, laser shape control unit 19 is to driver 20 output control signals, it is conducting state that this control signal is used for the small eyeglass corresponding with the pixel with value " 1 " driven, and small eyeglass that will be corresponding with the pixel with value " 0 " drives and is cut-off state, the data of the defect shape image Dd that its intermediate value " 1 " expression is received belong to defective part G, and the data of the defect shape image Dd that value " 0 " expression is received belong to the background area.
In step S104, the driver 20 that has received control signal from laser shape control unit 19 drives each memory cell of DMD unit 17 according to control signal and is conducting state or cut-off state.That is to say that driver 20 is according to control signal, it is conducting state or cut-off state that each small eyeglass is driven.
Then, such as mentioned above in step S105, use correction position to confirm to carry out the affirmation of range of exposures with light source 21.When image processing part 12 confirms DMD unit 17 laser be radiated at exactly the scope of answering irradiating laser, be after mode on the detected indicated range is suitably driven, by laser oscillator 14 irradiation beam of laser.
Cross optical splitter 15 from the laser-transmitting that laser oscillator 14 penetrates, reflected by eyeglass 16, with set angle θ
InIncide DMD unit 17.And, in the small eyeglass of conducting state, to the optical path direction reflection that arrives optical splitter 8 via relay lens 18, in the small eyeglass of cut-off state, to the direction reflection that is different from relay lens 18.
Consequently, by DMD unit 17 reflection, the section shape that shines the laser beam on the glass substrate 2 via relay lens 18, optical splitter 8 and object lens 9 is consistent with the shape of the defective that is extracted by defect shape image Dd as defective part G.Therefore, can be by the defective on the laser ablation glass substrate 2 corresponding to proofread and correct with defective part G.
In step S106, residual defects test section 22 detects the processing that whether has uncorrected residual defects carried out the defect correcting zone of proofreading and correct by laser in.That is, residual defects test section 22 judges whether to exist the part of further proofreading and correct owing to the insufficient needs that left behind of the defect correction among the step S105.In the present embodiment, the elevation information that residual defects test section 22 obtains in the defect correcting zone judges whether to exist residual defects according to the elevation information that obtains.
In addition, residual defects test section 22 also can be discerned the position of residual defects and the processing of shape according to the elevation information in the defect correcting zone, and whether judge needs to proofread and correct residual defects.
In the 1st embodiment, burn trace and residual defects in order to be easy to difference, residual defects test section 22 uses elevation information.If the use elevation information then can be distinguished as the residual defects of the protuberance that has height on the glass substrate 2 clearly and not stay the glass substrate 2 lip-deep burning traces of residual defects.
In step S107, residual defects test section 22 judges whether need to proofread and correct again.Basically, whether need to proofread and correct again according to whether having detected residual defects and determine.Wherein, in the 1st embodiment, in order to prevent the excessive irradiation of laser, in step S107, residual defects test section 22 is specific as follows to be divided into the 1st～3rd kind of situation and to judge.
The 1st kind of situation is the situation that does not detect residual defects at step S106.Under the 1st kind of situation, residual defects test section 22 is judged as not to be needed to proofread and correct again, handles to enter into step S108.
On the other hand, if detected residual defects, then belong to the 2nd kind or the 3rd kind of situation at step S106.If S106 has detected residual defects in step, then residual defects test section 22 judges whether the current defect correcting of paying close attention to have been carried out the laser irradiation of set number of times (being made as M time).
The 2nd kind of situation is the situation of having carried out the laser irradiation of predefined set number of times (M time).Under the 2nd kind of situation, in order to prevent excessive irradiation, when having carried out the laser irradiation of predefined set number of times, residual defects test section 22 is judged as not to be needed to proofread and correct again, handles to enter into step S108.
The 3rd kind of situation is the situation of the current defective of paying close attention to not being carried out the laser irradiation of predefined set number of times, in this case, is judged as and need proofreaies and correct again detected residual defects among the step S106.Under the 3rd kind of situation, residual defects test section 22 need be proofreaied and correct residual defects again to image processing part 12 notices.In addition, if residual defects test section 22 identifies the position and the shape of residual defects in step S106, then also notify image processing part 12 with recognition result.Under the 3rd kind of situation, accepted to move according to following from the image processing part 12 of the notice of residual defects test section 22.
Promptly, if residual defects test section 22 only detects the elevation information of residual defects, then the data of the image processing part 12 defect shape image Dd that will obtain at first output to laser shape control unit 19, under the situation that does not change DMD unit 17, restart laser oscillator 14, to carrying out the laser irradiation with initial identical defect correcting zone.
In addition, if residual defects test section 22 also detects defective locations and shape except elevation information, then image processing part 12 outputs to laser shape control unit 19 according to the view data that generates the shape of representing residual defects from the inspection data of residual defects test section 22 with the view data that is generated.Laser shape control unit 19 is to the shape of driver 20 indication residual defects, each small eyeglass of DMD unit 17 carried out conduction and cut-off control and change the reflection shape.Laser oscillator 14 makes laser generation after changing in DMD unit 17, to residual defects area illumination laser to proofread and correct residual defects.
Therefore, repeat the processing of step S104～step S107, in to initial defect correction zone, detect less than residual defects till or carried out till M laser as set number of times shines.The 1st time step S104 and step S105 in the reprocessing are the steps that is used for defect correction, and the 2nd time and later step S104 and step S105 are used for the step that residual defects is proofreaied and correct.
Proceed under the situation of step S108 from step S107 in processing, mobile/drive control part 3 is judged and whether have untreated other defect from N corresponding defective of the defective locations data of base board checking device 4 acceptance.If there is no untreated other defect, then relevant with glass substrate 2 correction is all over, thereby finishes the processing of Fig. 2.If there is untreated other defect, then handles and return step S101.So, can be to N defective difference execution in step S101～step S108.
The 1st embodiment more than has been described, has illustrated successively below the residual defects test section in the 1st embodiment 22 is carried out other embodiments after the various distortion.
The 2nd embodiment be to use by from oblique to initial defect correction area illumination light and the shadow that the residual defects of remaining defectiveness correcting area causes detects the embodiment of residual defects with height.Below with reference to Fig. 4 and Fig. 5 the 2nd embodiment is described.
Fig. 4 is the pie graph of the laser-adjusting device 102 of the 2nd embodiment.The laser-adjusting device 101 of Fig. 1 is as follows with the difference of the laser-adjusting device 102 of Fig. 4.
That is, laser-adjusting device 102 also has and is used for from oblique lighting source 23 and relay lens 24 to initial defect correction area illumination illumination light.In addition, the image processing part 12b in the laser-adjusting device 102 except have with laser-adjusting device 101 in the same function of image processing part 12, also bring into play the part of functions of the residual defects test section 22 in the laser-adjusting device 101.Therefore, image pickup part 11 is not only to making a video recording with the same image of the 1st embodiment, also image processing part 12b detected the image that residual defects uses and makes a video recording.That is, in the 2nd embodiment, the function of the residual defects test section 22 of the 1st embodiment realizes by image pickup part 11, image processing part 12b, lighting source 23, relay lens 24.
Shine the angle φ that the surface of the optical axis of the illumination light on the glass substrate 2 and glass substrate 2 constitutes from lighting source 23 via relay lens 24
1, be the angle φ that the optical axis of illumination light and xy plane constitute
1For example below 30 degree, be more preferably the angle that constitutes roughly from about the 10 such degree of fully horizontal (level) irradiation.
