CN101450862B - 陶瓷切削刀片 - Google Patents
陶瓷切削刀片 Download PDFInfo
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- 238000005520 cutting process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000005245 sintering Methods 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 5
- 150000004767 nitrides Chemical class 0.000 claims abstract description 4
- 229910052574 oxide ceramic Inorganic materials 0.000 claims abstract description 4
- 239000011224 oxide ceramic Substances 0.000 claims abstract description 4
- 229910003564 SiAlON Inorganic materials 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 claims description 3
- 230000008025 crystallization Effects 0.000 claims description 3
- 238000009702 powder compression Methods 0.000 claims description 2
- 238000004663 powder metallurgy Methods 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 claims 2
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000523 sample Substances 0.000 description 12
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- 230000003287 optical effect Effects 0.000 description 6
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- 238000007517 polishing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 238000001694 spray drying Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910001247 waspaloy Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明涉及一种加工陶瓷切削刀片的方法,该刀片基于氧化物陶瓷、氮化物陶瓷或混合陶瓷材料,还可能含有纤维状结晶,加工工艺包括以下粉末冶金步骤:提供待压制陶瓷粉末,把待压制粉末压制成所需形状的坯块,把坯块烧结成致密的陶瓷坯件,随后通过滚动抛光陶瓷坯件去除烧结表层并形成倒圆刃。
Description
技术领域
本发明涉及一种用于金属加工的陶瓷切削刀片的制作方法和一种陶瓷切削刀片。
背景技术
陶瓷切削刀片通过粉末冶金法制成,包括研磨、压制和烧结过程。通过烧结过程得到陶瓷刀片的坯件,作为压制操作的结果,坯件具有相当锋利的切削刃,作为烧结过程的结果,形成烧结表层。但是,使用时锋利的刀刃太容易断裂,烧结表层可能含有表面缺陷,其在操作中充当刀片的裂缝开裂点。因此,烧结的坯件必需经过后烧结处理。通常,为了得到具有合适的最终形状和尺寸公差的切削刀片,也需要执行后烧结处理。
金属加工用的陶瓷刀片材料为硬而脆类型的,因此如果表面处理方式不恰当,容易产生例如崩刃(chipping)等表面缺陷。因此,在后烧结处理中,需注意不使刀片坯件表面造成损伤,特别是对于锐利的、烧结的切削刃。在一些情况下,例如在对特定陶瓷材料级别进行表面处理时,为了不产生不能接受的表面缺陷及因此使完工的刀片报废,需要进行特殊测量。
使陶瓷刀片坯件成型并除去烧结表层的常方式是使用研磨摩擦工具,如传统的砂轮。但是,为得到所需的最终形状,陶瓷坯件的研磨公知是一种耗费很大的过程,其需要精密的研磨设备和大量的人工处理,或者替代地,需要使用昂贵的设备进行自动处理。为了获得切削刃的倒圆刃(edge rounding),还需要执行第二后烧结步骤,通常是以擦刷操作的形式。
所得到的倒圆刃可以由W/H比来描述,其中W是倒圆刃沿前刀面的宽度,H是倒圆刃沿间隙面的宽度。为达到切削刀片的理想寿命,通过该处理获得的W/H比必须在一定的公差范围内。
滚动抛光法在金属和金属合金制品的表面预加工和处理中已有多年的应用,比如用于实现如叶片、翼片、喷嘴等燃气轮机部件的去毛刺、修圆或抛光。
美国专利:4,869,329公开了一种钻孔用凿岩钻头刀片的处理方法,该刀片包括复合材料,如碳化钨结合Co或者Ni-Fe合成物,该方法使用了振动滚动抛光技术以提高刀片的断裂韧度。
发明内容
本发明的目的是提供一种减轻现有技术中存在的问题的加工陶瓷切削刀片的方法。
本发明的另一目的是提供用于陶瓷切削刀片坯件的后烧结处理的有效方法。
附图说明
图1示出根据本发明经后烧结处理的示例性陶瓷切削刀片的刀刃的光学影像图。
图2示出根据本发明经后烧结处理的示例性陶瓷切削刀片的刀刃的光学影像图。
