CN205691412U - Large-size ceramic pin grid array shell mechanical shock test fixture - Google Patents
Large-size ceramic pin grid array shell mechanical shock test fixture Download PDFInfo
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- CN205691412U CN205691412U CN201620612434.1U CN201620612434U CN205691412U CN 205691412 U CN205691412 U CN 205691412U CN 201620612434 U CN201620612434 U CN 201620612434U CN 205691412 U CN205691412 U CN 205691412U
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- grid array
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Abstract
The utility model discloses a kind of large-size ceramic pin grid array shell mechanical shock test fixture, relate to ceramic pin grid array shell impact apparatus technical field, fixture comprises base plate and pressing plate, base plate is provided with grid array hole, and grid array bore region is provided with groove, the grid array hole outer peripheral areas of base plate is provided with four through holes, and on pressing plate, correspondence position is again provided with four through holes.Being inserted the pin of ceramic pin grid array shell in the grid array hole of base plate, shell upper covers pressing plate, is pressed on base plate and pressing plate by shell through through hole with bolt and can carry out mechanical test.This fixture increases pressing plate, can prevent process of the test housing and fixture dislocation from damaging pin, be provided with groove, can be used for carrying out mechanical shock test with heat sink or boss ceramic pin grid array shell on base plate.
Description
Technical field
This utility model relates to ceramic pin grid array shell impact apparatus technical field.
Background technology
Large-size ceramic pin grid array (CPGA type) shell can be used for system in package, its have one side cavity, positive and negative two
The various structures such as face cavity and up and down cavity type, such shell can built-in low-temperature co-fired ceramic substrate, carry out three-dimensional encapsulation, have
Superior bearing capacity, and it is advantageously integrated multiple hydrid integrated circuit, there is volume little, lightweight, Pin arrangement mode is certainly
By the feature such as various, alternative traditional system in package metal shell, it is widely used in the military equipment controls such as Aeronautics and Astronautics
System package casing processed.Can the purpose of mechanical shock test be to measure packaged components and parts bear moderate rushing
Hitting, this impact is that analog device produces due to unexpected stress or the change of kinestate in handling, transport or execute-in-place
Raw.In impact test, device is contained in above testing stand by fixture, and therefore the quality of jig Design is extremely important.Existing
Ceramic pin grid array shell mechanical shock test fixture, uses the installing plate with grid array hole, is inserted by the pin of test shell
Entering and carry out mechanical test in fixture grid array hole, process of the test housing likely misplaces with fixture and de-when impact test
From, during further with the ceramic pin grid array shell mechanical shock test of heat sink or boss, because heat sink or boss causes shell
Cannot be adjacent to fixture, process of the test also easilys lead to shell and comes off or misplace with fixture.
Utility model content
The technical problems to be solved in the utility model is for above-mentioned the deficiencies in the prior art, it is provided that a kind of large-size ceramic
Pin grid array shell mechanical test fixture, this fixture is provided with groove, can meet the ceramic pin grid array with heat sink or boss structure
Shell mechanical shock test, is provided with pressing plate, can avoid shell and fixture dislocation or disengaging during mechanical shock test.
For solving above-mentioned technical problem, technical solution adopted in the utility model is: outside large-size ceramic pin grid array
Shell mechanical shock test fixture, it is characterised in that include base plate, grid array hole, large-size ceramic are distributed on described base plate
Pin grid array shell is placed on base plate, and pin is placed in the grid array hole of base plate, and shell is provided with on pressing plate, base plate and pressing plate and sets
Having through hole, large-size ceramic pin grid array shell is compressed with base plate and pressing plate by bolt through through hole, has dug in the middle of base plate
Groove.
The technical scheme optimized further be described depth of groove be 0.7mm, the length of side is 37.2mm.
The grid array hole pitch that the technical scheme optimized further is described includes that 1.27mm, 2.54mm and 2.54mm hand over
Mistake, pin count is less than or equal to 1500.
