200913800 . 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種印刷電路板之組合式貫孔結 構，更詳而言之，係有關於一種應用於至少具有第一、第 -二訊號線、及複數基板之印刷電路板（PCB)上的印刷^ 路板之組合式貫孔結構。 ' 【先前技術】 隨著電子科技的不斷研發與精進，印刷電路板之設 ί亦在不斷發現問題與解決問題的過程中朝向高性能、好^ 質之共同目標發展。因此，在印刷電路板相關設計中，任 何一項改進’只要有益於使用者使用、提高了產品品質及 性能、改善了功能等實質性之功效增進，均為具有產業利 用價值之創作，亦符合專利法鼓勵、保護與利用創作之精 神。 月 目前，印刷電路板的設計過程中，會遇到許許多多的 【貫孔’這些貫孔通常是用以將由複數層面組成的電路板中 ν的某些層面進行電性連通（透過該些貫孔内緣鋪設之導電 材質），或是當某些層面的訊號線需要走向其他層面時， 即可透過該些貫孔進行換層。而對於某些成對的訊號線， 如差分訊號線，不僅最爲常用訊號線，出現頻率很高（如 目前大多主板上之clk、lan、usb等都是差分訊號線）， 而且由於是成對出現且有阻抗匹配之要求（若在走線路徑 的某個地方不滿足阻抗匹配要求將導致傳輸出錯、系統不 穩定或傳輸數據錯誤等問題），所以對該差分訊號線佈線 110325 5 200913800 .走=徑的要求比較高，例如佈設兩差分訊號線時，需要 k田罪^且^里保持平行，以滿^其阻抗匹配之要求。 β仏"b夠按知上述要求對這類訊號線進行佈線，但 疋要另:上述兩訊號線進行阻抗匹配仍然不容易。例如， 至分訊號線在電路板中需要進行上述換層或是與其他電 子元件連接日T $路板上的相關貫孔就會對兩訊號線阻抗 匹喊生干擾，甚至出現電磁干擾（EMI)之狀況，請參 閱=1圖’為-立體不意圖，其顯示差分訊號線換層時通 p k貝孔區域之立體示意圖，如圖所示，圖中所示由第一訊 號線1及第一訊號線2組成差分訊號線，分別經由電路板 之第一貝孔10及第二貫孔2〇貫穿電源層41和接地層43。 由於兩差分訊號線對應之兩貫孔（即第一貫孔丨〇及 第二貫孔20)之間的區域存在貫孔間隙3，而在此貫孔間 隙3中具有導電材質會對該差分訊號線（即第-訊號線i 及第一訊號線2)產生干擾，例如，該貫孔間隙3處之電 p源層41或接地層43中具有導電材質，抑或是其間走線層 (圖中未示）具有其他訊號線’那麼對於貫穿於該電源層 41或該接地層43之差分訊號線，極易受到該電源層41 或該接地層43之貫孔間隙3上的導電材質干擾，使得該 貫孔區域内的差分訊號線之阻抗與其他區域内的差分訊 號線之阻抗有所不同。為更清晰呈現該貫孔區域，請參閱 第2圖’係一平面示意圖’其顯示貫孔之截面示意圖。如 圖所示’該貫孔（即第一貫孔10及第二貫孔2〇)區域中， 該第一訊號線1與第二訊號線2之間存在貫孔間隙3,而 6 110325 200913800 該貫孔間隙3中之導電材質會使得該差分訊號線之阻r 與其他區域内的差分訊號線之阻抗不匹配。且，由於上\ 貫孔區域的導電材質與該差分訊號線能夠產生電磁干擾处 (EMI)，從而影響該差分訊號線之傳輸品質，使得原i 佈線走線路㈣要求較高之差分訊號線在進 得更加困難。 7文 因此，如何提供一種印刷電路板之組合式貫孔結 以消除該貫孔間之間隙上的導電材質對差分訊號線所產 ^之干擾，進而可避免該差分訊號線在走線過程中產生阻 ^相匹g己及電磁干擾之弊端，實為此領域中亟待解決之 【發明内容】 鑒於上述習知技術之缺點，本發明之主要目的在於提 之組合式貫孔結構，以消除該貫孔之間 罢八™产土 ： 干擾，進而可避免該 差分訊號線在走線過程+ & 4 Μ > γ α200913800. Nine, the invention relates to: [Technical field of the invention] The present invention relates to a combined through-hole structure of a printed circuit board, and more particularly, to an application having at least a first, a second A combined through-hole structure of a printed circuit board on a signal line and a printed circuit board (PCB) of a plurality of substrates. '[Prior Art] With the continuous development and advancement of electronic technology, the design of printed circuit boards is also developing towards the common goal of high performance and good quality in the process of continuously discovering problems and solving problems. Therefore, in the related design of printed circuit boards, any improvement is as long as it is beneficial to users, improves product quality and performance, and improves functions, etc. The patent law encourages, protects and uses the spirit of creation. At present, there are many [through-holes] in the design process of printed circuit boards. These through-holes are usually used to electrically connect certain layers of ν in a circuit board composed of multiple layers. The conductive material laid on the inner edge of the through hole), or when the signal lines of some layers need to go to other layers, the layers can be changed through the through holes. For some pairs of signal lines, such as differential signal lines, not only the most commonly used signal lines, but also very high frequency (such as clk, lan, usb, etc. on most motherboards are differential signal lines), and because of the The requirement for impedance matching (if the impedance matching requirement is not met somewhere in the routing path will result in transmission errors, system