CN101543147B - 配线基板和显示装置 - Google Patents

配线基板和显示装置 Download PDF

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CN101543147B
CN101543147B CN2007800437793A CN200780043779A CN101543147B CN 101543147 B CN101543147 B CN 101543147B CN 2007800437793 A CN2007800437793 A CN 2007800437793A CN 200780043779 A CN200780043779 A CN 200780043779A CN 101543147 B CN101543147 B CN 101543147B
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chip
substrate
wiring
resin
reinforcement
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CN101543147A (zh
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山下贤一
中谷喜纪
波多野晃继
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Sharp Corp
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Sharp Corp
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • G02—OPTICS
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    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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Abstract

本发明提供配线基板和显示装置，该配线基板是在安装基板(20)上安装有具有用于与配线图案(12a)连接的凸点电极(15b)的IC芯片(15)的配线基板(30a)，该安装基板(20)包括：具有在玻璃纤维中含浸有树脂的增强件(5)和设置在增强件(5)的表面的有机层(6a)的树脂基板(10)；和在树脂基板(10)的表面隔着覆盖层(11a)设置的配线图案(12a)，该配线基板(30a)的特征在于：树脂基板(10)具有露出增强件(5)的纤维露出部(5e)，IC芯片(15)在连接电极(15b)与配线图案(12a)连接的状态下，通过与纤维露出部(5e)连接的ACF(17)被固定在安装基板(20)上。

Description

配线基板和显示装置
技术领域
本发明涉及配线基板和显示装置，特别涉及利用各向异性导电膜等在树脂基板上安装电子部件的安装技术。
背景技术
各向异性导电膜(Anisotropic Condactive Film，以下称作“ACF”)是将覆盖有金属膜的塑料颗粒、金属颗粒等导电颗粒分散在热固化性树脂等中的粘接性的膜。因此，ACF利用其各向异性导电性和粘接性，被广泛应用于电子部件和安装基板之间的电连接(例如，参照专利文献1)。
下面，利用图17对现有的利用ACF的安装方法进行说明。其中，图17是现有的配线基板130的安装部的截面图。
