CN101562146B

CN101562146B - A transmission unit

Info

Publication number: CN101562146B
Application number: CN2009101306314A
Authority: CN
Inventors: 张文达
Original assignee: VISDYNAMICS
Current assignee: VISDYNAMICS
Priority date: 2008-03-31
Filing date: 2009-03-20
Publication date: 2012-06-20
Anticipated expiration: 2029-03-20
Also published as: TW200941629A; MY148052A; TWI485797B; CN101562146A

Abstract

The invention relates to a transmission unit (100) applicable to holding up a chip object (200) and putting down the object, which comprises: a hollow construction (110) which is defined by a top (111), a bottom (112) and a profile (113); in the hollow construction (110), a plurality of cavities (118) are formed; a plurality of pylomes (150) of a group are positioned on the undersurface (112) of the hollow construction (110) and are extended into the plurality of cavities (118); one or more than one drawing component (300) which are respectively installed on one or more than one of the cavities (118), thus reduced pressure is generated at the pylome (150) of the undersurface (112) through the installed drawing component (300), in order to be applied to holding up the chip object (200) positioned relatively close to the undersurface (112) along the opposite direction, and putting down the chip object (200) when the generated reduced pressure is undone.

Description

Delivery unit

Technical field

The present invention relates to a kind of being used for is sent to the equipment of another workbench to handle with a plurality of objects (being preferably the flaky semiconductor device) from a workbench automatically.More particularly, the equipment that is disclosed can transmit the sheet semiconductor device, regardless of the size of installing and along the matrix of the dish of technological process transfer device.

Background technology

In semiconductor was made, being carried in the storing media of some forms so that the back-end processing in downstream through the assembled semiconductor device of completion was for example to electrical testing, part mark and the vision mechanical verification of manufacturing device.Because mass-produced cause, nearly all this type of downstream all be automation and implement with higher speed.Exist in the storing media that assembly process is used for the several forms of semiconductor device, it should be noted that the form of pipe and standard plate.Standard plate is made up of the matrix of the casket of the row and column of a certain number, and each casket is the fixing place that is used for semiconductor device.The dish media is in order to carry the special needs selected storage form of the semiconductor device of physical separation each other.The instance of this type of device is that (said device all has lead-in wire in all four sides of its package main body to quad-flat-pack for Quad Flat Package, QFP) device.Disk-form still be used for BGA (Ball Grid Array, BGA) and wafer-level package (this casket owing to dish is protected through being designed to guarantee the ball and the projection that are positioned at the bottom surface of encapsulation for Chip Scale Packaged, CSP) the physical holding of the stock media of device.

For the semiconductor device that is carried in these standard plates, must will install from dish and take out to allow to carry out electrical testing, visual inspection and many other processing.Therefore, the part with respect to certain form of coiling is an indispensable characteristic in dish part treatment facility in interior (part out and part in) disposing capacity outside and partly.For the semiconductor device with manufacturing is sent to another work disposal platform from a work disposal platform, adopt delivery unit usually, or be called pick-up head (pickhead).Invented that dissimilar pick-up heads is increased work efficiency and towards various semiconductor devices.

For instance, Safabakhsh about the pick-up head application No. 5169196 patent application.In the invention that this disclosed; The working face of pick-up head has in the inner pressure chamber of waiting to pick up the outer pressure chamber (plenum) of extending around the peripheral edge of object and being formed at the pick-up head center of waiting to pick up the object top; Simultaneously; Partial vacuum is put on inner pressure chamber and compressed air is fed to outer pressure chamber, and said compressed air flows through the support ridge with inner pressure chamber and outer pressure chamber separation.Therefore, the air that flows through said ridge produces the object that thin air film picks up with support.

Another No. 6030013 patent application discloses equipment and the method that is used for capturing and carrying with discontiguous mode limited spherical shaped semiconductor integrated circuit.Said equipment comprises divergent nozzles (diverging nozzle), and it has the ingate, is formed at outlet opening and internal side wall on the exterior side surfaces, and said internal side wall defines the cardinal principle spherical object frusto-conical internal path that gas stream is crossed.The equipment that is disclosed can be through being positioned at said equipment the relative equilibrium position and capturing limited spherical object at the divergent nozzles place.

