CN101412133B - 一种电子器件的解焊方法及其解焊装置 - Google Patents
一种电子器件的解焊方法及其解焊装置 Download PDFInfo
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- CN101412133B CN101412133B CN2008102244429A CN200810224442A CN101412133B CN 101412133 B CN101412133 B CN 101412133B CN 2008102244429 A CN2008102244429 A CN 2008102244429A CN 200810224442 A CN200810224442 A CN 200810224442A CN 101412133 B CN101412133 B CN 101412133B
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CN2008102244429A CN101412133B (zh) | 2008-10-15 | 2008-10-15 | 一种电子器件的解焊方法及其解焊装置 |
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CN2008102244429A CN101412133B (zh) | 2008-10-15 | 2008-10-15 | 一种电子器件的解焊方法及其解焊装置 |
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CN101412133A CN101412133A (zh) | 2009-04-22 |
CN101412133B true CN101412133B (zh) | 2012-05-30 |
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CN2008102244429A Expired - Fee Related CN101412133B (zh) | 2008-10-15 | 2008-10-15 | 一种电子器件的解焊方法及其解焊装置 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101961825A (zh) * | 2009-07-23 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 主板维修方法 |
CN102284761B (zh) * | 2010-06-17 | 2014-05-28 | 纬创资通股份有限公司 | 电子元件解焊方法以及导热模块 |
CN102686044A (zh) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | 一种bga芯片返修更换时清除焊盘残余焊锡的方法 |
CN102837093B (zh) * | 2012-09-29 | 2014-11-05 | 中国东方电气集团有限公司 | 一种钇系高温超导带材的焊接方法 |
CN105983743A (zh) * | 2015-01-28 | 2016-10-05 | 泓准达科技(上海)有限公司 | 一种半导体元器件解焊方法 |
CN112719502B (zh) * | 2019-10-28 | 2022-05-31 | 技嘉科技股份有限公司 | 解焊用高温容器以及解焊设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5072874A (en) * | 1991-01-31 | 1991-12-17 | Microelectronics And Computer Technology Corporation | Method and apparatus for using desoldering material |
JP2000151093A (ja) * | 1998-11-13 | 2000-05-30 | Nec Corp | 半導体パッケージの取り外し方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US5072874A (en) * | 1991-01-31 | 1991-12-17 | Microelectronics And Computer Technology Corporation | Method and apparatus for using desoldering material |
JP2000151093A (ja) * | 1998-11-13 | 2000-05-30 | Nec Corp | 半導体パッケージの取り外し方法 |
Non-Patent Citations (1)
Title |
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JP特开平6-6024A 1994.01.14 |
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CN101412133A (zh) | 2009-04-22 |
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Owner name: TSINGHUA UNIVERSITY Free format text: FORMER OWNER: WEIXINNUO SCIENCE AND TECHNOLOGY CO., LTD., BEIJING WEIXINNUO DISPLAY TECH CO., LTD. Effective date: 20140422 Owner name: KUNSHAN VISIONOX TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: TSINGHUA UNIVERSITY Effective date: 20140422 |
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Free format text: CORRECT: ADDRESS; FROM: 100084 HAIDIAN, BEIJING TO: 215300 SUZHOU, JIANGSU PROVINCE |
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Effective date of registration: 20140422 Address after: 215300 Kunshan high tech Zone, Jiangsu Province, Feng Feng Road, No. 188, No. Patentee after: KUNSHAN VISIONOX TECHNOLOGY CO., LTD. Patentee after: Tsinghua University Address before: 100084 room 111, Ho Tim building, Tsinghua University, Beijing Patentee before: Tsinghua University Patentee before: Weixinnuo Science and Technology Co., Ltd., Beijing Patentee before: Weixinnuo Display Tech Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20171015 |
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CF01 | Termination of patent right due to non-payment of annual fee |