As above the action of the laser-adjusting device 102 of Gou Chenging is identical with the flow chart of Fig. 2, yet has more specifically realized the action of step S106 in the 2nd embodiment.So, describe the action of laser-adjusting device 102 among the step S106 in detail below with reference to Fig. 5.
In step S106, in order to improve the accuracy of detection of residual defects, lighting source 5 extinguishes, and the substitute is lighting source 23 and lights.The angle φ of lighting source 23 from tilting with respect to glass substrate 2
1Center, the visual field towards image pickup optical system is the initial defect correction area illumination illumination light that is extracted out as defective part G among the step S103.
The protuberance that is had height from the next illumination light of lighting source 23 irradiations blocks, and therefore can present shadow.In step S106, shadow in initial defect correction zone, occurs and just represent to exist residual defects with projecting height.
That is to say that in the 2nd embodiment, elevation information comprises the information of expression " owing to the residual defects that has shadow to exist to have height " or the information that expression " does not have shadow thereby do not have residual defects ".
Therefore, in the step S106 of the 2nd embodiment, in that irradiation comprises defect correction zone on the glass substrate 2 under the situation of the area of visual field of interior object lens 9 from the illumination light of lighting source 23, make a video recording by the image in the visual field of 11 pairs of object lens 9 of image pickup part, the view data that shooting is obtained outputs to image processing part 12b.Image processing part 12b judges whether to exist shadow according to the data that receive, thereby judges whether to exist residual defects.The following example that the detection of the residual defects that image processing part 12b carries out is described with reference to Fig. 5.
Fig. 5 is the figure that expression is used for the example of the image that residual defects detects in the 2nd embodiment.
The residual defects image De of Fig. 5 is an example of being taken the image that obtains in step S106 by image pickup part 11.Residual defects image De is similar to the defect image Da of Fig. 3, yet difference is: replace comprising the defective part G corresponding with initial defective, but comprise the residual defects portion Gb corresponding, and comprise the H of shadow portion that is mapped with the shadow that produces owing to residual defects with residual defects.
Therefore, and generate error image Dc similarly in the step S103 of Fig. 2, image processing part 12b is the benchmark image Db of residual defects image De and Fig. 3 relatively, the error image Df of generation Fig. 5.Image processing part 12b also carries out 2 values to error image Df to be handled, and generates the shadow shape image Dg after 2 values.Be used for generating the 2 value processing of shadow shape image Dg and step S103 and be used for handling similar, thereby omit its detailed description according to 2 values that error image Dc generates defect shape image Dd.
In Fig. 5, represent the H of shadow portion of shadow shape image Dg with black, represent background area outside the H of shadow portion with white.With the defect shape image Dd of Fig. 3 similarly, in shadow shape image Dg, also use the brightness of each pixel that comprises among " 1 " such value representation black shadow H of portion, the brightness of each pixel that comprises in the background area with " 0 " such value representation white.By above a series of processing, image processing part 12b extracts the H of shadow portion.
And image processing part 12b utilizes brightness poor of Gb of residual defects portion and the H of shadow portion, uses suitable threshold to carry out 2 values and handles, thereby can only extract the H of shadow portion.
In step S106, image processing part 12b extracts the processing of the H of shadow portion, if having the H of shadow portion then be judged as that to have the protuberance with height be residual defects, if there is no the H of shadow portion then is judged as and does not have residual defects.And image processing part 12b is in order to suppress The noise, is judged as when only the area of the H of shadow portion is more than or equal to both sizings in shadow shape image Dg to have the H of shadow portion.
And in step S107, image processing part 12b judges whether there is residual defects in initial defect correction zone according to the image information of shadow.Processing afterwards is identical with Fig. 2 of the 1st embodiment.
The 2nd embodiment more than has been described, yet the 2nd embodiment can carry out various distortion, the variation of the following stated is exactly an example.
Lighting source 23 preferred variable irradiating angle φ shown in Figure 4
1, so that elongated by the shadow that residual defects generated that highly is tens nm.In addition, radiation source 23 preferably can change the irradiating angle φ that manifests shadow brightly according to the resolution ratio of image pickup optical system
1
In addition, owing to do not discern the accurate position of residual defects and the processing of shape in above-mentioned the 2nd embodiment, therefore the scope of irradiating laser is identical with the scope of initial defect correction for the correction of carrying out residual defects.
In addition, image processing part 12b also can be according to the length of the H of shadow portion with from the irradiating angle φ of the illumination light of lighting source 23
1Calculate the height of residual defects, judge whether to proofread and correct again according to elevation information.And then image processing part 12b can also control laser oscillator 14, makes to penetrate laser in the high more mode of the high more then output of residual defects that calculates.
In addition, image processing part 12b also can be according to from the shape of the optical axis direction of the illumination light of lighting source 23 and the H of shadow portion and the position that scope is dwindled residual defects and the processing of scope.In this case, image processing part 12b can generate the view data of the scope after expression is dwindled by the form identical with shadow shape image Dg, and this view data is outputed to laser shape control unit 19.Thus, also can prevent excessive laser irradiation.
In addition, can also come the 2nd embodiment is out of shape in the mode of getting rid of the concavo-convex influence to shadow that causes by circuit pattern.
Promptly, lighting source 23 on the part of having used, having distinguished in advance the unit cell pattern that does not have defective of making a video recording for benchmark image Db to Fig. 3 irradiating illumination light (and, in general FPD glass substrate 2, owing to repeat identical circuit pattern, this recurring unit is called " unit cell pattern " below therefore) with being the two-dimensional array shape.And, making a video recording by the unit cell pattern on 11 pairs of glass substrates of image pickup part under this state.For convenience's sake, below the image of being made a video recording is called " benchmark image that has shadow ".In having the benchmark image of shadow, be mapped with the shadow that produces by the concavo-convex of normal circuit pattern.The benchmark image that has shadow is made a video recording in advance, is stored in the not shown storage device that laser-adjusting device 102 possessed.
Therefore, image processing part 12b uses the benchmark image that has shadow to replace the benchmark image Db of Fig. 3, residual defects image De according to Fig. 5 generates error image Df with the benchmark image that has shadow, thereby can only extract the H of shadow portion of residual defects with above-mentioned the 2nd embodiment in the same manner.
The 2nd embodiment and variation thereof more than have been described.The 3rd embodiment then is described.
The 3rd embodiment is the projected light that has predetermined linear pattern to the substrate projection, detects the embodiment of the residual defects with height according to the deflection of the projected light on the substrate.Followingly the 3rd embodiment is described with reference to Fig. 6～Fig. 8.
Fig. 6 is the pie graph of the laser-adjusting device 103 of the 3rd embodiment.The following difference of expressing laser-adjusting device 101 with the laser-adjusting device 103 of Fig. 6 of Fig. 1.
That is, laser-adjusting device 103 is in order to have the projected light of predetermined linear pattern to glass substrate 2 projections, also have lighting source 23, relay lens 24 and be configured in lighting source 23 and relay lens 24 between light path on projection pattern grating 25.In addition, the image processing part 12c of laser-adjusting device 103 except bear with the same function of the image processing part 12 of laser-adjusting device 101, also bear the part of functions of the residual defects test section 22 in the laser-adjusting device 101.Therefore, image pickup part 11 is not only made a video recording to the image identical with the 1st embodiment, but also the image that image processing part 12c detection residual defects is used is made a video recording.That is, in the 3rd embodiment, the function of the residual defects test section 22 of the 1st embodiment realizes by image pickup part 11, image processing part 12c, lighting source 23, relay lens 24, projection pattern grating 25.
