CN101419324A - 摄像模组 - Google Patents
摄像模组 Download PDFInfo
- Publication number
- CN101419324A CN101419324A CNA200710202240XA CN200710202240A CN101419324A CN 101419324 A CN101419324 A CN 101419324A CN A200710202240X A CNA200710202240X A CN A200710202240XA CN 200710202240 A CN200710202240 A CN 200710202240A CN 101419324 A CN101419324 A CN 101419324A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- shooting module
- groove
- circuit substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- 235000012431 wafers Nutrition 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (10)
- 【权利要求1】一种摄像模组,其包括:一个镜头单元,一个影像感测晶片,一个电路基板,所述镜头单元与所述影像感测晶片中心对正设置,且设置于所述电路基板上,其特征在于:所述电路基板为多层电路板复合而成,所述电路基板具有一个容置所述影像感测晶片的凹槽,所述凹槽至少贯穿所述复合电路板的一层电路板,所述影像感测晶片设置在该凹槽中,并与所述电路基板电性连接。
- 【权利要求2】如权利要求1所述的摄像模组,其特征在于:所述电路基板由多层软、硬电路板复合而成,所述软性电路板层互相邻接,硬质电路板层互相邻接,且硬质电路板层靠近所述镜头单元设置,硬质电路板层相对镜头单元的另一侧与所述软性电路板邻接。
- 【权利要求3】如权利要求2所述的摄像模组,其特征在于:所述凹槽自邻接所述镜头单元的电路基板表面起贯通所述至少一层硬质电路板。
- 【权利要求4】如权利要求3所述的摄像模组,其特征在于:所述凹槽横断其贯通的所述至少一层硬质电路板。
- 【权利要求5】如权利要求4所述的摄像模组,其特征在于:所述影像感测晶片设置于暴露于所述凹槽内的电路板层表面上,且与该层电路板电性连接。
- 【权利要求6】如权利要求2所述的摄像模组,其特征在于:所述电路基板包括四层软、硬电路板,其中靠近镜头单元的两层为硬质电路板,另外两层为软性电路板。
- 【权利要求7】如权利要求6所述的摄像模组,其特征在于:所述凹槽自邻接所述镜头单元的电路基板表面起贯通所述至少两层硬质电路板,所述影像感测晶片设置于暴露于所述凹槽内的软性电路板层表面上,且与该层软性电路板电性连接。
- 【权利要求8】如权利要求1所述的摄像模组,其特征在于:所述镜头单元包括一个镜筒,一个镜座,所述镜筒部分收容于所述镜座内。
- 【权利要求9】如权利要求8所述的摄像模组,其特征在于:所述镜座具有一个方形的收容腔,所述收容腔的腔壁对应于所述凹槽支持于所述电路基板上。
- 【权利要求10】如权利要求9所述的摄像模组,其特征在于:所述镜座的两个相对的腔壁横跨所述凹槽,该两个腔壁上分别形成有两个凸缘,所述两凸缘嵌入所述印刷电路板的凹槽中。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202240A CN100592131C (zh) | 2007-10-24 | 2007-10-24 | 摄像模组 |
US12/061,883 US7929052B2 (en) | 2007-10-24 | 2008-04-03 | Camera module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202240A CN100592131C (zh) | 2007-10-24 | 2007-10-24 | 摄像模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101419324A true CN101419324A (zh) | 2009-04-29 |
CN100592131C CN100592131C (zh) | 2010-02-24 |
Family
ID=40582335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710202240A Expired - Fee Related CN100592131C (zh) | 2007-10-24 | 2007-10-24 | 摄像模组 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7929052B2 (zh) |
CN (1) | CN100592131C (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103281488A (zh) * | 2013-06-05 | 2013-09-04 | 四川艾普视达数码科技有限公司 | 摄像机通用模组 |
CN103294115A (zh) * | 2012-03-05 | 2013-09-11 | 联想(北京)有限公司 | 电子设备 |
CN103888649A (zh) * | 2014-03-07 | 2014-06-25 | 海特光电有限责任公司 | 一种低成本激光摄像机 |
CN104580855A (zh) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | 摄像头模组 |
CN104580857A (zh) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | 摄像头模组 |
CN106559957A (zh) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | 软硬结合板及手机摄像模组 |
CN106941582A (zh) * | 2017-02-07 | 2017-07-11 | 奇鋐科技股份有限公司 | 摄像模组保护结构 |
CN108124082A (zh) * | 2016-11-28 | 2018-06-05 | 宁波舜宇光电信息有限公司 | 下沉式摄像模组和下沉式感光组件及其制造方法 |
CN103294115B (zh) * | 2012-03-05 | 2018-08-31 | 联想(北京)有限公司 | 电子设备 |
CN108875571A (zh) * | 2018-05-10 | 2018-11-23 | Oppo广东移动通信有限公司 | 指纹识别模组组装方法、指纹识别模组及电子装置 |
CN110611753A (zh) * | 2018-06-15 | 2019-12-24 | 三赢科技(深圳)有限公司 | 镜头模组及该镜头模组的组装方法 |
CN110611754A (zh) * | 2018-06-15 | 2019-12-24 | 三赢科技(深圳)有限公司 | 摄像头模组 |
CN112104769A (zh) * | 2019-06-18 | 2020-12-18 | 成都鼎桥通信技术有限公司 | 一种感光镜片、光线感应组件及终端 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011084900A1 (en) | 2010-01-11 | 2011-07-14 | Flextronics Ap Llc | Camera module with molded tape flip chip imager mount and method of manufacture |
JP2013232756A (ja) * | 2012-04-27 | 2013-11-14 | Sony Corp | 光学モジュール |
US10591720B2 (en) * | 2016-06-28 | 2020-03-17 | Texas Instruments Incorporated | Optical device housing |
