CN101269575A - 喷墨打印头及其制造方法 - Google Patents
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Abstract
本发明涉及一种喷墨打印头及其制造方法。该喷墨打印头包括:一个用于喷墨的喷墨部;包括给喷墨部提供电信号的连接衬垫的焊盘区;设置在焊盘区外边缘的一体的分隔壁。分隔壁用于防止制造喷墨打印头的过程中切割分离打印头时产生的碎片散落到焊盘区上。分隔壁与喷墨部的流动通路层和喷嘴层一起形成。
Description
技术领域
本发明涉及一种喷墨打印头及其制造方法,具体而言,涉及一种根据这样的方法制造的喷墨打印头,该方法为防止切割晶片时产生的主要成分发生污染。
背景技术
喷墨打印头是一种在打印媒介上通过喷射墨滴来形成图像的装置。喷墨打印头根据墨滴喷射机构主要分为热电型或压电型两种。热电型打印头通过热源在墨中生成气泡,然后通过气泡扩散力来喷出墨滴。
通常,热电型喷墨打印头包括:一个具有多个加热墨的加热器和多个连接加热器和外部电路的连接衬垫的基底;一个位于基底上具有流动通路和存墨腔的流动通路层;以及一个喷嘴层,该喷嘴层设置在流动通路层之上,且喷嘴与存墨腔相对应。
喷墨打印头是在一块晶片上加工制造的。换而言之,一排喷墨打印头形成在一个晶片上,并且该晶片通过轮锯切割,使各个喷墨打印头彼此分隔开。在切割晶片的过程中,如果晶片碎片散落并留存在连接衬垫的表面、喷嘴的内部、存墨腔的内部,则会将一个电信号错误地传递给加热器、或者墨无法平稳地流过存墨腔和喷嘴,由此使其打印质量下降。因此,防止切割晶片时产生的碎片散落到喷墨打印头结构中是很重要的。
喷墨打印头的连接衬垫与一个软性印刷电路(FPC)的线路相连,该软性印刷电路具有多个与连接衬垫相对应的导线。当将软性印刷电路(FPC)线路的导线和打印头的连接衬垫接合时,如果导线与基底的表面相接触,就会造成电路短路。因此,在导线和连接衬垫接合过程中,避免导线与基底表面相接触也是很重要的。
韩国专利公开文献No.2005-0072356公开了一种半导体晶片及其生产方法,其通过在划片道上形成缓冲层图案的方法能防止FPC线路和半导体基底之间的电路短路。然而,其公开的这种传统半导体晶片是通过仅仅在划片道和连接衬垫相对应的位置处形成缓冲层图案的方法,而在结构上防止短路的,但并没有给出防止由于分散的碎片对打印头造成污染的解决方法。因此,就产生了这样的问题:在晶片上分隔打印头时污染了打印头结构,由此造成了打印头的故障。
发明内容
本发明提供了一种喷墨打印头制造方法,该方法可以有效地避免FPC线路导线与基底的短路,并且可以防止打印头部件由于切割晶片时产生的碎片的污染。
本发明的另一方面提供了一种根据上述方法制造的喷墨打印头。
本发明的一个示例性实施例给出了一个喷墨打印头,包括:一个用来喷出墨滴的喷墨部,和包括给喷墨部提供电信号的连接衬垫的焊盘区(padregions)。在焊盘区边界形成一体的分隔壁。分隔壁防止切割包括喷墨打印头的晶片产生的碎片散落到焊盘区。
根据本发明的实施方案,分隔壁包括一个沿着焊盘区的一条边延伸的延伸部,和一个以与延伸部成一个角度沿着焊盘区的相反方向延伸的弯曲部。分隔壁至少围绕焊盘区的三个侧边。
根据本发明的实施方案,喷墨部包括一个限定以墨填充的存墨腔的流动通路层。弯曲部朝着流动通路层延伸并与流动通路层相连接。
根据本发明的实施方案,喷墨部包括一个喷嘴层,墨滴通过喷嘴层上的喷嘴喷出。弯曲部向喷嘴层延伸并与喷嘴层相连接。
根据本发明的实施方案,分隔壁可包括一个用与流动通路层相同的材料制成的第一层,和一个用与喷嘴层相同的材料制成的第二层。
根据本发明的实施方案,分隔壁具有和喷嘴层相同的高度。
本发明的又一个示例性实施例给出了一个喷墨打印头,包括:一个喷墨部,该喷墨部包括流动通路层和设置在流动通路层之上的喷嘴层;焊盘区,该焊盘区分布在流动通路层和喷嘴层的外边缘,且包括多个控制喷墨部的连接衬垫;和分隔壁,该分隔壁与流动通路层和喷嘴层一起围绕着焊盘区。
本发明的一个示例性实施例给出了一种制造喷墨打印头的方法,该打印头包括用于喷出墨滴的喷墨部和含有控制喷墨部连接衬垫的焊盘区,该方法包括如下这些步骤:在晶片上的多个头芯片区的每一个上形成喷墨部和连接衬垫,头芯片区通过切割区来划分;在焊盘区和切割区之间形成有分隔壁,同时形成喷墨部,以从切割区中分离出喷墨部;粘贴一层保护件,以覆盖喷墨部、焊盘区、分隔壁;沿着切割区切割晶片以分隔开各个头芯片区。
