CN101452226A - 无氟化物的光致抗蚀剂剥离剂或残余物移除清洁组合物及用其清洁微电子基板的方法 - Google Patents
无氟化物的光致抗蚀剂剥离剂或残余物移除清洁组合物及用其清洁微电子基板的方法 Download PDFInfo
- Publication number
- CN101452226A CN101452226A CNA2008100959605A CN200810095960A CN101452226A CN 101452226 A CN101452226 A CN 101452226A CN A2008100959605 A CNA2008100959605 A CN A2008100959605A CN 200810095960 A CN200810095960 A CN 200810095960A CN 101452226 A CN101452226 A CN 101452226A
- Authority
- CN
- China
- Prior art keywords
- composition
- alpha
- amine
- conjugate
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 137
- 238000004140 cleaning Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 title claims abstract description 15
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 52
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000003960 organic solvent Substances 0.000 claims abstract description 30
- 238000004377 microelectronic Methods 0.000 claims abstract description 19
- 150000003868 ammonium compounds Chemical class 0.000 claims abstract description 14
- 239000004094 surface-active agent Substances 0.000 claims abstract description 11
- 239000002738 chelating agent Substances 0.000 claims abstract description 10
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 28
- 238000006384 oligomerization reaction Methods 0.000 claims description 27
- 229930091371 Fructose Natural products 0.000 claims description 24
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 claims description 24
- 239000005715 Fructose Substances 0.000 claims description 24
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 239000003513 alkali Substances 0.000 claims description 10
- 150000001455 metallic ions Chemical class 0.000 claims description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 6
- LPQOADBMXVRBNX-UHFFFAOYSA-N ac1ldcw0 Chemical compound Cl.C1CN(C)CCN1C1=C(F)C=C2C(=O)C(C(O)=O)=CN3CCSC1=C32 LPQOADBMXVRBNX-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 239000003344 environmental pollutant Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 231100000719 pollutant Toxicity 0.000 claims description 5
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 229930182830 galactose Natural products 0.000 claims description 4
- 239000008103 glucose Substances 0.000 claims description 4
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-CBPJZXOFSA-N D-Gulose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@H](O)[C@H]1O WQZGKKKJIJFFOK-CBPJZXOFSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-IVMDWMLBSA-N D-allopyranose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@H](O)[C@@H]1O WQZGKKKJIJFFOK-IVMDWMLBSA-N 0.000 claims description 2
- LKDRXBCSQODPBY-JDJSBBGDSA-N D-allulose Chemical compound OCC1(O)OC[C@@H](O)[C@@H](O)[C@H]1O LKDRXBCSQODPBY-JDJSBBGDSA-N 0.000 claims description 2
- HSNZZMHEPUFJNZ-QMTIVRBISA-N D-keto-manno-heptulose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)C(=O)CO HSNZZMHEPUFJNZ-QMTIVRBISA-N 0.000 claims description 2
- HAIWUXASLYEWLM-UHFFFAOYSA-N D-manno-Heptulose Natural products OCC1OC(O)(CO)C(O)C(O)C1O HAIWUXASLYEWLM-UHFFFAOYSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 claims description 2
- HMFHBZSHGGEWLO-SOOFDHNKSA-N D-ribofuranose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@@H]1O HMFHBZSHGGEWLO-SOOFDHNKSA-N 0.000 claims description 2
- ZAQJHHRNXZUBTE-NQXXGFSBSA-N D-ribulose Chemical compound OC[C@@H](O)[C@@H](O)C(=O)CO ZAQJHHRNXZUBTE-NQXXGFSBSA-N 0.000 claims description 2
- ZAQJHHRNXZUBTE-UHFFFAOYSA-N D-threo-2-Pentulose Natural products OCC(O)C(O)C(=O)CO ZAQJHHRNXZUBTE-UHFFFAOYSA-N 0.000 claims description 2
- ZAQJHHRNXZUBTE-WUJLRWPWSA-N D-xylulose Chemical compound OC[C@@H](O)[C@H](O)C(=O)CO ZAQJHHRNXZUBTE-WUJLRWPWSA-N 0.000 claims description 2
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-VSOAQEOCSA-N L-altropyranose Chemical compound OC[C@@H]1OC(O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-VSOAQEOCSA-N 0.000 claims description 2
- HSNZZMHEPUFJNZ-UHFFFAOYSA-N L-galacto-2-Heptulose Natural products OCC(O)C(O)C(O)C(O)C(=O)CO HSNZZMHEPUFJNZ-UHFFFAOYSA-N 0.000 claims description 2