图3示出经对比的后烧结处理的示例性陶瓷切削刀片的刀刃的光学影像图。
图4示出经对比的后烧结处理的示例性陶瓷切削刀片的刀刃的光学影像图。
图5示出根据本发明的示例性陶瓷切削刀片的磨损刀刃的光学影像图。
图6示出根据现有技术的示例性陶瓷切削刀片的磨损刀刃的光学影像图。
具体实施方式
令人惊奇地发现,可以通过陶瓷刀片坯件的一次后烧结过程完成表面处理,去除烧结表层,以及使倒圆刃形成在所需公差范围内的W、H和W/H比。
根据本发明,提供了一种加工陶瓷切削刀片的方法,该刀片基于氧化物陶瓷、氮化物陶瓷或混合陶瓷材料,还可能含有(例如SiC的)纤维状结晶。生产工艺包括以下粉末冶金步骤:提供待压制陶瓷粉末,把待压制粉末压制成所需形状的坯块,将坯块烧结成致密的陶瓷坯件,以及滚动抛光陶瓷坯件,以去除烧结表层并提供倒圆刃。
更具体地讲,该方法的特征在于,进行滚动抛光处理步骤直到陶瓷刀片切削刃的倒圆刃的W值在30μm和70μm之间,H值在30μm和70μm之间,W/H比在0.8和1.6之间,表面平均粗糙度值即MRa值≤0.30μm,优选MRa≤0.25μm。
对于获得具有规定值的W、H、W/H比和MRa的所需倒圆刃,确定所需的滚动抛光时间在熟练技术人员的能力范围之内。
本发明在将该方法应用于具有圆形形状的切削刀片时尤其成功。
进一步证实,本发明在将该方法应用在赛隆陶瓷级别(sialongrade)的切削刀片上时尤其适用。
优选的是使用陶瓷片作为滚动抛光介质,优选是氧化铝片。
在一种实施方式中,滚动抛光时间≥300分钟,更优选≥360分钟,但优选≤720分钟,更优选≤660分钟。
在一种优选的实施方式中,在振动抛光机中进行滚动抛光处理。
在一种实施方式中,滚动抛光处理包括把烧结的陶瓷坯件装入振动式滚动抛光机,陶瓷片为滚动抛光介质,陶瓷片和坯件的重量比为3∶1到7∶1,坯件总重5-13kg,加入1400-1800kg的研磨支撑化合物(grinding support compound),水流速度为1升/小时,进行滚动抛光处理570-630分钟。
在一种实施方式中,滚动抛光的刀片进一步在所选表面上经受研磨操作,例如圆形刀片的上和下表面,随后进行第二滚动抛光步骤以提供光滑表面和/或倒圆刃。
根据本发明,还提供了一种陶瓷切削刀片,该刀片基于氧化物陶瓷或氮化物陶瓷或混合陶瓷材料,还可能含有纤维状结晶,通过上述方法加工生产,其中成品刀片的切削倒圆刃的W值在30μm和70μm之间,H值在30μm和70μm之间,W/H比在0.8和1.6之间,并具有光滑表面,其MRa值≤0.30μm,优选MRa≤0.25μm。
在一种优选的实施方式中,所述切削刀片为圆形。
在另一优选的实施方式中,切削刀片是赛隆陶瓷级别的。
例1(本发明)
圆形的、类型为RNGN120700的陶瓷切削刀片通过以下方式生产,将68.62wt%的Si3N4、9.28wt%的Al2O3、17.11wt%的21R-F和4.99%wt的Y2O3用赛隆研磨介质在水中研磨,制备原材料混合物。将有机粘合剂混合到浆料中,然后再通过喷雾干燥法将其颗粒化。粉末被单轴冷压以形成生坯,然后在650℃的温度下分离烧制。烧制的生坯然后在最高烧结温度1810℃的氮压强下烧结。把烧结后的坯件和高研磨效率类型的圆柱状陶瓷片(3×6mm)以陶瓷片:坯件重量比为5∶1装入200升的振动抛光机中。坯件总重10kg。加入总重2000克的化合物,水流速度为1升/小时。振动抛光机的不平衡度设置为4/40/110°,电动机转速为1700rpm,得到的振幅为2.5mm。在这种配置下,抛光机分别运行360分钟和540分钟,生产出样品A和样品B两组刀片。
对样品A的表面状况测量(见图1)显示刀片的W值为67μm,H值为65μm,因此倒圆刃的W/H比为1.03。进一步的测量显示表面区去除厚度约8μm,留下光滑表面,其MRa值为0.253μm,如通过探针技术(Mitutoyo Surtest 211)测量的,这表明表面的不规则性已经消除。测量结果还表明刀片的圆形形状在抛光过程中没有发生变化。观测到切削刃有轻微的崩刃倾向。
对样品B的表面状况测量(见图2)显示刀片的W值为51μm,H值为62μm,因此倒圆刃的W/H比为0.82。进一步的测量显示表面区去除厚度约10μm,留下光滑表面,其MRa值为0.223μm,这表明表面的不规则性已经消除。测量结果还表明刀片的圆形形状在抛光过程中没有发生变化。没有观测到切削刃有崩刃倾向。
例2(对比例)
制备与例1相同等级和类型的陶瓷切削刀片,但经历如下后烧结处理。把烧结后的坯件和研磨效率比例1差的三角形陶瓷片(6×6mm)以陶瓷片:坯件重量比为5∶1装入25升的离心圆盘精加工型抛光机中。陶瓷片总重28kg。加入2vol%的化合物净化剂水溶液,流速为30升/小时。在这种配置下,抛光机分别运行30分钟和60分钟,生产出样品C(图3)和样品D(图4)两组刀片。
对样品C的表面状况测量(见图3)显示刀片的W值为30μm,H值为179μm,因此倒圆刃的W/H比为0.16。进一步的测量显示表面区去除厚度约14μm,留下光滑表面,其MRa值为0.561μm,如通过探针技术测量的。测量结果还表明刀片的圆形形状在抛光过程中没有发生变化。切削刃有严重的崩刃现象。
对样品D的表面状况测量(见图4)显示,刀片的W值为38μm,H值为200μm,因此倒圆刃的W/H比为0.19。进一步的测量显示表面区去除厚度约21μm,留下光滑表面,其MRa值为0.503μm。测量结果还表明刀片的圆形形状在抛光过程中没有发生变化。切削刃有严重的崩刃现象。
例3
在烧结后又在车削操作中研磨成为最终形状以后,对例1中的样品B和相同等级、相同类型的参考陶瓷刀片进行了试验和对比。
材料:沃斯帕洛伊合金
切削数据:
切削速度=230m/min
