CN101349417A

CN101349417A - High heat conducting shimming material of LED light fitting heat radiation technique

Info

Publication number: CN101349417A
Application number: CNA2008101489861A
Authority: CN
Inventors: 刘爱军; 苏亚梅; 李辛杰; 李效志
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-09-18
Filing date: 2008-09-18
Publication date: 2009-01-21
Anticipated expiration: 2028-09-18
Also published as: CN101349417B

Abstract

The invention relates to a high-thermal conducting gap filling material which is adaptable to the radiating technique for LED lambs. The high-thermal conducting gap filling material utilizes flexible pasty silicone grease as a thermal conducting base material, is added with certain silver nanowires and micron-sized thermal conducting metal particles as a thermal conducting filling material, and utilizes certain surface active agents to synthesize via stirring. The high-thermal conducting gap filling material is used in a gap between a metal radiating base on an LED package support and a copper foil on a corresponding position of an aluminum base, and in a gap between the aluminum base and a radiating structure of a lamp casing. After being treated by a special technique of low-temperature sintering, the sliver nanowires and the micron-sized thermal conducting metal particles in the flexible gap filling material can be sintered into network connection in a chemical bond type, and forms an sub-integral efficient radiating passage among the LED (the heat source), the aluminum base and the radiating structure of the lamp casing to guarantee the LED to work under an allowable temperature, thereby guaranteeing the high amount of passed light and the super-long service life.

Description

The high heat conductivity gap filling material of LED light fixture heat dissipation technology

Technical field:

The present invention relates to a kind of high heat conductivity gap filling material of LED light fixture heat dissipation technology.

Background technology:

The light fixture of making of semiconductor LED can produce sizable heat, particularly high-power LED illuminating light source when entering duty when using in groups under actual environment, and the heat dissipation technology of light fixture directly has influence on luminous efficiency and the service life of LED.

On the luminous monomer structure of LED,, on package support, designed a heat dissipation metal pedestal for solving the heat dissipation problem of chip self.The power-type LED of Shi Yonging is lined up the array of a definite form in groups, the two poles of the earth electrode of each LED all is welded on the special-purpose aluminium base, heat dissipation metal pedestal on its package support all contacts with the Copper Foil of correspondence position on the aluminium base, the work calories of LED then is diffused into heat-dissipating aluminium plate by the insulating barrier that Copper Foil sees through on the aluminium base, thereby reaches the technical purpose of heat radiation.

Though yet the heat dissipation metal pedestal of LED is corresponding with the Copper Foil position on the aluminium base, two planes hang together and have the gap, and its effective contact area is very limited, has a strong impact on its heat transfer efficiency.For addressing this problem, the insider had adopted two kinds of technology once: a kind of is to adopt epoxy resin as sealant, coats between the cooling base and the Copper Foil on the aluminium machine plate of LED, and the two is bonding.The shortcoming of this technology is: the poor thermal conductivity of epoxy resin, and be subjected to the influence of variation of ambient temperature after solidifying, both are taken off split, the forfeiture heat conduction condition; Another kind is to adopt heat-conducting silicone grease as contact agent, substituted epoxy resin technology.Heat-conducting silicone grease is to be matrix with the silicone grease, adds the thermal conductive metal particle thing, thereby forms certain heat conduction condition, compares with epoxy resin, and heat-conducting silicone grease has flexibility, has improved contact quality preferably.But the connection each other of metallic particles thing is a physical connection, does not reach desirable heat-conducting effect.Particularly as the aluminium base of LED carrier and have between the lamp housing of heat abstractor and more have large-area heat conduction interconnection technique to need to be resolved hurrily.

In LED lighting technical field thermal conductance is to obtain high pass light quantity, high reliability and long-life key.The present invention just provides a kind of high heat conductivity gap filling material that solves above-mentioned LED light fixture heat dissipation technology difficult point.It can increase substantially between LED cooling base and the aluminium base and even the thermal conductivity factor between the radiator structure of aluminium base and lamp housing, and the bottleneck technology of high-power LED lamp heat radiation is solved preferably.

Summary of the invention:

The present invention makes heat conduction matrix with the silicone grease of flexible body of paste, add the silver nanowire of certain component and micro nanometer silver particle as inserts, stir finished product after synthetic and coat between the Copper Foil on LED cooling base and the aluminium base, and between the gap that fixes of aluminium base and lamp body shell radiator structure.When the LED that uses in groups after the welding on the aluminium base finishes and is fixed on aluminium base on the lamp housing, be placed in the electric dry oven, when rising to 190 ℃～240 ℃ peak value with the heating rate of 10 ℃/min, the intrinsic physical attribute of nano silver wire produces the physical action of cold melt rapidly.Nano silver wire after the fusing and micro nanometer silver particle sinter the network connections of the chemical bond form of a high heat conduction mutually into, are cooled to room temperature then.

When LED worked, its work calories can pass through this metalolic network structure rapidly to the high efficiency conduction of the radiator structure of aluminium base and lamp housing, thereby realizes from inferior incorporate high efficiency and heat radiation passage between LED (thermal source) → aluminium base → lamp housing radiator structure.

