CN101494217B - Conductor frame - Google Patents
Conductor frame Download PDFInfo
- Publication number
- CN101494217B CN101494217B CN200810000575.8A CN200810000575A CN101494217B CN 101494217 B CN101494217 B CN 101494217B CN 200810000575 A CN200810000575 A CN 200810000575A CN 101494217 B CN101494217 B CN 101494217B
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- China
- Prior art keywords
- pedestal
- lead frame
- insulating body
- light
- aqueous vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention discloses a lead frame which can load a plurality of light-emitting wafers. The lead frame comprises a base, an insulated body and a support. The base comprises an upper end face and a lower end face; and the upper end face comprises a first surface and a second surface. The insulated body partially coats the base and the support. A bonding area is formed between the insulated body and the first surface for bearing the light-emitting wafers, wherein, the first surface is defined as a height reference and the lower end face thereof is lower than the first surface. A height difference exists between the first surface and the second surface. Therefore, the height difference can prevent the external aqueous vapor from directly permeating to the bonding area and being contacted with the light-emitting wafers.
Description
Technical field
The invention relates to a kind of lead frame that carries a plurality of luminescence chips, and particularly stop extraneous aqueous vapor to infiltrate the lead frame that contacts with luminescence chip in it relevant for a kind of.
Background technology
In recent years, (Light Emitting Diode LED) has the low advantage of the short and small and single heat of volume, and the related application of LED is more and more owing to light-emitting diode.The mainstream applications of LED is the back lighting of electronic product at present, for example: mobile phone, mobile computer and TV.These electronic products general needed backlight be white light, the production method of white light LEDs be present LED industry important issue one.At present, the production method of white light LEDs is broadly divided into the excitated fluorescent powder bright dipping or utilizes primitive colours LED (red, blue, green) mixed light.The mode of excitated fluorescent powder bright dipping is broadly divided into blue-ray LED collocation yellow fluorescent powder, blue-ray LED collocation redness and green emitting phosphor or ultraviolet leds collocation three primary colors fluorescent material.Generally speaking, RGB three-color LED mixed light has the higher and luminosity advantage of higher of color saturation, therefore is widely used in the high-order electronic product.
In addition, on illumination market, LED has the trend that replaces the traditional lighting light fixture gradually at present, such as Vehicular headlamps, searchlight and room lighting etc.Because above-mentioned illumination market must have enough luminous intensities, therefore the identification object, develops the light-emitting device that highlight illumination is arranged at present on the market gradually at a distance.Shown in figure one, be light-emitting device at present existing on the market highlight illumination.
Because light-emitting device 1 with high brightness luminescent ability, no matter be to utilize fluorescence excitation bright dipping mode or RGB three-color LED mixed light mode, all need to be provided with a plurality of light-emitting diodes 12 on lead frame 10, may be in practical application up to dozens of even 100 or more light-emitting diode 12, only a plurality of light-emitting diodes 12 are illustrated to be provided with at this place.Therefore, pedestal 102 must form bigger area, allows a plurality of light-emitting diodes 12 be arranged in this pedestal 102 tops simultaneously, and the heat energy that a plurality of light-emitting diodes 12 are produced is able to carry out thermal energy transfer by pedestal 102, and then it is discharged.And in order to solve heat dissipation problem, so need be fitted with a radiating component 14 in the bottom of pedestal 102, so that heat is able to be passed on the radiating component 14 by pedestal 102.And then, produce the effect that heat exchange reaches quick heat radiating by radiating component 14 and air.
But, carry the lead frame 10 of a plurality of light-emitting diodes 12, for the pedestal 102 with big area of dissipation is provided, need pedestal 102 is made tabular, form insulating body 100 in pedestal 102 tops again, and the area of pedestal 102 is greater than insulating body 100.And insulating body 100 during moulding, for unlikely generation comes off, therefore is provided with plurality of through holes 1024 on pedestal 102 on pedestal 102, makes the insulating body 100 can be affixed mutually by through hole 1024 and pedestal 102.And pedestal 102 is in order to combine with radiating component 14, so must be provided with locking hole 1026 on the pedestal 102, so that pedestal 102 is able to be locked on the radiating component 14 by this locked assembly 16 (screw shown in figure one).