instability, or transmission data errors), the wiring of the differential signal line is 110325 5 200913800 . The requirement of the path = path is relatively high. For example, when two differential signal lines are arranged, it is necessary to keep the line and keep it parallel, so as to meet the requirements of impedance matching. β仏"b is sufficient to wire such signal lines in accordance with the above requirements, but it is still not easy to perform impedance matching on the above two signal lines. For example, if the sub-signal line needs to be replaced in the circuit board or connected to other electronic components, the relevant through-hole on the T$ board will interfere with the impedance of the two signal lines, and even electromagnetic interference (EMI) may occur. The status of the case, please refer to the figure =1, the stereo is not intended, and it shows the three-dimensional diagram of the pk hole area when the differential signal line is changed. As shown in the figure, the first signal line 1 and the A signal line 2 constitutes a differential signal line, which penetrates the power layer 41 and the ground layer 43 via the first via hole 10 and the second through hole 2 of the circuit board, respectively. Since there is a through-hole gap 3 in a region between the two through holes corresponding to the two differential signal lines (ie, the first through hole and the second through hole 20), the conductive material in the through hole gap 3 will be the difference The signal line (ie, the first signal line i and the first signal line 2) generates interference, for example, the conductive p source layer 41 or the ground layer 43 at the through hole gap 3 has a conductive material or a trace layer therebetween (Fig. The other signal lines are not shown. Therefore, the differential signal lines running through the power layer 41 or the ground layer 43 are highly susceptible to interference from the conductive material on the power layer 41 or the via gap 3 of the ground layer 43. The impedance of the differential signal line in the through-hole area is different from the impedance of the differential signal line in other areas. In order to present the through-hole area more clearly, please refer to Fig. 2' is a schematic plan view showing a cross-sectional view of the through hole. As shown in the figure of the through hole (ie, the first through hole 10 and the second through hole 2 〇), there is a through hole gap 3 between the first signal line 1 and the second signal line 2, and 6 110325 200913800 The conductive material in the via gap 3 causes the resistance of the differential signal line to be mismatched with the impedance of the differential signal line in other regions. Moreover, since the conductive material of the upper hole region and the differential signal line can generate electromagnetic interference (EMI), thereby affecting the transmission quality of the differential signal line, the original i wiring route (4) requires a higher differential signal line. It is more difficult to enter. Therefore, how to provide a combined through-hole junction of a printed circuit board to eliminate the interference of the conductive material on the gap between the through-holes to the differential signal line, thereby