CN101961825A - 主板维修方法 - Google Patents

主板维修方法 Download PDF

Info

Publication number
CN101961825A
CN101961825A CN2009103047009A CN200910304700A CN101961825A CN 101961825 A CN101961825 A CN 101961825A CN 2009103047009 A CN2009103047009 A CN 2009103047009A CN 200910304700 A CN200910304700 A CN 200910304700A CN 101961825 A CN101961825 A CN 101961825A
Authority
CN
China
Prior art keywords
maintaining
mainboard
memory slot
memory bank
spare memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009103047009A
Other languages
English (en)
Inventor
夏易
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2009103047009A priority Critical patent/CN101961825A/zh
Priority to US12/603,644 priority patent/US8250722B2/en
Publication of CN101961825A publication Critical patent/CN101961825A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y10T29/4975—Repairing by shaping, e.g., bending, extruding, turning, etc. including heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种主板维修方法，包括以下步骤：利用球栅阵列结构返修台及喷嘴对主板上的不良内存插槽的焊锡加热；焊锡熔化后取下该不良内存插槽；将一钢条装于一备用内存插槽上；检测该备用内存插槽底面的平整度；及检测合格后将该备用内存插槽对准安装于主板上。本发明主板维修方法可维修具有贴装不良的内存插槽的主板，维修成功率高。

