CN101358999B - 探针组合体 - Google Patents

探针组合体 Download PDF

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Publication number
CN101358999B
CN101358999B CN2008101350401A CN200810135040A CN101358999B CN 101358999 B CN101358999 B CN 101358999B CN 2008101350401 A CN2008101350401 A CN 2008101350401A CN 200810135040 A CN200810135040 A CN 200810135040A CN 101358999 B CN101358999 B CN 101358999B
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CN
China
Prior art keywords
probe
resin film
probes
aforementioned
probe assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101350401A
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English (en)
Chinese (zh)
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CN101358999A (zh
Inventor
木本军生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN101358999A publication Critical patent/CN101358999A/zh
Application granted granted Critical
Publication of CN101358999B publication Critical patent/CN101358999B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN2008101350401A 2007-08-02 2008-07-29 探针组合体 Expired - Fee Related CN101358999B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-221740 2007-08-02
JP2007221740A JP5077794B2 (ja) 2007-08-02 2007-08-02 プローブ組立体
JP2007221740 2007-08-02

Publications (2)

Publication Number Publication Date
CN101358999A CN101358999A (zh) 2009-02-04
CN101358999B true CN101358999B (zh) 2013-04-24

Family

ID=40331499

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101350401A Expired - Fee Related CN101358999B (zh) 2007-08-02 2008-07-29 探针组合体

Country Status (5)

Country Link
US (1) US7948253B2 (https=)
JP (1) JP5077794B2 (https=)
KR (1) KR20090013718A (https=)
CN (1) CN101358999B (https=)
TW (1) TW200907353A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置
JP2012058223A (ja) * 2010-09-10 2012-03-22 Isao Kimoto プローブ組立
JP5496852B2 (ja) 2010-10-26 2014-05-21 富士フイルム株式会社 電子内視鏡システム、電子内視鏡システムのプロセッサ装置、及び電子内視鏡システムの作動方法
CN103257255A (zh) * 2012-02-20 2013-08-21 木本军生 探针组装
US20130233099A1 (en) * 2012-03-08 2013-09-12 Gunsei Kimoto Probe assembly
TW201400818A (zh) * 2012-06-22 2014-01-01 Mpi Corp 探針空間轉換模組及其製作方法
US10266402B2 (en) * 2012-11-20 2019-04-23 Formfactor, Inc. Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355080A (en) * 1989-08-07 1994-10-11 Giga Probe, Inc. Multi-point probe assembly for testing electronic device
CN1379513A (zh) * 2001-03-29 2002-11-13 木本军生 接触器装置
CN1407612A (zh) * 2001-09-03 2003-04-02 木本军生 探测器装置
JP2004274010A (ja) * 2003-03-11 2004-09-30 Isao Kimoto プローバ装置
US20050083072A1 (en) * 2003-08-27 2005-04-21 Chikaomi Mori Probe card and contactor of the same
CN1670540A (zh) * 2004-03-16 2005-09-21 木本军生 电气信号连接装置、及使用此装置之探针组装体及探测器装置
JP2005300545A (ja) * 2004-03-16 2005-10-27 Isao Kimoto 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
CN1821788A (zh) * 2005-02-16 2006-08-23 旺矽科技股份有限公司 嵌入式微接触元件及其制造方法
CN1936596A (zh) * 2005-09-19 2007-03-28 木本军生 接点组装体及其lsi芯片检查装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10111316A (ja) * 1996-10-04 1998-04-28 Fujitsu Ltd 半導体検査装置及び半導体検査方法
JP4355074B2 (ja) 1999-12-27 2009-10-28 株式会社日本マイクロニクス プローブカード
JP2004138391A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp 半導体装置の製造方法
JP2004340654A (ja) 2003-05-14 2004-12-02 Micronics Japan Co Ltd 通電試験用プローブ
JP4455940B2 (ja) 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
JP2006242774A (ja) * 2005-03-03 2006-09-14 Tokyo Electron Ltd プローブ及びプローブカード
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355080A (en) * 1989-08-07 1994-10-11 Giga Probe, Inc. Multi-point probe assembly for testing electronic device
CN1379513A (zh) * 2001-03-29 2002-11-13 木本军生 接触器装置
CN1407612A (zh) * 2001-09-03 2003-04-02 木本军生 探测器装置
JP2004274010A (ja) * 2003-03-11 2004-09-30 Isao Kimoto プローバ装置
US20050083072A1 (en) * 2003-08-27 2005-04-21 Chikaomi Mori Probe card and contactor of the same
CN1670540A (zh) * 2004-03-16 2005-09-21 木本军生 电气信号连接装置、及使用此装置之探针组装体及探测器装置
JP2005300545A (ja) * 2004-03-16 2005-10-27 Isao Kimoto 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
CN1821788A (zh) * 2005-02-16 2006-08-23 旺矽科技股份有限公司 嵌入式微接触元件及其制造方法
CN1936596A (zh) * 2005-09-19 2007-03-28 木本军生 接点组装体及其lsi芯片检查装置

Also Published As

Publication number Publication date
CN101358999A (zh) 2009-02-04
KR20090013718A (ko) 2009-02-05
US20090033349A1 (en) 2009-02-05
TWI380024B (https=) 2012-12-21
JP2009036743A (ja) 2009-02-19
US7948253B2 (en) 2011-05-24
JP5077794B2 (ja) 2012-11-21
TW200907353A (en) 2009-02-16

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130424

Termination date: 20140729

EXPY Termination of patent right or utility model