avoiding the differential signal line during the routing process; The disadvantages of generating resistance and electromagnetic interference are urgently solved in the field. SUMMARY OF THE INVENTION In view of the above disadvantages of the prior art, the main object of the present invention is to provide a combined through-hole structure to eliminate the Between the through holes, the production of the soil: interference, and thus avoid the differential signal line in the routing process + & 4 Μ > γ α
V 足术幻枉甲產生阻抗不相匹配及電磁 之弊端。 & 為達上述目的以及其他目的，本發明提供_種印刷電 路板之組合式貫孔結構，係應用於至少具有第_、第二訊 基Γ之印刷電路板(PCB)上，複數基板： 二:: 層、及走線層，該印刷電路板之組合V foot surgery illusion armor produces impedance mismatch and electromagnetic drawbacks. In order to achieve the above and other objects, the present invention provides a combined through-hole structure of a printed circuit board for use on a printed circuit board (PCB) having at least a second and a second basis, a plurality of substrates: Two:: layer, and trace layer, the combination of the printed circuit board
式貝孔結構則至少包括：坌I 少匕枯.弟一貝孔，係貫穿該複數基板， 以供穿設該第一訊號線；第二貫孔，係與該第一貫孔間隔 -預定距離，並貫穿該複數基板，用以供穿設該第二訊號 110325 7 200913800 . 線；以及絕緣區域，係對應設於該第一貫孔及該第二貫孔 周邊之電源層與接地層上，並至少涵蓋由該第一貫孔之外 緣向外延伸第一安全距離之區域、該第二貫孔之外緣向外 ' 延伸第二安全距離之區域、以及該第一貫孔與該第二貫孔 - 間之區域。 其中，該第一訊號線與該第二訊號線為組成差分訊號 線對之兩訊號線，該第一貫孔與該第二貫孔則係為差分對 之貫孔。該第一貫孔半徑與該第二貫孔半徑相等；該預定 { 距離係大於該第一安全距離與第二安全距離；該第一安全 距離係該第一訊號線與其他訊號線之間不會發生訊號干 擾之距離；該第二安全距離係該第二訊號線與其他訊號線 之間不會發生訊號干擾之距離；該第一安全距離與該第二 安全距離相等；其中，該第一貫孔的半徑與該第一安全距 離相加之長度為第一安全半徑，該第二貫孔的半徑與該第 二安全距離相加之長度為第二安全半徑，且該第一安全半 徑與該第二安全半徑相等。於該電源層及接地層之該絕緣 .(. v 區域為絕緣材質；於該走線層中之該絕緣區域則不佈設導 線。 相較於習知技術，本發明之印刷電路板之組合式貫孔 結構，主要係於對應差分訊號線對之差分對貫孔周邊設有 一絕緣區域，由該絕緣區域保護組合式之差分貫孔結構， 從而可消除習知技術中由於貫孔之間存在的導電材質對 差分訊號線對產生之干擾，進而避免該差分訊號線對在走 線過程中產生阻抗不相匹配及電磁干擾之弊端。 8 110325 200913800 【實施方式】 以下係藉由特定的具體實例說 式，熟悉此技藝之人士可由本說明書所揭示月之之=方 瞭解本發明之其他優點與功效。本亦 ^ 2易地 的具體實例加以施行戋岸用，^^、3日+ 了碏由其他不同 w 4愿用，本s兄明書中的 基於不同觀點與應用，在不#離 下^亦可 修飾與變更。 仏精神下進行各種The shell hole structure includes at least: 坌I 匕 匕 . 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟 弟a distance between the power supply layer and the ground layer disposed on the first through hole and the second through hole And covering at least a region of the first safety distance extending outward from the outer edge of the first through hole, an outer edge of the second through hole extending outwardly from the second safety distance, and the first through hole and the The second through hole - the area between. The first signal line and the second signal line are two signal lines constituting a differential signal line pair, and the first through hole and the second through hole are differential holes. The first through hole radius is equal to the second through hole radius; the predetermined {distance is greater than the first safety distance and the second safety distance; the first safety distance is not between the first signal line and other signal lines The distance of the signal interference occurs; the second safety distance is a distance between the second signal line and the other signal lines that does not interfere with the signal; the first safety distance is equal to the second safety distance; wherein the first The length of the through hole and the first safety distance are the first safety radius, the length of the second through hole and the second