- PYMYPHUHKUWMLA-LMVFSUKVSA-N Ribose Natural products OC[C@@H](O)[C@@H](O)[C@@H](O)C=O PYMYPHUHKUWMLA-LMVFSUKVSA-N 0.000 claims description 2
- HAIWUXASLYEWLM-AZEWMMITSA-N Sedoheptulose Natural products OC[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@](O)(CO)O1 HAIWUXASLYEWLM-AZEWMMITSA-N 0.000 claims description 2
- HMFHBZSHGGEWLO-UHFFFAOYSA-N alpha-D-Furanose-Ribose Natural products OCC1OC(O)C(O)C1O HMFHBZSHGGEWLO-UHFFFAOYSA-N 0.000 claims description 2
- SRBFZHDQGSBBOR-STGXQOJASA-N alpha-D-lyxopyranose Chemical compound O[C@@H]1CO[C@H](O)[C@@H](O)[C@H]1O SRBFZHDQGSBBOR-STGXQOJASA-N 0.000 claims description 2
- SRBFZHDQGSBBOR-LECHCGJUSA-N alpha-D-xylose Chemical compound O[C@@H]1CO[C@H](O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-LECHCGJUSA-N 0.000 claims description 2
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 claims description 2
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 claims description 2
- 150000001720 carbohydrates Chemical class 0.000 claims description 2
- 125000002951 idosyl group Chemical class C1([C@@H](O)[C@H](O)[C@@H](O)[C@H](O1)CO)* 0.000 claims description 2
- BJHIKXHVCXFQLS-PQLUHFTBSA-N keto-D-tagatose Chemical compound OC[C@@H](O)[C@H](O)[C@H](O)C(=O)CO BJHIKXHVCXFQLS-PQLUHFTBSA-N 0.000 claims description 2
- HSNZZMHEPUFJNZ-SHUUEZRQSA-N sedoheptulose Chemical compound OC[C@@H](O)[C@@H](O)[C@@H](O)[C@H](O)C(=O)CO HSNZZMHEPUFJNZ-SHUUEZRQSA-N 0.000 claims description 2
- 229960003487 xylose Drugs 0.000 claims description 2
- 125000000089 arabinosyl group Chemical group C1([C@@H](O)[C@H](O)[C@H](O)CO1)* 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 21
- 230000007797 corrosion Effects 0.000 abstract description 21
- 239000002184 metal Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 238000009472 formulation Methods 0.000 abstract description 3
- 208000029523 Interstitial Lung disease Diseases 0.000 abstract description 2
- 239000012458 free base Substances 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 19
- -1 ribodesose Chemical compound 0.000 description 17
- 239000010949 copper Substances 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 7
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000002280 amphoteric surfactant Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 229960003237 betaine Drugs 0.000 description 5
- RXKJFZQQPQGTFL-UHFFFAOYSA-N dihydroxyacetone Chemical compound OCC(=O)CO RXKJFZQQPQGTFL-UHFFFAOYSA-N 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 235000013905 glycine and its sodium salt Nutrition 0.000 description 4
- 150000002334 glycols Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 239000000908 ammonium hydroxide Substances 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003093 cationic surfactant Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229960002449 glycine Drugs 0.000 description 3
- 239000006210 lotion Substances 0.000 description 3
- 239000002798 polar solvent Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 2
- JZQLRTAGAUZWRH-UHFFFAOYSA-N 2-aminoethanol;hydrate Chemical compound [OH-].[NH3+]CCO JZQLRTAGAUZWRH-UHFFFAOYSA-N 0.000 description 2
- CMJLMPKFQPJDKP-UHFFFAOYSA-N 3-methylthiolane 1,1-dioxide Chemical compound CC1CCS(=O)(=O)C1 CMJLMPKFQPJDKP-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical class CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- ZTHYODDOHIVTJV-UHFFFAOYSA-N Propyl gallate Chemical compound CCCOC(=O)C1=CC(O)=C(O)C(O)=C1 ZTHYODDOHIVTJV-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 229940120503 dihydroxyacetone Drugs 0.000 description 2
- 125000005594 diketone group Chemical group 0.000 description 2
- 229940113088 dimethylacetamide Drugs 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000007046 ethoxylation reaction Methods 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- TZMFJUDUGYTVRY-UHFFFAOYSA-N pentane-2,3-dione Chemical compound CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 description 2