Description

主板维修方法
技术领域
本发明涉及一种维修方法，特别是一种可维修具有贴装不良的DIMM(Dual InlineMemory Module，双列直插内存模块)插槽的主板的方法。
背景技术
DIMM(Dual Inline Memory Module，双列直插内存模块)是继SIMM(Single InlineMemory Module，单列直插内存模块)以来又一新规格的直插内存模组。同样采用DIMM，SDRAM(Synchronous Dynamic Random Access Memory，同步动态随机存取存储器)的接口与DDR(Dual Date Rate SDRAM，也就是双倍速率SDRAM，简称DDR)内存的接口略有不同，SDRAM DIMM为168Pin DIMM结构，金手指每面为84Pin，金手指上有两个卡口，用来避免插入插槽时，错误将内存反向插入而导致烧毁；双倍速率DIMM系列的内存模组分为DDR DIMM、DDR2DIMM及DDR3DIMM三种，现在较常用的是DDR DIMM及DDR2DIMM，随着对主板性能要求的提升以及未来主板生产的发展趋势，DDR3DIMM已逐渐应用于许多主板上。DDR DIMM及DDR2DIMM插槽的固定方式是将其底面的针脚插入主板的PTH(Plated-Through-Hole，镀通孔技术)孔内，使DDR DIMM及DDR2DIMM插槽的针脚与主板的对应走线连接。
而DDR3DIMM插槽是通过SMT(Surface Mounted Technology，表面贴装技术)贴装于主板上的，在SMT贴装过程中会出现空焊、连锡(相邻针脚之间)、少锡、偏位等不良，导致主板不良，维修SMT元件主要有两种方法：一是使用钳形烙铁，在SMT元件侧面绕一圈较粗的焊锡丝，用钳形烙铁夹住元件，烙铁头的热量经熔化的焊锡传到每只引脚，停留几秒即可轻轻取下SMT元件。这种方法取下的SMT元件不能再用，而且大面积熔化的高温焊锡可能损坏电路板。另一种方法是用热风枪吹焊，待所有引脚焊锡熔化后，轻轻取下SMT元件，最后用吸锡带清理焊盘。但是，上述两种维修方法均只能针对较小的SMT元件，对于较大的SMT元件，例如DDR3DIMM插槽，其针脚分布的区域较大，烙铁或者热风枪的热量无法在很短的时间内使所有锡点熔化，因此利用传统的方法无法拆卸不良的DDR3DIMM插槽，具有不良DDR3DIMM插槽的主板常无法维修，导致整个主板报废，造成极大的浪费。
发明内容
鉴于以上内容，有必要提供一种能维修贴装不良的内存插槽的主板维修方法。
一种主板维修方法，包括以下步骤：利用球栅阵列结构返修台及喷嘴对主板上的不良内存插槽的焊锡加热；焊锡熔化后取下该不良内存插槽；将一钢条装于一备用内存插槽上；检测该备用内存插槽底面的平整度；及检测合格后将该备用内存插槽对准安装于主板上
相较于现有技术，本发明主板维修方法利用喷嘴对不良内存插槽下的焊锡加热，利用钢条协助检查备用内存插槽的平整度，可成功的完成拆卸及更换内存插槽的步骤，维修成功率高。
附图说明
图1是本发明较佳实施方式主板维修方法的流程图。
图2是本发明较佳实施方式主板维修方法所用到的一钢片的示意图。
图3是本发明较佳实施方式主板维修方法所用到的一钢条的示意图。
图4是本发明较佳实施方式主板维修方法所用到的一喷嘴的示意图。
具体实施方式
请参阅图1，本发明较佳实施方式主板维修方法包括以下步骤：
S01：准备维修工具；所述维修工具包括BGA(Ball Grid Array，球栅阵列结构)返修台、锡膏、助焊膏、清洗剂、40X显微镜(40倍放大)、吸锡线、烙铁、3-D显微镜、X-RAY(X射线)检测设备、喷嘴、钢片、钢条等。其中钢片10、钢条20、喷嘴30的示意图可参阅图2至图4。
S02：将钢片10插入主板的不良DIMM插槽中。该钢片10的下端与DIMM卡的金手指的形状相仿，可紧紧地插入DIMM插槽中；该钢片10的上端开设一缺口12，作为返修台、检测设备摆放对齐时的参考点使用，靠近所述缺口的下方开设一对通孔14，镊子的两脚可伸进通孔内，夹起所述钢片10。
S03：所述BGA返修台的加热器产生的热气流通过所述喷嘴30吹向所述DIMM插槽，使DIMM插槽下的锡球坍塌融化。所述喷嘴30下端的长度(如图4所示的一对平行线)与DIMM插槽的长度一致，可使热气流分散到不良内存插槽的中间和两边。
S04：利用镊子伸进所述钢片10的两通孔14内夹起钢片10，以将该不良DIMM插槽自主板取下。利用钢片10及镊子可以防止直接用手操作碰触影响到主板上的其它元件。
S05：清洁不良内存插槽下的DIMM焊盘；此步骤中可利用烙铁将焊盘残留的焊锡清理干净、平整，也可使用吸锡线和扁铲形烙铁头进行清理，操作时务必注意不要损坏焊盘和阻焊膜，电烙铁温度使用烙铁测温仪校验，一般调整在385℃左右。然后用清洗剂(可用异丙醇)将助焊剂残留物清洗干净。
S06：利用40倍放大的显微镜检查清洁后的焊盘。
S07：印刷锡膏。由于主板上有其它元器件，因此必须采用BGA专用小模板，模板厚度一般采用0.15或0.13MM，模板与主板的PCB(Printed Circuit Board，印刷电路板)需固定紧密结合好，印刷时尽量做到不重复印刷，保证印刷质量，如有少数焊盘未印刷好，可以点涂修理；如大面积不良，必须重新印刷。
S08：利用40倍放大的显微镜检查所述锡膏。
S09：测量并记录所述锡膏的高度，锡膏的高度必须在规定的范围内，焊锡的高度不能有起伏，以免影响SMT贴装质量。
S10：将钢条20装于一备用内存插槽上，可协助检查该备用插槽底面的平整度。
S11：检测该备用内存插槽底面的平整度。
S12：将该备用内存插槽对准安装于主板上。此步骤具体包括贴装及固化两步骤。贴装是将所述备用内存插槽准确安装到PCB的固定位置上。固化的作用是将贴片胶融化，从而使所述备用内存插槽与PCB板牢固粘接在一起；所用设备为固化炉，位于SMT生产线中贴片机的后面。
S13：X-RAY检查。使用X-RAY检查焊接好的BGA是否有桥连，测量出BGA球的直径，目视检查BGA四周是否平整，无歪斜现象以及周边焊点质量。

Claims (9)