And the parts that will have thin-line-shaped slit opening portion and light shielding part in the 3rd embodiment are called " projection pattern grating ".Be formed with cross pattern on the projection pattern grating 25 or specific pattern shown in Figure 8 is used as slit opening portion.Below this specific pattern is called " projection pattern ".
Projection pattern grating 25 for example can be the plate that is provided with the transparent material of photomask in the part, also can be to offer the hole and the plate that formed the light-proofness material of peristome, can also be to use the spatial light modulator of transmission-type liquid crystal.
In addition, can also realize that the projection pattern grating is to replace the projection pattern grating 25 that Fig. 6 disposes like that by DMD.If for example confirm to reflect, then be projected onto on the glass substrate 2 via relay lens 18, optical splitter 8, object lens 9 with the small eyeglass of illumination light under the conducting state of DMD unit 17 that light source 21 penetrates from correction position shown in Figure 6.At this moment, each small eyeglass of DMD unit 17 is carried out conduction and cut-off control forming projection pattern, thereby also can realize the projection pattern grating.
In addition, projection pattern projects to the lip-deep angle φ of glass substrate 2
2, be the angle φ that the optical axis of relay lens 24 and xy plane constitute
2Can suitably determine according to embodiment.
As above the action of the laser-adjusting device 103 of Gou Chenging is identical with the flow chart of Fig. 2, yet has more specifically realized the action of step S106 in the 3rd embodiment.So, below with reference to the details of the action of laser-adjusting device 103 among Fig. 7 description of step S106.
In step S106, in order to improve the accuracy of detection of residual defects, lighting source 5 extinguishes and lights lighting source 23 for it.The angle φ of lighting source 23 from tilting with respect to glass substrate 2
2Towards the center, the visual field of image pickup optical system, be the initial defect correction area illumination illumination light that is extracted out as defective part G among the step S103.
Form the cross pattern shape from the section shape of the next illuminating bundle of lighting source 23 irradiations by projection pattern grating 25.Section shape with light beam is called " pattern light " by the illumination light that projection pattern grating 25 forms given shape below.Pattern light arrives the surface of glass substrate 2 via relay lens 24.
If do not have residual defects, then shine the pattern light meeting conduct and the angle φ in defect correction zone via relay lens 24 at initial defect correction intra-zone
2The projection pattern of corresponding cross projects on the surface of glass substrate 2.But if having concavo-convex residual defects at the defect correction region memory, then pattern light can be owing to the concavo-convex of residual defects with the state, as projected of pattern distortion (inclination).
Therefore, the elevation information in the 3rd embodiment comprises: the information that is shown as " having the residual defects with height owing to institute's projected pattern distortion "; With the information that is shown as ", thereby not having residual defects " because pattern does not carry out projection to distortion.
Therefore, in the step S106 of the 3rd embodiment, under the projection pattern of wire is projected in state on the glass substrate 2, comprises the image of defect correction zone in the visual field of interior object lens 9 view data that obtains of making a video recording by 11 pairs of image pickup parts and be output to image processing part 12c.Image processing part 12c judges whether to exist the distortion of the projection pattern in the defect correction zone according to the view data that receives, thereby judges whether to exist residual defects.The example of the detection of the residual defects that image processing part 12c carries out is described below with reference to Fig. 7.
Fig. 7 is the figure of detection of the residual defects of explanation the 3rd embodiment.And the projection pattern in Fig. 7 example is criss-cross pattern.
In step S106, lighting lighting source 5 and extinguishing under the situation of lighting source 23, after 11 pairs of glass substrates of image pickup part 2 have carried out shooting, can similarly obtain to comprise the residual defects image of Gb of residual defects portion and circuit pattern with the defect image Da of Fig. 3.
In addition, for the ease of visually recognizing accompanying drawing, on the residual defects image Dh of Fig. 7, only show the residual defects portion Gb corresponding with residual defects and with distortion ground projected pattern Ia corresponding shape.
In step S106, the error image after image processing part 12c generates the residual defects image that image pickup part 11 is captured and benchmark image and compares to these error image 2 values, obtains the pattern light shape image Di of Fig. 7.In pattern light shape image Di, extract because residual defects causes the projection pattern Ia of distortion.
The pattern light shape benchmark image Dj of Fig. 7 does not have under the situation of residual defects the 2 desirable value images that should be able to obtain as pattern light shape in supposition.Pattern light shape benchmark image Dj is stored in the not shown storage device of preprepared.
Image processing part 12c is Comparing patterns light shape image Di and pattern light shape benchmark image Dj in step S106, thereby detects the distortion that whether has pattern light.For example, image processing part 12c generates the error image of pattern light shape image Di and pattern light shape benchmark image Dj, thereby calculates the size of the different piece among pattern light shape image Di and the pattern light shape benchmark image Dj.If the size that calculates is more than or equal to threshold value, then image processing part 12c can be judged as pattern by distortion ground projection.In the example of Fig. 7, the shape of the pattern Ib among the shape of the pattern Ia among the pattern light shape image Di and the pattern light shape benchmark image Dj is obviously different, so image processing part 12c detects distortion.That is to say that image processing part 12c detects residual defects.
And in step S107, image processing part 12c judges whether there is the residual defects that has by the concavo-convex height that causes in initial defect correction zone according to the image information of projection pattern.After this processing is identical with Fig. 2 of the 1st embodiment.
Fig. 8 is the figure of the example of the projection pattern used in the 3rd embodiment of expression.Fig. 8 is a peristome of representing projection pattern grating 25 with black, represents the figure of light shielding part with white.
As shown in Figure 8, can with cross projection pattern Pa, the projection pattern Pc etc. that forms latticed projection pattern Pb and form concentric circles arbitrarily linear pattern as projection pattern.The size and the interval between the line of projection pattern are preferably suitably determined according to the size of the residual defects that should detect.
And, when existing on the glass substrate 2 under the concavo-convex situation cause by the normal circuit pattern that forms, when having detected in projection the same projection pattern because the complexity of the distortion that the height of residual defects causes also depends on the wiring direction that is formed on the circuit pattern on the glass substrate 2 and density etc. sometimes.For example preferred design data according to glass substrate 2 waits uses suitable projection pattern grating 25.
The 3rd embodiment more than has been described.The 4th embodiment then is described.
The 4th embodiment is to use the height in the initial defect correction zone of confocal unit (confocal unit) mensuration, detects the embodiment of the residual defects with height.Followingly the 4th embodiment is described with reference to Fig. 9～Figure 12.
Fig. 9 is the pie graph of the laser-adjusting device 104 of the 4th embodiment.Compare the formation that laser-adjusting device 104 is described with Fig. 1 below.Laser illuminating optical system in the laser-adjusting device 104 is identical with Fig. 1, thereby omits its explanation.
In the image pickup optical system of laser-adjusting device 104, optical splitter 34 is configured between lighting source 5 and the optical splitter 6, and image pickup part 11 is configured on the reflected light path of this optical splitter 34.Reflected by optical splitter 7 via relay lens 6 after optical splitter 34 is crossed in the illumination light transmission of lighting source 5 ejaculations, optical splitter 8 is crossed in transmission, shines on the glass substrate 2 via object lens 9 again.Reverberation from glass substrate 2 is reflected by optical splitter 34 through the path identical with input path again, incides image pickup part 11.
The image pickup part 11 and the 1st embodiment of the laser-adjusting device 104 of Fig. 9 are same, and the various images that shooting is obtained output to image processing part 12d.