此处，配线基板主体120是包括以下部件的安装基板：由在玻璃布中含浸有树脂的增强件105、分别设置在增强件105的上表面和下表面的有机层106a和106b构成的树脂基板110；分别设置在树脂基板110的上表面和下表面的无机膜111a和111b；以及设置在无机膜111a的上表面的配线图案112。此外，集成电路(Integrated Circuit，以下称作“IC”)芯片115是具有芯片主体115a、和以从芯片主体115a的底面突出的方式设置的多个凸点电极115b的电子部件。
在配线基板主体120上安装IC芯片115的情况下，首先，在配线基板主体120的配线图案112上通过加热临时压接ACF117。接着，将IC芯片115配置在ACF117上之后，从上侧按压IC芯片115，进行加压。进一步，通过加热IC芯片115和ACF117，将IC芯片115永久压接在配线基板主体120上。此时，在配线基板130中，通过加热和加压，ACF117中的树脂成分熔融，从凸点电极115b和配线图案112之间流出，并且，分散在ACF117中的导电颗粒的一部分被夹持在凸点电极115b和配线图案112之间。这样，在配线基板130中，在ACF117中的导电颗粒在凸点电极115b和配线图案112之间被挤压的状态下，利用ACF117中的树脂成分，IC芯片115被固定在配线基板主体120上，从而，凸点电极115b和配线图案112被电连接。然后，如图17所示，为了应对振动和冲击，或者为了防湿，也存在在IC芯片115的周围涂敷绝缘性树脂118的情况。另外，图17中的FPC116与IC芯片115同样，通过ACF117被安装在配线基板主体120上。
专利文献1：日本特开平9-244047号公报
发明内容
但是，在通过ACF在玻璃基板上安装IC芯片、柔性印刷配线基板(Flexible Printed Circuit，以下称作“FPC”)等电子部件的情况下，经过一段时间后，在IC芯片与ACF之间、FPC与ACF之间、配线图案与ACF之间、以及玻璃基板主体与ACF之间，各自的紧贴(粘附)力有可能分别变弱。此处，认为相对于玻璃基板的COG(Chip On Glass)紧贴强度和FPC紧贴强度分别在很大程度上受到IC芯片与ACF之间的紧贴强度、和FPC与ACF之间的紧贴强度的影响。
另一方面，如图17所示，在通过ACF117在树脂制造的配线基板主体120上安装IC芯片115和FPC116的情况下，经过一段时间后，在无机膜111a与树脂基板110之间、树脂基板110中的增强件105与有机层106a之间，各自的紧贴力相比于IC芯片115与ACF117之间、以及FPC116与ACF117之间的各自的紧贴力变得更弱，因此认为，与在上述玻璃基板上进行安装的情况相比，COG紧贴强度和FPC紧贴强度变弱。此处，一般情况下，树脂制造的配线基板主体120比玻璃基板更容易弯曲，因此，如果其以安装有刚性的IC芯片115的状态产生弯曲，则局部的应力可能会施加在IC芯片115的端部，特别是其角部。这样的话，在配线基板130中，IC芯片115会从配线基板主体120剥离。
本发明是鉴于该点而提出的，其目的在于，相比于现有技术，进一步提高在包括纤维状的增强件的树脂基板上安装的电子部件的紧贴性。
为了达到上述目的，本发明是，构成安装基板的树脂基板具有纤维露出部，电子部件通过与纤维露出部粘接的粘接层被固定在安装基板上。
具体来讲，本发明涉及的配线基板，在具有包含纤维状的增强件的树脂基板、和设置在上述树脂基板上的配线图案的安装基板上，安装有具有用于与上述配线图案连接的连接电极的电子部件，该配线基板的特征在于：上述树脂基板具有露出上述增强件的纤维露出部，上述电子部件在上述连接电极与上述配线图案电连接的状态下，通过与上述纤维露出部粘接的粘接层被固定在上述安装基板上。
根据上述结构，电子部件通过粘接层与露出纤维状的增强件的树脂基板的纤维露出部粘接，因此，与使粘接层与纤维露出部以外的部分粘接的现有技术的情况相比，树脂基板与粘接层的接触(粘接)面积增大。因此，树脂基板和粘接层之间的紧贴性比现有技术提高，而且，粘接层和电子部件间的紧贴性被保持为现有技术的状态，因此，与现有技术相比，能够提高在包括纤维状的增强件的树脂基板上安装的电子部件的紧贴性。