Aforementioned structure, insulating body 100 only combine with pedestal 102 by through hole 1024.But insulating body 100 is to be incorporated on the pedestal 102 with injection molding method, so its insulating body 100 and 102 binding faces that are formed with a level of this pedestal, but when utilizing ejection forming technique on pedestal 102, to be shaped owing to insulating body 100, because insulating body 100 is constituted with the material of pedestal 102 by two kinds of unlike materials, therefore, insulating body 100 can't fit on this pedestal 102 effectively closely, so need to reach combining of insulating body 100 and pedestal 102 by through hole 1024.
Only, because when this insulating body 100 is incorporated on this pedestal 102 in the injection molding mode, because of injection molding must be through the process of supercooling contraction, therefore cause the distortion of insulating body 100 easily, cause the binding face of 102 of insulating body 100 and pedestals to contact to driving fit, and produce the slit in the binding face of 102 of insulating body 100 and this pedestals, cause aqueous vapor to become entrained in the air, do not enter in the crystal bonding area territory that insulating body 100 and pedestal 102 produced in the slit that binding face produced of driving fit via this, and produce the problem that aqueous vapor is infiltrated, cause the damage of the light-emitting diode 12 of inside, crystal bonding area territory.Moreover, pedestal 102 combines with radiating component 14 by locked assembly 16, therefore, in the process of locking, also easily because locking power inequality causes the buckling deformation of pedestal 102, make 102 of insulating body 100 and pedestals produce the slit, or increasing its slit, the situation that causes aqueous vapor to infiltrate is aggravated, and has a strong impact on the usefulness of light-emitting device 1, the easier inefficacy that causes light-emitting diode 12, and shorten its useful life.
So, how a kind of excellent radiating effect that has is provided, and can effectively prevents the aqueous vapor infiltration, and then the lead frame of the high brightness luminescence device special use that increases the service life, be the problem that institute's desire solves among the present invention.
Summary of the invention
The objective of the invention is to, a kind of excellent radiating effect that has is provided, and can effectively prevent the aqueous vapor infiltration, and then the lead frame of the high brightness luminescence device special use that increases the service life.
For reaching above-mentioned purpose, according to first specific embodiment of the present invention, lead frame of the present invention includes pedestal, insulating body and support.Pedestal comprises upper surface and lower surface, and the upper surface more includes first surface and second surface.Its insulating body coats pedestal partially and constitutes the crystal bonding area territory with first surface simultaneously, to carry this plural number luminescence chip by this crystal bonding area territory.The definition first surface is that a height plane of reference and lower surface are lower than first surface.First surface and second surface have a difference in height.Support is insulated body partially and coats, and comprises first connecting portion that electrically connects with these luminescence chips and second connecting portion that electrically connects with circuit.
By this first surface and the formed high low head of this second surface, infiltrate the effect of light-emitting device to reach effective prevention aqueous vapor.
In addition, second specific embodiment according to the present invention, the upper surface of pedestal further comprises the 3rd surface, and the 3rd surface, first surface and second surface all have a difference in height between any two.The 3rd surface is located between first surface and the second surface.
The 3rd specific embodiment according to the present invention again, the upper surface of pedestal further comprises the 4th surface, and the 4th surface, the 3rd surface, first surface and second surface all have a difference in height between any two.The 3rd surface and the 4th surface are adjacent to be located between first surface and the second surface.
According to above-mentioned a plurality of specific embodiments, be formed with a plurality of surfaces of height fall between the pedestal utilization of lead frame of the present invention, so that be formed with more complicated contact area between insulating body and this pedestal, after making its aqueous vapor infiltrate from the slit between insulating body and the pedestal, remove the flow direction that the length that can prolong aqueous vapor infiltration path also can change aqueous vapor, to increase the degree of difficulty that aqueous vapor is infiltrated, and then effectively avoid aqueous vapor to penetrate into the crystal bonding area territory contacting with luminescence chip, to prevent led failure or to shorten its useful life.
Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.
Description of drawings
Fig. 1 is the schematic diagram of the lead frame of prior art.
Fig. 2 A is the schematic diagram of the lead frame of first specific embodiment according to the present invention.
Fig. 2 B is that lead frame among Fig. 2 A is along the profile of A-A line.
Fig. 2 C is the pedestal among Fig. 2 A and the schematic diagram of support.
