CN101416301A - 将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统 - Google Patents

将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统 Download PDF

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CN101416301A
CN101416301A CNA2007800118444A CN200780011844A CN101416301A CN 101416301 A CN101416301 A CN 101416301A CN A2007800118444 A CNA2007800118444 A CN A2007800118444A CN 200780011844 A CN200780011844 A CN 200780011844A CN 101416301 A CN101416301 A CN 101416301A
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self
bearing part
circuit carrier
organization
surf zone
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CN101416301B (zh
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斯蒂芬·菲德勒
克劳斯-彼得·加卢希基
詹斯-克里斯琴·霍尔斯特
伯恩哈德·M·沙克特纳
拉尔夫·施密特
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ASMPT GmbH and Co KG
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Siemens AG
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Abstract

本发明涉及一种将电接触元件(11)放置在承载件(13)上的方法。根据本发明，所述元件通过自组织过程暂时以预定方式进行排列，在此情况下，可能在接触面(18a)上施加焊粒(17)后，就可借助所述承载件(13)将所述元件放置到电路载体上。将所述元件与所述电路载体焊接在一起，通过这种方式可有利地在一个加工步骤中将多个很难对其进行个别操作的元件安装在所述电路载体上。因此，所述方法优选适合用于放置极小的元件。

Description

将电接触元件放置在电路载体上的方法和适于实施该方法的安装系统
技术领域
本发明涉及一种将带有安装侧的电接触元件放置在电路载体上的方法，其中，通过一自组织过程实现所述元件的预期排列，其中：通过元件上与安装侧相对的背面将所述元件固定在一承载件上，为此，事先为所述元件的背面和承载件的表面配备用于触发元件自组织过程的表面区域，将承载件定向，使所述元件的安装侧面朝所述电路载体，并将承载件放置在电路载体上，并将所述元件固定在电路载体上。
背景技术
目前已利用自组织(也称自组装)过程来将电接触元件放置在电路载体上。A.O′Riordan(A.奥里奥丹)的“Field-configured self-assembly：manufacturing at the mesoscale(场配置自组装：中等规模制造)”(《材料科学与工程C23》，2003年，第3-6页)中公开了一种可将大量发光二极管放置在电路载体上的方法。借此可以低投入制备大面积显示器。自组织过程由适当的电场支持，所述电场将待安装发光二极管导引至已经过预处理的安装位置，因为借此可达到就能量而言的有利状态。
此外，H.O.Jacobs(H.O.雅各布斯)及其他人等所著的“Fabricationof a Cylindrical Display by Patterned Assembly(通过图案化组装制备圆柱形显示器)”(《科学》，第296卷，2002年4月12日，第323-325页)中说明了一种方法，这种方法是使待安装元件(发光二极管)悬浮在水中，并通过已经过相应预处理的表面沉积在衬底上。此处利用的是积聚在衬底相应表面区域阵列上的元件的金接触面。自组织安装过程结束后可在已安装元件上覆一层用于与这些元件的背面进行进一步接触的薄膜。
此外，Yeh(叶)与Smith(史密斯)合著的“Fluidic Self-Assembly ofMicrostructures and its Application to the Integration of GaAs on Si(微结构的流体自组装及其在将GaAs集成到Si上方面的应用)”(IEEE，1994年，第279-284页)中公开了一种实现发光二极管自组织安装过程的方法，即：制备具有梯形截面的专用发光二极管，这些发光二极管可沉积在衬底上的相应凹穴内。其中的自组织过程通过强制锁止(锁钥原理)而实现。在此之后还须对已放置的发光二极管进行电接触。
Xiong(熊)与其他人等合著的“Controlled Multibatch Self-Assemblyof Microdevices(微器件的可控多批次自组装)”(IEEE，2003年，第117-127页)中说明了一种方法，通过这种方法可借助已经过相应预处理的具有亲水或疏水特性的面实现自组织放置。实施这个过程时，将元件放在水中，其中，在相继实施的放置步骤中可在衬底上为此目的而改性的表面区域内安放各种元件。随后可通过电化学方法对已放置的元件进行电接触。其中，电连接材料在元件和衬底的为此而设置的面上发生电化学生长，直至元件与衬底之间的距离被生长中的接触材料所覆盖。上述所有方法均要求对衬底进行相应的预处理，以便在放置元件时强制实现自组织过程。但在为实现自组织过程而对电路载体进行预处理的过程中，还须对(例如)与电路载体的几何形状或其他功能区相关的实际情况加以考虑。
J.Fang(J.方)和K.