可以是，上述增强件是含浸有树脂的玻璃纤维，上述树脂基板具有在上述增强件的表面设置的有机层，上述有机层以使上述增强件露出的方式开口。
根据上述结构，玻璃纤维从有机层开口处的纤维露出部露出，与使粘接层与有机层的表面粘接的现有技术的情况相比，树脂基板与粘接层的接触(粘接)面积增大，因此，本发明的作用效果得到具体的发挥。
可以是，在上述树脂基板和配线图案之间设置有覆盖层，上述覆盖层以使上述增强件露出的方式开口。
根据上述结构，纤维状的增强件从覆盖层开口处的纤维露出部露出，与使粘接层与覆盖层的表面粘接的现有技术的情况相比，树脂基板与粘接层的接触(粘接)面积增大，因此，本发明的作用效果得到具体的发挥。
上述电子部件也可以是集成电路芯片。
根据上述结构，集成电路芯片通过粘接层与露出纤维状的增强件的树脂基板的纤维露出部粘接，因此，在将集成电路芯片安装在树脂基板上的情况下，本发明的作用效果得到具体的发挥。
上述集成电路芯片也可以具有可挠性。
根据上述结构，例如现有的集成电路芯片的厚度是400μm左右，但通过使集成电路芯片的厚度为200μm左右，使集成电路芯片具有可挠性，从而集成电路芯片能够根据树脂制造的安装基板的弯曲而变形，因此，能够进一步提高在树脂基板上安装的集成电路芯片的紧贴性。
上述集成电路芯片也可以在俯视时角部为圆弧状。
根据上述结构，集成电路芯片在俯视时角部为圆弧状，因此，在安装基板弯曲时施加在集成电路芯片的角部的应力分散，能够进一步提高在树脂基板上安装的集成电路芯片的紧贴性。
上述集成电路芯片的侧壁也可以通过与上述纤维露出部粘接的树脂层被固定在上述安装基板上。
根据上述结构，集成电路芯片的侧壁通过与纤维露出部粘接的树脂层被固定在安装基板上，因此，应对集成电路芯片的振动和冲击、或者防湿效果更加有效。
上述粘接层也可以由各向异性导电膜构成。
根据上述结构，电子部件通过各向异性导电膜与露出纤维状的增强件的树脂基板的纤维露出部粘接，因此，电子部件的连接电极与安装基板的配线图案通过各向异性导电膜中的导电颗粒被电连接，本发明的作用效果得到具体的发挥。
此外，本发明涉及的显示装置，是在包括安装基板的显示面板上安装有电子部件的显示装置，该安装基板具有包含纤维状的增强件的树脂基板、和设置在上述树脂基板的表面的配线图案，该电子部件具有用于与上述配线图案连接的连接电极，该显示装置的特征在于：上述树脂基板具有露出上述增强件的纤维露出部，上述电子部件在上述连接电极与上述配线图案电连接的状态下，通过与上述纤维露出部粘接的粘接层被固定在上述安装基板上。
根据上述结构，在构成显示面板的安装基板(例如有源矩阵基板)中，电子部件通过粘接层与露出纤维状的增强件的树脂基板的纤维露出部粘接，因此，与使粘接层与纤维露出部以外的部分粘接的现有技术的情况相比，树脂基板与粘接层的接触(粘接)面积增大。因此，树脂基板和粘接层间的紧贴性相比于现有技术得到提高，此外，粘接层和电子部件间的紧贴性被保持在现有技术的状态，因此，在显示装置(例如设置有有源矩阵基板的液晶显示装置)中，能够相比于现有技术提高在包括纤维状的增强件的树脂基板上安装的电子部件的紧贴性。
根据本发明，构成安装基板的树脂基板具有纤维露出部，电子部件通过与纤维露出部粘接的粘接层被固定在安装基板上，因此，与现有技术相比，能够提高在包括纤维状的增强件的树脂基板上安装的电子部件的紧贴性。
附图说明
图1是实施方式1的配线基板30a的安装部的截面图。
图2是实施方式1的液晶显示装置60a的安装部的平面图。
图3是液晶显示装置60a的安装部的截面图。
图4是构成液晶显示装置60a的有源矩阵基板20a的芯片安装部的平面图。
图5是作为有源矩阵基板20a的变形例的有源矩阵基板20b的芯片安装部的平面图。