The technical scheme optimized further be described base plate be the square of 150mm × 150mm, be highly less than or equal to
20mm。
The technical scheme optimized further is described base plate and pressing plate is aluminum alloy materials.
Use and have the beneficial effects that produced by technique scheme: solve the punching of existing ceramic pin grid array shell machinery
Hit test fixture size little, it is impossible to meeting large-size ceramic pin grid array shell and use, existing ceramic pin grid array shell is tested
Fixture fixes shell without pressing plate, is easily caused the dislocation of shell and fixture and damages pin during impact test, it is impossible to meet band heat sink or
The ceramic pin grid array shell of boss structure uses, and by increasing grip size, increases pressing plate, base plate arranges groove, available
The mechanical shock test of the ceramic pin grid array shell of or boss structure heat sink in large scale band.
Accompanying drawing explanation
Fig. 1 is this utility model base plate schematic diagram.
Fig. 2 is this utility model base plate top view.
Fig. 3 is this utility model pressing plate top view.
Fig. 4 is that this utility model uses schematic diagram.
In figure: 1, base plate;2, pressing plate;3, grid array hole;4, groove;5, through hole;6, bolt;7, grid array shell;8, draw
Foot.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
Any amendment, equivalent and the improvement etc. made within spirit of the present utility model and principle, broadly fall into this utility model
The scope of protection.
The utility model discloses a kind of large-size ceramic pin grid array shell mechanical shock test fixture, comprise base plate 1
With pressing plate 2, use aluminum alloy materials, it is easy to processing.
As depicted in figs. 1 and 2, base plate 1 intermediate distribution has grid array hole 3, and this grid array hole 3 can meet multiple pin array
Arrangement output, pin pitch includes that 1.27mm, 2.54mm, 2.54mm interlock, number of pins≤1500, profile length and width size≤
150mm × 150mm, highly≤20mm.A groove 4 is had in the middle of the scope of grid array hole 3, groove 4 length and width a size of 37.2mm ×
37.2mm, a height of 0.7mm, the design of this groove 4 can be used for the impact test of the ceramic pin grid array shell with heat sink or boss, and
And can be according to the size of the size design groove 4 of heat sink or boss.It is formed around four through holes in the grid array hole 3 of base plate 1
5。
As it is shown on figure 3, be again provided with four corresponding with base plate 1 through hole 5 on pressing plate 2, shell is played fixing work by pressing plate 2
With, it is possible to it is effectively prevented the shell phenomenon when impact test with fixture dislocation and disengaging and occurs.
As shown in Figure 4, grid array shell 7 is placed between base plate 1 and pressing plate 2, and the pin 8 of grid array shell 7 inserts base plate 1
Grid array hole 3 in, grid array shell 7 is pressed in the middle of base plate 1 and pressing plate 2 by bolt 6 through through hole 5.
Use technique scheme, solve existing ceramic pin grid array shell mechanical shock test fixture size little, nothing
Method meets large-size ceramic pin grid array shell and uses, and existing ceramic pin grid array shell test fixture fixes shell without pressing plate,
It is easily caused shell during impact test and damages pin with fixture dislocation, it is impossible to meet with the heat sink or ceramic pin grating array of boss structure
Row shell uses, and by increasing grip size, increases pressing plate, base plate arranges groove, can be used for that large scale band is heat sink or boss
The mechanical shock test of the ceramic pin grid array shell of structure.
Claims (5)
1. large-size ceramic pin grid array shell mechanical shock test fixture, it is characterised in that: include base plate (1), the described end
Plate (1) upper distribution grid array hole (3), large-size ceramic pin grid array shell (7) is placed on base plate (1), and pin (8) is placed in base plate
(1), in grid array hole (3), shell (7) top is provided with pressing plate (2), base plate (1) and pressing plate (2) and is provided with through hole (5), bolt
(6) through through hole (5), large-size ceramic pin grid array shell (7) is pressed on base plate (1) and pressing plate (2), in base plate (1)
Between dig fluted (4).