In addition, the laser-adjusting device 104 of Fig. 9 has the confocal unit identical with known confocal microscope, to replace the residual defects test section 22 of Fig. 1.And, the image processing part 12d of Fig. 9 of the 4th embodiment not only can bring into play with the 1st embodiment in image processing part 12 identical functions of Fig. 1, can also be by to handle the elevation information that obtains with the height correlation of glass substrate 2 from the data of confocal unit output.That is, image processing part 12d also has the function that is equivalent to a part of residual defects test section 22.
The confocal unit of the 4th embodiment has LASER Light Source 26, eyeglass 27, optical splitter 28, two-dimentional scanning mechanism 29, collector lens 30, collector lens 31, pinhole plate 32, photodetector 33.In addition, the total common light path that constitutes by optical splitter 7, optical splitter 8 and object lens 9 of confocal unit and image pickup optical system.LASER Light Source 26 is the LASER Light Sources that are used for the kind of general confocal laser microscope observation.The laser of LASER Light Source 26 can not bring physically influence to defective and residual defects.
In addition, the workbench 1d of Fig. 9 not only similarly has with the workbench 1 of Fig. 1 makes object lens 9 and glass substrate 2 function that relative position moves on x direction and y direction, also has the function that the relative position on the z direction is moved.Therefore, mobile/drive control part 3d of Fig. 9 and mobile/drive control part 3 of Fig. 1 are similarly not only controlled workbench 1d with respect to object lens 9 relatively moving on x direction and y direction, also are controlled at relatively moving on the z direction.
And, also can make object lens 9 move by the not shown motor of not shown control part control etc. towards the z direction, realize relatively moving on the z direction between glass substrate 2 and the object lens 9 thus.
Confocal unit according to as get off to obtain the elevation information of glass substrate 2.
That is, after the LASER Light Source 26 as spot light work penetrated laser, laser can be reflected by eyeglass 27, and transmission is crossed optical splitter 28 and arrived two-dimentional scanning mechanism 29.Two-dimentional scanning mechanism 29 for example is to use the sweep mechanism of beam flying mirror (galvanometer mirror).Two-dimentional scanning mechanism 29 utilizes from the laser of optical splitter 28 incidents and realizes the scanning of glass substrate 2 on x direction and y direction.
Arrived optical splitter 7 by two-dimentional scanning mechanism 29 laser light reflected via collector lens 30, optical splitter 7 and 8 are crossed in transmission, shine on the glass substrate 2 via object lens 9.The light that reflects on the surface of glass substrate 2 is after optical splitter 8 and 7 are crossed in transmission via object lens 8, arrive two-dimentional scanning mechanism 29 via collector lens 30, reflected by two-dimentional scanning mechanism 29 and arrive optical splitter 28, on optical splitter 28, be reflected, arrive pinhole plates 32 via collector lens 31.
Therefore, on one side mobile/drive control part 3d makes a control of moving to the z direction in workbench 1d and the object lens 9, on one side by the positional information on photodetector 33 detection of reflected light intensities and this moment z direction, thereby obtain elevation information on the glass substrate 2.
For example, move/drive control part 3d with set interval delta z from z=z
sTo z=z
s+ N Δ z (n is a positive integer) changes the z coordinate of workbench 1d successively.And, to (N+1) individual different z coordinate, carry out the two-dimensional scan of x direction and y direction respectively, about the each point of representing with the group of x coordinate and y coordinate, by photodetector 33 detection of reflected light intensities and storage by two-dimentional scanning mechanism 29.
Here, the scope that also can will have a height more than for example predetermined threshold value by image processing part 12d is as the scope of residual defects and detect.Perhaps, image processing part 12d can dynamically determine benchmark according to the distribution of the height from the data of photodetector 33 outputs, discerns the scope of residual defects according to determined benchmark.In any case, photodetector 33 and image processing part 12d play a role as following protuberance detecting unit, that is: this protuberance detecting unit is measured the height of glass substrate 2 according to the detected intensity of the light that changes along with the z coordinate, according to the height of being measured, the protuberance that has height on the glass substrate 2 is detected as residual defects.
And the scope that scans by two-dimentional scanning mechanism 29 comprises initial defect correction scope at least.That is, the scope that comprises the defective part G among the defect shape image Dd of Fig. 3 is equivalent to sweep object.
In addition, as mentioned above, the elevation information in the 4th embodiment comprises the concrete height of the each point in the scope of residual defects.Therefore, can be according to the concrete output level that highly changes laser oscillator 14 of the residual defects that obtains as elevation information.For example can be for, image processing part 12d or not shown control part calculate average height in the residual defects scope, the output level of control laser oscillator 14 makes that mean value is big more and then penetrates laser with high more output.Except mean value, can also use suitable typical value.
By by laser oscillator 14 with the intensity irradiation correction laser corresponding with the height of residual defects, thereby can obtain following effect.That is, can reduce the number of times of the detection and the laser irradiation of repetition residual defects, can shorten correction time, needn't export to highly lower defective irradiating laser with required above height, thereby the generation of energy inhibition of sintering trace.
Then, with reference to the action of the laser-adjusting device 104 of flowchart text the 4th embodiment of Figure 10.
The difference of the flow chart of Fig. 2 and Figure 10 is following 2 points in the 1st embodiment.The 1st is that the processing of Figure 10 begins back execution in step S201 at once.The 2nd is in Figure 10 the step S106 of Fig. 2 to be replaced into step S207.
Except that these 2, the processing of Figure 10 is all identical with Fig. 2.That is, step S 101～step S105 of Fig. 2 is corresponding with step S202～step S206 of Figure 10, and the step S107 of Fig. 2～step S108 is corresponding with step S208～step S209 of Figure 10.In addition, the two difference is: the judgement of step S107 is that the residual defects test section 22 by Fig. 1 carries out, and the judgement of step S208 is that the image processing part 12d by Fig. 9 carries out, yet the judgment standard that divides three kinds of situations to judge is identical.
Therefore, only description of step S201 and step S207 below.
In step S201, the calibrated altitude of glass substrate 2 is measured in confocal unit.Mensuration about calibrated altitude has several different methods.
For example, as the 1st method, can be by the method that Fig. 9 is illustrated, the height of being measured the datum level of the glass substrate 2 that does not have defective by confocal unit obtains calibrated altitude.The result who measures is that photodetector 33 identifies the height of each point in the measurement range.Then the surface of glass substrate 2 just should smooth such precondition so photodetector 33 is based on if there is no residual defects, according to the distribution of the height that recognizes, obtains the calibrated altitude of the glass substrate within the vision 2 of object lens 9.
In addition, for example as the 2nd method because the scope of residual defects can be than initial indicated range broadness, thus photodetector 33 can be outside the initial defect correction scope of the glass substrate 2 of calibration object basis of calculation height.Both the measurement of 1 standard height can be only carried out like that to the glass substrate 2 that comprises a plurality of defectives, also the metering of calibrated altitude can be carried out each defective by Figure 10.
If in step S201, measure the height of part of the unit cell pattern do not have defective and registration elevation information like that in advance according to above-mentioned the 1st method as benchmark, then need not every glass substrate execution in step S201, when proofreading and correct each defective, can omit step S201.
In this case, the each point height in the measurement range that is identified as the result who measures by photodetector 33 is the calibrated altitude of each point.Therefore, even if concavo-convex being present on the glass substrate 2 that causes by the normal circuit pattern that forms, also can be according to the actual height of the glass substrate 2 of calibrated altitude and calibration object poor, each point is detected whether there is residual defects.
In any case, all in step S201, measure as the height that is used for judging whether to exist the standard of residual defects according to elevation information.