US11246483B2 (en) * | 2016-12-09 | 2022-02-15 | Ora, Inc. | Apparatus for capturing an image of the eye |
USD875946S1 (en) | 2016-12-09 | 2020-02-18 | Ora, Inc. | Apparatus for capturing an image of the eye |
US10598926B2 (en) | 2017-02-06 | 2020-03-24 | Texas Instruments Incorporated | Optical device housing |
TWI686081B (zh) * | 2017-05-17 | 2020-02-21 | 群光電子股份有限公司 | 影像模組 |
TWI696389B (zh) * | 2019-04-24 | 2020-06-11 | 群光電子股份有限公司 | 影像擷取模組及其製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
JP2004260357A (ja) | 2003-02-24 | 2004-09-16 | Hitachi Maxell Ltd | カメラモジュール |
DE602004022273D1 (de) * | 2003-04-22 | 2009-09-10 | Konica Minolta Opto Inc | Abbildungseinrichtung und mobiles endgerät mit dieser abbildungseinrichtung |
JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US7122787B2 (en) * | 2003-05-09 | 2006-10-17 | Matsushita Electric Industrial Co., Ltd. | Imaging apparatus with three dimensional circuit board |
JP4446773B2 (ja) * | 2004-03-26 | 2010-04-07 | 富士フイルム株式会社 | 撮影装置 |
US7714931B2 (en) * | 2004-06-25 | 2010-05-11 | Flextronics International Usa, Inc. | System and method for mounting an image capture device on a flexible substrate |
KR100674833B1 (ko) * | 2005-02-16 | 2007-01-26 | 삼성전기주식회사 | 카메라 모듈 |
JP4064408B2 (ja) * | 2005-04-07 | 2008-03-19 | 今湛光學科技股▲分▼有限公司 | 映像センサーモジュール |
CN100523988C (zh) * | 2005-11-02 | 2009-08-05 | 亚洲光学股份有限公司 | 可精确对准的数字镜头组 |
JP2007174263A (ja) * | 2005-12-22 | 2007-07-05 | Acme System Technologies Corp | 映像検知センサーを回路板に組付けるパッケージ方法 |
KR100770690B1 (ko) * | 2006-03-15 | 2007-10-29 | 삼성전기주식회사 | 카메라모듈 패키지 |
KR20070096303A (ko) * | 2006-03-23 | 2007-10-02 | 엘지이노텍 주식회사 | 카메라 모듈용 인쇄회로기판 및 그 제조 방법 |
-
2007
- 2007-10-24 CN CN200710202240A patent/CN100592131C/zh not_active Expired - Fee Related
-
2008
- 2008-04-03 US US12/061,883 patent/US7929052B2/en active Active
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103294115A (zh) * | 2012-03-05 | 2013-09-11 | 联想(北京)有限公司 | 电子设备 |
CN103294115B (zh) * | 2012-03-05 | 2018-08-31 | 联想(北京)有限公司 | 电子设备 |
CN103281488A (zh) * | 2013-06-05 | 2013-09-04 | 四川艾普视达数码科技有限公司 | 摄像机通用模组 |
CN103888649A (zh) * | 2014-03-07 | 2014-06-25 | 海特光电有限责任公司 | 一种低成本激光摄像机 |
CN104580855A (zh) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | 摄像头模组 |
CN104580857A (zh) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | 摄像头模组 |
CN106559957A (zh) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | 软硬结合板及手机摄像模组 |
CN108124082B (zh) * | 2016-11-28 | 2022-08-23 | 宁波舜宇光电信息有限公司 | 下沉式摄像模组和下沉式感光组件及其制造方法 |
CN108124082A (zh) * | 2016-11-28 | 2018-06-05 | 宁波舜宇光电信息有限公司 | 下沉式摄像模组和下沉式感光组件及其制造方法 |
CN106941582A (zh) * | 2017-02-07 | 2017-07-11 | 奇鋐科技股份有限公司 | 摄像模组保护结构 |
CN106941582B (zh) * | 2017-02-07 | 2020-09-11 | 奇鋐科技股份有限公司 | 摄像模组保护结构 |
CN108875571A (zh) * | 2018-05-10 | 2018-11-23 | Oppo广东移动通信有限公司 | 指纹识别模组组装方法、指纹识别模组及电子装置 |
CN110611753A (zh) * | 2018-06-15 | 2019-12-24 | 三赢科技(深圳)有限公司 | 镜头模组及该镜头模组的组装方法 |
CN110611754A (zh) * | 2018-06-15 | 2019-12-24 | 三赢科技(深圳)有限公司 | 摄像头模组 |
CN112104769A (zh) * | 2019-06-18 | 2020-12-18 | 成都鼎桥通信技术有限公司 | 一种感光镜片、光线感应组件及终端 |
Also Published As
Publication number | Publication date |
---|---|
US20090109327A1 (en) | 2009-04-30 |
US7929052B2 (en) | 2011-04-19 |
CN100592131C (zh) | 2010-02-24 |
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Effective date of registration: 20170821 Address after: Room 4, 155-2 ginkgo Road, Shanghai, Putuo District Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. Patentee before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. |
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