Fig. 2 D is the schematic diagram that lead frame among Fig. 2 A and fin are fitted.
Fig. 3 A is the schematic diagram of the lead frame of second specific embodiment according to the present invention.
Fig. 3 B is the schematic diagram of the pedestal among Fig. 3 A.
Fig. 4 is the schematic diagram of the lead frame of the 3rd specific embodiment according to the present invention.
Fig. 5 is the schematic diagram of the lead frame of the 4th specific embodiment according to the present invention.
Fig. 6 A is the schematic diagram of the lead frame of the 5th specific embodiment according to the present invention.
Fig. 6 B is the schematic diagram of the pedestal among Fig. 6 A.
Fig. 7 A is the schematic diagram of the lead frame of the 6th specific embodiment according to the present invention.
Fig. 7 B is the first subbase seat among Fig. 7 A and the schematic diagram of the second subbase seat.
Fig. 8 A is the schematic diagram of the lead frame of the 7th specific embodiment according to the present invention.
Fig. 8 B is the stereogram of the lead frame among the corresponding diagram 8A.
Fig. 8 C is another stereogram of the lead frame among the corresponding diagram 8A.
Fig. 9 is the schematic diagram of the lead frame of the 8th specific embodiment according to the present invention.
Figure 10 A is the schematic diagram of the lead frame of the 9th specific embodiment according to the present invention.
Figure 10 B is that lead frame among Figure 10 A is along the profile of A-A line.
Figure 10 C is the schematic diagram that the lead frame of Figure 10 B comprises the bending support.
Figure 11 is the schematic diagram that illustrates the lead frame of the tenth specific embodiment according to the present invention.
Figure 12 is the schematic diagram that shows the pedestal of the 11 specific embodiment according to the present invention.
Figure 13 is the schematic diagram of the lead frame of the present invention's the 12 specific embodiment.
Embodiment
Therefore lead frame of the present invention is mainly used on the light-emitting device with highlight illumination, needs most luminescence chips of carrying, and it can carry dozens of or more than 100.In fact, luminescence chip can be light-emitting diode, laser diode or other semiconductor light emitting structure.
Compared to the lead frame 10 (as shown in Figure 1) of prior art, the pedestal of lead frame of the present invention comprises the surface that has difference in height between a plurality of and infiltrates in the light-emitting device to stop aqueous vapor.Shown in the lead frame among Fig. 2 B 20, the second surface 20202 that the upper surface 2020 of pedestal 202 comprises first surface 20200 and is lower than first surface 20200 causes this first surface 20200 to be formed with a high low head with this second surface 20202.In addition, what need supplementary notes is that in order to allow all embodiment can both have clear and definite height and the definition of positive negative direction, therefore the first surface with pedestal is defined as a height plane of reference, and the lower surface definition of pedestal is lower than first surface.
After becoming entrained in airborne aqueous vapor and penetrating into second surface 20202 via the slit between insulating body 200 and the pedestal 202, the infiltration path of aqueous vapor can run into by the formed turning point, close surface with difference in height, and the turning point can stop the infiltration of aqueous vapor even allow the aqueous vapor reverse flow.And aqueous vapor need overcome this difference in height just can penetrate into first surface 20200, has relatively prolonged the path that aqueous vapor desires to contact with light-emitting diode 4 required infiltration.Moreover, because this first surface 20200 and 20202 of this second surfaces are formed with a height fall, when causing this insulating body 200 to take shape on this pedestal 202, its insulating body 200 can should fill up at high low head place, and be coated on first surface 20200 around, and make this insulating body 200 and the periphery of this first surface 20200 form the preferable effect that fits tightly, and then avoid aqueous vapor to infiltrate in the first surface 20200.And then lead frame 20 of the present invention reaches the purpose that stops that extraneous aqueous vapor infiltration crystal bonding area territory 20204 contacts with light-emitting diode 4.