- 229960003330 pentetic acid Drugs 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- KEQUNHIAUQQPAC-OLQVQODUSA-N (2r,5s)-2,5-bis(hydroxymethyl)-1,4-dioxane-2,5-diol Chemical compound OC[C@]1(O)CO[C@@](O)(CO)CO1 KEQUNHIAUQQPAC-OLQVQODUSA-N 0.000 description 1
- ZXKXJHAOUFHNAS-FVGYRXGTSA-N (S)-fenfluramine hydrochloride Chemical compound [Cl-].CC[NH2+][C@@H](C)CC1=CC=CC(C(F)(F)F)=C1 ZXKXJHAOUFHNAS-FVGYRXGTSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 description 1
- JEXYCADTAFPULN-UHFFFAOYSA-N 1-propylsulfonylpropane Chemical compound CCCS(=O)(=O)CCC JEXYCADTAFPULN-UHFFFAOYSA-N 0.000 description 1
- MAEDLSNGVQYGPK-UHFFFAOYSA-N 2,2-diaminoacetic acid Chemical class NC(N)C(O)=O MAEDLSNGVQYGPK-UHFFFAOYSA-N 0.000 description 1
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 1
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 1
- DMQQXDPCRUGSQB-UHFFFAOYSA-N 2-[3-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCN(CC(O)=O)CC(O)=O DMQQXDPCRUGSQB-UHFFFAOYSA-N 0.000 description 1
- WYMDDFRYORANCC-UHFFFAOYSA-N 2-[[3-[bis(carboxymethyl)amino]-2-hydroxypropyl]-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)CN(CC(O)=O)CC(O)=O WYMDDFRYORANCC-UHFFFAOYSA-N 0.000 description 1
- XWSGEVNYFYKXCP-UHFFFAOYSA-N 2-[carboxymethyl(methyl)amino]acetic acid Chemical compound OC(=O)CN(C)CC(O)=O XWSGEVNYFYKXCP-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- SFAMKDPMPDEXGH-UHFFFAOYSA-N 2-hydroxyethyl propanoate Chemical compound CCC(=O)OCCO SFAMKDPMPDEXGH-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- ZFDNAYFXBJPPEB-UHFFFAOYSA-M 2-hydroxyethyl(tripropyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCO ZFDNAYFXBJPPEB-UHFFFAOYSA-M 0.000 description 1
- AIDLAEPHWROGFI-UHFFFAOYSA-N 2-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=C(C(O)=O)C=CC=C1C(O)=O AIDLAEPHWROGFI-UHFFFAOYSA-N 0.000 description 1
- KWYJDIUEHHCHCZ-UHFFFAOYSA-N 3-[2-[bis(2-carboxyethyl)amino]ethyl-(2-carboxyethyl)amino]propanoic acid Chemical compound OC(=O)CCN(CCC(O)=O)CCN(CCC(O)=O)CCC(O)=O KWYJDIUEHHCHCZ-UHFFFAOYSA-N 0.000 description 1
- RPQFOXCKLIALTB-UHFFFAOYSA-M 3-hydroxybutyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC(O)CC[N+](C)(C)C RPQFOXCKLIALTB-UHFFFAOYSA-M 0.000 description 1
- AJEUSSNTTSVFIZ-UHFFFAOYSA-M 3-hydroxypropyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCCO AJEUSSNTTSVFIZ-UHFFFAOYSA-M 0.000 description 1
- UIKUBYKUYUSRSM-UHFFFAOYSA-N 3-morpholinopropylamine Chemical compound NCCCN1CCOCC1 UIKUBYKUYUSRSM-UHFFFAOYSA-N 0.000 description 1
- YZHQBWDNOANICQ-UHFFFAOYSA-M 4-hydroxybutyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCCCO YZHQBWDNOANICQ-UHFFFAOYSA-M 0.000 description 1
- DHMQDGOQFOQNFH-UHFFFAOYSA-M Aminoacetate Chemical compound NCC([O-])=O DHMQDGOQFOQNFH-UHFFFAOYSA-M 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BYRJNWIHXADTSH-UHFFFAOYSA-N C(CCCCCCCCCCC)C(C(=O)O)CNCCC(=O)O Chemical class C(CCCCCCCCCCC)C(C(=O)O)CNCCC(=O)O BYRJNWIHXADTSH-UHFFFAOYSA-N 0.000 description 1
- BTKLMGGKCQZDNC-UHFFFAOYSA-N CC(C)CCCCCCC[O] Chemical compound CC(C)CCCCCCC[O] BTKLMGGKCQZDNC-UHFFFAOYSA-N 0.000 description 1
- JGLMVXWAHNTPRF-CMDGGOBGSA-N CCN1N=C(C)C=C1C(=O)NC1=NC2=CC(=CC(OC)=C2N1C\C=C\CN1C(NC(=O)C2=CC(C)=NN2CC)=NC2=CC(=CC(OCCCN3CCOCC3)=C12)C(N)=O)C(N)=O Chemical compound CCN1N=C(C)C=C1C(=O)NC1=NC2=CC(=CC(OC)=C2N1C\C=C\CN1C(NC(=O)C2=CC(C)=NN2CC)=NC2=CC(=CC(OCCCN3CCOCC3)=C12)C(N)=O)C(N)=O JGLMVXWAHNTPRF-CMDGGOBGSA-N 0.000 description 1
- 235000012469 Cleome gynandra Nutrition 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-L L-tartrate(2-) Chemical compound [O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O FEWJPZIEWOKRBE-JCYAYHJZSA-L 0.000 description 1
- BZORFPDSXLZWJF-UHFFFAOYSA-N N,N-dimethyl-1,4-phenylenediamine Chemical compound CN(C)C1=CC=C(N)C=C1 BZORFPDSXLZWJF-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 125000006177 alkyl benzyl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000005211 alkyl trimethyl ammonium group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- PYMYPHUHKUWMLA-WDCZJNDASA-N arabinose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)C=O PYMYPHUHKUWMLA-WDCZJNDASA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- KFJNCGCKGILQMF-UHFFFAOYSA-M dibutyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](C)(C)CCCC KFJNCGCKGILQMF-UHFFFAOYSA-M 0.000 description 1