In step S207,, measure the height of glass substrate 2 by confocal unit by the method that Fig. 9 is illustrated.The scope of measuring height for example both can be the field range of object lens 9, also can be the scope that is equivalent to detected initial defective among the step S20, can also be the rectangular extent that comprises the minimum of initial defective.In addition, to the beginning coordinate Z that relatively moves of the z direction of Fig. 9 explanation
sFor example both can be the calibrated altitude of measuring among the step S201, also can be the height than the degree at the low set edge of calibrated altitude.
In step S207, the x coordinate of the elevation information of the each point in the measurement range that confocal unit is measured and the each point of two-dimensional operation mechanism 29 and y coordinate associate and are input to image processing part 12d.Image processing part 12d will deduct calibrated altitude from the height of photodetector 33 outputs and come calculated difference at the each point in the measurement range, detect residual defects according to the difference that calculates.For example, image processing part 12d will be identified as the scope of residual defects by the scope that the difference that calculates constitutes more than or equal to the point of set threshold value, generate the position of expression residual defects and 2 value images of scope and also output to laser shape control unit 19.
Figure 11 is the figure that the residual defects of explanation the 4th embodiment detects.Figure 11 comprise the section L vertical with the xy plane residual defects profile Q and represent the vertical view of residual defects with contour.
Among Figure 11, with " Z
0" calibrated altitude of the datum level measured among the expression step S201.In addition, in vertical view, represented that with the straight line of expression section L height is at Z
1Above scope R1 and height are at Z
1Above scope R2 and height are at Z
3Above scope R3.
For example, establishing predetermined allowable error is ε, and Z
1=Z
0During+ε, image processing part 12d in step S207, be identified as " in the each point in the scope R1, height of being measured and calibrated altitude Z
0Difference more than or equal to ε, therefore be the scope of residual defects ".When detecting the scope R1 of residual defects like this, then image processing part 12d generates the pixel of scope R1 inside is set " 1 " value, and the pixel of scope R1 outside is set the 2 value images that " 0 " is worth, and this 2 value image is outputed to laser shape control unit 19.And, enter into step S205 and step S206 in case handle from step S208, then region R 1 is carried out the laser irradiation.
Perhaps, if Z
1=Z
0+ ε, then image processing part 12d should be able to be with scope R2 as the scope of residual defects and detect.
The 4th embodiment more than has been described, yet that the formation of confocal unit is not limited to is shown in Figure 9, can pinhole plate 32 be replaced into miscellaneous part according to the formation of confocal unit.
In Fig. 9 of the 4th embodiment, used the pinhole plate 32 that offers pin hole 32a, pin hole 32a plays a role as the catoptrical aperture that is used to cut off from the position outside the focusing position of object lens 9.But in the mensuration of confocal unit, can use various confocal aperture portion to replace pinhole plate 32, and aperture is configured on the position with the focusing position conjugation of object lens 9 with aperture to height.
Below, the variation of the pinhole plate 32 of having replaced Fig. 9 is described with reference to Figure 12 and Figure 13.
Figure 12 is the figure of the example of employed confocal aperture portion in the variation of expression the 4th embodiment.4 kinds of dishes representing for example among Figure 12 all are by the rotating panel of not shown motor with the constant speed rotation.
Be formed with a plurality of slits on the whole surface of slit plate 51.As shown in the figure, the shape of all slits all is a wire.Can also use the dish of on whole surface, having offered pin hole to replace slit.
According to the formation of laser-adjusting device, the light path that may appear at the laser that penetrates from laser oscillator 14 has disposed the formation of the slit plate 51 of confocal unit.In this case, the laser that shines for the correction of carrying out defective or residual defects must not blocked by slit plate 51.So, produce the needs that for example constitute following laser-adjusting device sometimes, that is: support the rotating shaft of slit plate 51 in the mode that can freely advance and retreat, in laser oscillator 14 irradiating lasers, slit plate 51 is retreated on the position of the light path of not blocking laser.
But,, then do not need to be used to the mechanical part that slit plate 51 is retreated if use slit plate 52 to replace slit plate 51 with peristome 53.This be because, in the time of laser oscillator 14 irradiating lasers, as long as the anglec of rotation of control slit plate 52 makes the light path of laser by peristome 53.
In addition, can also use the slit plate 59 that has formed peristome 60, light shielding part 61, slit portion 62, light shielding part 63 in a circumferential direction successively.On slit portion 62, be formed with slit with slit plate 51 and 52 same a plurality of wire.
Equally, on pin hole dish 64, be formed with peristome 65, light shielding part 66, pin hole drafting department 67, light shielding part 68 at random successively along circumferencial direction.Pin hole dish 64 is the structures that the slit portion 62 of slit plate 59 are replaced into the drafting department of pin hole at random 67 of having offered a plurality of pin holes at random.Slit plate 59 and pin hole dish 64 can have disclosed feature in for example above-mentioned patent documentation 3.In addition, can also replace slit plate, pin hole dish at random, and known Nip section (Nipkow) dish that uses helical form to offer a plurality of pin holes comes as confocal aperture portion.
More than in Figure 12 for example the various rotating panels of expression for example can be used in the laser-adjusting device that Figure 13 constitutes like that.
Figure 13 is the pie graph of laser-adjusting device 105 of the variation of the 4th embodiment.The formation of laser-adjusting device 105 is compared the laser-adjusting device 104 of Fig. 9 and is wanted simple, approaches the formation of the laser-adjusting device 101 of Fig. 1.
Owing to do not need scanning on x direction and the y direction in the laser-adjusting device 105 of Figure 13, so the difference of the laser-adjusting device 104 of itself and Fig. 9 do not need to be inscapes such as two-dimentional scanning mechanism 29.Because do not need scanning, the formation of laser-adjusting device 105 is correspondingly simple, but also has shortened the detection required time of residual defects.
In addition, the laser-adjusting device 101 of Fig. 1 is as follows with the difference of the laser-adjusting device 105 of Figure 13.
The workbench 1d of Figure 13 and move/drive control part 3d is identical with the structure of Fig. 9, has realized glass substrate 2 and object lens 9 relatively moving on the z direction.
On laser-adjusting device 105, between optical splitter 8 and object lens 9, be provided with rotating panel 35 to replace the residual defects test section 22 of Fig. 1.Rotating panel 35 for example is the dish with a plurality of slits or a plurality of pin holes.And rotating panel 35 is configured to: the focusing position conjugation that is positioned at glass substrate 2 sides of the position of slit on the optical axis of object lens 9 or pin hole and object lens 9.
That is, under the state that rotating panel 35 is rotated, image pickup part 11 is repeatedly made a video recording to glass substrate 2 simultaneously with set interval delta z travelling table 1d (or object lens 9), and image processing part 12e obtains the elevation information of glass substrate 2 according to a plurality of images.And image processing part 12e detects whether there is residual defects according to elevation information, also discerns the position and the scope of residual defects.
That is to say, in Figure 13, workbench 1d, move/drive control part 3d, rotating panel 35, image pickup part 11, image processing part 12e play a role as confocal unit, in other words, the function that the residual defects test section of its performance and Fig. 1 22 is equal.In addition, image pickup part 11 plays a role as optical detecting unit with image processing part 12e, and its detection has passed through to be positioned at the light intensity with the locational aperture of the focusing position conjugation of object lens 9.
For example, when rotating panel 35 is when having offered the slit plate 52 of the dish of a plurality of pin holes or Figure 12 on whole surface, then according to the acquisition of the elevation information of the following laser-adjusting device 105 that carries out Figure 13.