根据本发明的实施方案,分隔壁b)的形成方式包括:形成一个沿焊盘区的一侧延伸的延伸部;以及形成一个从延伸部开始曲转,从切割区中分离出焊盘区的弯曲部。分隔壁围绕焊盘区的至少三个侧边。
根据本发明的实施方案,喷墨部的形成方式包括:形成一个限定存墨腔的流动通道层。分隔壁包括一个与流动通道层一同形成的第一层。
根据本发明的实施方案,喷墨部的形成还包括:在流动通道层上形成一个喷嘴层。分隔壁还包括一个与喷嘴层一同形成的第二层。
本发明的其他实施方式和/或优点将会在下面的具体实施方式部分中进一步阐述,部分内容将直接通过描述而显见,部分内容则可通过实践而领会。
附图说明
本发明的具体实施方式的这些和/或其它方面以及优点将通过如下的描述并结合以下附图而变得显而易见和更易理解,其中:
图1为示出了根据本发明具体实施方式中的一个喷墨打印头的截面图;
图2为示出了根据本发明具体实施方式中分布在一个晶片上的多个喷墨打印头的平面图;
图3a-3k示出了根据了本发明具体实施方式中生产喷墨打印头的方法;
图4为示出了根据本发明具体实施方式中的FPC导线与喷墨打印头相连接的截面图。
具体实施方式
下面将根据本发明的具体实施方式来进行说明,其中所有附图中相同的附图标记表示相同的元件。参见附图和如下具体描述来说明本发明的实施方式。
图1是本发明所述的喷墨打印头100的截面图,图2是分布在晶片10上的多个喷墨打印头100的平面图。
如图1所示,喷墨打印头100包括:一个基底10a;一个喷墨部101,该喷墨部形成在基底10a上,用于喷射墨滴;与外部电路相连、并通过传送电信号来控制喷墨部101的连接衬垫110;其上设置有连接衬垫110的焊盘区102。焊盘区102设置在基底10a上,位于喷墨部101的两边上。
喷墨部101包括一个形成在基部10a上的供墨口101a,其用于向喷墨部101提供墨。喷墨部101包括一个设置在基底10a上的流动通路层130,以及一个设置在流动通路层130上的喷嘴层150。流动通路层130限定了与供墨口101a和喷嘴151相连的墨流通道131。墨流通道131包括用于储存墨的存墨腔132,以及一个与供墨口101a和存墨腔132相连的限流器133。喷嘴151形成在喷嘴层150中,用于喷射存墨腔132中的墨。
加热器120装配在基底10a上的存墨腔132中。多个加热器120用于加热存墨腔132中的墨。
墨通过供墨口101a从底部的基底10a供给到墨流通道131中。通过供墨口101a供给的墨流入存墨腔132,由加热器120加热。加热器120接收到与外部电路相连的连接衬垫110发出的电信号后开始进行加热。被加热器120加热的墨中产生易破气泡,存墨腔132中的一部分墨汁通过气泡从喷嘴151喷出,该喷嘴设置在存墨腔132的上方。
喷墨头100是在晶片10上制造的,如图2所示。换而言之,如附图1所示的多个喷墨打印头100是在晶片10上以喷墨打印头100阵列的形式制造的。晶片10经过切割来分隔出各个喷墨打印头100。
如图1和2所示,切割区11分布在相邻的两个喷墨打印头100之间。每个喷墨打印头100由焊盘区102外边缘的分隔壁140形成,即,在焊盘区102和切割区11之间。分隔壁140用于防止切割分离喷墨打印头100时的副产物(下文中称为“碎片”)散落到焊盘区102上。为了有效地防止碎片散落到焊盘区102上,分隔壁140以一个整体的形式形成。
分隔壁140包括延伸部141,其沿着焊盘区102的一边垂直延伸,以从切割区11的垂直部分分割焊盘区102,以及两个弯曲部142,其从延伸部141的两端水平延伸,以沿切割区11的水平部分分割焊盘区102。弯曲部142深入到流动通路层130和喷嘴层150中。从而,焊盘区102的三面都被分隔壁140围绕。
分隔壁140可以与流动通路层130和喷嘴层150共同形成。换而言之,分隔壁140可以包括一个第一层140a,该第一层140a用与流动通路层130相同的材料制成;还包括一个设置在第一层140a之上的第二层140b,该第二层140b用与喷嘴层150相同的材料制成。
图3a-3k阐明了一种依照本发明实施方式的制造喷墨打印头100的方法。为了便于解释,在图3a-3k中仅仅表示了晶片10上相邻的两个喷墨打印头100和100’。