图6是作为有源矩阵基板20a的变形例的有源矩阵基板20c的芯片安装部的平面图。
图7是作为有源矩阵基板20a的变形例的有源矩阵基板20d的芯片安装部的平面图。
图8是有源矩阵基板20a的FPC安装部的平面图。
图9是作为有源矩阵基板20a的变形例的有源矩阵基板20e的FPC安装部的平面图。
图10是作为有源矩阵基板20a的变形例的有源矩阵基板20f的FPC安装部的平面图。
图11是以覆盖IC芯片15的方式形成有树脂层18的有源矩阵基板20a的安装部的平面图。
图12是实施方式2的配线基板30b的芯片安装部的截面图。
图13是弯曲状态的配线基板30b的芯片安装部的截面图。
图14是实施方式3的配线基板30c的芯片安装部的平面图。
图15是实施方式4的液晶显示装置60b的安装部的平面图。
图16是液晶显示装置60b的安装部的截面图。
图17是现有技术的配线基板130的安装部的截面图。
图18是配线基板130的芯片安装部的截面图。
图19是弯曲状态的配线基板130的芯片安装部的截面图。
图20是配线基板130的芯片安装部的平面图。
符号说明
5增强件
5e、5ea～5ef纤维露出部
6a、6b有机层
10树脂基板
11a覆盖层
12a、12b配线图案
15、15c、15d IC芯片(集成电路芯片、电子部件)
15b凸点电极(连接电极)
16a、16b柔性印刷配线基板(电子部件)
17ACF(各向异性导电膜、粘接层)
18树脂层
20配线基板主体(安装基板)
20a～20f有源矩阵基板(安装基板)
30a～30c配线基板
50a、50b液晶显示面板
60a、60b液晶显示装置
具体实施方式
下面，根据附图，对本发明的实施方式进行说明。另外，本发明并非限定于以下的各个实施方式。
(发明的实施方式1)
图1～图12表示本发明的配线基板和显示装置的实施方式1。在本实施方式中，作为配线基板和显示装置，举例说明有源矩阵驱动方式的液晶显示装置。此处，图1是本实施方式的配线基板30a的安装部的截面图。
如图1所示，配线基板30a包括配线基板主体20、通过ACF17被分别安装在配线基板主体20的安装部的IC芯片15和FPC16a。
如图1所示，配线基板主体20是包括树脂基板10、在树脂基板10的上表面和下表面分别设置的覆盖层11a和11b、以及在覆盖层11a的上表面设置的配线图案12a和12b的安装基板。
如图1所示，树脂基板10包括：在将玻璃纤维束编成栅格状的玻璃布中含浸有树脂的增强件5、以及在增强件5的上表面和下表面分别设置的有机层6a和6b。另外，增强件5并非仅能够如上所述由玻璃纤维构成，也可以由芳香族聚酰胺纤维等构成。
此处，有机层6a和覆盖层11a以使增强件5的表面的一部分露出的方式开口。而且，在树脂基板10中，由增强件5的从有机层6a和覆盖层11a露出的部分构成纤维露出部5e。
此外，IC芯片15是包括芯片主体15a、和以从芯片主体15a的底面突出的方式设置的多个凸点电极15b的电子部件。
FPC16a是在由聚酰亚胺树脂等构成的膜基材上形成有由铜箔等构成的引绕配线的膜状的配线基板。
ACF17例如是在热固化性的环氧树脂等中分散有在塑料珠的表面依次叠层有镍镀层和金镀层的导电颗粒17a和17b的粘接性的膜。在本实施方式中，作为与纤维露出部5e粘接的粘接层举例表示了ACF17，但是，也可以是各向异性导电性膏(ACP：Anisotropic Condactive Paste)、绝缘性膜(NCF：Non Condactive Film)、绝缘性膏(NCP：Non CondactivePaste)、和焊膏等导电性膏。
此外，如图3所示，配线基板30a也可以构成液晶显示装置60a。此处，图2是液晶显示装置60a的安装部的平面图，图3是液晶显示装置60a的安装部的截面图。