Under the control of mobile/drive control part 3d, Yi Bian similarly carry out relatively moving on the z direction with the 4th embodiment, Yi Bian under the state of lighting source 5 irradiating illumination light, repeat the shooting of glass substrate 2 by image pickup part 11.For example, similarly respectively (N+1) individual different z coordinate is made a video recording with the 4th embodiment.
In this case, image processing part 12e is at the each point of representing with the group of x coordinate and y coordinate, and it is the highest that the brightness of putting on which image in the image is opened in investigation (N+1).And image processing part 12e is at each point, and the z coordinate when taking the highest image of brightness obtains as the height of this point.Perhaps image processing part 12e also can carry out suitable interpolation based on the change curve of the brightness corresponding with the z coordinate, calculates brightness and should be the highest z coordinate, and the z coordinate that acquisition calculates is as the height of each point.
In addition, be under the situation of slit plate 59 of Figure 12 at rotating panel 35, respectively (N+1) individual different z coordinate is carried out shooting by peristome 60 and the shooting by slit portion 62 by image pickup part 11.The shooting timing of image pickup part 11 can obtain by not shown timing control part with the anglec of rotation of slit plate 59 synchronously.
The image that photographs by peristome 60 is non-confocal image, and the image that photographs by slit portion 62 is confocal image and the synthetic picture of non-confocal picture.Therefore, image processing part 12e is at each point, deducts long-pending behind the set coefficient, calculated difference are multiply by in the brightness of the image that photographs by peristome 60 from the brightness of the image that photographs by slit portion 62.Above-mentioned set coefficient is according to the characteristic of slit plate 59 and definite constant, and the difference that calculates is the brightness corresponding with confocal image.
As above, image processing part 12e carries out the calculating of the brightness corresponding with confocal image respectively to (N+1) individual different z coordinate.And on each point, image processing part 12e obtains the brightness corresponding with confocal image is used as this point for maximum z coordinate height.Perhaps image processing part 12e can similarly carry out suitable interpolation with above-mentioned.
Use pin hole dish 64 to replace the situation of slit plate 59 also identical.
As above, according to the variation of the 4th embodiment, under the scan condition of not carrying out x direction and y direction, can obtain the elevation information of glass substrate 2 by the confocal unit of simple formation.
The 4th embodiment and variation thereof more than have been described.Then, the 5th embodiment that the 4th embodiment has been carried out distortion is described.
The 5th embodiment is not only to use confocal unit to detect residual defects, also uses confocal unit to detect the embodiment of defective.That is, in the 5th embodiment, the image pickup optical system of the laser-adjusting device 104 of Fig. 9 only is used to obtain the inspection personnel and confirms and the image that shows on monitor 13.Therefore, if do not need the inspection personnel to confirm, then can omit image pickup optical system.
And the step S203 of Figure 10 and step S204 are replaced in the 5th embodiment: the elevation measurement that by confocal unit undertaken same with step S207; With by image processing part 12d based on the extraction of the height of being measured to defective.In addition, as following with reference to Figure 14 illustrated, can further be out of shape the 5th embodiment, make 1 defective only carried out elevation measurement 1 time.
Figure 14 is the figure of the variation of explanation the 5th embodiment.
The defect image Dk of Figure 14 has carried out in the step S202 of Figure 10 after the relatively moving of defective locations, in order to confirm by the inspection personnel and to suppose under the situation of in step S203, making a video recording, the example of the image that obtains by image pickup part 11 shooting glass substrates 2.As mentioned above, be not must be, and for convenience of explanation, represented defect image Dk among Figure 14 the shooting of defect image Dk.
On defect image Dk, map out the circuit pattern C3～C6 of normal formation.In addition, defect image Dk comprises and is equivalent to across circuit pattern C4 and C5 and the defective part G2 of the defective that produces.
In the variation of the 5th embodiment, replace the step S204 of Figure 10, carry out elevation measurement by confocal unit.Consequently, the image processing part 12d of Fig. 9 identifies more than or equal to the height Z that should be regarded as defective according to the output from photodetector 33
aScope R4.And then image processing part 12d uses proper spacing Δ z, identifies more than or equal to height Z
b(=Z
a+ Δ z) scope R5 identifies more than or equal to height Z
c(=Z
b+ Δ z) scope R6 and R7.And in this example, do not exist more than or equal to height Z
d(=Z
c+ Δ z) scope.
The contour map D1 of Figure 14 is for convenience of explanation, has showed the figure of these scopes R4～R7 together by contour with circuit pattern C3～C6.
In the variation of the 5th embodiment, after this be not used to detect the mensuration of the confocal unit of residual defects again.That is to say, deleted step S207 in the variation of the 5th embodiment.
In addition, the judgement among the step S208 is replaced into following judgement, whether has the height Z of the scope R4 of the calibration object more current than regulation that is:
aThe height Z of high Δ z
bAbove scope.In the example of Figure 14, owing to exist more than or equal to height Z
bScope R5, so after scope R4 having been carried out proofread and correct, if having residual defects then image processing part 12d can judge.
The reason of carrying out this judgement is: when defective or residual defects are thick more, just can't not remove defective or residual defects if do not shine more laser.Therefore, by in advance the output level of laser oscillator 14 being set at the suitable value corresponding with above-mentioned interval delta z, thereby after scope R4 having been carried out the laser irradiation, can expect following 2 approximate establishments.
● be contained among the scope R4 but the part that is not contained among the scope R5 does not possess such defective thickness, therefore just be removed by 1 laser irradiation.
● be contained in part among the scope R5 and have to a certain degree thickness on defective, therefore the amount of approximately removing thickness deltat z by 1 laser irradiation makes highly reduction, however also remaining residual defects.
So image processing part 12d generation will be finished identified range R5 and be identified as the scope of residual defects and the 2 value images that scope R5 is expressed as calibration object, and 2 value images are outputed to laser shape control unit 19.And, the scope irradiating laser on the glass substrate 2 that is equivalent to scope R5 by step S205 and step S206.
Then, the judgement of step of replacing S208, ground same as described above judges whether to exist height Z by image processing part 12d
c(=Z
b+ Δ z) Yi Shang scope.Owing to have scope R6 and R7, thus image processing part 12d generate with scope R6 and R7 be identified as the scope of residual defects, with the 2 value images that scope R6 and R7 are expressed as calibration object, 2 value images are outputed to laser shape control unit 19.And, the scope irradiating laser on the glass substrate 2 that is equivalent to scope R6 and R7 by step S205 and step S206.
Then, the judgement of step of replacing S208, ground same as described above judges whether to exist height Z by image processing part 12d
d(=Z
c+ Δ z) Yi Shang scope.Owing to there is not this scope, so image processing part 12d is judged as and do not have remaining residual defects, handles and transfers to step S209.
As mentioned above, in the variation of the 5th embodiment, confocal unit only carries out 1 time at each initial defective the mensuration of height.In other words, about whether also there being the judgement of the residual defects that proofread and correct after defective is proofreaied and correct, only carry out according to the elevation information that obtains in the mensuration of being carried out before to the defective irradiating laser, be not to carry out the mensuration that the laser irradiation all is used to obtain new elevation information at every turn.
But as mentioned above, owing to judge whether to exist residual defects according to approximate prediction, therefore in fact the scope of residual defects might be unlike prediction.For example in above-mentioned example, scope R5 has been carried out after the laser irradiation, suppose that 11 pairs of glass substrates 2 of image pickup part make a video recording, then may also obtain residual defects image Dm or the such image of Dn of Figure 14.And, in residual defects image Dm or Dn, dot scope R4 for the ease of understanding.