The open case of other No. 20020019074 United States Patent (USP) is advocated a kind of pick device that comprises load carrier, and it uses collecting means to draw electronic chip in proper order, till using pin that chip is peeled off from adhesive tape through the dorsal part from adhesive tape.

People such as Tanae have applied for No. 20060138793 U. S. application case about a kind of load bearing unit, and said load bearing unit can use the suction force carrying object and put down the object of carrying in the predetermined area.

Yet; All inventions mentioned above all can further be modified; Especially comprise invention common application that permission discloses in picking up different electronic installations the characteristic of unfettered restriction, said constraint for example is the relative position or the like of manufacturing device of size or pattern, the transmission dish of matrix or layout, the chip type electronic device of corresponding transmission dish.In the field that semiconductor is made, need have a kind of delivery unit or pick-up head, it is applicable to different transmission pipe and disc system and the various forms of electronic installations of in production line, making.

Summary of the invention

General purpose of the present invention is through disclosing the disposal that a kind of general delivery unit helps to coil part, and said general delivery unit can cater to the semiconductor devices with different sizes in the transmission dish of the wider range with different number row and columns.

Another object of the present invention is to disclose a kind of delivery unit, and it can transmit electronic installation from a treatment bench to another treatment bench with its optimum capacity in single operation, regardless of the size of the matrix and the electronic installation of transmission dish.

Another purpose of the present invention provides a kind of chip type electronic device unit; Its influence that vacuum leak produced that can cause through the incomplete sealing that makes by the suction openings place minimizes and the electronic installation that all are captured is applied enough vacuum and ventilation influence, and the device of especially waiting to lift is in the transmission dish under the situation of dispersion.

The present invention has satisfied at least one in the above-mentioned purpose wholly or in part; Wherein one embodiment of the present of invention comprise a kind of delivery unit that is used for lifting and putting down board; It comprises: hollow structure, and it is defined by top, bottom and side, is formed with a plurality of chambeies in the said hollow structure; A plurality of through holes of one group, it is positioned on the bottom surface of said structure and extends to said a plurality of chamber; One or more draw member; It is associated with one or more chambeies respectively; Produce the pressure that reduces via the absorption member of said installation in the through hole of bottom surface whereby, put down flaky semiconductor when being placed in substantially near the flaky semiconductor device at place, bottom surface and the pressure that reduces that produced cancelling to be used for going up in the opposite direction lifting.

In another preferred embodiment, the delivery unit that is disclosed can further comprise moving-member, and it more preferably is attached to said textural, to be used to handle moving of said delivery unit.Therefore, it makes it possible between workbench, transmit the sheet electronic installation.

Can make the bottom surface of hollow structure recessed on every side in the zone of defining through hole.Recessed fringe region around the through hole can improve the vacuum suction force of delivery unit substantially.On the other hand, one of embodiment can make the bottom surface outstanding forming the edge that raises around in the zone of defining through hole, so that the contact area between hollow structure and the sheet-type device minimizes, and cracked with the device avoiding capturing.

According to preferred embodiment, said a plurality of through hole dense distribution form a group along the center line of hollow structure.Yet another preferred embodiment can comprise a plurality of through holes of two or more groups, and its periphery along the bottom surface is positioned on the bottom surface of structure and extends to said a plurality of chamber.

In order to produce enough uplift forces via the pressure that reduces that is produced, the size of the through hole on the bottom surface in the preferred embodiment arrives in the scope of 5mm 0.1.

Equally, the distance between two adjacent through-holes in the group on the bottom surface preferably in 1 to 10mm scope with the uplift force that evenly distributes along the bottom surface.

Preferably, each chamber in the structure is associated with a plurality of through holes, and the pressure that reduces that the size of through hole allows to be produced produces enough absorptions, with during transmitting board with board fixing or remain on the bottom surface securely.