如图3所示，液晶显示装置60a包括：液晶显示面板50a，该液晶显示面板50a具有与上述配线基板主体(安装基板)20对应的有源矩阵基板20a、与有源矩阵基板20a相对配置的相对基板40、和在有源矩阵基板20a和相对基板40之间设置的液晶层35；以及通过ACF17被分别安装在液晶显示面板50a的安装部的IC芯片15和FPC16a。
有源矩阵基板20a包括：树脂基板10；在树脂基板10上以相互平行延伸的方式设置的多个栅极线12；在与各栅极线12正交的方向上以相互平行延伸的方式设置的多个源极线(未图示)；分别设置在各栅极线12和各源极线的交叉部分的多个薄膜晶体管(Thin Film Transistor，以下称作“TFT”，未图示)；与各TFT对应地分别设置的多个像素电极(未图示)(参照图1和图2)。此处，图1的配线基板30a中的配线图案12a例如是各栅极线12的末端的输入端子部。另外，配线图案12a也可以是各源极线等的显示用配线的末端的输入端子部。
此外，在有源矩阵基板20a中，通过各像素电极构成作为图像的最小单位的像素，这些像素配置为矩阵状，从而构成显示区域。而且，在有源矩阵基板20a的显示区域的外周部设置有框状的密封部36，其与相对基板40粘接并且包围液晶层35。
相对基板40包括：在树脂基板(未图示)上设置的彩色滤光片层(未图示)；在该彩色滤光片层上设置的保护涂层(未图示)；和在该保护涂层上设置的共用电极(未图示)。此处，上述彩色滤光片层具有：与有源矩阵基板20a上的各像素电极对应地，例如各自被着色为红色、绿色或者蓝色的多个着色层(未图示)；和在各个着色层之间设置的黑矩阵(未图示)。
液晶层35由具有电光学特性的向列型液晶等构成。
在液晶显示面板50a中，如图2所示，有源矩阵基板20a的例如两边的端部形成得比相对基板40突出，在有源矩阵基板20a的突出的部分(后述的芯片安装部和FPC安装部)，安装有用于驱动面板的IC芯片15、FPC16a。
此处，如图4所示，在有源矩阵基板20a的芯片安装部，分别设置有：在图中上侧沿纵方向延伸、并且与栅极线12等显示用配线连接的多个配线图案12a；在图中下侧沿纵方向延伸、并且用于与FPC16a连接的多个配线图案12b；以及在各配线图案12a和12b之间延伸、并且与图1的纤维露出部5e对应的纤维露出部5ea。另外，各个配线图案12a和12b具有宽幅部，用于与IC芯片15的各个凸点电极15b电连接。
此外，在上述以外，芯片安装部的纤维露出部5e也可以是：在IC芯片15的周端的外侧形成得较大的结构，使得构成ACF17的树脂能够流出至IC芯片15的外侧并固化(参照图5的有源矩阵基板20b和图6的有源矩阵基板20c中的符号5eb)；在配线图案12a的组和配线图案12b的组之间沿图中横方向延伸而形成的结构(参照图6的有源矩阵基板20c和图7的有源矩阵基板20d中的符号5ec)；以及，在IC芯片15的凸点电极15b采用曲折配置的情况下，在外侧的各个配线图案12a和12b之间宽度形成得较窄的结构(参照图7的有源矩阵基板20d中的符号5ed)。
进一步，如图8所示，在有源矩阵基板20a的FPC安装部上设置有从芯片安装部延伸的多个配线图案12b、和在各个配线图案12b之间延伸的纤维露出部5ee。
此外，在上述以外，FPC安装部的纤维露出部5e也可以是沿图中横方向延伸而形成的结构(参照图9的有源矩阵基板20e和图10的有源矩阵基板20f中的符号5ef)。
进一步，在有源矩阵基板20a的安装部，也可以如图11所示，以覆盖IC芯片15的方式设置有树脂层18。此处，树脂层18与ACF17同样，与纤维露出部5ea粘接。由此，IC芯片15的周围的侧壁通过与纤维露出部5ea粘接的树脂层18被固定在有源矩阵基板20a上，因此，能够更加有效地应对IC芯片15的振动和冲击、或者防湿。