Residual defects image Dm comprises the G3 of residual defects portion that is equivalent to across the actual residual defects of circuit pattern C4 and C5.According to above-mentioned approximate prediction, owing to should have the defective that depends on scope R6 and R7 in this stage, thereby depart from prediction.
In addition, residual defects image Dn and above-mentioned approximate prediction comprise and the G4 of residual defects portion of the local repetition of circuit pattern C4 and the G5 of residual defects portion that repeats with circuit pattern C5 part in the same manner.But specifically in shape, scope R6 is different with the G4 of residual defects portion, and scope R7 is different with the G5 of residual defects portion.Therefore, accurately, also depart from prediction in this case.
Therefore, in this variation of the 5th embodiment, for example be judged as the stage that does not have residual defects, can make a video recording,, make monitor 13 show the image that photographs by image processing part 12d by 11 pairs of glass substrates 2 of image pickup part at image processing part 12d.And, also can observe monitor 13 by the inspection personnel, confirm in fact whether to have the residual defects that proofread and correct, indicate whether and need proofread and correct again to laser-adjusting device 104.
In addition, for the purpose of simplifying the description, above supposed the height Z
a, Z
b, Z
cBe spaced apart uniformly-spaced Δ z, and at interval also can be different.For example, in the example of Figure 14, image processing part 12d will height Z
aAbove scope is identified as initial defective, will height Z
bAbove scope is identified as residual defects the 1st time, will height Z
cAbove scope is identified as residual defects the 2nd time, and height Z
a, Z
b, Z
cThe interval also can be the interval of not waiting.Image processing part 12d can be according to dynamically definite height Z such as gradient of the height in the initial indicated range
bAnd Z
c, consequently, height Z
a, Z
b, Z
cThe interval also can be the interval of not waiting.In this case, preferably by image processing part 12d or not shown control part according to height Z
a, Z
b, Z
cThe interval control the output level of laser oscillator 14.
The 5th embodiment and variation thereof more than have been described.The 6th embodiment then is described.The 6th embodiment is to use contactless elevation measurement sensor to detect the embodiment of residual defects.
That is, in the 6th embodiment, contactless elevation measurement sensor such as laser length meter is used as the residual defects test section 22 of Fig. 1 to measure the height of glass substrate 2.
For example in the step S106 of Fig. 2, laser length meter is measured the height of the scope in the shooting visual field on glass substrate 2 surfaces.And laser length meter is measured with the height of appropriate intervals to a plurality of points of having carried out sampling in the measurement range.Measurement result is the elevation information of the 6th embodiment.And laser length meter detects than the part more than the high set threshold value of calibrated altitude the lip-deep of glass substrate 2 as the residual defects with height, with the position of detected residual defects and the range notification image processing part 12 to Fig. 1.
Calibrated altitude also can be to measure the value that obtains in advance by laser length meter like that according to the step S201 of Figure 10.Perhaps can in step S106, dynamically distribute, settle the standard highly by laser length meter according to the height in the object range of measuring height.In the mensuration of calibrated altitude, laser length meter is measured the height that has carried out a plurality of points of sampling by proper spacing in measurement range.
The 6th embodiment more than has been described.Then the 7th embodiment of distortion has been carried out in explanation to the 6th embodiment.The 7th embodiment is not only to use contactless elevation measurement sensor to detect the embodiment that residual defects also detects defective in the lump.
That is, in the 7th embodiment, the image pickup optical system of the laser-adjusting device 101 of Fig. 1 only is used to obtain to be presented at the image of confirming usefulness on the monitor 13 for the inspection personnel.And in the 7th embodiment, the extraction that the step S102 of Fig. 2 and step S103 for example is replaced into the defective of being undertaken by laser length meter equal altitudes determination sensor is handled.The extraction of the defective that the elevation measurement sensor carries out is identical with the method for extraction residual defects in the 6th embodiment, thereby omits its explanation.
The the 1st～the 7th embodiment more than has been described, yet has the invention is not restricted to above-mentioned embodiment, can also carry out various distortion.
For example, the configuration of optical elements such as optical splitter in the laser-adjusting device and lens is not limited among the figure situation of expression for example.In addition, detecting the method for defective and the combination of the method that detects residual defects is arbitrarily, is not limited to the combination of expression for example in above-mentioned the 1st～the 7th embodiment.In addition, only otherwise produce contradiction, also can will be applied in other embodiments with the identical distortion of the variation shown in the example of passing the imperial examinations at the provincial level of certain embodiment.
Claims (16)
1. a means for correcting is characterized in that, this means for correcting has:
Defect detection unit, it detects the defective that should proofread and correct on the substrate of checking object, discerns the position and the scope of above-mentioned defective;
The residual defects detecting unit, it obtains the relevant elevation information of height with the interior aforesaid substrate of the above-mentioned scope of above-mentioned defective, judge after detected above-mentioned defective has carried out proofreading and correct to above-mentioned defect detection unit according to above-mentioned elevation information whether also have the residual defects that proofread and correct at the local of the above-mentioned scope of above-mentioned defective or all;
Laser oscillator, it exports laser, and when above-mentioned defect detection unit detected above-mentioned defective, this laser was used to proofread and correct above-mentioned defective, and when above-mentioned residual defects detecting unit is judged as when having above-mentioned residual defects, this laser is used to proofread and correct above-mentioned residual defects; And
The two-dimensional space light-modulating cell, its above-mentioned position and above-mentioned scope according to above-mentioned defective is carried out spatial light modulation to above-mentioned laser, so that be radiated at by on the detected above-mentioned defective of above-mentioned defect detection unit by the above-mentioned laser of above-mentioned laser oscillator output, this two-dimensional space light-modulating cell also carries out spatial light modulation to above-mentioned laser, so that be radiated on the above-mentioned residual defects on the aforesaid substrate by the above-mentioned laser of above-mentioned laser oscillator output.
2. means for correcting according to claim 1 is characterized in that, above-mentioned defect detection unit has:
Image unit, it takes aforesaid substrate; And
Graphics processing unit, it takes the image that aforesaid substrate obtains according to above-mentioned image unit, detects above-mentioned defective and discerns the above-mentioned position and the above-mentioned scope of above-mentioned defective.
3. means for correcting according to claim 1 is characterized in that, above-mentioned defect detection unit has:
Object lens, it has the optical axis of the short transverse that is parallel to aforesaid substrate, will be mapped on the aforesaid substrate from the ejaculation illumination of light source;
The unit that relatively moves, it moves the focusing position of above-mentioned object lens and the relative position between the aforesaid substrate on the optical axis direction of above-mentioned object lens;
Confocal aperture unit, it has the locational aperture that is configured in above-mentioned focusing position conjugation;
Optical detecting unit after it detects and to shine on the aforesaid substrate by above-mentioned object lens, is reflected by aforesaid substrate and has passed through the light intensity of the said aperture of above-mentioned confocal aperture unit; And
The protuberance detecting unit, it is according to the mobile pattern that changes that is carried out according to the above-mentioned unit that relatively moves by the above-mentioned intensity of the detected above-mentioned light of above-mentioned optical detecting unit, measure the height of aforesaid substrate, according to the above-mentioned height of being measured, the protuberance with height on the aforesaid substrate is come out as above-mentioned defects detection.