Description of drawings

Fig. 1 is the cross-sectional view of an embodiment of delivery unit;

Fig. 2 is the part perspective view of the hollow structure that uses among the embodiment shown in Figure 1;

Fig. 3 shows and is used for along two different available layouts of the hollow structure distribution through hole of embodiment shown in Figure 1;

Fig. 4 shows that the embodiment with Fig. 1 incorporates manufacturing equipment into to be used to transmit the chip type electronic device of lifting; And

The embodiment of Fig. 5 exploded view 1 is fit to is used for lifting the style that is distributed in the board on the transmission dish.

Embodiment

Referring now to graphic description most preferred embodiment of the present invention,, wherein same reference numerals is indicated similar element on identical or the function.Although discuss customized configuration and layout, should be appreciated that this only is used for the illustrative purpose.Those skilled in the art will realize that under the situation that does not break away from the spirit and scope of the present invention and can use other configuration and layout.

For example " top ", " bottom ", " side ", " vertically ", " level ", " relative direction of the present invention when the " center " directional terms refers in manufacture process, use the invention that is disclosed substantially in the whole specification of this paper, used.

The delivery unit of in the whole specification of this paper, mentioning can exchange with other term and use, for example pick-up head or complete pick-up head (gang pick head) or general pick-up head.

The present invention discloses a kind of delivery unit (100) that is used for lifting and putting down board (200), and it comprises: hollow structure (110), and it is defined by top (111), bottom (112) and side (113), is formed with a plurality of chambeies (118) in the said hollow structure (110); A plurality of through holes (150) of one group, said a plurality of chamber (118) is gone up and extended in its bottom surface (112) that is positioned at hollow structure (110); One or more draw member (300); It is installed in respectively on one or more chambeies (118); Whereby via the absorption member of installing (300) in the bottom surface through hole (150) of (112) locate to produce the pressure that reduces, put down board (200) when being placed in relatively board of locating near bottom surface (112) (200) and the pressure that reduces that is produced cancelling to be used for going up in the opposite direction lifting.One of embodiment of the useful advantage of representing in order to implementation the present invention among Fig. 1 and obtaining to be mentioned.Preferably, the board of being mentioned is meant semiconductor elec-tronic device, for example computer chip, the integrated circuit that is equipped with electronic building brick and analog.Yet, also can use and lift other non-board in the invention that is disclosed, the disposal ability especially in light weight or through hole is enough to support the object by the weight of last act object.

According to preferred embodiment, hollow structure (110) is processed by the metal or alloy of the inner vacuum suction force that can bear external pressure and during transport process, it applied.Possibly also capable of usingly have high pressure supports the polymeric compositions of character to make said hollow structure.Be important to note that the hollow structure among the present invention (110) can be suitable for the difformity of for example square, rectangle, circle, polygon or its combination to carry out required function.Yet said hollow structure more preferably is a rectangle.

Such as in the preceding text statement, available hollow space preferably is made into a plurality of chambeies or compartment (118) in the said structure.Chamber (118) in the hollow structure (110) is connected to bottom surface (112) via through hole (150), and extends towards the end face (111) of one or more openings of top formation (119).Maybe be also can be via the horizontal channel of making in advance that through hole the is cross-linked to each other through hole in the same group that interconnects.The amount in available chamber (118) can change according to the size of shape, the structure of structure, number of through-holes, available vacuum power and other correlative factor in the said structure.Preferably, be installed on each chamber, just can each indivedual chamber (but and inessential) be sealed each other airtightly in case will draw member (300).Through this characteristic, the vacuum leak that single chamber and corresponding through hole (150) are located will can not influence the disposal ability at other place, chamber.Therefore, no matter on the transmission dish distribution of object (200) how all to keep enough uplift forces and be used to transmit board (200).

And, can be not do not make hollow structure (110) but with the combining form manufacturing of several peripheral components with the single-piece form.For instance, in practice,, hollow structure is split into the upper and lower assembly, and in each assembly, carves the half the of said chamber in order to help in structure (110), to make enclosed cavity (118).When upper and lower assembly gas-tight seal together the time, formation chamber during building the hollow structure of putting (110).