- VILAVOFMIJHSJA-UHFFFAOYSA-N dicarbon monoxide Chemical compound [C]=C=O VILAVOFMIJHSJA-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- JQDCIBMGKCMHQV-UHFFFAOYSA-M diethyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)CC JQDCIBMGKCMHQV-UHFFFAOYSA-M 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- PCHPORCSPXIHLZ-UHFFFAOYSA-N diphenhydramine hydrochloride Chemical compound [Cl-].C=1C=CC=CC=1C(OCC[NH+](C)C)C1=CC=CC=C1 PCHPORCSPXIHLZ-UHFFFAOYSA-N 0.000 description 1
- 150000002016 disaccharides Chemical class 0.000 description 1
- GEGKMYLSPGGTQM-UHFFFAOYSA-L disodium;3-[2-(2-carboxylatoethoxy)ethyl-[2-(octanoylamino)ethyl]amino]propanoate Chemical compound [Na+].[Na+].CCCCCCCC(=O)NCCN(CCC([O-])=O)CCOCCC([O-])=O GEGKMYLSPGGTQM-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002169 ethanolamines Chemical class 0.000 description 1
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 1
- IIAPBJPXNIYANW-UHFFFAOYSA-M ethyl-(2-hydroxyethyl)-dimethylazanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)CCO IIAPBJPXNIYANW-UHFFFAOYSA-M 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical group 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KTDMLSMSWDJKGA-UHFFFAOYSA-M methyl(tripropyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](C)(CCC)CCC KTDMLSMSWDJKGA-UHFFFAOYSA-M 0.000 description 1
- HIQXJRBKNONWAH-UHFFFAOYSA-N methylidenephosphane Chemical compound P=C HIQXJRBKNONWAH-UHFFFAOYSA-N 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000005935 nucleophilic addition reaction Methods 0.000 description 1
- 125000002801 octanoyl group Chemical group C(CCCCCCC)(=O)* 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- WTSXICLFTPPDTL-UHFFFAOYSA-N pentane-1,3-diamine Chemical compound CCC(N)CCN WTSXICLFTPPDTL-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- UBYZGUWQNIEQMH-SBBOJQDXSA-M potassium;(2s,3s,4s,5r)-2,3,4,5,6-pentahydroxy-6-oxohexanoate Chemical compound [K+].OC(=O)[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O UBYZGUWQNIEQMH-SBBOJQDXSA-M 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 235000010388 propyl gallate Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 238000003419 tautomerization reaction Methods 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- HPWUYZIJILJHNG-UHFFFAOYSA-M tributyl(2-hydroxyethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](CCO)(CCCC)CCCC HPWUYZIJILJHNG-UHFFFAOYSA-M 0.000 description 1
- FYFNFZLMMGXBMT-UHFFFAOYSA-M tributyl(ethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](CC)(CCCC)CCCC FYFNFZLMMGXBMT-UHFFFAOYSA-M 0.000 description 1
- QVOFCQBZXGLNAA-UHFFFAOYSA-M tributyl(methyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](C)(CCCC)CCCC QVOFCQBZXGLNAA-UHFFFAOYSA-M 0.000 description 1
- GRNRCQKEBXQLAA-UHFFFAOYSA-M triethyl(2-hydroxyethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CCO GRNRCQKEBXQLAA-UHFFFAOYSA-M 0.000 description 1
- JAJRRCSBKZOLPA-UHFFFAOYSA-M triethyl(methyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(CC)CC JAJRRCSBKZOLPA-UHFFFAOYSA-M 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 1
- 239000000811 xylitol Substances 0.000 description 1
- 235000010447 xylitol Nutrition 0.000 description 1
- 229960002675 xylitol Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/62—Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3723—Polyamines or polyalkyleneimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/329—Carbohydrate or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
- C23G1/061—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors nitrogen-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
