CN101416301B - 将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统 - Google Patents
将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统 Download PDFInfo
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- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102006016275.7 | 2006-03-31 | ||
DE102006016275A DE102006016275B4 (de) | 2006-03-31 | 2006-03-31 | Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger |
PCT/EP2007/052803 WO2007113139A1 (de) | 2006-03-31 | 2007-03-23 | Verfahren zum platzieren von elektrisch kontaktierbaren bauelementen auf einem schaltungsträger sowie zur durchführung dieses verfahrens geeignetes montagesystem |
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CN101416301A CN101416301A (zh) | 2009-04-22 |
CN101416301B true CN101416301B (zh) | 2011-12-14 |
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CN2007800118444A Expired - Fee Related CN101416301B (zh) | 2006-03-31 | 2007-03-23 | 将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统 |
Country Status (3)
Country | Link |
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CN (1) | CN101416301B (zh) |
DE (1) | DE102006016275B4 (zh) |
WO (1) | WO2007113139A1 (zh) |
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DE102009050426B3 (de) * | 2009-10-22 | 2011-03-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum ausgerichteten Aufbringen von Bauteilen auf einem Trägersubstrat und ein Verfahren zur Herstellung eines Trägersubstrats dafür und ein Verfahren zur Bestückung eines Zielsubstrats damit. |
DE102021206898B4 (de) | 2021-06-30 | 2023-02-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Anordnung und Verfahren zur Herstellung einer Halbleiteranordnung |
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US6569382B1 (en) * | 1991-11-07 | 2003-05-27 | Nanogen, Inc. | Methods apparatus for the electronic, homogeneous assembly and fabrication of devices |
US6089853A (en) * | 1997-12-24 | 2000-07-18 | International Business Machines Corporation | Patterning device for patterning a substrate with patterning cavities fed by service cavities |
US6946322B2 (en) * | 2002-07-25 | 2005-09-20 | Hrl Laboratories, Llc | Large area printing method for integrating device and circuit components |
US6982191B2 (en) * | 2003-09-19 | 2006-01-03 | Micron Technology, Inc. | Methods relating to forming interconnects and resulting assemblies |
WO2005091354A1 (ja) * | 2004-03-22 | 2005-09-29 | Tamura Corporation | はんだ組成物及びこれを用いたバンプ形成方法 |
JP3955302B2 (ja) * | 2004-09-15 | 2007-08-08 | 松下電器産業株式会社 | フリップチップ実装体の製造方法 |
DE102004058201A1 (de) * | 2004-12-02 | 2006-06-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Übertragung von Bauelementen auf eine Oberfläche |
-
2006
- 2006-03-31 DE DE102006016275A patent/DE102006016275B4/de not_active Expired - Fee Related
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2007
- 2007-03-23 WO PCT/EP2007/052803 patent/WO2007113139A1/de active Application Filing
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Also Published As
Publication number | Publication date |
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WO2007113139A1 (de) | 2007-10-11 |
DE102006016275A1 (de) | 2007-10-18 |
CN101416301A (zh) | 2009-04-22 |
DE102006016275B4 (de) | 2013-12-19 |
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