CN101489883B - 板状体的收纳方法及收纳装置 - Google Patents

板状体的收纳方法及收纳装置 Download PDF

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Publication number
CN101489883B
CN101489883B CN2007800273420A CN200780027342A CN101489883B CN 101489883 B CN101489883 B CN 101489883B CN 2007800273420 A CN2007800273420 A CN 2007800273420A CN 200780027342 A CN200780027342 A CN 200780027342A CN 101489883 B CN101489883 B CN 101489883B
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CN
China
Prior art keywords
tray
pallet
tabular body
glass substrate
plate
Prior art date
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Active
Application number
CN2007800273420A
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English (en)
Chinese (zh)
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CN101489883A (zh
Inventor
野濑雄彦
丰嶋一也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN101489883A publication Critical patent/CN101489883A/zh
Application granted granted Critical
Publication of CN101489883B publication Critical patent/CN101489883B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D19/38—Details or accessories
    • B65D19/385—Frames, corner posts or pallet converters, e.g. for facilitating stacking of charged pallets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B23/00—Packaging fragile or shock-sensitive articles other than bottles; Unpacking eggs
    • B65B23/20—Packaging plate glass, tiles, or shingles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Robotics (AREA)
  • Pallets (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2007800273420A 2006-07-21 2007-06-06 板状体的收纳方法及收纳装置 Active CN101489883B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP199418/2006 2006-07-21
JP2006199418 2006-07-21
PCT/JP2007/061489 WO2008010358A1 (fr) 2006-07-21 2007-06-06 Procédé et appareil pour stocker un corps en forme de planche.

Publications (2)

Publication Number Publication Date
CN101489883A CN101489883A (zh) 2009-07-22
CN101489883B true CN101489883B (zh) 2010-11-03

Family

ID=38956693

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800273420A Active CN101489883B (zh) 2006-07-21 2007-06-06 板状体的收纳方法及收纳装置

Country Status (5)

Country Link
JP (1) JP4998805B2 (enExample)
KR (1) KR101364947B1 (enExample)
CN (1) CN101489883B (enExample)
TW (1) TW200808619A (enExample)
WO (1) WO2008010358A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101364947B1 (ko) * 2006-07-21 2014-02-19 아사히 가라스 가부시키가이샤 판상체의 수납 방법 및 수납 장치
CN101654152B (zh) * 2009-05-31 2011-12-21 江苏蓝星玻璃有限公司 Low-E镀膜玻璃异地加工包装方法
JP2011126546A (ja) * 2009-12-15 2011-06-30 Shin-Etsu Chemical Co Ltd ガラス基板搬送用ケースおよびガラス基板搬送用台車
CN101817004A (zh) * 2010-04-12 2010-09-01 中国电子科技集团公司第四十五研究所 一种电池片自动分选装置
TWI429566B (zh) * 2012-01-05 2014-03-11 Mas Automation Corp Automatic Edge Method and Device for Plate - like Material
JP6682224B2 (ja) * 2015-09-30 2020-04-15 ＡｖａｎＳｔｒａｔｅ株式会社 素板ガラス梱包装置、素板ガラスの梱包方法、及び素板ガラス梱包体
CN108789868B (zh) * 2018-06-13 2024-09-24 佛山市南海耀祥玻璃制品有限公司 一种高效的玻璃打孔机
KR102814896B1 (ko) 2025-03-12 2025-05-30 주식회사 지에스아이 기재 인출장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1274326A (zh) * 1997-10-16 2000-11-22 L·S·卡尔皮塞克 带有可倾斜底板的托架基座

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191334A (ja) * 1998-12-25 2000-07-11 Asahi Glass Co Ltd 板ガラスの搬送装置
JP3938645B2 (ja) * 1999-11-16 2007-06-27 セントラル硝子株式会社 ガラス板の移載方法および移載装置
JP2001144166A (ja) * 1999-11-17 2001-05-25 Futaba Corp 基板位置決め装置及び基板ハンドリング方法
JP4297305B2 (ja) * 1999-11-29 2009-07-15 大日本印刷株式会社 基板位置決め装置
JP2002029541A (ja) * 2000-07-21 2002-01-29 Sharp Corp パレットおよびパレットを用いた物品の搬送方法
JP2004338849A (ja) * 2003-05-14 2004-12-02 Olympus Corp 基板位置決め装置
KR100438200B1 (ko) * 2003-11-24 2004-07-02 삼성코닝정밀유리 주식회사 디스플레이용 평판유리 포장 콘테이너 및 포장방법
JP2006019565A (ja) * 2004-07-02 2006-01-19 Dainippon Screen Mfg Co Ltd 熱処理装置
KR101364947B1 (ko) * 2006-07-21 2014-02-19 아사히 가라스 가부시키가이샤 판상체의 수납 방법 및 수납 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1274326A (zh) * 1997-10-16 2000-11-22 L·S·卡尔皮塞克 带有可倾斜底板的托架基座

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2002-29541A 2002.01.29
JP特开2004-338849A 2004.12.02
JP特开2006-19565A 2006.01.19

Also Published As

Publication number Publication date
KR101364947B1 (ko) 2014-02-19
KR20090033322A (ko) 2009-04-02
TWI335293B (enExample) 2011-01-01
JPWO2008010358A1 (ja) 2009-12-17
TW200808619A (en) 2008-02-16
WO2008010358A1 (fr) 2008-01-24
JP4998805B2 (ja) 2012-08-15
CN101489883A (zh) 2009-07-22

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PB01 Publication
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Address after: Tokyo, Japan

Patentee after: AGC Corporation

Address before: Tokyo, Japan

Patentee before: Asahi Glass Co., Ltd.