CN101351865A - 制作至少一个溅射涂覆基板的方法及溅射源 - Google Patents
制作至少一个溅射涂覆基板的方法及溅射源 Download PDFInfo
- Publication number
- CN101351865A CN101351865A CNA200680048479XA CN200680048479A CN101351865A CN 101351865 A CN101351865 A CN 101351865A CN A200680048479X A CNA200680048479X A CN A200680048479XA CN 200680048479 A CN200680048479 A CN 200680048479A CN 101351865 A CN101351865 A CN 101351865A
- Authority
- CN
- China
- Prior art keywords
- static
- elongated devices
- magnetic pole
- magnetic field
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75314405P | 2005-12-22 | 2005-12-22 | |
US60/753,144 | 2005-12-22 | ||
PCT/EP2006/069995 WO2007071719A1 (en) | 2005-12-22 | 2006-12-20 | Method of manufacturing at least one sputter-coated substrate and sputter source |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101351865A true CN101351865A (zh) | 2009-01-21 |
CN101351865B CN101351865B (zh) | 2012-08-29 |
Family
ID=37781979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680048479XA Expired - Fee Related CN101351865B (zh) | 2005-12-22 | 2006-12-20 | 制作至少一个溅射涂覆基板的方法及溅射源 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070175748A1 (zh) |
EP (1) | EP1969613B1 (zh) |
JP (1) | JP5342240B2 (zh) |
KR (1) | KR20080085893A (zh) |
CN (1) | CN101351865B (zh) |
WO (1) | WO2007071719A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102859639A (zh) * | 2010-02-10 | 2013-01-02 | Oc欧瑞康巴尔斯公司 | 磁控管源及制造方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112008000702T5 (de) * | 2007-03-16 | 2010-03-11 | National University Corporation Tohoku University | Magnetron-Sputter-Vorrichtung |
JP5147083B2 (ja) * | 2007-03-30 | 2013-02-20 | 国立大学法人東北大学 | 回転マグネットスパッタ装置 |
CN101652499B (zh) * | 2007-04-06 | 2013-09-25 | 国立大学法人东北大学 | 磁控溅射装置 |
CN101970713B (zh) * | 2008-03-04 | 2012-08-29 | 国立大学法人东北大学 | 旋转磁铁溅射装置 |
WO2010105077A2 (en) * | 2009-03-12 | 2010-09-16 | Applied Materials, Inc. | Minimizing magnetron substrate interaction in large area sputter coating equipment |
JP5873276B2 (ja) | 2010-12-27 | 2016-03-01 | キヤノンアネルバ株式会社 | 磁石ユニットおよびマグネトロンスパッタリング装置 |
PL2661514T3 (pl) | 2011-01-06 | 2020-11-16 | Bühler AG | Zespół magnetronowy i system rozpylania zawierający zespół magnetronowy |
PL2880196T3 (pl) * | 2012-09-04 | 2020-11-30 | Bühler AG | Urządzenie do rozpylania |
JP2015017304A (ja) * | 2013-07-11 | 2015-01-29 | ソニー株式会社 | 磁界発生装置、及びスパッタリング装置 |
KR20150012590A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 대향타겟 스퍼터링 장치 |
KR101580617B1 (ko) | 2014-06-05 | 2015-12-28 | 오병오 | 빛의 조사구간 선택이 용이한 실외용 엘이디등기구 |
US20180327897A1 (en) * | 2017-05-12 | 2018-11-15 | Applied Materials, Inc. | Re-deposition free sputtering system |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4102102C2 (de) * | 1991-01-25 | 1995-09-07 | Leybold Ag | Magnetanordnung mit wenigstens zwei Permanentmagneten sowie ihre Verwendung |
US5399253A (en) * | 1992-12-23 | 1995-03-21 | Balzers Aktiengesellschaft | Plasma generating device |
US5685959A (en) * | 1996-10-25 | 1997-11-11 | Hmt Technology Corporation | Cathode assembly having rotating magnetic-field shunt and method of making magnetic recording media |
US6464841B1 (en) * | 1997-03-04 | 2002-10-15 | Tokyo Electron Limited | Cathode having variable magnet configuration |
SE511139C2 (sv) * | 1997-11-20 | 1999-08-09 | Hana Barankova | Plasmabearbetningsapparat med vridbara magneter |
US6093293A (en) * | 1997-12-17 | 2000-07-25 | Balzers Hochvakuum Ag | Magnetron sputtering source |
GB2393321B (en) * | 2002-04-06 | 2005-06-29 | Gencoa Ltd | Plasma generation |
-
2006
- 2006-12-20 WO PCT/EP2006/069995 patent/WO2007071719A1/en active Application Filing
- 2006-12-20 EP EP06830754A patent/EP1969613B1/en not_active Not-in-force
- 2006-12-20 KR KR1020087017866A patent/KR20080085893A/ko not_active Application Discontinuation
- 2006-12-20 JP JP2008546443A patent/JP5342240B2/ja not_active Expired - Fee Related
- 2006-12-20 CN CN200680048479XA patent/CN101351865B/zh not_active Expired - Fee Related
- 2006-12-22 US US11/615,268 patent/US20070175748A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102859639A (zh) * | 2010-02-10 | 2013-01-02 | Oc欧瑞康巴尔斯公司 | 磁控管源及制造方法 |
CN102859639B (zh) * | 2010-02-10 | 2016-03-09 | 欧瑞康先进科技股份公司 | 磁控管源及制造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1969613A1 (en) | 2008-09-17 |
WO2007071719A1 (en) | 2007-06-28 |
CN101351865B (zh) | 2012-08-29 |
US20070175748A1 (en) | 2007-08-02 |
EP1969613B1 (en) | 2012-08-22 |
KR20080085893A (ko) | 2008-09-24 |
JP5342240B2 (ja) | 2013-11-13 |
JP2009520878A (ja) | 2009-05-28 |
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C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090116 Address after: Swiss Te Lui Bach Applicant after: Oc Oerlikon Balzers AG Address before: Liechtenstein Barr Che J Applicant before: OC Oerlikon Balzers AG |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: UNAXIS BALZERS AG Free format text: FORMER OWNER: OC OERLIKON BALZERS AG Effective date: 20090116 |
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ASS | Succession or assignment of patent right |
Owner name: OERLIKON SUN IP STOCK CO., LTD. (TELVBAHE) Free format text: FORMER OWNER: UNAXIS BALZERS AG Effective date: 20091204 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20091204 Address after: Swiss Te Lui Bach Applicant after: Oerlikon Solar IP AG. Truebbach Address before: Swiss Te Lui Bach Applicant before: Oc Oerlikon Balzers AG |
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ASS | Succession or assignment of patent right |
Owner name: OERLIKON SOLAR AG (TRUBBACH) Free format text: FORMER OWNER: OERLIKON SOLAR IP AG (TRUBBACH) Effective date: 20110303 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20110303 Address after: Swiss Te Lui Bach Applicant after: Oerlikon Solar IP AG. Truebbach Address before: Swiss Te Lui Bach Applicant before: Oerlikon Solar IP AG. Truebbach |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: OERLIKON SOLAR AG Free format text: FORMER NAME: OERLIKON SOLAR AG (TRUBBACH) |
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CP01 | Change in the name or title of a patent holder |
Address after: Swiss Te Lui Bach Patentee after: Oerlikon Solar AG, Truebbach Address before: Swiss Te Lui Bach Patentee before: Oerlikon Solar IP AG. Truebbach |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120829 Termination date: 20131220 |