Moreover the upper surface of pedestal can comprise the surface that has difference in height between more, shown in the lead frame among the lead frame among Fig. 3 A 21 and Fig. 4 22.Pedestal 202 in Fig. 2 B, the upper surface 2120 of the pedestal 212 among Fig. 3 A and Fig. 3 B further comprises 21204, the three surfaces 21204, the 3rd surface and all is higher than first surface 21200 and second surface 21202.Pedestal 212 in Fig. 3 A, the upper surface 2220 of the pedestal 222 among Fig. 4 further comprises 22206, the four surfaces, the 4th surface and all is lower than first surface 22200 and second surface 22202.By this, the contact-making surface between insulating body and the pedestal has the turning point that multipotency block water air infiltration is more gone into, and relatively prolonged aqueous vapor from the external world to the infiltration road warp in crystal bonding area territory.In addition, insulating body more can closely fit in pedestal by filling up a plurality of turning points (that is, high low head place), infiltrates in the lead frame to stop extraneous aqueous vapor.
In addition, the substrate 202 of the lead frame 20 shown in Fig. 2 D is roughly the same with the size of insulating body 202, therefore insulating body 200 and pedestal 202 (shown in Fig. 2 C) all need be opened a locking hole, allow screw can lock this locking hole, and lead frame 20 is locked in (shown in Fig. 2 D) on the radiating component 5.But lead frame of the present invention is not limited thereto, and therefore the size of the pedestal 232 of lead frame 23 as shown in Figure 5 only needs to open a locking hole on insulating body 230 less than insulating body 230, and screw can not pass substrate 232 and lock radiating component.Because insulating body 230 can absorb partly locking force road, and substrate 232 directly not stressed (not passed) by screw, when so lead frame 23 is locked on the radiating component 5, substrate 232 is not easy to stick up to bend and is out of shape, and then can not produce or strengthen slit between insulating body 230 and the substrate 232, more can stop aqueous vapor to be infiltrated in the lead frame 23.
Since the insulating body of ejection formation can cool off shrink or pedestal locked power can buckling deformation, and between pedestal and insulating body, produce the slit.If the engaging force between insulating body and the pedestal is big more, the slit of generation will be relatively more little.Desire closely engages insulating body with pedestal, except the locking power of utilizing screw indirectly, also can set about from the direction that increases engaging force between insulating body and the pedestal.A plurality of through holes can be set on pedestal, and the pedestal that comprises a plurality of through holes 2,024 202 shown in Fig. 2 B and Fig. 2 C can also be provided with groove, the pedestal 242 shown in Fig. 6 A and Fig. 6 B around pedestal.Insulating body 240 fills up groove 2424 when ejection formation, and then increases the vertical engaging force (direction of arrow as shown in Figure 6A) between insulating body 240 and the pedestal 242.
Outside the purpose that the block water air infiltration is gone into, lead frame of the present invention also can have other variation to distribute or to guide the heat that light-emitting diode is produced quickly in structure and material aspect.The a plurality of surfaces that have difference in height between the pedestal of certainly, following lead frame still comprises are to reach the main purpose that stops aqueous vapor to be infiltrated.
For the heat that the highlight illumination light-emitting device that leaves is apace produced, the pedestal of lead frame can use the higher material of conductive coefficient to make.Generally speaking, the material of pedestal is aluminium or copper, and the pedestal of lead frame all becomes to get final product with the higher copper of conductive coefficient in theory, but the cost of copper is than the aluminium costliness.Therefore, actual practice is that the part that two different materials are made is combined as pedestal, and shown in the pedestal 252 of Fig. 5 A and Fig. 5 B, pedestal 252 comprises the first subbase seat 2520 and the second subbase seat 2522.The material of the first subbase seat 2520 is a copper, and the material of the second subbase seat 2522 is an aluminium.Less and the made of copper first subbase seat 2520 of size is in order to carry a plurality of light-emitting diodes, to lead the amount of reducing phlegm and internal heat fast.Size can be held the first subbase seat 2520 than the second subbase seat 2522 of big and aluminum, except the heat that the first subbase seat, 2520 conduction that help to leave come, the second subbase seat 2522 that area is bigger also can increase heat exchange amount with radiating component with the heat that leaves fast.And then pedestal 252 has been taken into account the requirement of rate of heat dispation and manufacturing cost.
