CN101306517B - 化学机械抛光垫 - Google Patents

化学机械抛光垫 Download PDF

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Publication number
CN101306517B
CN101306517B CN2008100050062A CN200810005006A CN101306517B CN 101306517 B CN101306517 B CN 101306517B CN 2008100050062 A CN2008100050062 A CN 2008100050062A CN 200810005006 A CN200810005006 A CN 200810005006A CN 101306517 B CN101306517 B CN 101306517B
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CN
China
Prior art keywords
polishing pad
polishing
polymer matrix
isocyanate
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008100050062A
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English (en)
Chinese (zh)
Other versions
CN101306517A (zh
Inventor
T·T·克韦纳克
A·S·拉文
C·A·福西特
K·A·普莱贡
M·J·库尔普
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROHM AND HAAS ELECTRONIC MATER filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN101306517A publication Critical patent/CN101306517A/zh
Application granted granted Critical
Publication of CN101306517B publication Critical patent/CN101306517B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249976—Voids specified as closed
    • Y10T428/249977—Specified thickness of void-containing component [absolute or relative], numerical cell dimension or density
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro
    • Y10T428/249979—Specified thickness of void-containing component [absolute or relative] or numerical cell dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249986—Void-containing component contains also a solid fiber or solid particle

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
CN2008100050062A 2007-01-29 2008-01-28 化学机械抛光垫 Active CN101306517B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/699,775 2007-01-29
US11/699,775 US7569268B2 (en) 2007-01-29 2007-01-29 Chemical mechanical polishing pad

Publications (2)

Publication Number Publication Date
CN101306517A CN101306517A (zh) 2008-11-19
CN101306517B true CN101306517B (zh) 2010-12-01

Family

ID=39668520

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100050062A Active CN101306517B (zh) 2007-01-29 2008-01-28 化学机械抛光垫

Country Status (5)

Country Link
US (1) US7569268B2 (enExample)
JP (1) JP5270182B2 (enExample)
KR (1) KR101526010B1 (enExample)
CN (1) CN101306517B (enExample)
TW (1) TWI396732B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
KR101177781B1 (ko) * 2006-09-08 2012-08-30 도요 고무 고교 가부시키가이샤 연마 패드의 제조 방법
SG177963A1 (en) 2007-01-15 2012-02-28 Toyo Tire & Rubber Co Polishing pad and method for producing the same
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
WO2010038724A1 (ja) * 2008-09-30 2010-04-08 Dic株式会社 研磨パッド用２液型ウレタン樹脂組成物、それを用いてなるポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法
WO2010038725A1 (ja) * 2008-09-30 2010-04-08 Dic株式会社 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造法。
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US20150065013A1 (en) * 2013-08-30 2015-03-05 Dow Global Technologies Llc Chemical mechanical polishing pad
US9102034B2 (en) 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
JP6315246B2 (ja) * 2014-03-31 2018-04-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US11638978B2 (en) * 2019-06-10 2023-05-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-debris fluopolymer composite CMP polishing pad
KR102743611B1 (ko) * 2019-07-12 2024-12-17 씨엠씨 머티리얼즈 엘엘씨 폴리아민 및 시클로헥산디메탄올 경화제를 사용한 폴리싱 패드
KR102421208B1 (ko) * 2020-09-10 2022-07-14 에스케이씨솔믹스 주식회사 연마 패드 및 이를 이용한 반도체 소자의 제조 방법
CN115816291A (zh) * 2022-12-09 2023-03-21 万华化学集团电子材料有限公司 一种具有改善边缘效应的化学机械抛光垫、制备方法及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1559082A (zh) * 2001-08-02 2004-12-29 ��ʽ����Skg 微孔化学机械抛光垫

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MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
KR100485847B1 (ko) * 1997-04-04 2005-04-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 개선된 연마용 패드 및 이에 관한 방법
KR100354830B1 (ko) * 2000-05-19 2002-10-05 주식회사 만영엔지니어링 난형선형 설계기능을 갖춘 도로선형 자동설계장치
US6860802B1 (en) * 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
JP2002371055A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 自己ドープ型導電性ポリマー・合成用モノマー及びそれらの合成方法
US20030139122A1 (en) * 2002-01-24 2003-07-24 Lawing Andrew Scott Polishing pad for a chemical mechanical planarization or polishing (CMP) system
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6899612B2 (en) * 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
EP1649007A4 (en) * 2003-07-17 2008-05-14 Gamida Cell Ltd PROCESS FOR THE EX-VIVO EXPANSION OF STEM / PROVIDER CELLS
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US7074115B2 (en) * 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1559082A (zh) * 2001-08-02 2004-12-29 ��ʽ����Skg 微孔化学机械抛光垫

Also Published As

Publication number Publication date
JP2008188757A (ja) 2008-08-21
KR101526010B1 (ko) 2015-06-04
US7569268B2 (en) 2009-08-04
JP5270182B2 (ja) 2013-08-21
KR20080071089A (ko) 2008-08-01
CN101306517A (zh) 2008-11-19
US20080182492A1 (en) 2008-07-31
TWI396732B (zh) 2013-05-21
TW200914588A (en) 2009-04-01

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Delaware, USA

Patentee after: DuPont Electronic Materials Holdings Co.,Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Country or region before: U.S.A.