CN101389184A - 印刷电路板的组合式贯孔结构 - Google Patents
印刷电路板的组合式贯孔结构 Download PDFInfo
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- CN101389184A CN101389184A CNA2007101492605A CN200710149260A CN101389184A CN 101389184 A CN101389184 A CN 101389184A CN A2007101492605 A CNA2007101492605 A CN A2007101492605A CN 200710149260 A CN200710149260 A CN 200710149260A CN 101389184 A CN101389184 A CN 101389184A
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- perforation
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2007101492605A CN101389184B (zh) | 2007-09-10 | 2007-09-10 | 印刷电路板的组合式贯孔结构 |
Applications Claiming Priority (1)
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CN2007101492605A CN101389184B (zh) | 2007-09-10 | 2007-09-10 | 印刷电路板的组合式贯孔结构 |
Publications (2)
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CN101389184A true CN101389184A (zh) | 2009-03-18 |
CN101389184B CN101389184B (zh) | 2010-08-25 |
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CN2007101492605A Active CN101389184B (zh) | 2007-09-10 | 2007-09-10 | 印刷电路板的组合式贯孔结构 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103531485A (zh) * | 2012-07-02 | 2014-01-22 | 旭德科技股份有限公司 | 基板结构的制作方法 |
CN104050328A (zh) * | 2014-06-25 | 2014-09-17 | 上海斐讯数据通信技术有限公司 | 一种pcb保护线布设方法及系统 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6039889A (en) * | 1999-01-12 | 2000-03-21 | Fujitsu Limited | Process flows for formation of fine structure layer pairs on flexible films |
TWI236754B (en) * | 2003-04-18 | 2005-07-21 | Phoenix Prec Technology Corp | Method for plating metal layer over isolated pads on substrate for semiconductor package substrate |
US20050201065A1 (en) * | 2004-02-13 | 2005-09-15 | Regnier Kent E. | Preferential ground and via exit structures for printed circuit boards |
-
2007
- 2007-09-10 CN CN2007101492605A patent/CN101389184B/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103531485A (zh) * | 2012-07-02 | 2014-01-22 | 旭德科技股份有限公司 | 基板结构的制作方法 |
CN104050328A (zh) * | 2014-06-25 | 2014-09-17 | 上海斐讯数据通信技术有限公司 | 一种pcb保护线布设方法及系统 |
Also Published As
Publication number | Publication date |
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CN101389184B (zh) | 2010-08-25 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhu Wan Inventor before: Wei Qixin Inventor before: Fan Wengang |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170703 Address after: 529000, 5, 268 Lan Qing Road, Jianghai District, Guangdong, Jiangmen Patentee after: Jiangmen Cheng Cheng Electronic Industry Co.,Ltd. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170703 Address after: 2414-2416, main building, No. five, No. 371, Tianhe District mountain road, Guangzhou, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: Taipei City, Taiwan, China Patentee before: Yingda Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 519100 Room 301, 1st Floor, 2nd Floor, 3rd Floor, Block B, No. 168, Fushan Second Road, Doumen District, Zhuhai City, Guangdong Province Patentee after: Zhuhai Core Technology Co.,Ltd. Address before: 529000 Building 5, 268 Qinglan Road, Jianghai District, Jiangmen City, Guangdong Province Patentee before: Jiangmen Cheng Cheng Electronic Industry Co.,Ltd. |