Like Fig. 3 explanation, the through hole among the present invention (150) can be suitable for different patterns or shape, but it more preferably is circular.The uplift force that the partial vacuum of locating to produce between through hole (150) external environment condition on every side owing to chamber (118) and bottom surface (112) for enhancing produces preferably is recessed into around the zone of through hole or the edge of through hole, to produce more shallow substantially zone.These recessed shallow zones (151) will increase the area that is applied to the uplift force on the object (200) substantially, especially when the contact surface of board and bottom surface when formation seals on every side on the surface of the edge of shallow zone (151) and board (200) substantially airtightly.

On the other hand, be alternative in and form shallow zone (151), the protrusion that can raise and have the flat, level face with formation around the edge or the zone of through hole.This characteristic has especially reduced bottom surface (112) and has contacted with surface between the board (200).More particularly; Bottom surface (112) has the zone of defining through hole (118); It gives prominence to the edge that raises to form, to avoid owing to the greater impact area when going up the act object to bottom surface (112) causes the cracked or damage on the precise electronic assembly on the board (200).

In order to be suitable for or to be used for flexibly lifting the board with all size and weight of different transmission dishes; The present invention is with preferred specification manufacturing in essence, for example be positioned at the minimal amount of the through hole (150) on the bottom surface (112), in order joltily not transmit object between through hole isolated preferred distance, in the through hole with the minimum treat ability that realizes or vacuum suction force or the like.In a preferred embodiment, the partial vacuum located of the through hole (118) of bottom surface (112) or suction force are 1 * 10 ^-3In the scope of 650 holders, be in low in the scope of medium vacuum.High vacuum comes in handy in the present invention, risk cracked or indentation possibly on the object that transmits, occur but exist, and therefore damages its fine structure.Comparatively speaking, the size of through hole (118) or diameter can be with respect to the disposal ability of drawing member (300) generation and 0.1 in the scopes of 5mm.Or comparatively speaking, the size of through hole or diameter should on treating, lift object the minimum widith scope 5% to 10%.Absorption or uplift force can reduce with respect to the size of through hole and increase, and wherein constant disposal ability is from drawing member (300).Be important to note that through hole (118) is (112) last dense distribution in the bottom surface preferably.

Although as shown in Figure 3, the group of through hole (150) is that the center line along structure distributes, one or more groups of through hole (150) can be in the bottom surface around the periphery of (112) location.Through this layout, in the time of can on the usable surface of object (200), evenly applying suction force board (200) is secured to bottom surface (112) securely.More particularly, the position of a plurality of through holes of another group beyond the first group position that is being in centerline on the bottom surface of structure extends in said a plurality of chamber.Yet it should be noted that to exist other available mode to come positioning through hole (150), as long as this layout provides enough strong absorption to be used to transmit sheet semiconductor device (200).Therefore, can not depart from the scope of the present invention its modification of carrying out.Preferably, the distance between two adjacent through-holes in the group on the bottom surface arrives in the scope of 10mm 1.Preferably, the separation distance between two adjacent through-holes in the group on the bottom surface (comprising its recessed fringe region) gets into recessed fringe region less than 50% of the size of the smallest object of waiting to lift to prevent object.

Another preferred embodiment, delivery unit can further comprise moving-member (120), it is attached at said textural to be used to handle moving of delivery unit.Moving-member (120) can be the robots arm, its by mechanical system vertical and/or horizontal drive to be used to transmit the object that picks up.For instance; In one embodiment of the present of invention as shown in Figure 4; Transport sector back and forth (motorized shuttle mechanism) by motorized drives delivery unit (100) along horizontal stand (195), between the work disposal platform, to come the general delivery unit of transmission back (100).More particularly, in an example embodiment, said transport sector back and forth is based on the ball screw system via mechanical motor (190).Other preferred embodiment can have through the z axle by another motor (191) control and moves the delivery unit that (with respect to dish) promotes.