上述结构的液晶显示装置60a构成为：在各个像素中，从栅极线12发送栅极信号，TFT成为导通状态时，从源极线发送源极信号，通过成为导通状态的TFT，规定的电荷被写入像素电极，在像素电极和共用电极之间产生电位差，规定的电压被施加在由液晶层35构成的液晶电容上。而且，在液晶显示装置60a中，利用液晶分子的取向状态根据该施加电压的大小而变化的特点，调整从背光源单元(未图示)入射的光的透过率，从而显示图像。
下面，参照图1，对通过ACF17在配线基板主体20上安装IC芯片15和FPC16a的方法进行说明。
首先，使环氧树脂、酚醛树脂等含浸在玻璃布中，制作增强件5，然后，为了提高基板的平滑性和气体阻隔性，在其表面和背面涂敷硅类、丙烯酸酯类的树脂，从而形成有机层形成膜(6a)和有机层6b，准备树脂基板母材。
接着，通过等离子体CVD(Chemical Vapor Deposition：化学气相沉积)法在树脂基板母材的表面和背面形成氧化硅膜等覆盖层形成膜(11a)和覆盖层11b。
进一步，通过溅射法在上述覆盖层形成膜的表面形成钛膜等金属导电膜，然后，通过光刻法形成图案，形成配线图案12a和12b。另外，在配线基板主体20为有源矩阵基板的情况下，继续形成TFT、像素电极等。
然后，蚀刻上述覆盖层形成膜的规定区域，形成覆盖层11a。
进一步，利用氧等离子体等对从覆盖层11a露出的上述有机层形成膜进行灰化，形成有机层6a，从而形成纤维露出部5e。
如上所述能够准备配线基板主体20。
接着，在配线基板主体20的配线图案12a和12b上，在将ACF17加热至80℃左右的同时进行临时压接。
进一步，在将IC芯片15和FPC16a配置在ACF17的上方之后进行定位，使得IC芯片15的各个凸点电极15b与配线图案12a和12b重合，并且使得FPC16a(的引绕配线)与配线图案12b重合。
然后，使用被加热至190℃左右的压接工具，通过从上方按压IC芯片15和FPC16a并加压，进行永久压接。此时，在配线基板主体20和IC芯片15之间，通过加热和加压，ACF17中的树脂成分熔融，从凸点电极15b与配线图案12a和12b之间、以及FPC16a与配线图案12b之间流出，并且分散在ACF17中的导电颗粒17a被夹持在凸点电极15b和FPC16a与配线图案12a和12b之间，因此，ACF17中的导电颗粒17a在凸点电极15b(和FPC16a的引绕配线)与配线图案12a和12b之间被挤压，从而凸点电极15b(和FPC16a的引绕配线)与配线图案12a和12b通过导电颗粒17a电连接，在此状态下，利用ACF17中的树脂成分，IC芯片15和FPC16a被固定在配线基板主体20上。
根据上述方法，能够制造安装有IC芯片15和FPC16a的配线基板30a。
如以上说明的，根据本实施方式的配线基板30a和液晶显示装置60a，在配线基板主体20、和构成液晶显示面板50a的有源矩阵基板20a中，在露出增强件5的玻璃纤维的树脂基板10的纤维露出部5e(5ea～5ef)上，通过ACF17粘接有IC芯片15和FPC16a，因此，与使ACF17与纤维露出部以外的部分粘接的现有技术的情况(参照图17)相比，树脂基板10与ACF17的接触(粘接)面积增大。因此，树脂基板10和ACF17之间的紧贴性与现有技术相比得到提高，而且，ACF17与IC芯片15和FPC16a之间的紧贴性被保持在现有技术的水平，因此，在配线基板30a和液晶显示装置60a中，与现有技术相比，能够提高在包括纤维状的增强件5的树脂基板10上安装的IC芯片15和FPC16a的紧贴性。
(发明的实施方式2)
图12和图13是本实施方式的配线基板30b的芯片安装部的截面图。另外，在以下的各个实施方式中，对与图1～图11相同的部分标注相同的符号，并省略其详细的说明。