Description of drawings:

Accompanying drawing 1, the structural relation schematic diagram of application target thing of the present invention:

1, the pad on the aluminium base;

2, the two poles of the earth of LED;

3, the heat dissipation metal pedestal on the LED package support;

4, led chip

5, high heat conductivity gap filling material of the present invention;

6, on the aluminium base with the Copper Foil of LED cooling base correspondence position;

7, the insulating barrier on the aluminium base;

8, aluminium base;

9, lamp housing radiator structure.

Structural representation before accompanying drawing 2, the sealant intensification sintering of the present invention.

Structural change schematic diagram after accompanying drawing 3, the sealant low-temperature sintering of the present invention.

The specific embodiment:

The present invention is further described below in conjunction with drawings and Examples.

Application target thing of the present invention is: the gap location on LED cooling base (3) and the aluminium base between the Copper Foil (6) of correspondence position; The gap location that aluminium base (8) is connected with lamp housing radiator structure (9).Heat dissipation metal pedestal (3) on led chip (4) package support is being born the conduction of led chip work calories, it is gone up with the Copper Foil (6) of its opposite position with aluminium base (8) and should the contact-making surface of the two closely is connected with technical method preferably between the two, thereby the work calories that makes LED penetrates insulating barrier (7) by Copper Foil (6) rapidly and is transmitted on the aluminium base (8), and aluminium base only is first carrier of LED work calories diffusion, and the heat that aluminium base bore must be transmitted on the lamp housing heat abstractor (9) as early as possible, and this is only the terminals that the LED work calories distributes.It is important that its heat conductivility of sealant between this three (LED, aluminium base, lamp housing radiator structure) causes the pass.The present invention is to use the high thermal conductivity flexible sealant that requires in above-mentioned purpose thing heat dissipation technology, it is that heat-conducting silicone grease by flexible body of paste is a matrix, as inserts, and use certain surfactant with certain nano silver wire and thermal conductive metal particle thing, stir synthetic.It contains component: silicone grease 60%-80%, nano silver wire 1%-10%, micro nanometer silver particle (also can select micron order aluminium powder, copper powder etc. for use) 15%-30%, surfactant 0.5%-3%.Use technology of the present invention is: earlier high heat conduction caulking compound of the present invention (5) is evenly coated on the plane of Copper Foil (6) of the contact plane of heat dissipation metal pedestal (3) of LED package support and aluminium base, it is bonding that the two is pressed correspondence position; Treat that the welding procedure of circuit pad (1) on the LED electrode (2) that uses in groups and the aluminium base all finishes, aluminium base (8) is fixed on the lamp housing (9), use the high heat conductivity gap filling material of the present invention (5) evenly to coat between the two before.Put it into then in the electric dry oven, when rising to 1 90 ℃-240 ℃ peak value with the heating rate of 10 ℃/min, the intrinsic physical attribute of nano silver wire makes it to produce rapidly the physical action of cold melt.Nano silver wire after the fusing and micron-sized silver-colored particle (also can select micron order aluminium powder, copper powder etc. for use) sinter the network connections of the chemical bond form of a high heat conduction mutually into, are cooled to room temperature then.When LED worked, its work calories can guarantee that LED is operated under the temperature of permission by this metalolic network structure to aluminium base and the powerful conduction of lamp housing radiator structure, thereby ensured high luminous efficiency and the overlength service life of LED.

As shown in Figure 2, the nano silver wire in the high thermal conductivity flexible sealant of the present invention before sintering with the metallic particles thing between for physical property contacts, its poor thermal conductivity; As shown in Figure 3, nano silver wire and micron order metallic particles thing form the network connections with the chemical bond form behind sintering, thereby significantly improve heat conductivility.

Claims

1. high heat conductivity gap filling material that is applicable to LED light fixture heat dissipation technology, it is characterized in that: it is to make matrix by the heat-conducting silicone grease of flexible body of paste, adds the nano silver wire of certain component and micron order thermal conductive metal particle thing and stirs synthetic as the heat conduction inserts; It contains component: flexible body of paste heat-conducting silicone grease 60%～80%, nano silver wire 1%～10%, micro nanometer silver particle (also can select micron order aluminium powder, copper powder etc. for use) 15%～30%, surfactant 0.5%～3%.

2. a kind of high heat conductivity gap filling material that is applicable to LED light fixture heat dissipation technology according to claim 1, it uses technology to be: earlier high heat conductivity gap filling material of the present invention is evenly coated on the plane of Copper Foil (7) of the contact plane of the heat dissipation metal pedestal (3) on the LED package shelf and aluminium base, it is bonding that the two is pressed correspondence position, after the welding procedure for the treatment of circuit pad (1) on the LED electrode (2) that uses in groups and the aluminium base is all finished, aluminium base (8) is fixed on the lamp housing (9), use the high heat conductivity gap filling material of the present invention (5) to coat between the two before, put it in the electric dry oven then, when rising to 190 ℃～240 ℃ peak value with the heating rate of 10 ℃/min, the intrinsic physical attribute of nano silver wire makes it to produce rapidly the physical action of cold melt, nano silver wire after the fusing and micron-sized silver-colored particle (also can be selected micron-sized aluminium powder for use, copper powder etc.) sinter the network connections of the chemical bond form of a high heat conduction mutually into, be cooled to room temperature then, thereby form inferior incorporate high efficiency and heat radiation passage between LED (thermal source) → aluminium base → lamp housing radiator structure.