In addition, the present invention also has additional features with through the impact that when applying suction force, object is caused being minimized avoid the cracked of the board lifted, otherwise structure (110) possibly smashed object (200) when leaning on too closely.In a preferred embodiment, keep a safe distance between bottom surface (112) and board (200) through near the short of structure (110), having (112) extended protrusion (303) from the bottom surface.Be important to note that the length of protrusion (303) is the preferred tunable joint in the present invention, to be suitable for the object of differing heights.For absorbing impact is impacted, the elastic component of preferred spring-like is attached to structure (110) goes up combining moving-member (120) to use, rise and (110) are constructed in decline towards the object of waiting to lift being used for.This elastic component can collide bottom surface (112) recoil of last time at the object (200) of last act, has therefore alleviated the impact that causes.

Should note incorporating into absorption member of the present invention (300) now.In a preferred embodiment, draw member and be meant tracheae or air flue in the air chamber (118) that is installed in the structure (110), the air flue of said installation constantly produces the air pressure that reduces of locating through hole (150) atmosphere on every side with respect to bottom surface (112) in the chamber.Preferably, each air flue (300) joins the person in charge (122) to, is responsible for (122) and is connected to air pump again to be used for acquisition partial pressure difference or enough uplift forces at the air flue place.Otherwise, can each air flue be distributed to single air pump respectively and bigger suction force be provided, and also avoid the vacuum leak at an air flue place to influence the suction force of other air flue with pipeline to each connection.As stated, each air flue (300) is preferably sealed airtightly and is installed on the air chamber, because vacuum leak can greatly reduce suction force.

In another embodiment, the impact absorbing material layer of for example sponge, rubber or analog is placed on the bottom surface, with the indentation on the object that prevents when the suction force that is produced is big, to be picked up or cracked.

In the process of making electronic semi-conductor's device, can, adopt Fig. 5 the present invention referring to describing as following.For instance, stop (stop-over) platform place halfway, play first count and stop at a position, make general pick-up head coil the center of (301) just in alignment with first row (or row).General pick-up head is lifted the semiconductor device an of complete line (or row) subsequently from the casket under bottom surface (112) of dish (301).Yet general pick-up head can be from coiling the semiconductor device of lifting more than delegation's (or row).Subsequently, general pick-up head is transferred to the automatic vision check system at the other end place that is positioned at horizontal stand back and forth, so that the semiconductor device that is picked up bears inspection.When checking process is accomplished, general pick-up head is turned back to first shroud position and the semiconductor device that is picked up placed back dish once more go up previous original each the place of said semiconductor device of picking up.Dish advances to next available rows (or row) of dish subsequently to be transmitted by general pick-up head.Repeat whole circulation, till all row (or row) of dish being carried out visual inspection.

The present invention comprises the content that contains in the appended claims and the content of foregoing description.Although used the preferred form with a certain degree specificity of the present invention the present invention has been described; But should be appreciated that; Only make the present invention, and can take many changes of combination of structure detail and part and layout aspect without departing from the present invention with preferred form by means of instance.

Claims

1. delivery unit (100) that is used for lifting and putting down board (200) comprising: hollow structure (110), and it is defined by top (111), bottom (112) and side (113), is formed with a plurality of chambeies (118) in the said hollow structure (110);

A plurality of through holes (150) of one group, said a plurality of chamber (118) is gone up and extended in its said bottom surface (112) that is positioned at said hollow structure (110); It further comprises the moving-member that moves that is used to handle said delivery unit, and each chamber is associated with a plurality of through holes,

It is characterized in that one or more and draw member (300); It is associated with one or more chambeies (118) respectively; Locate to produce the pressure that reduces via said absorption member (300) at the said through hole (150) of said bottom surface (112) whereby; Be placed in the said board of locating near said bottom surface (112) relatively (200) to be used for lifting; And the size of said through hole allows to produce enough absorptions and goes up the said board of act; Said bottom surface (112) is recessed on every side in the zone of defining said through hole (118); A plurality of through holes of said another group are positioned on the said bottom surface of said structure and extend to said a plurality of chamber, and the said through hole (118) on said bottom surface (112) has 5% to 10% diameter of the minimum widith of said object (200), the distance between two adjacent through-holes (118) in said bottom surface (112) the above group 1 in the scope of 10mm.

2. delivery unit according to claim 1, it further comprises the pair of protrusions (303) of extending from the short of said bottom surface (112).