safety distance are the second safety radius, and the first safety radius is The second safety radius is equal. The insulation of the power layer and the ground layer. (. v area is an insulating material; the insulating area in the wiring layer is not provided with a wire. Compared with the prior art, the combination of the printed circuit board of the present invention The through-hole structure is mainly provided with an insulating region around the differential pair of the differential signal pair, and the combined differential via structure is protected by the insulating region, thereby eliminating the existing interference between the through-holes in the prior art. The interference of the conductive material on the differential signal line pair, thereby avoiding the disadvantages of the impedance mismatch and electromagnetic interference of the differential signal line pair during the routing process. 8 110325 200913800 [Embodiment] The following is a specific example Those skilled in the art can understand the other advantages and effects of the present invention by the month disclosed in the present specification. The specific example of the present invention is also applied to the shore, ^^, 3 days + Other different w 4 will be used, this s brother's book based on different viewpoints and applications, can not be modified and changed in the next.
请爹閲第3圖，為—平面示意圖，其顯示本發明 刷電路板之組合式貫孔結構應用於印刷電路板（pa)之 橫截面示意圖。如圖所示，本發明之印刷電路板之組 貫孔結構，係供—印刷電路板之組合式訊號線換層或是^ 其他電子元件連接所需者，其中，該印刷電路板係具有複 數基板4。於本實施例中，該組合式訊號線係以第一訊號 線1及第二訊號線2組成之差分訊號線為例，加以説明， 但不以此為限。 本發明之印刷電路板之組合式貫孔結構，係用以消除 由於該第一及第二貫孔之間存在的導電材質對該差分訊 號線產生之干擾，其中，該第一訊號線1與其他訊號線之 間不會發生訊號干擾之距離為第一安全距離丨〇3 ;該第二 訊號線2與其他訊號線之間不會發生訊號干擾之距離為 第二安全距離2 0 3，該印刷電路板之組合式貫孔結構至少 包括.對應该弟一 §孔说線1且貫穿該基板4而設置之第· 一 貫孔10 ;對應該第二訊號線2且貫穿該基板4而設置之 第二貫孔20 ;以及對應該第一貫孔10及該第二貫孔20 9 110325 200913800 而設置之絕緣區域5。 該第一貫孔1 0，係對應該第一訊號線】貫穿於該基 板4 ,以供該第一訊號線丨貫穿該基板4後，換至其他基 板4進行走線或與其他電子元件連接。且該第一貫孔的半 徑101與該第一安全距離103相加之長度為第一安全半徑 105。 該第二貫孔20，係與該第一貫孔間隔一預定距離 100，對應該第二訊號線2貫穿於該基板4，以供該第二 〇孔號線2貝牙該基板4後’換至其他基板4進行走線或與 其他電子7L件連接，其中，該預定距離丨〇〇係大於該第一 女全距離103與第二安全距離2〇3。且該第二貫孔的半徑 201與該第二安全距離2〇3相加之長度為第二安全 205。 工 該絕緣區域5，係對應該第一貫孔1〇及該第二貫孔 2〇設置於該基板4上’並至少涵蓋三個區域：該第一貫 之外緣向外延伸第—安全距離m之區域、該第二 二孔之外緣向外延伸第二安全距離2Q3之區域以及該 第μ貝孔1Q與該第二貫孔2G間之區域，於該絕緣區域5 =止導體之佈設。該絕緣區域5橫截面外緣係—除去第 一貫孔10及該第二貫孔2〇之封閉圖形，該封閉圖形係包 :门以該第-貫孔10之圓心及該第一安全半徑1〇5所對 應圓=去該第一貫孔1〇之圓環、以該第二貫孔別之圓 :第^安王半徑205對應另—圓形除去該第二貫孔 之Q衣以及上述兩個圓環兩外側切線相連接線内部 110325 10 200913800 . 區域。即，本發明之印屈，丨φ ,A , 令知月心「刷免路板之組合式貫孔 該封閉圖形貫穿於嗜其拓z 。稱知依縣 =貝牙於这基板4，以形成該絕緣區域5。 。月參閱弟4圖，係一立體示青囝，1¾ 一 y •換層時通過本發明之印刷電二差分訊號線 .的卩I路板之組合式I孔結構設計 的只把例不意圖。如圖所示， 9 ^ x 田弟汛唬線1及第二訊號 :、，、成差m線，分別經過由電源層41和接地層43 兩基板上對應之第一貫孔10 ι 41 , a UiU及弟—貝孔2〇貫穿該電源層 忒接地層43。由於本發明之印刷電路板之組合式貫 r孔結構在該第一貫孔1〇與該第二 —貝孔20之間係具有該絕 緣〔域5,而該絕緣區域5内為未怖設導線， 於電路板具有複數基板4,其中至 @=的由 ν，、有包/原層（power ) 二=層（ground)43、及走線層（未圖示），而於該 :、曰及接地層43中之該絕緣區域5為絕緣材質，其 「^电源層41及接地層43 一般來說即為本產業中所稱之 二片層」二於走線層中之該絕緣區域5則不佈設導線。 、之該帛貞孔10及第二貫孔2〇周圍的絕緣區域5 在負片層，而其他走線層不會出現該形狀的絕緣區域， 4表現為該區域内無走線穿過^ 。、本發明之印刷電路板之組合式貫孔結構具有該絕緣 區域^，達到在此處的差分訊號線與其他位置的差分訊號 線阻^相互匹配’亦不會產生電磁干擾。需要説明的是， 、；本只她例中’ 5亥第一訊號線！與該第二訊號2線為組成 差分訊號線對之兩訊號線’該第一貫孔10與該第二貫孔 2〇則係為差分對之貫孔。所以，相對應的，該第一貫孔 π 110325 200913800 .10與該第二貫孔20之尺寸與特性應相同；例如 貫孔10半徑與該第二貫孔2〇半徑相等；上述該弟一 離m與第二安全距離203相等；上述第_安== .:第二安全半徑2°5相等’以配合差分訊號綠對特；： 最後，需要説明的是，本實施例中所示者 無電性連接墊（Pad)，而直接是貝孔周圍 叩直接疋絕緣區域的情況， 為於此層無需與其他零件電性連接而不具有該電性隸 ί塾；當於其他實施例中，貫孔周圍可具有相應的電性^ ，時，此時於本發明之印刷電路板之組合式貫孔結構中= 弟-貝孔10及該第二貫孔20之外圍亦可具有該電 塾（未圖示），相應的，該絕緣區域5則設於該電 塾外圍。