Figure A200780011844D00051
(K.勃林格)在其合著的“High YieldBatch Packaging of Micro Devices with Uniquely OrientingSelf-Assembly(通过单一定向自组装实现微器件的高产成批封装)”(第18届微电子机械系统(MEMS)IEEE国际会议，2005年1月30日-2005年2月3日，第12-15页)中提供了一种为多个几何形状相同、尺寸极小的试样和为这些试样所设置的安装板一侧配备销-槽配合、另一侧配备对应亲水面对的方法。借助所述配合可实现试样在安装板上的自组织粗略定向，其中，精确定向在使用水的情况下借助亲水表面区域而实现。
DE 10 2004 058 201 A1中公开了一种通过使用电子照相法可以高至μm的精度将元件放置在承载件上的方法。
US 6,089,853中公开了一种通过掩模技术将功能化表面区域安置到(例如)承载件表面的方法。
发明内容
由此，本发明的目的是提供一种将电接触元件放置在电路载体上的方法，其中，放置元件所需采用的自组织过程的进行相对而言不受电路载体和所用元件的实际情况的影响。
根据本发明，通过开篇所述方法达成这个目的的解决方案为：将不同类型的元件固定在承载件上，其中，确保所述元件在所述承载件上定位的确定性的方法是，为每一种元件的表面区域和所述承载件上与此对应的表面区域的建立，选择一种自组织作用原理，所述自组织作用原理相对于所有其他类型的元件的自组织作用原理而言具有选择性。
所采用的作用原理通常可分为物理、化学和生化作用原理，其中，在采用上述顺序的情况下，可实现的排列选择由于界面的选定(Adressierung derGrenzf 
Figure A200780011844D0006163621QIETU
)而增大。可利用的物理作用原理，例如表面张力(即对毛细作用力的利用)，机械力、静电力和磁力。化学作用原理可建立在非共价、部分共价或共价相互作用、络合作用直至化学键基础上，或者建立在离子交换直至席夫碱(Schiff-sche Base)基础上。可利用的生化作用原理例如有抗原-抗体结合、寡核苷酸之间的结合或酶-底物结合。为能对上述作用原理加以利用，为进行自组织过程而设置的表面区域必须具有适当的表面性质。这一点既可通过为表面选材而实现，也可通过以适当方式为表面区域配备功能性涂层而实现。
为能安装不同类型的元件，需要在各种作用原理中选出一种组合，这种组合可确保，特定表面区域选择特定待放置元件结合，即为了确保元件的定位唯一确定性，其他各表面区域之间不得存在兼容性。此外，如果有必要考虑电接触时各元件的极性，就还须为各元件配备不同作用原理的表面区域。只有这样才能避免元件以错误的定向放置在承载件上。
本发明的另一设想是，为安装过程提供一种承载件，元件的自组织过程在所述承载件上进行。有意识地通过元件的背面将元件固定在承载件上，其中，自组织过程所产生的保持力必须足以确保在进一步安装过程中可对承载件进行顺利操作。因为元件的自组织过程结束后，承载件会被放置到电路载体上，借此将元件平放在电路载体上，其安装侧朝向电路载体(电路载体和承载件只需具有彼此匹配的几何形状即可，而无需采取平整设计)。随后将元件固定在电路载体上，其中，这一点既可通过在元件和电路载体之间预先固定一种底部填料来实现，或者也可借助焊料或导电胶粘剂将元件电连接在电路载体上而实现。
这种处理方法的优点主要在于，无需为了进行自组织过程而对电路载体的表面进行改性。由此而带来的有利之处是，电路载体表面的设计自由度不受限制，这是因为实施自组织过程时，无需将因设计电路载体而产生的实际情况考虑在内。此外，所用承载件的任务仅在于利用自组织过程对元件进行暂时性安装，承载件可以为实现这个任务而进行最佳预处理。因为除元件的排列外，设计时无需对其他结构性限制加以考虑。
根据本发明的一种有利建构方案，将元件固定在电路载体上后，从元件上移除承载件。其优点在于，随后可将承载件提供给其他自组织过程，从而提高所述方法的效率。为实现自组织过程，所述承载件优选地进行如此的预处理，使得暂时放置在承载件上的元件的积聚和脱落是一个可逆过程(参见下文)。由此使用承载件带来了另一优点，即：为了将元件暂时放置在承载件上而须对承载件进行的预处理只需进行一次，随后可在同一批次的多个电路载体上重复进行安装过程。而在现有技术中，每个电路载体都须接受以实现自组织过程为目的的预处理。