本发明涉及无氟化物的光致抗蚀剂剥离剂或残余物移除清洁组合物及用其清洁微电子基板的方法。无氟的有机溶剂基的微电子清洁制剂,其包括:(a)至少一种“黄色”或“褐色”的α-羟基羰基共轭物,其是α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,(b)至少一种游离胺,和(c)至少一种有机溶剂或者至少一种有机溶剂和水。该制剂还可以包含其它任选的成分,包括(d)至少一种无金属离子的碱,其量足以使最终组合物的pH为7或更高,优选pH为约9.5至约10.8,和一种或多种(e)多羟基醇,(f)金属螯合剂,和(g)表面活性剂。该组合物用于清洁微电子设备,而没有任何明显的金属腐蚀,且与ILDs兼容。
Description
技术领域
本发明涉及用于从微电子设备移除光致抗蚀剂、污染物、或等离子体(plasma)或蚀刻残余物的组合物,该组合物提供了良好的铜腐蚀抑制或抵抗,同时保持了清洁效果。特别地,本发明提供了有机溶剂基或半水基的,不含氟化物的清洁组合物,在该组合物中含有α-羟基羰基化合物的寡聚或多聚共轭物材料(conjugate material),尤其是α-羟基羰基化合物的“褐色”或“黄色”寡聚或多聚共轭物材料,其尤其是单糖的“褐色”或“黄色”寡聚或多聚共轭物材料。本发明还提供了使用这些组合物清洁微电子基板和设备的方法。
背景技术
通过下述步骤生产半导体设备:用光致抗蚀剂涂布无机基板;通过曝光形成光致抗蚀剂薄膜且随后显影;用形成的光致抗蚀剂薄膜作为掩膜蚀刻无机基板的暴露区域,以形成精细电路;和从无机基板上去除形成的光致抗蚀剂薄膜。或者,以与上述相同的方法形成精细电路后,将形成的光致抗蚀剂薄膜灰化,且然后从无机基板上去除残留的抵抗性残余物(resist residue)。
已经提出了许多碱性基的清洁组合物,用于从这些微电子设备清洁光致抗蚀剂和残余物。然而,在清洁这些微电子设备时遇到一个明显的问题,清洁组合物有腐蚀这些微电子设备中的金属的特性,尤其是铜。然而,至少部分由于碱性剥离剂与金属的反应,已经观察到现有可用的剥离溶液,通常是碱性剥离溶液,产生各种金属腐蚀,如腐蚀触须线(corrosion whiskers)、电偶腐蚀、点蚀、金属线的切蚀(notching)。
用于避免该腐蚀问题的现有方法是使用含非碱性的有机溶剂(如异丙醇)的中间洗液(intermediate rinse)。然而,这些方法是昂贵的且具有不希望的安全、化学卫生和环境的后果。
在US专利6,465,403中公开了用于在微电子工业中通过移除光致抗蚀剂残余物和其它不希望的污染物剥离或清洁半导体晶片基板的水性碱性组合物。水性组合物一般包括(a)一种或多种无金属离子的碱,其量足以使pH约为10-13;(b)约0.01%至约5%重量(表示为%SiO2)的水溶性无金属离子的硅酸盐;(c)约0.01%至约10%重量的一种或多种金属螯合剂;和(d)任选其它成分。
然而,没有一种现有技术中公开的组合物有效地去除有典型的蚀刻过程后留下的所有有机污染和含金属的残余物。使用这些制剂尤其难以去除含硅的残余物。因此,需要通过从这些基板去除无机和有机污染物清洁半导体晶片基板而不损伤集成电路的剥离组合物。这些组合物一定不能腐蚀部分包括集成电路的金属且应该避免高费用和由中间洗液引起的不良后果。因此,对于清洁剂需要:
(1)基本上与半导体设备中所用的所有金属(Al、Cu、Mo等)相容;
(2)要求不需要中间洗液;
(3)有效清洁富含Si的残余物;
(4)对ILDs基本上不产生损坏。
发明内容
根据本发明,提供了有机溶剂基或半水性基的无氟化物的微电子清洁组合物或制剂,其包括(a)至少一种“褐色”或“黄色”α-羟基羰基共轭物,其是α-羟基羰基化合物与胺或氨化合物的寡聚或多聚共轭物(oligomeric orpolymeric conjugate),(b)至少一种胺,和(c)至少一种有机溶剂或者至少一种有机溶剂和水。所述α-羟基羰基化合物是通式为R1CH(OH)COR2的化合物,其中R1和R2独立地选自H、脂肪族基团或环状基团,所述脂肪族基团或环状基团可含有一个或多个取代基。这些取代基包括,但不限于,选自下述的基团:芳香族基团、杂芳香族基团、羟基(-OH)、醚基(-C-O-C)、酰胺基(-C(O)NH)、亚砜基团(-C-S(O)-C)、胺(-NR3R4)和酮基(-C(O)),其中R3和R4为H或1-10个碳原子的烷基。在通式为R1CH(OH)COR2的α-羟基羰基化合物中,R1和R2优选选自H、CH3和(CH2)nCH3,其中n为0-20的整数,优选为1-10,且更优选为1-6。一些合适的α-羟基羰基化合物的实例包括,但不限于,1-羟基-2-丙酮(CH3COCH2OH)CAS#119-09-6、1,3-二羟基丙酮(HOCH2COCH2OH)CAS#62147-49-3,和符合上述通式的单糖,所述单糖尤其包括葡萄糖、果糖或半乳糖。胺和α-羟基羰基化合物的反应已知首先通过使胺在羰基碳上亲核加成,然后通过Maillard反应(Yaylayan,V.A.;Harty-Magors,S.;Ismail,A.A.;J.Agric.Food Chem.1999,47,2335-2340)进行。所述Maillard反应实际上是一系列复杂的反应,其详细描述参见Dills,W.L.;Am.J.Clin.Nutr.1993,58,779S-787S。
所述组合物的pH可以是从酸性至碱性pH的任何合适的pH。在本发明组合物的一个实施方案中,所述组合物还可以包含(d)至少一种无金属离子的碱,其量足以使最终组合物的pH为7或更高,优选pH为约9.5至约10.8。本发明的组合物还可以包括一种或多种(e)多羟基醇和(f)金属螯合剂,和(g)表面活性剂。在本发明的组合物中所用的褐色或黄色α-羟基羰基化合物的寡聚或多聚共轭物是那些在约300至330nm处有吸收峰且所述吸收峰开始于约500至800nm波长的寡聚或多聚共轭物。将理解所述术语“黄色”和“褐色”包括褐色和黄色的组合的色彩的颜色和色调,如亮和暗橙色。这些褐色或黄色寡聚或多聚共轭物可以通过已知的“Maillard反应”形成,L.C.Maillard,Compt.Rend.154,66(1912);Ann.Chim.9,5,258(1916)。在本发明的组合物中使用的黄色共轭物为α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,其可在相同的Maillard反应中,一般在较低温度或较短反应时间中形成,且甚至可以通过将反应物放在一起在室温下经过合适的时间形成。本发明的组合物中所用的褐色共轭物为α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,其在300至330nm处有吸收峰且所述吸收峰起始于约600至800nm,而作为反应产物的α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物的“黄色”共轭物具有300至330nm的吸收峰,然而所述吸收峰起始于约500至580nm。首先形成共轭物,然后将其加入到本发明的组合物中,或者可将它们加热至如70℃或更高,以足够的时间以导致α-羟基羰基化合物与胺或铵化合物形成寡聚物的Maillard型反应发生。
在一定温度下使本发明的清洁组合物与半导体设备接触一段时间,以足以从基板表面清洁不需要的污染物和/或残余物。本发明的组合物提供了加强的腐蚀抵抗,尤其是铜腐蚀抵抗,且提高了清洁效果。
具体实施方式
本发明的清洁组合物包含有机溶剂基或半水基的不含氟化物的清洁制剂,其包括(a)至少一种“褐色”或“黄色”的α-羟基羰基共轭物,其是α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,和(b)至少一种胺,和(c)至少一种有机溶剂或者至少一种有机溶剂和水。该制剂还可以包含其它任选的成分,包括,但不限于,(d)至少一种无金属离子的碱,其量足以使最终组合物的pH为7或更高,当需要碱性清洁组合物时优选pH为约9.5至约10.8,和一种或多种(e)多羟基醇,和(f)金属螯合剂,和(g)表面活性剂。
在本发明的组合物中所用的“褐色”和“黄色”α-羟基羰基共轭物是那些α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,且其具有约300至330nm的吸收峰,所述吸收峰起始于约500至800nm。根据已知的方法,如上面提到的“Maillard反应”制备这些褐色和黄色的寡聚或多聚共轭物。然而,可以使用任何合适的方法得到“褐色”α-羟基羰基共轭物。而且,这些“褐色”α-羟基羰基共轭物可以以例如深色糖浆(dark molasses)形式使用。α-羟基羰基化合物与胺或含氨化合物的反应可以以下述比例进行,α-羟基羰基化合物与胺或氨化合物的化学计量比例为约1:1至约16:1,基于1mol的α-羟基羰基化合物与1mol的胺或氨化合物反应。然而,优选比例为1:1,因为较少的胺或氨化合物与α-羟基羰基化合物反应导致反应产物的铜腐蚀抑制能力的减少。虽然反应可以在很宽范围的时间和温度范围进行,但优选该反应在室温下进行几小时、一天或更长,或者优选将α-羟基羰基化合物与胺或氨化合物在约70℃或更高下加热约15分钟或更长,如3小时或更长进行反应。可以使用任何合适的时间和温度,只要所得的寡聚或多聚共轭物反应产物为“褐色”或“黄色”产物,即具有约300至330nm的吸收峰且所述峰开始于约500至800nm。通常,在本发明所用的褐色和黄色α-羟基羰基共轭物优选特征为具有约0.5eV或更低的低带隙(bandgap)。