进给=0.28mm/rev
切削深度=2mm
切削时间=2min
每个变量选取5个刀刃进行试验。
结果:
在光学显微镜下观察磨耗图纹,发现在平均水平下,根据本发明中样品B(见图5)的刀片的崩刃现象比参考刀片(图6)轻微。
Claims (7)
1.一种加工陶瓷切削刀片的方法,所述刀片基于氧化物陶瓷、氮化物陶瓷或混合陶瓷材料,加工工艺包括以下粉末冶金步骤:提供待压制陶瓷粉末,把待压制粉末压制成所需形状的坯块,把所述坯块烧结成致密的陶瓷坯件,其特征在于,滚动抛光所述陶瓷坯件,以去除烧结表层并形成倒圆刃,其中执行所述滚动抛光直到所述陶瓷坯件的倒圆刃的W值在30μm和70μm之间,H值在30μm和70μm之间,W/H比在0.8和1.6之间,并且平均表面粗糙度值即MRa值≤0.3μm,。
2.根据上述权利要求所述的方法,其特征在于:对所述陶瓷坯件执行所述滚动抛光直到所述陶瓷坯件的平均表面粗糙度值即MRa值≤0.25μm。
3.根据上述权利要求中的任一项所述的方法,其特征在于:所述坯件为圆形。
4.根据上述权利要求中的任一项所述的方法,其特征在于:所述陶瓷材料为赛隆陶瓷等级。
5.根据上述权利要求中的任一项所述的方法,其特征在于:所述滚动抛光进行的时间≥300分钟。
6.根据上述权利要求中的任一项所述的方法,其特征在于:在振动抛光机中进行所述滚动抛光。
7.根据上述权利要求中的任一项所述的方法,其特征在于:所述陶瓷切削刀片含有纤维状结晶。
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EP2543653B2 (fr) * | 2011-07-04 | 2023-01-11 | Comadur S.A. | Procédé de fabrication d'une céramique mate non marquante |
RU2687623C2 (ru) * | 2014-06-03 | 2019-05-15 | Сандвик Интеллекчуал Проперти Аб | Способ изготовления режущего инструмента и режущий инструмент |
CN104365517A (zh) * | 2014-11-27 | 2015-02-25 | 浙江海洋学院 | 确定深水产卵场的装置 |
CN107662154A (zh) * | 2017-08-31 | 2018-02-06 | 安徽青花坊瓷业股份有限公司 | 一种日用陶瓷餐具的振动抛光工艺 |
CN111203548A (zh) * | 2020-01-17 | 2020-05-29 | 广西长城机械股份有限公司 | 一种陶瓷刀片应用在锰铬系无磁性大型零件上的加工方法 |
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US3152385A (en) * | 1961-11-07 | 1964-10-13 | Norton Co | Ceramic tools |
CN1104946A (zh) * | 1993-10-21 | 1995-07-12 | 桑德维克公司 | 切削刀具的刀片 |
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JPS60246268A (ja) * | 1984-05-23 | 1985-12-05 | 三菱マテリアル株式会社 | サイアロン基セラミツクス |
US4869329A (en) | 1987-04-06 | 1989-09-26 | Smith International, Inc. | Rock bit insert |
SE9200530D0 (sv) | 1992-02-21 | 1992-02-21 | Sandvik Ab | Haardmetall med bindefasanrikad ytzon |
SE505425C2 (sv) | 1992-12-18 | 1997-08-25 | Sandvik Ab | Hårdmetall med bindefasanrikad ytzon |
JPH06298568A (ja) * | 1993-04-09 | 1994-10-25 | Toshiba Tungaloy Co Ltd | ウイスカー強化サイアロン基焼結体およびその被覆焼結体 |
JP2003170343A (ja) * | 2001-12-03 | 2003-06-17 | Ishikawajima Harima Heavy Ind Co Ltd | タンブリング装置 |
JP2006192552A (ja) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | スローアウェイチップ、その製造方法、及び切削方法 |
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US3152385A (en) * | 1961-11-07 | 1964-10-13 | Norton Co | Ceramic tools |
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JP2008221459A (ja) | 2008-09-25 |
EP1970158A3 (en) | 2010-11-17 |
SE0700624L (sv) | 2008-09-13 |
US9238285B2 (en) | 2016-01-19 |
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