因此為所屬技術領域中具有通常知識者可理 者’故不再另纟會圖式表示之。 綜上所述，本發明之印刷電路板之組合式貫孔妗構， f主要係通過在差分訊號線對應之第一貫孔及第二貫2周， U邊以及該第-及第二貫孔之間之區域設計_絕緣區域:以 禁止導體之佈設，從而可消除習知技術中由於貫孔之間疒 在的導電材質對差分訊號線產生之干擾，進而避免該差= 訊號線在走線過程中產生阻抗不相匹配及電磁干擾之敞刀 端。 # 上述實施例僅例示性說明本發明之原理及其功效，而 非用於限制本發明。任何熟習此項技藝之人士均可在不違 月本發明之精神及範疇下，對上述實施例進行修飾與改 110325 12 200913800 * •交。因此，本發明之權利保護範圍，應如後述 範圍所列。 【圖式簡單說明】 第1圖為一立體示意圖，其顯示差分訊號線換層時通 *過習知貫孔結構之立體示意圖； 第2圖為一平面示意圖，其顯示習知貫孔結構之橫截 面示意圖； 苐3圖為—平面示意圖，其顯示本發明之印刷電路板 (之組合式貫孔結構設計之橫截面示意圖；以及 第4圖為一立體示意圖，其顯示差分訊號線換層時通 過本發明之印刷電路板之組合式貫孔結構設計示意圖。 【主要元件符號說明】 1 第一訊號線 2 第二訊號線 10 第一貫孔 20 第二貫孔 100 預定距離 3 貫孔間隙 4 基板 41 電源層 43 接地層 5 絕緣區域 101 第一貫孔的半徑 201 第二貫孔的半徑 110325 13 200913800 .103 第一安全距離 203 第二安全距離 105 第一安全半徑 205 第二安全半徑Referring to Figure 3, there is shown a plan view showing a cross-sectional view of a combined through-hole structure of the brush circuit board of the present invention applied to a printed circuit board (pa). As shown in the figure, the assembled hole structure of the printed circuit board of the present invention is required for the combination of the signal line of the printed circuit board or the connection of other electronic components, wherein the printed circuit board has a plurality of Substrate 4. In this embodiment, the combined signal line is exemplified by a differential signal line composed of the first signal line 1 and the second signal line 2, but is not limited thereto. The combined through-hole structure of the printed circuit board of the present invention is for eliminating interference caused by the conductive material existing between the first and second through holes, wherein the first signal line 1 The distance between the other signal lines will not be the first safety distance 丨〇3; the distance between the second signal line 2 and the other signal lines will not be the second safety distance 2 0 3, The combined through-hole structure of the printed circuit board includes at least a first continuous hole 10 disposed corresponding to the hole 1 and extending through the substrate 4; corresponding to the second signal line 2 and disposed through the substrate 4 a second through hole 20; and an insulating region 5 corresponding to the first through hole 10 and the second through hole 20 9 110325 200913800. The first through hole 10 is corresponding to the first signal line extending through the substrate 4 for the first signal line to pass through the substrate 4, and then switched to the other substrate 4 for routing or connecting with other electronic components. . And the length of the first through hole 101 and the first safety distance 103 is the first safety radius 105. The second through hole 20 is spaced apart from the first through hole by a predetermined distance 100, and the second signal line 2 is inserted through the substrate 4 for the second boring line 2 after the substrate 4 Switching to the other substrate 4 for routing or connecting with other electronic 7L pieces, wherein the predetermined distance 丨〇〇 is greater than the first female full distance 103 and the second safety distance 2〇3. And the length of the second through hole 201 combined with the second safety distance 2〇3 is the second safety 205. The insulating region 5 is disposed on the substrate 4 corresponding