此外，如果通过焊接实现元件在电路载体上的固定，是有利的。焊接连接可有利地在元件和电路载体之间产生极为可靠、负荷能力极好的连接，从而确保焊接固定结束后承载件的顺利移除。此外，元件在电路载体上的安装过程以焊接过程为终点，而承载件还能在实施这个处理步骤的过程中稳定元件在电路载体上的位置。
为了进行焊接，在承载件被放置到电路载体上之前，通过其他自组织过程将由焊料构成的焊粒安置在元件的接触面上，这是有利的。所述其他自组织过程可在单独的处理步骤中进行，借此可以用可靠的方式为位于承载件上的元件配备精确定量的焊料。但如果在同一个工序内进行元件和焊粒的自组织过程，是特别有利。借此可有利地提高所述方法的效率，进而实现更高的经济效益。整合自组织过程时，每个自组织过程必须采用自己的自组织机制，以此确保选择性。在此情况下，焊粒在元件接触面上的自组织方式不会受到元件在电路载体上的组织方式的影响，从而可避免焊粒取代元件沉积在承载件上。如果需要在元件的自组织过程中同时将多种类型的元件放置在电路载体上，则各种类型的元件之间也须采用不同的自组织过程机制，所述自组织过程机制之间不得存在兼容性。只有这样才能确保承载件上的相应位置只被应该占据这些位置的元件所占据。
根据本发明的另一实施方案，在所述承载件被放置到电路载体上之前，通过其他自组织过程将由焊料构成的焊粒安置在电路载体上为元件而设置的接触面上。其优点在于，焊料的自组织过程在任何情况下都与承载件分离进行，因此，将元件放置在承载件上的过程可针对各种不同的元件类型而设计得更复杂。此外，一种焊料颗粒的施加是相对简单的自组织过程，因为焊料颗粒具有不确定的几何形状，因而无需以确定的定向安置在电路载体上。采用本发明的这种实施方案时，虽然须对电路载体进行预处理来实现用于施加焊料的自组织过程(与现有技术相似)，但这个自组织过程的实施相对而言简单得多，因此，电路载体的实际情况对这个自组织过程的限制小于所述元件自组织放置过程的限制，其中，所述元件甚至有可能彼此互不相同。
如果通过所述其他自组织过程在所述接触面上安置单层焊粒，就特别有利。其优点在于，通过这种方式可特别精确地确定所施加的焊料的量，因为通过接触面的面积可精确定义焊料量。此外，只能沉积一层焊粒(即焊粒无法积聚在一起)的自组织过程特别容易实施。如果这些焊粒具有基本一致的尺寸，就可特别精确地规定所产生的焊料沉积物的几何形状。借此还可特别精确地规定每个接触面上需要施加的焊料量。
此外，本发明还涉及一种安装系统，用于制备配有复数个元件的电路载体。如果这个安装系统要允许通过自组织过程将元件安装到电路载体上，就须在这个安装系统内以实现自组织过程为目的对所述那些元件和用于承载元件的衬底进行预处理。根据上文所述的现有技术，这一点通过在所述元件和对应的衬底上制备适当的表面区域而实现，由此形成所述安装系统。
据此，本发明的另一目的是提供一种用于制备配有复数个元件的电路载体的安装系统，这种安装系统可以比较全面地对所述待安装的电路载体和待安装的元件所规定的边缘条件加以考虑。
根据本发明，达成这个目的的所述安装系统解决方案为：所述安装系统包括：一个用于待安装元件且与待安装电路载体相匹配的承载件；和所述待安装元件。其中，所述元件上与安装侧相对的背面和所述承载件的表面都配有表面区域，在对电路载体安装要求加以考虑的情况下，这些表面区域允许所述元件在承载件上进行自组织排列。其中，设置有不同类型的可被固定在承载件上的元件，确保所述元件在承载件上定位的确定性的方法是，为每一种元件的表面区域和承载件上与此对应的表面区域，设置一种自组织作用原理，所述自组织作用原理相对于所有其他类型的元件的自组织作用原理而言具有选择性。
通过所述安装系统可实现上文已针对本发明的方法加以说明的诸多优点。在所述安装系统进行制备的过程中，只需在以下方面对所述待安装电路载体加以考虑，即：所述元件必须正好以电路载体安装所需的排列方式布置在所述承载件上(电路载体无需平整)。在处理用于实现元件在承载件上的自组织的表面时，无需对所述待安装电路载体加以考虑。只需确保承载件与元件之间能进行简单的相互作用。由承载件和元件(为进行自组织过程而进行了预处理)构成的上述安装系统，可作为安装系统进行销售。而需要用这种安装系统进行安装的电路载体的来源可随意不限。如果所述元件在承载件上的自组织过程为可逆过程，所述承载件可有利地多次用于电路载体安装。
附图说明