任何合适的α-羟基羰基化合物与胺或氨化合物的反应可以得到褐色或黄色的α-羟基羰基共轭物。适合的α-羟基羰基化合物包括,但不限于,1-羟基-2-丙酮,CH3COCH2OH和1,3-二羟基丙酮,HOCH2COCH2OH,以及所有单糖,其包括阿拉伯糖、来苏糖、核糖、脱氧核糖、木糖、核酮糖、木酮糖、阿洛糖、阿卓糖、半乳糖、葡萄糖、古洛糖、艾杜糖、甘露糖、果糖、阿洛酮糖、山梨糖、塔格糖、甘露庚酮糖、景天庚酮糖、辛酮糖、2-酮-3-去氧-甘露-辛酮酸(octonate)和唾液糖(sialose)。尤其优选的是果糖。二糖不能用于本发明。
任何合适的胺或含有氨的化合物可以与本发明的α-羟基羰基化合物反应以产生褐色或黄色的α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物。其中,合适的胺为胺、二胺、三胺、烷醇胺、氨基酸,尤其是伯胺和仲胺、和烷醇胺。尤其适用的是通式为NH2(CH2)nOH的烷醇胺,其中n为1至约10的整数,优选为1至约4,且尤其为2。氨(ammonia)是如上述胺一样是适合的胺。适合的胺化合物包括,但不限于,单乙醇胺、二乙醇胺、三乙醇胺、单异丙醇胺、二亚乙基三胺、氨基乙酸。尤其优选的是单乙醇胺。从果糖与单乙醇胺的反应得到优选的褐色α-羟基羰基化合物。
该组合物还可含有至少一种胺成分。所述胺成分可以是形成α-羟基羰基化合物的褐色或黄色寡聚或多聚共轭物反应产物中的剩余的过量游离胺,或是除了α-羟基羰基化合物的褐色或黄色寡聚或多聚共轭物以外加入到组合物中的胺。其中适合的胺为胺、二胺、三胺、烷醇胺、尤其是伯胺和仲胺的氨基酸和烷醇胺。尤其适用的是通式为NH2(CH2)nOH的烷醇胺,其中n为1至约10的整数,优选为1至约4,且尤其为2。氨如上述胺一样是适合的胺。适合的胺化合物包括,但不限于,单乙醇胺、二乙醇胺、三乙醇胺、单异丙醇胺、二亚乙基三胺、氨基乙酸。尤其优选的是单乙醇胺。
本发明的制剂可以为有机溶剂基或者有机溶剂加水基。即,所述制剂可含有至少一种极性、可与水混溶的有机溶剂。在该制剂中可以使用任何合适的极性、可与水混溶的有机溶剂。这些极性、可与水混溶的有机溶剂包括,但不限于酰胺、砜、亚砜、饱和醇、乙二醇醚(glycol ethers)等。这些有机极性溶剂包括,但不限于,下述有机极性溶剂,如环丁砜(四氢噻吩-1,1-二氧化物)、3-甲基环丁砜、正丙基砜、二甲基亚砜(DMSO)、甲基砜、正丁基砜、3-甲基环丁砜,酰胺如1-(2-羟基乙基)-2-吡咯烷酮(HEP)、二甲基哌啶酮(DMPD)、N-甲基-2-吡咯烷酮(NMP)、二甲基乙酰胺(DMAc)、和二甲基甲酰胺(DMF)、烷撑二醇(alkylene glycol)单和二烷基醚类,如乙二醇单乙基醚(Carbitol)及其混合物。尤其优选的有机极性溶剂为N-甲基吡咯烷酮、环丁砜、乙二醇单乙基醚、DMSO及其混合物。所述有机溶剂为可与水混溶的有机溶剂且含量通常为约35至约98wt%,优选为约40至约90wt%,且更优选为约45至约85wt%。除至少一种有机溶剂外,在该组合物中还可任选含有水。如果在本发明的组合物中水与有机溶剂一起存在,则水的含量通常为约大于0至约20wt%,优选为约3至约15wt%,且更优选为约5至约10wt%。
在本发明的清洁组合物中一般含有“褐色”或“黄色”的寡聚或多聚α-羟基羰基化合物,其含量为约0.1至约20wt%,优选为约1至约10wt%,且更优选约3至约7wt%。在该组合物中含有的胺的含量为约1%至约15wt%,优选为约3%至约12wt%,且更优选为约5至约10wt%。所述有机溶剂为可与水混溶的有机溶剂,且一般其含量为约35至约98wt%,优选为约40至约90wt%,且更优选为约45至约85wt%。如果在本发明的组合物中水与有机溶剂一起存在,则水的含量为约大于0至约20wt%,优选为约3至约15wt%,且更优选为约5至约10wt%。所有的百分比都是基于清洁组合物的总重量。
清洁组合物的pH将为碱性或酸性,但是优选将为7或更高,优选为约pH7至约10.8,更优选为约9.5至约10.8。视需要,在清洁组合物中任选加入无金属离子的碱以调节组合物的pH。可以使用任何适合的无金属离子的碱。其中,在清洁组合物中使用的适合的无金属离子的碱可以是季铵氢氧化物,如四烷基氢氧化铵(包括含有羟基和烷氧基的烷基,一般在烷基或烷氧基中含有1至4个碳原子)。最优选的这些碱性物质是四甲基氢氧化铵和三甲基-2-羟基乙基氢氧化铵(胆碱)。其它可用的季铵氢氧化物的实例包括:三甲基-3-羟基丙基氢氧化铵、三甲基-3-羟基丁基氢氧化铵、三甲基-4-羟基丁基氢氧化铵、三乙基-2-羟基乙基氢氧化铵、三丙基-2-羟基乙基氢氧化铵、三丁基-2-羟基乙基氢氧化铵、二甲基乙基-2-羟基乙基氢氧化铵、二甲基二(2-羟基乙基)氢氧化铵、单甲基三(2-羟基乙基)氢氧化铵、四乙基氢氧化铵、四丙基氢氧化铵、四丁基氢氧化铵、单甲基-三乙基氢氧化铵、单甲基三丙基氢氧化铵、单甲基三丁基氢氧化铵、单乙基三甲基氢氧化铵、单乙基三丁基氢氧化铵、二甲基二乙基氢氧化铵、二甲基二丁基氢氧化铵等和其混合物。其它可在本发明中起作用的碱包括氢氧化铵、有机胺尤其为烷醇胺如2-氨基乙醇、1-氨基-2-丙醇、1-氨基-3-丙醇、2-(2-氨基乙氧基)乙醇、2-(2-氨基乙基氨基)乙醇、2-(2-氨基乙基氨基)乙基胺等,和其它强有机碱,如胍、1,3-戊二胺、4-氨基甲基-1,8-辛二胺、氨基乙基哌嗪、4-(3-氨基丙基)吗啉、1,2-二氨基环己烷、三(2-氨基乙基)胺、2-甲基-1,5-戊二胺和羟基胺。在组合物中使用的碱的量为使组合物得到所需pH的量,且一般为约0至约15wt%,优选为约0.5至约5wt%,且更优选为约1至约2wt%。
本发明的制剂还可以任选含有任何合适的多羟基醇成分。这些合适的多羟基醇包括,但不限于,山梨醇、木糖醇、甘油、乙二醇、丁-1,4-二醇。优选地,所用的多羟基醇优选为D-山梨醇。如果存在,在组合物中的多羟基醇的量可以为约大于0至约10wt%的范围,优选为约大于0至约7wt%,且更优选为约大于0至约5wt%。
本发明的制剂还可以包含对清洁组合物的效果无害的任选成分,例如表面活性剂。本发明的组合物还可以包含任何适合的水溶性两性的、非离子的、阳离子的或阴离子的表面活性剂。加入表面活性剂将降低制剂的表面张力并改善待被清洁的表面的润湿度,且因此改善组合物的清洁作用。在本发明组合物中使用的两性表面活性剂包括:甜菜碱和磺基甜菜碱(sulfobetaines),如烷基甜菜碱、酰氨基烷基甜菜碱、烷基磺基甜菜碱和酰氨基烷基磺基甜菜碱;氨基羧酸衍生物,如两性甘氨酸盐(amphoglycinates)、两性丙酸盐(amphopropionates)、两性二氨基乙酸盐(amphodiglycinates)、和两性二丙酸盐(amphodipropionates);亚氨基二酸,如烷氧基烷基亚氨基二酸;胺氧化物,如烷基胺氧化物和烷酰胺烷基胺氧化物;氟烷基磺酸酯和氟化的烷基两性表面活性剂;及其混合物。优选地,所述两性表面活性剂为椰油酰氨基丙基(cocoamidopropyl)甜菜碱、椰油酰氨基丙基二甲基甜菜碱、椰油酰氨基丙基羟基磺基甜菜碱(sultaine)、辛酰基两性二丙酸盐(capryloamphodipropionate)、椰油酰氨基二丙酸盐、椰油两性丙酸盐、椰油两性羟基乙基丙酸盐、异癸基氧基丙基亚氨基二丙酸、月桂基亚氨基二丙酸盐、椰油酰氨基丙基胺氧化物和椰油胺氧化物,以及氟化的烷基两性表面活性剂。本发明组合物中使用的非离子型表面活性剂包括炔二醇、乙氧基化的炔二醇、氟化的烷基烷氧化物、氟化的烷基酯、氟化的聚氧乙烯烷醇、多羟基醇的脂肪酸酯、聚氧乙烯单烷基醚、聚氧乙烯二醇、硅氧烷型表面活性剂、和烷撑二醇单烷基醚。优选地,非离子型表面活性剂为炔二醇或乙氧基化的炔二醇。本发明组合物中所用的阴离子表面活性剂包括羧酸化物(carboxylate)、N-酰基肌氨酸盐、磺酸盐、硫酸盐、和正磷酸的单或二酯,如磷酸癸酯。优选地,阴离子表面活性剂为无金属的表面活性剂。本发明的组合物中的阳离子表面活性剂包括胺的乙氧基化物、二烷基二甲基铵盐、二烷基吗啉鎓盐、烷基苄基二甲基铵盐、烷基三甲基铵盐、和烷基吡啶鎓盐。优选地,阳离子表面活性剂为无卤素的表面活性剂。如果在本发明中使用表面活性剂,则这些表面活性剂的量一般为约大于0至约1wt%,优选为约0.05至约0.2wt%。
本发明的制剂还可以用一种或多种适合的金属螯合剂配制,以增加制剂将金属保留在溶液中的能力并提高对晶片基板上金属残余物的溶解度。一般为此目的使用的金属螯合剂的实例为下述的有机酸和它们的异构体和盐:乙二胺四乙酸(EDTA)、丁二胺四乙酸、环己烷-1,2-二胺四乙酸(CyDTA)、二亚乙基三胺五乙酸(DETPA)、乙二胺四丙酸、(羟基乙基)乙二胺三乙酸(HEDTA)、N,N,N’,N’-乙二胺四(亚甲基膦)酸(EDTMP)、三亚乙基四胺六乙酸(TTHA)、1,3-二氨基-2-羟基丙烷-N,N,N’,N’-四乙酸(DHPTA)、甲基亚氨基二乙酸、丙二胺四乙酸、氨基三乙酸(NTA)、柠檬酸、酒石酸、葡萄糖酸、葡糖二酸、甘油酸、草酸、邻苯二甲酸、马来酸、扁桃酸、丙二酸、乳酸、水杨酸、儿茶酚、没食子酸、没食子酸丙酯、连苯三酚、8-羟基喹啉、和半胱氨酸。优选的金属螯合剂为氨基羧酸,如环己烷-1,2-二胺四乙酸(CyDTA)。在制剂中可以存在至少一种金属螯合剂,其含量为约大于0至约1wt%,优选地含量为约0.05至约0.2wt%。
本发明的清洁组合物用于从微电子设备上清洁光致抗蚀剂或等离子体或蚀刻残余物,其是通过在适合温度下将微电子设备与本发明的清洁组合物接触适合的时间以从微电子设备上除去光致抗蚀剂或等离子体或蚀刻残余物。