1.一种主板维修方法，包括以下步骤：
利用球栅阵列结构返修台及喷嘴对主板上的不良内存插槽的焊锡加热；
焊锡熔化后取下该不良内存插槽；
将一钢条装于一备用内存插槽上；
检测该备用内存插槽底面的平整度；及
检测合格后将该备用内存插槽对准安装于主板上。
2.如权利要求1所述的主板维修方法，其特征在于：所述主板维修方法还包括在所述加热的步骤之前将一钢片插入所述不良内存插槽中；焊锡融化后用镊子夹取所述钢片即可取下不良内存插槽。
3.如权利要求1所述的主板维修方法，其特征在于：所述喷嘴在所述加热的步骤中使热气流分散到不良内存插槽的中间和两边。
4.如权利要求1所述的主板维修方法，其特征在于：所述维修方法还包括在取下所述该不良内存插槽的步骤之后清洁不良内存插槽下的焊盘区的步骤。
5.如权利要求4所述的维修方法，其特征在于：所述维修方法还包括在所述清洁的步骤之后利用显微镜检查所述焊盘区的步骤。
6.如权利要求5所述的维修方法，其特征在于：所述维修方法还包括在所述用显微镜检查所述焊盘区的步骤之后在所述在焊盘上印刷锡膏的步骤。
7.如权利要求6所述的维修方法，其特征在于：所述维修方法还包括在所述印刷锡膏的步骤之后利用显微镜检查所述锡膏的步骤。
8.如权利要求7所述的维修方法，其特征在于：所述维修方法还包括在所述检查锡膏的步骤之后测量所述锡膏的高度的步骤。
9.如权利要求8所述的维修方法，其特征在于：所述将备用内存插槽对准安装于主板上的步骤包括贴装及固化两步骤；贴装是将所述备用内存插槽准确安装到主板上的对应位置上；固化是将贴片胶融化，从而使所述备用内存插槽与主板牢固粘接在一起。
CN2009103047009A 2009-07-23 2009-07-23 主板维修方法 Pending CN101961825A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009103047009A CN101961825A (zh) 2009-07-23 2009-07-23 主板维修方法
US12/603,644 US8250722B2 (en) 2009-07-23 2009-10-22 Method for repairing motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103047009A CN101961825A (zh) 2009-07-23 2009-07-23 主板维修方法

Publications (1)

Publication Number Publication Date
CN101961825A true CN101961825A (zh) 2011-02-02

Family

ID=43496026

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009103047009A Pending CN101961825A (zh) 2009-07-23 2009-07-23 主板维修方法

Country Status (2)