4. means for correcting according to claim 3, it is characterized in that, the raised part detecting unit that above-mentioned defect detection unit possessed is according to the above-mentioned height of being measured, to have more than or equal to the part of height of the 1st height to come out as above-mentioned defects detection, and the raised part detecting unit detects the effect of bringing into play above-mentioned residual defects detecting unit by the part of height that will have more than or equal to the 2nd height as above-mentioned residual defects, and wherein the 2nd aspect ratio the above-mentioned the 1st is highly high.
5. means for correcting according to claim 3 is characterized in that, above-mentioned confocal aperture unit is to have the nipkow disk that makes a plurality of pin holes that light passes through or have the slit plate that makes a plurality of seams that light passes through.
6. means for correcting according to claim 1, it is characterized in that, above-mentioned defect detection unit has contactless elevation measurement unit, the height of aforesaid substrate is measured in this contactless elevation measurement unit under the situation that does not contact aforesaid substrate, and the protuberance with height on the aforesaid substrate is come out as above-mentioned defects detection.
7. means for correcting according to claim 1 is characterized in that, above-mentioned residual defects detecting unit has:
Object lens, it has the optical axis of the short transverse that is parallel to aforesaid substrate, will be mapped on the aforesaid substrate from the ejaculation illumination of light source;
The unit that relatively moves, it moves the focusing position of above-mentioned object lens and the relative position between the aforesaid substrate on the optical axis direction of above-mentioned object lens;
Confocal aperture unit, it has the locational aperture that is configured in above-mentioned focusing position conjugation;
Optical detecting unit after it detects and to shine on the aforesaid substrate by above-mentioned object lens, is reflected by aforesaid substrate and has passed through the light intensity of the said aperture of above-mentioned confocal aperture unit; And
The protuberance detecting unit, it is according to the mobile pattern that changes that is carried out according to the above-mentioned unit that relatively moves by the above-mentioned intensity of the detected above-mentioned light of above-mentioned optical detecting unit, measure the height of aforesaid substrate, and this protuberance detecting unit detects the protuberance with height on the aforesaid substrate according to the above-mentioned height of being measured as above-mentioned residual defects.
8. means for correcting according to claim 7 is characterized in that, above-mentioned residual defects detecting unit is according to the above-mentioned scope of the detected above-mentioned defective of above-mentioned defect detection unit, limits the scope that the height that is used to detect above-mentioned residual defects is measured.
9. means for correcting according to claim 7 is characterized in that, above-mentioned confocal aperture unit is to have the nipkow disk that makes a plurality of pin holes that light passes through or have the slit plate that makes a plurality of seams that light passes through.
10. means for correcting according to claim 7 is characterized in that, the above-mentioned height that above-mentioned laser oscillator is measured according to the raised part detecting unit, and change shines the output intensity of the above-mentioned laser on the above-mentioned residual defects on the aforesaid substrate.
11. means for correcting according to claim 1, it is characterized in that, above-mentioned residual defects detecting unit has contactless elevation measurement unit, the height of the aforesaid substrate in the above-mentioned scope of above-mentioned defective is measured in this contactless elevation measurement unit under the situation that does not contact aforesaid substrate, the protuberance with height on the aforesaid substrate is detected as above-mentioned residual defects.
12., it is characterized in that above-mentioned residual defects detecting unit also detects the position and the scope of above-mentioned residual defects according to claim 7 or 11 described means for correctings,
Above-mentioned two-dimensional space light-modulating cell carries out spatial light modulation to above-mentioned laser, so that above-mentioned laser is radiated on the above-mentioned scope of the detected above-mentioned residual defects of above-mentioned residual defects detecting unit.
13. means for correcting according to claim 1 is characterized in that, above-mentioned residual defects detecting unit has:
Lighting unit, it is radiated at illumination light on the surface of aforesaid substrate obliquely;
Image unit, its to by above-mentioned illumination unit the aforesaid substrate of above-mentioned illumination light make a video recording; And
Graphics processing unit, it is according to the image of aforesaid substrate being made a video recording and obtaining by above-mentioned image unit, judge whether on aforesaid substrate, to have produced shade, thereby judge whether to exist above-mentioned residual defects as the protuberance on the aforesaid substrate with height by above-mentioned illumination light.
14. means for correcting according to claim 1 is characterized in that, above-mentioned residual defects detecting unit has:
Projecting cell, its projected light that will have predetermined pattern are projected in the scope of above-mentioned scope on interior aforesaid substrate that comprises above-mentioned defective;
Image unit, its to by above-mentioned projecting cell projection the aforesaid substrate of above-mentioned projected light make a video recording; And
Graphics processing unit, its according to be mapped in by above-mentioned image unit to aforesaid substrate make a video recording the above-mentioned projected light in the image that obtains pattern, with above-mentioned predetermined pattern, judge the above-mentioned residual defects that in the above-mentioned scope of above-mentioned defective, whether exists as the protuberance on the aforesaid substrate with height.
15. the bearing calibration of a means for correcting, this means for correcting possesses the laser oscillator of the laser of exporting the defective on the substrate that is used for the rectifying inspection object, and has the function that any range on aforesaid substrate is shone above-mentioned laser, above-mentioned bearing calibration is characterised in that, carries out following steps by means for correcting:
The defective that detection should be proofreaied and correct,
Discern the position and the scope of above-mentioned defective,
According to the above-mentioned position and the above-mentioned scope of the above-mentioned defective that is identified, shine above-mentioned laser to above-mentioned defective,
Before or after the above-mentioned laser of irradiation, obtain the relevant elevation information of height of the aforesaid substrate in the above-mentioned scope with above-mentioned defective,
According to the above-mentioned elevation information that obtains, judge after above-mentioned defective has been shone above-mentioned laser whether have the residual defects that also should proofread and correct at the local of the above-mentioned scope of above-mentioned defective or all, and
Be judged as under the situation that has above-mentioned residual defects, the above-mentioned residual defects on aforesaid substrate shines above-mentioned laser.
16. a control device, it has: the laser of exporting the defective on the substrate that is used for the rectifying inspection object; And the above-mentioned laser of being exported carried out the two-dimensional space light-modulating cell of spatial light modulation, it is characterized in that above-mentioned control device has:
Defect detection unit, it detects the defective that should proofread and correct on the aforesaid substrate, discerns the position and the scope of above-mentioned defective;
The residual defects detecting unit, it obtains the relevant elevation information of height with the interior aforesaid substrate of the above-mentioned scope of above-mentioned defective, judge after detected above-mentioned defective has carried out proofreading and correct to above-mentioned defect detection unit according to above-mentioned elevation information whether also have the residual defects that proofread and correct at the local of the above-mentioned scope of above-mentioned defective or all;
The laser controlling unit, when it detects above-mentioned defective when above-mentioned defect detection unit, control above-mentioned laser oscillator so that its output is used to proofread and correct the laser of above-mentioned defective, and when above-mentioned residual defects detecting unit is judged as when having above-mentioned residual defects, the above-mentioned laser oscillator of above-mentioned laser controlling unit controls is so that its output is used to proofread and correct the laser of above-mentioned residual defects; And
The modulation control module, its above-mentioned position and above-mentioned scope according to above-mentioned defective is controlled above-mentioned two-dimensional space light-modulating cell, so that shine by on the detected above-mentioned defective of above-mentioned defect detection unit by the above-mentioned laser of above-mentioned laser oscillator output, and above-mentioned modulation control module is controlled above-mentioned two-dimensional space light-modulating cell, so that shone on the above-mentioned residual defects on the aforesaid substrate by the above-mentioned laser of above-mentioned laser oscillator output.
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| JP2009262161A (en) | 2009-11-12 |
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