本发明通过,但不限于下述示例性实施例来说明。
下述为在本发明组合物中使用的“褐色”或“黄色”α-羟基羰基共轭的寡聚物或多聚物的实例。
褐色成分1:100g的50:50wt的果糖与水的混合物与50g单乙醇胺在70℃温度下反应约3小时。
褐色成分2:100g的50:50wt的果糖与水的混合物与16g单乙醇胺在70℃温度下反应约3小时。
褐色成分3:100g的50:50wt的果糖与水的混合物与5g单乙醇胺在70℃温度下反应约3小时。
褐色成分4:100g的50:50wt的果糖与水的混合物与1g单乙醇胺在70℃温度下反应约3小时。
褐色成分5:50g果糖溶于10g水中,将混合物加热至80℃且然后加入20.8g单异丙醇胺,该溶液自身放热且在沸腾作用下释放水。
褐色成分6:50g果糖溶于10g水中,将混合物加热至80℃且然后加入29.2g二乙醇胺,该溶液自身放热且在沸腾作用下释放水。
褐色成分7:50g果糖溶于10g水中,将混合物加热至80℃且然后加入41.9g三乙醇胺,该溶液自身放热且在沸腾作用下释放水。
褐色成分8:50g果糖溶于10g水中,将混合物加热至80℃且然后加入26.5g二亚乙基三胺,该溶液自身放热且在沸腾作用下释放水。
褐色成分9:50g果糖溶于10g水中,将混合物加热至80℃且然后加入20.8g氨基乙酸(甘氨酸),该溶液自身放热且在沸腾作用下释放水。
褐色成分10:50g葡萄糖溶于10g水中,将混合物加热至80℃且然后加入17.0g单乙醇胺,该溶液自身放热且在沸腾作用下释放水。
褐色成分11:50g半乳糖溶于10g水中,将混合物加热至80℃且然后加入20.8g单乙醇胺,该溶液自身放热且在沸腾作用下释放水。
褐色成分12:50g的50:50的1-羟基-2-丙酮和水的混合物与8g单乙醇胺在70℃下反应约1小时。
褐色成分13:50g的50:50的二羟基丙酮和水的混合物与8g单乙醇胺在70℃下反应约1小时。
黄色成分14:100g的50:50wt的果糖和水的混合物与16g单乙醇胺在70℃下反应3小时,然后在室温下(约20℃)保持过夜。
黄色成分15:100g的50:50wt的果糖和水的混合物与50g单乙醇胺在70℃下反应过夜,然后在室温下(约20℃)保持1周。
表1中的组合物A至T中进一步列出了那些本发明的寡聚物成分。那些组合物的寡聚成分各自通过在清洁组合物中的成分中的果糖与单乙醇胺原位反应制备,且加热已经加热至70℃的清洁组合物15分钟以形成共轭物。
本发明的组合物和对比组合物的铜腐蚀抑制以下述方式列出。将铜面晶片置于约70℃含有检测组合物的150ml烧杯中。以200rpm搅拌组合物15分钟,Cu面不与搅拌棒接触。
所述组合物和检测结果见于表1。
表1
表1(续)
表1(续)
检测一些化合物以证明在与胺反应中的α-羟基羰基化合物对提供足够的铜腐蚀抑制的必要性。检测不同类型的羰基化合物,酮(丙酮,H3CCOCH3)、二酮(2,3-戊二酮,H3CCOCOCH2CH3)、醛(甲醛,HCOH)和两种不同的α-羟基羰基化合物(1-羟基-2-丙酮,CH3COCH2OH和1,3-二羟基丙酮,HOCH2COCH2OH)。从表2中可以看出当用于与单乙醇胺接合(conjuction)时,丙酮和甲醛都没有益处。相反,当使用α-羟基羰基化合物,1-羟基-2-丙酮和1,3-二羟基丙酮时,对Cu的腐蚀速率相当于单乙醇胺对Cu腐蚀速率的1/20。可以看出,通过使用二酮、2,3-戊二酮,可以得到明显的腐蚀抑制。通过有机化学中公知的酮-烯醇互变异构现象可以合理解释,该现象提供了α-羟基羰基化合物的一定的化学平衡浓度(Jones,M;Organic Chemistry 1997,W.W.Norton & Company,Inc.,500 Fifth Avenue,New York,N.Y.10110)。清楚表明α-羟基羰基化合物必要性的其它数据是关于4-羟基-4-甲基-2-戊酮、β-羟基羰基化合物的结果。该化合物在铜的相容性(compatibility)中没有表现出改善,这强有力地说明需要α-羟基羰基化合物。对于所检测的组合物在70℃下,在DMSO、NMP或其混合物中的铜腐蚀速率()见于表2。所有组合物使用单乙醇胺作为胺与所列出的化合物在70℃下反应约3小时。
表2
本发明的组合物提供了从微电子设备中清洁光致抗蚀剂或等离子体或蚀刻残余物,其与已知的含氟化物的微电子清洁组合物相似,但是没有在使用那些已知的含氟化合物的清洁组合物中遇到的明显的铜腐蚀。本发明的优选的清洁组合物含有果糖与单乙醇胺的寡聚物、游离单乙醇胺、N-甲基吡咯烷酮、水、山梨醇和卡必醇的组合物,如表1中的组合物M。
而本文通过引用具体的实施方式描述了本发明,应该理解为在不背离本文中公开的发明概念的精神和范围内,可以进行改变、变更和变化。因此,本发明包括落入所附权利要求的精神和范围内的所有改变、变更和变化。
Claims (23)
1.无氟化物的微电子清洁组合物,其包括:(a)至少一种“褐色”或“黄色”的α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,(b)至少一种胺,和(c)至少一种有机的可与水混溶的有机溶剂或者至少一种可与水混溶的有机溶剂和水。
2.权利要求1的组合物,其中所述α-羟基羰基化合物是通式为R1CH(OH)COR2的化合物,其中R1和R2独立地选自脂肪族基团和环状基团。
3.权利要求2的组合物,其中所述α-羟基羰基化合物是通式为R1CH(OH)COR2的化合物,其中R1和R2选自H、CH3和(CH2)nCH3,其中n为0至20的整数,且α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物在约300至330nm处有吸收峰,且所述吸收峰开始于约500至800nm。
4.权利要求3的组合物,其中所述α-羟基羰基化合物为单糖,所述单糖选自阿拉伯糖、来苏糖、核糖、脱氧核糖、木糖、核酮糖、木酮糖、阿洛糖、阿卓糖、半乳糖、葡萄糖、古洛糖、艾杜糖、甘露糖、果糖、阿洛酮糖、山梨糖、塔格糖、甘露庚酮糖、景天庚酮糖、辛酮糖、2-酮-3-去氧-甘露-辛酮酸和唾液糖。
5.权利要求1的组合物,其中所述α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物为果糖和单乙醇胺的共轭物。
6.权利要求5的组合物,其中所述果糖和单乙醇胺的寡聚或多聚共轭物在约300至330nm处有吸收峰,且所述吸收峰开始于约500至800nm。
7.权利要求6的组合物,其中所述共轭物通过将果糖和单乙醇胺在至少70℃的温度下一起加热至少3小时而制备。
8.权利要求7的组合物,其中所述组合物还包括多羟基醇。
9.权利要求8的组合物,其中所述多羟基醇为山梨醇。
10.权利要求1的组合物,其中所述组合物的pH为约7至约10.8。
11.权利要求1的组合物,其包括0.1至约20wt%的寡聚或多聚共轭物成分,约1至约15wt%的胺成分,和约35至约98wt%的有机溶剂或有机溶剂和水。
12.权利要求1的组合物,其还包括一种或多种成分,所述成分选自表面活性剂、无金属离子的碱、极性可与水混溶的有机溶剂、多羟基醇和金属螯合剂。
13.权利要求5的组合物,其还包括一种或多种成分,所述成分选自表面活性剂、无金属离子的碱、多羟基醇和金属螯合剂。
14.权利要求1的组合物,其包括果糖和单乙醇胺寡聚物、游离单乙醇胺、N-甲基吡咯烷酮、水、山梨醇和卡必醇。
15.权利要求1的组合物,其中所述共轭物具有约0.5eV或更低的带隙。
16.权利要求5的组合物,其中所述褐色的共轭物具有约0.5eV或更低的带隙。
17.从微电子基板清洁光致抗蚀剂、污染物或者蚀刻或灰化残余物的方法,该方法包括在一定温度下将微电子基板与清洁组合物接触一段时间以移除光致抗蚀剂、污染物或者蚀刻或灰化残余物,其中所述清洁组合物是无氟化物的微电子清洁组合物,该组合物包括:(a)至少一种“褐色”或“黄色”的α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物,(b)至少一种胺,和(c)至少一种有机的可与水混溶的有机溶剂或者至少一种可与水混溶的有机溶剂和水。
18.权利要求17的方法,其中所述α-羟基羰基化合物是通式为R1CH(OH)COR2的化合物,其中R1和R2独立地选自脂肪族基团和环状基团。
19.权利要求18的方法,其中所述α-羟基羰基化合物是通式为R1CH(OH)COR2的化合物,其中R1和R2选自H、CH3和(CH2)nCH3,其中n为0至20的整数,且α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物在约300至330nm处有吸收峰,且所述吸收峰开始于约500至800nm。
20.权利要求17的方法,其中所述α-羟基羰基化合物与胺或铵化合物的寡聚或多聚共轭物为果糖和单乙醇胺的共轭物。
21.权利要求17的方法,其中所述组合物还包括山梨醇。
22.权利要求17的方法,其中所述组合物包括果糖与单乙醇胺的寡聚物、游离单乙醇胺、N-甲基吡咯烷酮、水、山梨醇和卡必醇。
23.权利要求17的方法,其中所述共轭物具有约0.5eV或更低的带隙。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99277007P | 2007-12-06 | 2007-12-06 | |