Except the above-mentioned method of utilizing the high thermal conductivity coefficient material, can also utilize the method that increases area of dissipation to increase rate of heat dispation, shown in Fig. 8 A to Fig. 8 C.The pedestal 262 of the lead frame 26 among Fig. 8 A comprises heating panel 2624, and heating panel 2624 outwards protrudes in insulating body 260 symmetrically.For example, the heating panel 2624 among Fig. 8 B outwards protrudes in insulating body 260 both sides, and the heating panel 2624 among Fig. 6 C outwards protrudes in around the insulating body 260.The heating panel 2624 that protrudes in insulating body 260 be except increasing the area of dissipation, can also be connected to each other separately heating panel 2624 between a plurality of lead frames 26 with the average mark heat dissipation capacity, avoids heat too concentrated.
In addition, the method that increases rate of heat dispation also can pedestal 272 as shown in Figure 9 protrudes in the lower edge of insulating body 270.Radiating component 6 comprises the interior concave space that is compatible with pedestal 272 ledges, and then the contact area between increase pedestal 272 and the radiating component 6 is to increase radiating efficiency.Certainly, the invention is not restricted to this, pedestal also can comprise the evagination part embedding mutually of concave space and radiating component in.
In addition, lead frame of the present invention also can have other to change to be applicable on the different purposes, for example: with the connected mode of circuit, present with the connected mode and the outward appearance of light-emitting diode.The a plurality of surfaces that have difference in height between the pedestal of certainly, following lead frame still comprises are to reach the main purpose that stops aqueous vapor to be infiltrated.
On the connected mode of lead frame and circuit, the support 204 of the lead frame 20 among Fig. 2 B is embedded in the insulating body 200, except exposing first connecting portion 2040 and light-emitting diode 4 electric connections, only expose second connecting portion 2042 and be electrically connected to and external circuit, to provide light-emitting diode 4 power supplys by wiring.Certainly, the method to set up of support is not limited thereto, and support can protrude in insulating body, shown in Figure 10 A to Figure 10 C.Look the actual welding situation of circuit board and support, protrude in insulating body and second connecting portion that is connected with circuit board can keep the straight or crooked welding that is beneficial to.For instance, if lead frame 28 is embedded in the sunk area of circuit board (shown in the dotted line), shown in Figure 10 A and Figure 10 B, second connecting portion 2842 of support 284 can keep straight to press close to circuit board.If lead frame 28 directly is placed on the circuit board (shown in the dotted line), shown in Figure 10 C, second connecting portion 2842 needs bending to press close to circuit board.By this, when crossing the tin stove, the tin cream on the circuit board can attach to second connecting portion 2842 easily.
On the connected mode of the support of lead frame and light-emitting diode, with a wherein row light-emitting diode 4 of lining up array among Fig. 2 A is example, 2040 of first connecting portions of the support 240 shown in Fig. 2 B are electrically connected to the light-emitting diode 4 of the most close first connecting portion 2040 in this row light-emitting diode 4, only electrically connect mutually with wiring between other light-emitting diode 4.If this row light-emitting diode 4 light-emitting diode 4 wherein damages lost efficacy, this row light-emitting diode 4 all can't be luminous.Therefore, support 294 as shown in figure 11 comprises a plurality of first connecting portions 2940, and each first connecting portion 2940 all is connected with second connecting portion 2942.Each first connecting portion 2940 is a strip, can electrically connect each light-emitting diode 7 in the row light-emitting diode 7, therefore should damage inefficacy by one of them light-emitting diode 7 of row, can not have influence on other light-emitting diode 7 runnings.
On outward appearance presents, because the size of light-emitting diode is little a lot of compared to the required luminescence component of general fluorescent tube or bulb, therefore carry the lead frame of light-emitting diode and can be easily change outward appearance and present, as Figure 12 and shown in Figure 13 according to practical application or manufacturing demand.Pedestal 302 among Figure 12 is a circle, and the pedestal 312 among Figure 13 is an ellipse, and insulating body 310 is a circle.Certainly, the outward appearance of pedestal 302, pedestal 312 and insulating body 310 is not limited thereto, and also can be triangle or other polygon.
What need supplementary notes is, the pedestal that above-mentioned a plurality of embodiment described is all with support and separates, that is, thermoelectric separate wires frame.But lead frame of the present invention is not limited thereto, and pedestal also can be integrally formed with the support of a side wherein, that is, thermoelectric coenosarc formula lead frame.
