CN101448607B - 抛光垫 - Google Patents

抛光垫 Download PDF

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Publication number
CN101448607B
CN101448607B CN2007800179946A CN200780017994A CN101448607B CN 101448607 B CN101448607 B CN 101448607B CN 2007800179946 A CN2007800179946 A CN 2007800179946A CN 200780017994 A CN200780017994 A CN 200780017994A CN 101448607 B CN101448607 B CN 101448607B
Authority
CN
China
Prior art keywords
polishing
light
region
polishing pad
light transmittance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2007800179946A
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English (en)
Chinese (zh)
Other versions
CN101448607A (zh
Inventor
福田武司
广濑纯司
中井良之
木村毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Publication of CN101448607A publication Critical patent/CN101448607A/zh
Application granted granted Critical
Publication of CN101448607B publication Critical patent/CN101448607B/zh
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN2007800179946A 2006-05-17 2007-05-15 抛光垫 Active CN101448607B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006137356A JP2007307639A (ja) 2006-05-17 2006-05-17 研磨パッド
JP137356/2006 2006-05-17
PCT/JP2007/059970 WO2007132855A1 (ja) 2006-05-17 2007-05-15 研磨パッド

Publications (2)

Publication Number Publication Date
CN101448607A CN101448607A (zh) 2009-06-03
CN101448607B true CN101448607B (zh) 2011-09-14

Family

ID=38693944

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800179946A Active CN101448607B (zh) 2006-05-17 2007-05-15 抛光垫

Country Status (6)

Country Link
US (1) US7927183B2 (https=)
JP (1) JP2007307639A (https=)
KR (1) KR101120533B1 (https=)
CN (1) CN101448607B (https=)
TW (1) TW200804034A (https=)
WO (1) WO2007132855A1 (https=)

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JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
JP5453507B1 (ja) * 2012-10-31 2014-03-26 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US9186772B2 (en) 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9446497B2 (en) 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
US8961266B2 (en) 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9475168B2 (en) 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US20180169827A1 (en) * 2016-12-16 2018-06-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods for making chemical mechanical planarization (cmp) polishing pads having integral windows
US10207388B2 (en) 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10293456B2 (en) 2017-04-19 2019-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
KR102567102B1 (ko) * 2017-05-12 2023-08-14 주식회사 쿠라레 연마층용 폴리우레탄, 폴리우레탄을 포함하는 연마층과 그 연마층의 개질 방법, 연마 패드 및 연마 방법
US10569383B2 (en) 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US10465097B2 (en) 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
KR102421208B1 (ko) * 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
JP7650698B2 (ja) * 2021-03-30 2025-03-25 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法

Citations (2)

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CN1628138A (zh) * 2002-02-04 2005-06-15 株式会社Skc 具有高硬度和极好的耐磨性的聚氨酯弹性体用组合物
CN1717785A (zh) * 2002-11-27 2006-01-04 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法

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JP3859241B2 (ja) 1992-09-29 2006-12-20 旭化成ケミカルズ株式会社 ポリテトラメチレンカーボネートジオールを用いた熱可塑性ポリウレタン及びポリテトラメチレンカーボネートジオールの製造法
WO1994007934A1 (fr) * 1992-09-29 1994-04-14 Asahi Kasei Kogyo Kabushiki Kaisha Polyurethane thermoplastique derive de polytetramethylene carbonate diol
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JP2002001647A (ja) * 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
JP3904854B2 (ja) * 2001-06-28 2007-04-11 セントラル硝子株式会社 含フッ素脂環式ジカルボン酸化合物の製造方法
JP2003048151A (ja) 2001-08-08 2003-02-18 Rodel Nitta Co 研磨パッド
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US8845852B2 (en) * 2002-11-27 2014-09-30 Toyo Tire & Rubber Co., Ltd. Polishing pad and method of producing semiconductor device
JP3582790B2 (ja) 2002-11-27 2004-10-27 東洋紡績株式会社 研磨パッド及び半導体デバイスの製造方法
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
JP2004259728A (ja) 2003-02-24 2004-09-16 Toray Ind Inc 研磨パッド
JP4849587B2 (ja) * 2003-03-11 2012-01-11 東洋ゴム工業株式会社 研磨パッドおよび半導体デバイスの製造方法
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP2005001059A (ja) 2003-06-12 2005-01-06 Sumitomo Bakelite Co Ltd 研磨用積層体
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
WO2005088690A1 (ja) * 2004-03-11 2005-09-22 Toyo Tire & Rubber Co., Ltd. 研磨パッドおよび半導体デバイスの製造方法
US7871685B2 (en) * 2004-04-08 2011-01-18 Tdk Corporation Methods for producing optical recording medium and optical recording medium
JP4627149B2 (ja) * 2004-05-10 2011-02-09 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
KR100881245B1 (ko) * 2004-06-28 2009-02-05 캐논 가부시끼가이샤 양이온 광중합성 에폭시 수지 조성물, 이것을 사용한 미세구조체, 및 미세 구조체의 제조 방법
JP4498232B2 (ja) * 2004-06-28 2010-07-07 キヤノン株式会社 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法
JP2006110686A (ja) * 2004-10-15 2006-04-27 Toyo Tire & Rubber Co Ltd 研磨パッド
US7226339B2 (en) * 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
JP2006102940A (ja) * 2006-01-10 2006-04-20 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1628138A (zh) * 2002-02-04 2005-06-15 株式会社Skc 具有高硬度和极好的耐磨性的聚氨酯弹性体用组合物
CN1717785A (zh) * 2002-11-27 2006-01-04 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法

Also Published As

Publication number Publication date
TWI330571B (https=) 2010-09-21
US7927183B2 (en) 2011-04-19
TW200804034A (en) 2008-01-16
US20090137188A1 (en) 2009-05-28
KR20080093059A (ko) 2008-10-17
KR101120533B1 (ko) 2012-03-07
WO2007132855A1 (ja) 2007-11-22
JP2007307639A (ja) 2007-11-29
CN101448607A (zh) 2009-06-03

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160905

Address after: Delaware

Patentee after: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Address before: Osaka Japan

Patentee before: TOYO TIRE & RUBBER Co.,Ltd.

CP03 Change of name, title or address

Address after: Delaware, USA

Patentee after: DuPont Electronic Materials Holdings Co.,Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Country or region before: U.S.A.

CP03 Change of name, title or address