下面借助附图对本发明的其他技术细节进行说明。各附图中所示的相同或彼此相符的元件均用相同的参考符号表示，只有在附图间产生差别的情况下，才对这些元件进行重复说明。其中：
图1至图4为本发明方法的各个实施例的选定处理步骤；
图1为本发明的安装系统的实施例。
具体实施方式
图1显示的是将电接触元件11放置在图1中未示出的电路载体12(参见图4)过程的第一处理步骤。为了进行用以产生元件11的预期排列的自组织过程，需要使用承载件13。其中，元件11和承载件13上均已布置有用于触发自组织过程的互补表面区域。为实现自组织过程，即为了产生元件11在承载件13的表面15上的预期排列，将元件11和承载件13放入(例如)装有水的容器16中(由表面区域14a、14b触发的自组织过程会在水中发生作用)。
通过自组织过程可产生元件11在电路载体12上的预期排列，而无需为此对这些元件11进行个别操作。一个移动容器可对上述自组织过程提供支持，其中，向表面15输送元件11的工作得到简化。
与此同时，借助其他自组织过程可在接触面18a上安置焊粒17。如果这个自组织过程与先前提到的自组织过程同时进行，这两个过程就不得彼此兼容，其结果是焊粒17以双向箭头19所示的方式受到承载件13的表面区域14b的推斥。同样地，焊粒17也不得积聚在元件的表面区域14a上，表面区域14a是为承载件上的表面区域14b而设置。接触面18a的表面与焊粒17的表面彼此相吸，借此可将球形焊粒安置在预定的使用位置上。
根据图2所示，作为图1所示的处理步骤的第二部分的替代方案，也可在一个单独步骤中将焊粒17安置到电路载体12上。这个步骤同样在装有水的容器16内进行。焊粒17依据上述机制积聚在电路载体的接触面18b上。在此情况下就无需再进行图1所示的焊粒17的积聚过程。
一种附图未作图示的方法是，在一个单独步骤中将焊粒安置在已固定于承载件13上的元件11上。所述方法的这种方案可在图1所示的装置中进行，其不同之处仅在于，第一步骤是将元件11放入容器11中，只有当所有元件都被放置在承载件上后，才加入焊粒。当然，焊粒17的施加也可在单独的容器内进行。
焊粒17所具有的尺寸使其足以用作实现接触块的焊料沉积物，特别是足以实现倒装芯片的安装。也就是说，每个接触面18a或18b上都正好沉积有一个焊粒。图2还显示了一种使用焊粒17a的替代方案，其中，焊粒17a的直径远小于焊粒17的直径。因此，焊粒17a可以单层的形式积聚在接触面18b上，借此可有利地产生体积小得多的焊料沉积物。图1、图3和图4并未对替代方案所用的焊粒17a进行图示，其中，可以类似方式借助由此而产生的焊料沉积物来实施所述方法。除球形外，焊粒17a也可呈圆柱形或不规则形状，其中，这些焊粒整体而言具有基本相同的尺寸是有利的，因为借此可产生具有恒定厚度的单层。
下面对图1和图2所示的自组织过程进行进一步说明。自组织就像一个热力学过程，其中系统看似自动地形成一种秩序。事实上，此处所利用的自组织的本质是在界面(在本实施例中为固/液界面，当然还也可以是固/气或液/气界面)上的自发形成有序的结构。其中，当自组织实现预期形式时，就达到了能量最小值。换言之，单个的自组织成分在斥力和引力的作用下以预期方式进行排列，其中，上述力可产生自形状、表面性质、电荷、极性、磁矩、质量或其他任意类型的编码信息。
下面对将焊粒安置在接触面上所适用的自组织过程的特殊示例进行说明。所述接触面用金、银或铜制成。在这些金属构成的表面上，不同分子的硫醇基可以化学方式积聚在这些表面上。其中，从硫醇基中分离出一个氢原子，形成金属硫醇合成物(Metall-Thiolatverbindung)。举例而言，硫醇可使用具有烷基链(Alkan-kette)的烷基硫醇(Alkanthiole)，其中，硫醇基位于烷基链的末端。由于硫醇基彼此相邻地积聚在接触面的表面，因而形生平行定向且突出在接触面表面上的烷基链。如果为焊粒配备蜡层，决定接触面表面性质的烷基链和焊粒表面所具有的亲脂性会强烈促进二者间的结合，其结果是焊粒在接触面上发生自组织积聚。作为替代方案，也可在第一处理步骤中，通过烷基硫醇的长链烷基部分使烷基硫醇积聚在焊粒的涂蜡表面，使得焊粒在被放入容器16后积聚在接触面18a上，在此情况下，无需对接触面18a进行进一步预处理。