to the first through hole 1 〇 and the second through hole 2 ' and includes at least three regions: the first through outer edge extends outwardly - safety a region of the distance m, an outer edge of the second two holes extending outwardly from the second safety distance 2Q3, and a region between the first μ hole 1Q and the second through hole 2G, in the insulating region 5 = the conductor Layout. The outer edge of the cross section of the insulating region 5 is a closed pattern of the first through hole 10 and the second through hole 2, the closed pattern is wrapped by the door with the center of the first through hole 10 and the first safety radius 1〇5 corresponds to the circle=the ring of the first through hole 1〇, and the circle of the second through hole: the second radius 205 corresponds to another circle, and the Q coat of the second through hole is removed The two outer rings of the above two rings are connected to the internal wiring 110325 10 200913800 . That is, the inflection of the present invention, 丨φ, A, and the Zhiyuexin "the combined through-hole of the brush-free road plate, the closed pattern runs through the zigzag z. It is known that the county = bei tooth on the substrate 4, Forming the insulating region 5. The moon is shown in Figure 4, which is a three-dimensional display of green enamel, 13⁄4 y. • The layer I structure design of the 卩I road board of the printed electric two-differential signal line of the present invention. The example is not intended. As shown in the figure, 9 ^ x Tiandi 汛唬 line 1 and the second signal: ,,, the difference m line, respectively, through the power supply layer 41 and the ground layer 43 on the two substrates corresponding to the a uniform hole 10 ι 41 , a UiU and a brother-hole 2 〇 penetrate the power layer 忒 ground layer 43. Since the combined through-hole structure of the printed circuit board of the present invention is in the first through hole 1 Between the two-holes 20 has the insulation [domain 5, and the insulating region 5 is an undisturbed wire, and the circuit board has a plurality of substrates 4, wherein ν, to the @=, has a package/original layer ( Power) a ground layer 43 and a wiring layer (not shown), and the insulating region 5 in the :, 曰 and ground layer 43 is an insulating material, and the "^ power layer 41 and The ground layer 43 is generally referred to as the two-layer layer referred to in the industry. Two of the insulating regions 5 in the wiring layer are not provided with wires. The insulating region 5 around the pupil 10 and the second through hole 2 is in the negative layer, and the other wiring layer does not have the insulating region of the shape, and 4 shows that there is no trace in the region. The combined through-hole structure of the printed circuit board of the present invention has the insulating region ^, and the differential signal line between the differential signal line and the other locations is matched with each other', and electromagnetic interference is not generated. It should be noted that, this is only her example of the 5th first signal line! And the second signal line 2 is a two-signal line constituting the differential signal line pair. The first through hole 10 and the second through hole 2 系 are the through holes of the differential