CN101324325A - LED module unit - Google Patents
LED module unit Download PDFInfo
- Publication number
- CN101324325A CN101324325A CNA2007101111247A CN200710111124A CN101324325A CN 101324325 A CN101324325 A CN 101324325A CN A2007101111247 A CNA2007101111247 A CN A2007101111247A CN 200710111124 A CN200710111124 A CN 200710111124A CN 101324325 A CN101324325 A CN 101324325A
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- light emitting
- emitting diode
- heat conducting
- conducting element
- diode module
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Abstract
An LED module set comprises a circuit board, an LED and a heat conducting element, wherein the LED is arranged on one surface of the circuit board; and the heat conducting element is arranged on the other surface of the circuit board corresponding to the LED and contains titanium, germanium, carbon or compounds thereof. The LED module set can utilize the heat of LED to improve the air quality of external environment and improve the health benefit of the external environment to the human body.
Description
Technical field
The present invention relates to a kind of light emitting diode, particularly relate to a kind of light emitting diode module.
Background technology
Volume is little, power consumption is low, the life-span is long and the reaction time is fast because light emitting diode (LED) has, so the die set light source backlight or even the advertisement plate of illumination such as, household electrical appliances, computer, communication device, liquid crystal indicator are all its application, and have reached the stage of technology maturation.Again because of the high brightness luminescent of light emitting diode, among the transfer process of its photoelectricity, to cause heat energy to produce in a large number, the decrease in efficiency that causes light emitting diode, so known techniques provides the device or the system of many solution heat dissipation problems, but major part all focuses on and heat is shed and is not changed or utilize.
Please refer to shown in Figure 1ly, a kind of known light emitting diode module 1 comprises a circuit board 11, a light emitting diode 12 and a heat conducting element 13.Circuit board 11 has at least one perforation 111 with respect to light emitting diode 12, and heat conducting element 13 is a heat-conducting layer or heat-conducting glue, and is arranged at the surface 112 of circuit board 11 and is filled in perforation 111.Light emitting diode 12 be arranged at heat conducting element 13 on, and have a plurality of pins 121 to be connected with other metal levels on the circuit board 11.When light emitting diode 12 because of luminous when producing heat energy, just by heat conducting element 13 will be after the heat absorption heat radiation to extraneous to keep the luminous efficacy of light emitting diode 12.
Yet known light emitting diode module 1 only dissipates to the external world with the heat energy that light emitting diode 12 is produced, and except heat energy, the environment of system also can't provide any benefiting to external world.
Therefore, the heat that how to utilize light emitting diode 12 to be produced is to produce the helpful material of environment to external world, real one of the current important topic that belongs to.
Summary of the invention
Main purpose of the present invention is, a kind of novel light emitting diode module is provided, technical problem to be solved is to make its heat energy that can utilize light emitting diode, with the air quality of improving external environment and increase the health-benefiting of external environment to human body, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of light emitting diode module that the present invention proposes, it comprises: a circuit board; One light emitting diode is arranged at a surface of this circuit board; And a heat conducting element, being arranged at another surface of this circuit board corresponding to this light emitting diode, this heat conducting element contains the material of titanium, germanium, carbon or its compound.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid light emitting diode module, wherein said light emitting diode are a naked crystalline substance or a LED package element.
Aforesaid light emitting diode module, wherein said heat conducting element are a conducting strip or a heat-conducting block.
Aforesaid light emitting diode module, wherein when light emitting diode module has a plurality of heat conducting elements and a plurality of light emitting diode, respectively this heat conducting element respectively with the respectively corresponding setting of this light emitting diode.
Aforesaid light emitting diode module, wherein said heat conducting element have a stickum or a ceramic powders.
Aforesaid light emitting diode module more comprises: a heat dissipation element links mutually with heat conducting element.
Aforesaid light emitting diode module, wherein said heat dissipation element and heat conducting element are bonding.
By technique scheme, light emitting diode module of the present invention has following advantage at least:
According to light emitting diode module of the present invention, contain the material of titanium, germanium, carbon or its compound by its heat conducting element, make titanium, germanium, carbon or its compound because of the heat that absorbs light emitting diode to external world environment produce the material useful to health.Compare with known techniques, light emitting diode module of the present invention have dust suction, system bacterium and or discharge effect such as anion, can promote air quality and increase the health-benefiting of external environment human body.
In sum, the light emitting diode module of novelty of the present invention can be utilized the heat energy of light emitting diode, with the air quality of improving external environment and increase the health-benefiting of external environment to human body.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is a kind of schematic diagram of known light emitting diode module.
Fig. 2 is the schematic diagram according to a kind of light emitting diode module of preferred embodiment of the present invention.
Fig. 3 is the schematic diagram according to the another kind of light emitting diode module of preferred embodiment of the present invention.
Fig. 4 is the schematic diagram according to another light emitting diode module of preferred embodiment of the present invention.
1,2,3,4: light emitting diode module 11,21: circuit board
111: perforation 112,211,212: surface
12,22: light emitting diode 121: pin
13,23,33,43: heat conducting element 44: heat dissipation element
441: fin
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its specific embodiment of light-emitting diodes pipe die, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Please refer to shown in Figure 2ly, a kind of light emitting diode module 2 of preferred embodiment of the present invention comprises a circuit board 21, a light emitting diode 22 and a heat conducting element 23.Wherein, light emitting diode module 2 can be applicable to throw light on, the light source of electronic installation, the die set light source backlight or the advertisement plate of liquid crystal indicator.