Country Link
US (1) US8250722B2 (zh)
CN (1) CN101961825A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231138A (zh) * 2013-05-08 2013-08-07 无锡江南计算技术研究所 Bga植球单点返修方法
CN103796435A (zh) * 2014-01-16 2014-05-14 广州兴森快捷电路科技有限公司 测量线路板层压偏位的方法
CN105830545A (zh) * 2013-11-11 2016-08-03 恩德莱斯和豪瑟尔两合公司 用于修复具有至少一个缺陷部件的电路板的方法
CN108247281A (zh) * 2018-01-22 2018-07-06 天津深之蓝海洋设备科技有限公司 一种水下推进器的上壳组件的维修工艺
CN112296473A (zh) * 2020-11-24 2021-02-02 滨州学院 一种计算机主板用高效清理控制装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201307832A (zh) * 2011-08-01 2013-02-16 Hon Hai Prec Ind Co Ltd 模仁成型面檢測方法
EP2973109A4 (en) * 2013-03-15 2016-11-02 Mmodal Ip Llc DYNAMIC WORKFLOW FOR SUPERBILLCODING
US10817949B1 (en) 2014-10-06 2020-10-27 State Farm Mutual Automobile Insurance Company Medical diagnostic-initiated insurance offering
US10664920B1 (en) 2014-10-06 2020-05-26 State Farm Mutual Automobile Insurance Company Blockchain systems and methods for providing insurance coverage to affinity groups
US11574368B1 (en) 2014-10-06 2023-02-07 State Farm Mutual Automobile Insurance Company Risk mitigation for affinity groupings
US20210166320A1 (en) 2014-10-06 2021-06-03 State Farm Mutual Automobile Insurance Company System and method for obtaining and/or maintaining insurance coverage
US10713728B1 (en) 2014-10-06 2020-07-14 State Farm Mutual Automobile Insurance Company Risk mitigation for affinity groupings
CN114012380A (zh) * 2021-11-03 2022-02-08 西华大学 一种计算机用主板安装装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1244729A (zh) * 1998-06-24 2000-02-16 国际商业机器公司 用于隔绝湿敏塑料球栅阵列组件的方法和设备
US20070211426A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212906A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
CN201023165Y (zh) * 2006-08-21 2008-02-20 李功明 自控温红外线返修台
CN101412133A (zh) * 2008-10-15 2009-04-22 清华大学 一种电子器件的解焊方法及其解焊装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1244729A (zh) * 1998-06-24 2000-02-16 国际商业机器公司 用于隔绝湿敏塑料球栅阵列组件的方法和设备
US20070211426A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212906A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
CN201023165Y (zh) * 2006-08-21 2008-02-20 李功明 自控温红外线返修台
CN101412133A (zh) * 2008-10-15 2009-04-22 清华大学 一种电子器件的解焊方法及其解焊装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103231138A (zh) * 2013-05-08 2013-08-07 无锡江南计算技术研究所 Bga植球单点返修方法
CN103231138B (zh) * 2013-05-08 2015-10-07 无锡江南计算技术研究所 Bga植球单点返修方法
CN105830545A (zh) * 2013-11-11 2016-08-03 恩德莱斯和豪瑟尔两合公司 用于修复具有至少一个缺陷部件的电路板的方法
US10237982B2 (en) 2013-11-11 2019-03-19 Endress+Hauser Se+Co.Kg Solder application stamp for applying solder on contact locations possessing small dimensions
CN105830545B (zh) * 2013-11-11 2019-08-20 恩德莱斯和豪瑟尔欧洲两合公司 用于修复具有至少一个缺陷部件的电路板的方法
CN103796435A (zh) * 2014-01-16 2014-05-14 广州兴森快捷电路科技有限公司 测量线路板层压偏位的方法
CN103796435B (zh) * 2014-01-16 2017-08-11 广州兴森快捷电路科技有限公司 测量线路板层压偏位的方法
CN108247281A (zh) * 2018-01-22 2018-07-06 天津深之蓝海洋设备科技有限公司 一种水下推进器的上壳组件的维修工艺
CN112296473A (zh) * 2020-11-24 2021-02-02 滨州学院 一种计算机主板用高效清理控制装置

Also Published As

Publication number Publication date
US8250722B2 (en) 2012-08-28
US20110016687A1 (en) 2011-01-27

Similar Documents

Publication Publication Date Title
CN101961825A (zh) 主板维修方法
CN102472711B (zh) 基板检查装置
US6911388B2 (en) Individual selective rework of defective BGA solder balls
US7469457B2 (en) Method of removing integrated circuit chip package and detachment jig therefor
US11039561B2 (en) Component mounting system and adhesive inspection device
CN102151927A (zh) 一种封装集成电路的焊柱焊接方法
JP2015153935A (ja) 基板検査装置及び部品実装装置
JP5893455B2 (ja) 電子部品の製造方法
CN111148427A (zh) 垛形/i形预置焊料端子连接器的返修工艺
CN111482670B (zh) 电子元件焊接方法
CN110739228B (zh) 一种快速贴装bga芯片的方法
US20090310318A1 (en) Attaching a lead-free component to a printed circuit board under lead-based assembly conditions
JP3254459B2 (ja) 微小ハンダ供給方法及び微小ハンダ供給装置
JP2011258749A (ja) 電子部品の実装方法、電子部品の取り外し方法及び配線板
TWI389620B (zh) A Method and System for Reducing Passive Components on Printed Circuit Boards
JP2006332120A (ja) はんだ付け方法とそれを用いたプリント配線板
CN218300528U (zh) 一种用于多排长针板间电连接器的预焊接装置
CN221127579U (zh) 一种bga返修控制装置
CN216017610U (zh) 一种灯珠芯片激光返修发热平台
JP2008260040A (ja) 残留はんだ除去装置および残留はんだ除去方法
US20070181640A1 (en) Lead-free solder reworking system and method thereof
JP5273841B2 (ja) プローブ実装方法
CN113115521B (zh) 一种微波组件粘接工艺集成器件的返工返修装置及方法
BRPI0900416A2 (pt) sistema de teste e método de testagem do mesmo
Krammer et al. Method for selective solder paste application for BGA rework

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned

Effective date of abandoning: 20110202

C20 Patent right or utility model deemed to be abandoned or is abandoned