也可将烷基硫醇布放在元件11的背面20的适当金属表面上，从而为耦合其他寡核苷酸(Oligonucleotide)创造条件。在此方案中，可挑选出各个互补对，其中，互补对中的一方可安置在承载件的接触面14b上，其另一方可安置在元件11的背面20的接触面14a上。借此可确保元件11在承载件13上的自组织放置。为实现元件11的明确定向，也可选出多个寡核苷酸互补对，所述互补寡核苷酸对只允许元件在一个定向上实现自组织放置。
图3显示的是如何将带有元件11的承载件13放置在电路载体12上的方法，其中，元件11提前积聚在承载件13上，其安装侧21朝向电路载体。焊粒17根据图1和图2所示的具体处理方式固定在接触面18a或18b上。在各个其他接触面上，只需将元件11平放在电路载体12上就可实现接触。承载件13最初可留在原处，用于稳定元件，以及通过自重增大对元件11的压紧力。
根据图4所示，已进行过将焊粒17变成焊接连接22的焊接过程，焊接连接22与接触面18a和18b的材料产生接合。元件11与电路载体12焊接在一起后就可移除承载件13。焊接过程产生的热量也可解除承载件13与元件11之间原来的连接。承载件13与元件11之间的结合强度在任何情况下都小于焊接连接22的强度，因此，焊接连接22会在移除承载件13时变形，并使元件11留在电路载体12上。

Claims (9)

1.通过电接触元件(11)的安装侧(21)将所述电接触元件(11)放置在一个电路载体(12)上的方法，包括：通过一自组织过程实现所述元件的预期排列，其中：
-首先，通过所述元件(11)上与安装侧(21)相对的背面(20)将所述元件(11)固定在一承载件(13)上，为此，事先为所述元件(11)的背面(20)和所述承载件(13)的表面配备用于触发所述元件(11)自组织过程的表面区域，
-将所述承载件(13)定向，使所述元件(11)的安装侧(21)面朝所述电路载体(12)，并将所述承载件放置在所述电路载体上，以及
-将所述元件(11)固定在所述电路载体(12)上，
其特征在于，
将不同类型的元件(11)固定在所述承载件(13)上，其中，确保所述元件(11)在所述承载件(13)上定位的确定性的方法是，为每一种元件(11)的表面区域和所述承载件(13)上与此对应的表面区域的建立，选择一种自组织作用原理，所述自组织作用原理相对于所有其他类型的元件(11)自组织作用原理而言具有选择性。
2.根据权利要求1所述的方法，其特征在于，
将所述元件(11)固定在所述电路载体(12)上后，从所述元件(11)上移除所述承载件(13)。
3.根据上述权利要求中任一项权利要求所述的方法，其特征在于，
通过焊接实现所述元件(11)在所述电路载体(12)上的固定。
4.根据权利要求3所述的方法，其特征在于，
在所述承载件(13)被放置到所述电路载体(12)上之前，通过其他自组织过程将由焊料构成的焊粒(17，17a)安置在所述元件(11)的接触面(18a)上。
5.根据权利要求4所述的方法，其特征在于，
在同一个工序内进行所述元件(11)和所述焊粒(17，17a)的自组织过程。
6.根据权利要求3所述的方法，其特征在于，
在所述承载件(13)被放置到所述电路载体(12)上之前，通过其他自组织过程将由焊料构成的焊粒(17，17a)安置在所述电路载体(12)的为所述元件(11)而设置的接触面(18b)上。
7.根据权利要求4至6中任一项权利要求所述的方法，其特征在于，
通过所述其他自组织过程在那些接触面(18b)上安置单层焊粒(17，17a)。
8.根据权利要求7所述的方法，其特征在于，
所述焊粒(17，17a)具有基本均匀的尺寸。
9.安装系统，用于制备配有复数个元件(11)的电路载体(12)，包括：
-一个用于待安装元件(11)且与所述待装配的电路载体(12)相匹配的承载件(13)和
-所述待安装元件(11)，
其中，所述元件(11)上与安装侧相对的背面(20)和所述承载件(13)的表面配有表面区域，在考虑所述电路载体安装需求的情况下，所述表面区域允许所述元件在所述承载件上进行自组织排列，
其特征在于，
设置有不同类型的可被固定在所述承载件(13)上的元件(11)，确保所述元件(11)在所述承载件(13)上定位的确定性的方法是，为每种元件(11)的表面区域和所述承载件上与此对应的表面区域设置一种自组织作用原理，所述自组织作用原理相对于所有其他种类的元件(11)的自组织作用原理而言具有选择性。
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