Heat conducting element 23 is arranged at another surface 212 of circuit board 21 corresponding to light emitting diode 22.Be noted that heat conducting element 23 can be a conducting strip, or be shaped as a rule or an irregular heat-conducting block.In present embodiment, heat conducting element 23 is a conducting strip, and corresponding a plurality of light emitting diodes 22 are provided with.Certainly, have more by making light emitting diode 22 be sent heat energy that multipath sheds, can be chosen in circuit board 21 and run through a plurality of through holes (figure shows) to increase heat dissipation.
In order to improve external environment, heat conducting element 23 contains the material of titanium (Ti), germanium (Ge), carbon (C) or its compound, by the light or the heat of light emitting diode 22, makes material in the heat conducting element 23 produce the material of favourable human body.For example: titanium valve can promote the tissue blood circulation and quicken metabolism; Current potential imbalance (abnormalelectric potential) on the removable human body surface of organic germanium (Organic Germanium), and then favourable health; In addition, Ge element also can produce heat at light emitting diode 22 and environment temperature is increased to after 35 ℃, just begins to discharge anion among air, and the dust in the environment is landed fast.
The material of heat conducting element 23 also can include stickum or other can assist the material of above-mentioned material moulding except titanium (Ti), germanium (Ge), carbon (C) or its compound etc. and the useful material of health.For example, stickum can be colloid, can mix with the useful material of above-mentioned health, and assisting moulding and to provide heat conducting element 23 adhesion strengths, favourable heat conducting element 23 is arranged on the circuit board 21.In addition, the material of heat conducting element 23 also can be added ceramic powders, assists moulding.
Please refer to shown in Figure 3, the another kind of light emitting diode module 3 of preferred embodiment of the present invention, all the light emitting diode module 2 with above-mentioned preferred embodiment is identical with function for its basic structure, repeats no more in this.Difference is that light emitting diode module 3 has a plurality of heat conducting elements 33, and respectively with each light emitting diode 22 corresponding setting, more meet the elasticity of heat conducting element 33 design.
Please refer to shown in Figure 4, another light emitting diode module 4 of preferred embodiment of the present invention, its basic structure and function all with the light emitting diode module 2 of above-mentioned preferred embodiment identical outside, difference is that light emitting diode module 4 can comprise that more a heat dissipation element 44 is bonded in heat conducting element 43.Heat dissipation element 44 has a plurality of fins 441 with the rapider discharge of heat with heat conducting element 43.
In sum, because of foundation light emitting diode module of the present invention, contain the material of titanium, germanium, carbon or its compound by its heat conducting element, make titanium, germanium, carbon or its compound because of the heat that absorbs light emitting diode to external world environment produce the material useful to health.Compare with known techniques, light emitting diode module of the present invention have dust suction, system bacterium and or discharge effect such as anion, can promote air quality and increase the health-benefiting of external environment human body.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (7)
1, a kind of light emitting diode module is characterized in that it comprises:
One circuit board;
One light emitting diode is arranged at a surface of this circuit board; And
One heat conducting element is arranged at another surface of this circuit board corresponding to this light emitting diode, and this heat conducting element contains the material of titanium, germanium, carbon or its compound.
2, light emitting diode module according to claim 1 is characterized in that wherein said light emitting diode is a naked crystalline substance or a LED package element.
3, light emitting diode module according to claim 1 is characterized in that wherein said heat conducting element is a conducting strip or a heat-conducting block.
4, light emitting diode module according to claim 1 is characterized in that wherein when light emitting diode module has a plurality of heat conducting elements and a plurality of light emitting diode, respectively this heat conducting element respectively with the respectively corresponding setting of this light emitting diode.
5, light emitting diode module according to claim 1 is characterized in that wherein said heat conducting element has a stickum or a ceramic powders.
6, light emitting diode module according to claim 1 is characterized in that it more comprises: a heat dissipation element links mutually with heat conducting element.
7, light emitting diode module according to claim 6 is characterized in that wherein said heat dissipation element and heat conducting element are bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101111247A CN101324325A (en) | 2007-06-11 | 2007-06-11 | LED module unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101111247A CN101324325A (en) | 2007-06-11 | 2007-06-11 | LED module unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101324325A true CN101324325A (en) | 2008-12-17 |
Family
ID=40187965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101111247A Pending CN101324325A (en) | 2007-06-11 | 2007-06-11 | LED module unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101324325A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299250A (en) * | 2011-09-19 | 2011-12-28 | 广东昭信灯具有限公司 | Heat dissipation module of high power light-emitting diode (LED) and preparation method for heat dissipation module |
| CN110444111A (en) * | 2019-08-16 | 2019-11-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
-
2007
- 2007-06-11 CN CNA2007101111247A patent/CN101324325A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299250A (en) * | 2011-09-19 | 2011-12-28 | 广东昭信灯具有限公司 | Heat dissipation module of high power light-emitting diode (LED) and preparation method for heat dissipation module |
| CN110444111A (en) * | 2019-08-16 | 2019-11-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
| US11248756B2 (en) | 2019-08-16 | 2022-02-15 | K-Tronics (Suzhou) Technology Co., Ltd. | Backlight module and display apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081217 |