CN101477945A - 防止/减少基片背面聚合物沉积的方法和装置 - Google Patents
防止/减少基片背面聚合物沉积的方法和装置 Download PDFInfo
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- CN101477945A CN101477945A CNA2008102050917A CN200810205091A CN101477945A CN 101477945 A CN101477945 A CN 101477945A CN A2008102050917 A CNA2008102050917 A CN A2008102050917A CN 200810205091 A CN200810205091 A CN 200810205091A CN 101477945 A CN101477945 A CN 101477945A
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465451A (zh) * | 2013-09-22 | 2015-03-25 | 中微半导体设备(上海)有限公司 | 一种静电吸盘及其供气方法 |
CN104465450A (zh) * | 2013-09-22 | 2015-03-25 | 中微半导体设备(上海)有限公司 | 一种用于冷却静电吸盘的供气装置及供气方法 |
CN109427527A (zh) * | 2017-08-24 | 2019-03-05 | 中微半导体设备(上海)有限公司 | 一种等离子体刻蚀设备及用于该设备的喷头 |
US20190318910A1 (en) * | 2018-04-17 | 2019-10-17 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
CN110364409A (zh) * | 2018-04-09 | 2019-10-22 | Asm知识产权私人控股有限公司 | 衬底支撑设备、包含其的衬底处理设备以及衬底处理方法 |
CN111453695A (zh) * | 2020-06-16 | 2020-07-28 | 中芯集成电路制造(绍兴)有限公司 | 氧化硅层的刻蚀方法、mems器件及其形成方法 |
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2008
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465451A (zh) * | 2013-09-22 | 2015-03-25 | 中微半导体设备(上海)有限公司 | 一种静电吸盘及其供气方法 |
CN104465450A (zh) * | 2013-09-22 | 2015-03-25 | 中微半导体设备(上海)有限公司 | 一种用于冷却静电吸盘的供气装置及供气方法 |
CN104465450B (zh) * | 2013-09-22 | 2017-05-10 | 中微半导体设备(上海)有限公司 | 一种用于冷却静电吸盘的供气装置及供气方法 |
CN104465451B (zh) * | 2013-09-22 | 2017-09-05 | 中微半导体设备(上海)有限公司 | 一种静电吸盘及其供气方法 |
CN109427527A (zh) * | 2017-08-24 | 2019-03-05 | 中微半导体设备(上海)有限公司 | 一种等离子体刻蚀设备及用于该设备的喷头 |
CN109427527B (zh) * | 2017-08-24 | 2021-02-26 | 中微半导体设备(上海)股份有限公司 | 一种等离子体刻蚀设备及用于该设备的喷头 |
CN110364409A (zh) * | 2018-04-09 | 2019-10-22 | Asm知识产权私人控股有限公司 | 衬底支撑设备、包含其的衬底处理设备以及衬底处理方法 |
US20190318910A1 (en) * | 2018-04-17 | 2019-10-17 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
CN110391122A (zh) * | 2018-04-17 | 2019-10-29 | Asm Ip控股有限公司 | 基底加工装置以及基底加工方法 |
CN110391122B (zh) * | 2018-04-17 | 2024-05-28 | Asmip控股有限公司 | 基底加工装置以及基底加工方法 |
CN111453695A (zh) * | 2020-06-16 | 2020-07-28 | 中芯集成电路制造(绍兴)有限公司 | 氧化硅层的刻蚀方法、mems器件及其形成方法 |
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CN101477945B (zh) | 2011-01-19 |
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Denomination of invention: Method and apparatus for preventing/reducing substrate back polymer deposition Effective date of registration: 20150202 Granted publication date: 20110119 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
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Date of cancellation: 20170809 Granted publication date: 20110119 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
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Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |
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