US60/992,770 | 2007-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101452226A true CN101452226A (zh) | 2009-06-10 |
Family
ID=40336520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2008100959605A Pending CN101452226A (zh) | 2007-12-06 | 2008-04-30 | 无氟化物的光致抗蚀剂剥离剂或残余物移除清洁组合物及用其清洁微电子基板的方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2009141311A (zh) |
KR (1) | KR20090060104A (zh) |
CN (1) | CN101452226A (zh) |
SG (1) | SG152960A1 (zh) |
TW (1) | TW200925800A (zh) |
WO (1) | WO2009073589A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107153329A (zh) * | 2017-06-19 | 2017-09-12 | 江阴润玛电子材料股份有限公司 | Tft行业铜制程用高回收率环保型剥离液 |
CN113161234A (zh) * | 2021-04-27 | 2021-07-23 | 上海新阳半导体材料股份有限公司 | 一种含氟清洗液组合物的应用 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011014027A2 (ko) * | 2009-07-29 | 2011-02-03 | 동우 화인켐 주식회사 | 세정액 조성물 및 이를 이용한 패널의 세정방법 |
TWI566058B (zh) * | 2013-04-25 | 2017-01-11 | 奇美實業股份有限公司 | 剝離光阻用組成物及其使用方法 |
KR102051346B1 (ko) * | 2016-06-03 | 2019-12-03 | 후지필름 가부시키가이샤 | 처리액, 기판 세정 방법 및 레지스트의 제거 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5567574A (en) * | 1995-01-10 | 1996-10-22 | Mitsubishi Gas Chemical Company, Inc. | Removing agent composition for photoresist and method of removing |
JP2000284506A (ja) * | 1999-03-31 | 2000-10-13 | Sharp Corp | フォトレジスト剥離剤組成物および剥離方法 |
ATE471537T1 (de) * | 2004-07-15 | 2010-07-15 | Mallinckrodt Baker Inc | Nichtwässrige mikroelektronische reinigungszusammensetzungen mit fructose |
-
2008
- 2008-01-30 TW TW097103592A patent/TW200925800A/zh unknown
- 2008-01-31 SG SG200800898-9A patent/SG152960A1/en unknown
- 2008-02-13 KR KR1020080012945A patent/KR20090060104A/ko not_active Application Discontinuation
- 2008-04-25 JP JP2008115445A patent/JP2009141311A/ja not_active Withdrawn
- 2008-04-30 CN CNA2008100959605A patent/CN101452226A/zh active Pending
- 2008-12-01 WO PCT/US2008/085096 patent/WO2009073589A1/en active Application Filing
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107153329A (zh) * | 2017-06-19 | 2017-09-12 | 江阴润玛电子材料股份有限公司 | Tft行业铜制程用高回收率环保型剥离液 |
CN113161234A (zh) * | 2021-04-27 | 2021-07-23 | 上海新阳半导体材料股份有限公司 | 一种含氟清洗液组合物的应用 |
CN113161234B (zh) * | 2021-04-27 | 2023-02-17 | 上海新阳半导体材料股份有限公司 | 一种含氟清洗液组合物的应用 |
Also Published As
Publication number | Publication date |
---|---|
JP2009141311A (ja) | 2009-06-25 |
KR20090060104A (ko) | 2009-06-11 |
TW200925800A (en) | 2009-06-16 |
WO2009073589A1 (en) | 2009-06-11 |
SG152960A1 (en) | 2009-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1789527B1 (en) | Cleaning compositions for microelectronics substrates | |
CN101452227A (zh) | 含氟化物的光致抗蚀剂剥离剂或残余物移除清洁组合物以及用其清洁微电子基板的方法 | |
DE60218468T2 (de) | Ammoniak-freie zusammensetzungen mit verbesserter substrat-kompatibilität zum reinigen von mikroelektronischen substraten | |
EP1576072B1 (en) | Aqueous phosphoric acid compositions for cleaning semiconductor devices | |
US8178482B2 (en) | Cleaning compositions for microelectronic substrates | |
JP5662365B2 (ja) | クリーニング調合物およびそのクリーニング調合物の使用方法 | |
ZA200603387B (en) | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors | |
KR20040002455A (ko) | 포토레지스트 박리제 조성물 및 세정 조성물 | |
JP6033314B2 (ja) | 銅/アゾールポリマー阻害剤を含むマイクロ電子基板洗浄組成物 | |
JP2017531735A (ja) | pH中性脱錆剤組成物 | |
CN101452226A (zh) | 无氟化物的光致抗蚀剂剥离剂或残余物移除清洁组合物及用其清洁微电子基板的方法 | |
US10597616B2 (en) | Cleaning liquid and method for manufacturing the same | |
KR20040035368A (ko) | 반도체 및 tft-lcd용 세정제 조성물 | |
IL193237A (en) | Water-stabilized preparations for cleaning microelectronic substrates | |
TWI784995B (zh) | 洗淨液及製造其之方法 | |
PL199501B1 (pl) | Kompozycja czyszcząca do oczyszczania pozostałości z podłoży stosowanych w mikroelektronice i sposób oczyszczania układu mikroelektronicznego | |
KR20110083689A (ko) | 다중-금속 소자 처리를 위한 글루콘산 함유 포토레지스트 세정 조성물 | |
KR20170111411A (ko) | 레지스트 박리액 조성물, 및 디스플레이 장치용 플랫 패널의 제조방법 및 그에 의해 제조된 디스플레이 장치용 플랫 패널, 및 디스플레이 장치 | |
KR101880297B1 (ko) | 평판표시장치용 세정제 조성물 | |
JP2001288496A (ja) | 電子部品洗浄液 | |
TWI732885B (zh) | 用於含鋁之微電子基板的清潔組合物 | |
JP2004026696A (ja) | オキシメチルアミン化合物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090610 |