pair. Therefore, correspondingly, the first through hole π 110325 200913800 .10 and the second through hole 20 should have the same size and characteristics; for example, the radius of the through hole 10 is equal to the radius of the second through hole 2; The distance m is equal to the second safety distance 203; the above-mentioned _A == .: the second safety radius is equal to 2° 5 'to match the differential signal green pair;: Finally, it should be noted that the one shown in this embodiment The electrical connection pad (Pad) is directly in the case of the 疋 directly surrounding the insulating region, so that the layer does not need to be electrically connected to other components without the electrical property; in other embodiments, The periphery of the through hole may have a corresponding electrical property. At this time, in the combined through hole structure of the printed circuit board of the present invention, the periphery of the second hole and the second through hole 20 may also have the power. (not shown), correspondingly, the insulating region 5 is provided on the periphery of the electric pole. Therefore, it is a person of ordinary skill in the art, and therefore will not be shown in the drawings. In summary, the combined through-hole structure of the printed circuit board of the present invention f mainly passes through the first through hole corresponding to the differential signal line and the second through two weeks, the U side and the first and second passes The design of the area between the holes _Insulation area: to prevent the conductor from being laid, so as to eliminate the interference of the conductive material on the differential signal line between the through holes in the prior art, thereby avoiding the difference = the signal line is going During the line process, the open end of the impedance mismatch and electromagnetic interference occurs. The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Anyone who is familiar with the art may modify and modify the above embodiments without departing from the spirit and scope of the invention. 110325 12 200913800 * • Therefore, the scope of protection of the present invention should be as set forth below. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a three-dimensional schematic diagram of a conventional through-hole structure when a differential signal line is changed; FIG. 2 is a schematic plan view showing a conventional through-hole structure. Cross-sectional schematic view; FIG. 3 is a plan view showing a printed circuit board of the present invention (a cross-sectional view of a combined through-hole structure design; and FIG. 4 is a perspective view showing a differential signal line changing layer Schematic diagram of the combined through-hole structure design of the printed circuit board of the present invention. [Main component symbol description] 1 First signal line 2 Second signal line 10 First consistent hole 20 Second through hole 100 Predetermined distance 3 Through hole gap 4 Substrate 41 Power supply layer 43 Ground layer 5 Insulation area 101 Radius of the first constant hole 201 Radius of the second through hole 110325 13 200913800 .103 First safety distance 203 Second safety distance 105 First safety radius 205 Second safety radius