在上述实施方式1中，IC芯片15的厚度是400μm左右，但是，在本实施方式中，IC芯片15c的厚度是200μm左右，IC芯片15c具有可挠性。由此，IC芯片15c能够根据树脂制造的配线基板主体20的弯曲而变形，因此，能够进一步提高在树脂基板10上安装的IC芯片15c的紧贴性。与此相对，在图18和图19所示的现有技术的配线基板130中，当在安装有刚性的IC芯片115的状态下发生弯曲时，局部应力可能会作用在IC芯片115的端部。如果这样，则在配线基板130中，IC芯片115会从配线基板主体120剥离。
(发明的实施方式3)
图14是本实施方式的配线基板30c的芯片安装部的平面图。
在上述实施方式1和2以及现有技术的配线基板中，IC芯片15和IC芯片115(参照图20)的角部是大致直角，但是，在本实施方式中，IC芯片15d在俯视时角部是圆弧状(例如，在纵2mm×横10mm的IC芯片的情况下，圆弧状的曲率半径为0.8mm)，因此，配线基板主体20弯曲时，施加在集成电路芯片的角部的应力分散，能够进一步提高在树脂基板10上安装的IC芯片15d的紧贴性。
(发明的实施方式4)
图15是本实施方式的液晶显示装置60b的芯片安装部的平面图，图16是液晶显示装置60b的芯片安装部的截面图。
在液晶显示装置60b中，在有源矩阵基板20g的两边的端部安装有TAB(Tape Automated Bonding：带状自动化粘合)。该TAB是在与上述实施方式1的FPC16a对应的FPC16b上安装有IC芯片15的电路元件，与上述各个实施方式同样，通过ACF17被粘接在构成有源矩阵基板20g的树脂基板10的纤维露出部5e上。
在上述各个实施方式中，举例表示了有源矩阵驱动方式的液晶显示装置，但是，本发明也能够应用于无源矩阵驱动方式的液晶显示装置、和EL(Electroluminescence：电致发光)显示装置等显示装置、和构成电子设备的各种配线基板。
产业上的可利用性
如上述所说明的，本发明能够提高在树脂基板上安装的电子部件的紧贴性，因此对于柔性配线基板和显示装置是有用的。

Claims (8)

1.一种配线基板，其在具有包含纤维状的增强件的树脂基板、和设置在所述树脂基板上的多个配线图案的安装基板上，安装有具有用于与所述配线图案连接的连接电极的集成电路芯片，该配线基板的特征在于：
所述树脂基板具有露出所述增强件的纤维露出部，
所述集成电路芯片在所述连接电极与所述配线图案电连接的状态下，通过与所述纤维露出部粘接的粘接层被固定在所述安装基板上，
所述纤维露出部在所述多个配线图案之间延伸，并且还在所述集成电路芯片的周端的外侧形成。
2.如权利要求1所述的配线基板，其特征在于：
所述集成电路芯片被与所述纤维露出部粘接的树脂层覆盖。
3.如权利要求1所述的配线基板，其特征在于：
所述增强件是含浸有树脂的玻璃纤维，
所述树脂基板具有在所述增强件的表面设置的有机层，
所述有机层以使所述增强件露出的方式开口。
4.如权利要求1所述的配线基板，其特征在于：
在所述树脂基板和配线图案之间设置有覆盖层，
所述覆盖层以使所述增强件露出的方式开口。
5.如权利要求1所述的配线基板，其特征在于：
所述集成电路芯片具有可挠性。
6.如权利要求1所述的配线基板，其特征在于：
所述集成电路芯片在俯视时角部为圆弧状。
7.如权利要求1所述的配线基板，其特征在于：
所述粘接层由各向异性导电膜构成。
8.一种显示装置，其是在包括安装基板的显示面板上安装有集成电路芯片的显示装置，该安装基板具有包含纤维状的增强件的树脂基板、和设置在所述树脂基板的表面的多个配线图案，该集成电路芯片具有用于与所述配线图案连接的连接电极，该显示装置的特征在于：
所述树脂基板具有露出所述增强件的纤维露出部，
所述集成电路芯片在所述连接电极与所述配线图案电连接的状态下，通过与所述纤维露出部粘接的粘接层被固定在所述安装基板上，
所述纤维露出部在所述多个配线图案之间延伸，并且还在所述集成电路芯片的周端的外侧形成。
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