Compared to prior art, be formed with a plurality of surfaces of height fall between the pedestal utilization of lead frame of the present invention, so that be formed with more complicated contact area between insulating body and this pedestal, after making its aqueous vapor infiltrate from the slit between insulating body and the pedestal, remove the flow direction that the length that can prolong aqueous vapor infiltration path also can change aqueous vapor, to increase the degree of difficulty that aqueous vapor is infiltrated, and then effectively avoid aqueous vapor to penetrate into the crystal bonding area territory contacting with luminescence chip, to prevent led failure or to shorten its useful life.Moreover the pedestal of lead frame of the present invention also can utilize locked assembly except through hole or groove are set, and increasing the engaging force between pedestal and the insulating body, and then reduces the slit between insulating body and the pedestal, therefore can reduce the aqueous vapor infiltration capacity.In addition, lead frame of the present invention can have the heating panel that protrudes in insulating body and use the made substrate of different materials, to increase radiating efficiency.In sum, lead frame of the present invention has excellent radiating effect, and can effectively prevent the aqueous vapor infiltration, and then prolongs the useful life of high brightness luminescence device.
By the above detailed description of preferred embodiments, be that hope can be known description feature of the present invention and spirit more, and be not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.Therefore, the category of the claim that the present invention applied for should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.
Claims (5)
1. lead frame in order to carry a plurality of luminescence chips, comprises:
One pedestal, comprise a upper surface and a lower surface, this upper surface comprises a first surface, a second surface and one the 3rd surface, and the 3rd surface, this first surface and this second surface all have a difference in height between any two, and the 3rd surface is located between this first surface and this second surface;
One insulating body, coat this pedestal partially and constitute a crystal bonding area territory with this first surface, this crystal bonding area territory is in order to carry these luminescence chips, and defining this first surface is that a height plane of reference and this lower surface are lower than this first surface, and this first surface and this second surface have a difference in height; And
One support is coated by this insulating body partially, comprises one first connecting portion that electrically connects with these luminescence chips and one second connecting portion that electrically connects with a circuit.
2. lead frame as claimed in claim 1, wherein, the 3rd surface is higher than this first surface and this second surface.
3. lead frame as claimed in claim 1, wherein, first surface and second surface all are higher than the 3rd surface.
4. lead frame as claimed in claim 1, wherein, this upper surface of this pedestal comprises one the 4th surface, the 4th surface, the 3rd surface, this first surface and this second surface all have a difference in height between any two, and the 3rd surface and the 4th surface are adjacent to be located between this first surface and this second surface.
5. lead frame as claimed in claim 4, wherein, the 3rd surface is higher than this first surface and this second surface, and the 4th surface is lower than this first surface and this second surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810000575.8A CN101494217B (en) | 2008-01-23 | 2008-01-23 | Conductor frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810000575.8A CN101494217B (en) | 2008-01-23 | 2008-01-23 | Conductor frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101494217A CN101494217A (en) | 2009-07-29 |
| CN101494217B true CN101494217B (en) | 2010-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810000575.8A Expired - Fee Related CN101494217B (en) | 2008-01-23 | 2008-01-23 | Conductor frame |
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| Country | Link |
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| CN (1) | CN101494217B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6188130B1 (en) * | 1999-06-14 | 2001-02-13 | Advanced Technology Interconnect Incorporated | Exposed heat spreader with seal ring |
| US6358773B1 (en) * | 2000-12-27 | 2002-03-19 | Vincent Lin | Method of making substrate for use in forming image sensor package |
| CN1684278A (en) * | 2004-04-15 | 2005-10-19 | 联欣光电股份有限公司 | Packaging structure of light emitting diode and its packaging method |
-
2008
- 2008-01-23 CN CN200810000575.8A patent/CN101494217B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6188130B1 (en) * | 1999-06-14 | 2001-02-13 | Advanced Technology Interconnect Incorporated | Exposed heat spreader with seal ring |
| US6358773B1 (en) * | 2000-12-27 | 2002-03-19 | Vincent Lin | Method of making substrate for use in forming image sensor package |
| CN1684278A (en) * | 2004-04-15 | 2005-10-19 | 联欣光电股份有限公司 | Packaging structure of light emitting diode and its packaging method |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平10-209194A 1998.08.07 |
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| CN101494217A (en) | 2009-07-29 |
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