Large-size ceramic pin grid array shell mechanical shock test fixture the most according to claim 1, it is characterised in that institute
Stating groove (4) degree of depth is 0.7mm, and the length of side is 37.2mm.
Large-size ceramic pin grid array shell mechanical shock test fixture the most according to claim 1, it is characterised in that institute
Stating grid array hole (3) pitch and include that 1.27mm, 2.54mm and 2.54mm are staggered, grid array hole (3) number is less than or equal to 1500.
Large-size ceramic pin grid array shell mechanical shock test fixture the most according to claim 1, it is characterised in that institute
Stating base plate (1) is the square of 150mm × 150mm, and height is less than or equal to 20mm.
Large-size ceramic pin grid array shell mechanical shock test fixture the most according to claim 1, it is characterised in that institute
State base plate (1) and pressing plate (2) is aluminum alloy materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620612434.1U CN205691412U (en) | 2016-06-21 | 2016-06-21 | Large-size ceramic pin grid array shell mechanical shock test fixture |
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CN201620612434.1U CN205691412U (en) | 2016-06-21 | 2016-06-21 | Large-size ceramic pin grid array shell mechanical shock test fixture |
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CN205691412U true CN205691412U (en) | 2016-11-16 |
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CN201620612434.1U Active CN205691412U (en) | 2016-06-21 | 2016-06-21 | Large-size ceramic pin grid array shell mechanical shock test fixture |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106876317A (en) * | 2017-03-02 | 2017-06-20 | 中国电子科技集团公司第四十四研究所 | For the fixture and method for packing of oversize CCD encapsulation |
CN109387771A (en) * | 2018-10-16 | 2019-02-26 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | Fixture and test method for semiconductor integrated circuit particle encounter noise fest |
CN111780959A (en) * | 2020-07-15 | 2020-10-16 | 中车株洲电力机车研究所有限公司 | Tool for testing insertion and extraction force of CPCI connector and testing method thereof |
CN113465853A (en) * | 2021-07-05 | 2021-10-01 | 中国电子科技集团公司第五十八研究所 | Vibration clamp for CCGA (ceramic column grid array) double-sided cavity integrated circuit |
CN114453814A (en) * | 2022-02-25 | 2022-05-10 | 江苏华讯电子技术有限公司 | Tube shell parallel seam welding clamp with anti-static function and fixing method |
-
2016
- 2016-06-21 CN CN201620612434.1U patent/CN205691412U/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106876317A (en) * | 2017-03-02 | 2017-06-20 | 中国电子科技集团公司第四十四研究所 | For the fixture and method for packing of oversize CCD encapsulation |
CN106876317B (en) * | 2017-03-02 | 2019-04-19 | 中国电子科技集团公司第四十四研究所 | Fixture and packaging method for oversize CCD encapsulation |
CN109387771A (en) * | 2018-10-16 | 2019-02-26 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | Fixture and test method for semiconductor integrated circuit particle encounter noise fest |
CN109387771B (en) * | 2018-10-16 | 2020-12-29 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | Clamp for semiconductor integrated circuit particle impact noise test and test method |
CN111780959A (en) * | 2020-07-15 | 2020-10-16 | 中车株洲电力机车研究所有限公司 | Tool for testing insertion and extraction force of CPCI connector and testing method thereof |
CN113465853A (en) * | 2021-07-05 | 2021-10-01 | 中国电子科技集团公司第五十八研究所 | Vibration clamp for CCGA (ceramic column grid array) double-sided cavity integrated circuit |
CN114453814A (en) * | 2022-02-25 | 2022-05-10 | 江苏华讯电子技术有限公司 | Tube shell parallel seam welding clamp with anti-static function and fixing method |
CN114453814B (en) * | 2022-02-25 | 2024-05-03 | 江苏华讯电子技术有限公司 | Shell parallel seam welding clamp with antistatic function and fixing method |
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