如图3a-3k所示,喷墨部101和101’分别形成在头芯片区12和12’(参见图3a),由晶片10上的分割区11分隔。头芯片区12和12’包括焊盘区102和102’,焊盘区上安装连接衬垫110和110’。头芯片区12和12’通过切割晶片(基底)10来分隔。然后,每个头芯片区12和12’形成单独的喷墨打印头100。下面就详细说明依据本发明的制造喷墨打印头的方法。
如图3a所示,加热器120和120’和连接衬垫110和110’安装在头芯片区12和12’上。加热器120和120’可以通过采用溅射或者化学气相沉积方法沉积例如钽-氮化合物或钽-铝合金等电热材料、并对其进行图案化的方式得到。而且,连接衬垫110和110’可以通过采用溅射方法沉积例如铝的具有充足导电率的金属材料、并对其进行图案化的方式得到。
如图3b和3c所示,流动通路层130和130’形成在晶片10上,加热器120和120’以及连接衬垫110和110’通过光刻法布置在其上。详细地说,一个负性光刻胶层130a(参见附图3b)用一种旋转涂覆方法涂在晶片10上。光刻胶层130a用光掩膜曝光,形成与墨流通道131相对应的图案。光刻胶层130a显影后去除未曝光部分。通过上述如图3c所示的步骤,形成了限定有墨流通道131和131’的流动通道层130和130’。
在制成流动通路层130和130’的方法中,分隔壁140和140’的第一层140a和140a’也一起制成了。光刻胶层130a在与分隔壁140和140’相对应的图案下曝光。分隔壁140和140’包括延伸部141和141’以及弯曲部142和142’,且其包围着焊盘区102和102’,所以光刻胶层130a的曝光部分在显影过程中保留了下来,形成了分隔壁140和140’的第一层140a和140a’。
如图3d所示,一个牺牲层200形成用以覆盖晶片10、流动通道130和130’以及分隔壁140和140’的第一层140a和140a’。牺牲层200可以通过以旋转方式涂覆正性光刻胶形成。
如图3e所示,牺牲层200的上表面、流动通路层130和130’、分隔壁140和140’的第一层140a和140a’通过化学机械打磨(CMP)方法变平,使得流动通路层130和130’、分隔壁140和140’的第一层140a和140a’以及牺牲层200具有相同的高度。这样就确保了喷嘴层150和150’形成在流动通道层130和130’上,并且与分隔壁140和140’的第一层140a和140a’紧密接触。因此,喷墨打印头100的耐用性能得到提高。
如图3f和3g所示,喷嘴层150和150’形成在平坦的牺牲层200和流动通路层130和130’上。与流动通路层130和130’一样,喷嘴层150和150’也通过光刻法制成。详细地说,光刻胶150b涂覆在牺牲层200和流动通路层130和130’上。光刻胶层150b在带有喷嘴图案的光掩膜下曝光。光刻胶层150b在显影后去除未曝光部分。通过上述步骤,如图3g所示,包括喷嘴151和151’的喷嘴层150和150’就制成了。
在制成喷嘴层150和150’的方法中,分隔壁140和140’的第二层140b和140b’也同时制成了。光刻胶层150b以与分隔壁140和140’相应的图形曝光,使得光刻胶层150b中曝光的部分在显影过程中保留下来,形成分隔壁140和140’的第二层140b和140b’。分隔壁140和140’通常与喷嘴层150和150’具有相同的高度。这样的构造在切割晶片10之前,可使保护件300与分隔壁140和140’安全地贴紧。因此,在切割晶片10时可以把保护件300与分隔壁140和140’分离(参见图3j)。
如图3h所示,一个蚀刻掩膜400设置在晶片10的底表面,形成一个供墨口101a和101a’(参见图3i)。蚀刻掩膜400可以通过在晶片10的底面涂覆正性或负性光刻胶、并对其进行图案化的方式来制成。
如图3i所示,供墨口101a和101a’在晶片10上这样形成,使得通过蚀刻掩膜400曝光的晶片10的部分,从晶片10的底面蚀刻到晶片10的顶面。而后将蚀刻掩膜400和牺牲层200去除。晶片10可以通过等离子体进行干法蚀刻。或者,晶片10也可以通过利用羟化四甲胺(TMAH)或者氢氧化钾(KOH)作为蚀刻剂进行湿法蚀刻。
如图3j所示,保护件300贴紧并覆盖在喷墨部101和101’、焊盘区102和102’以及分隔壁140和140’上。保护件300可以构造为在其一个表面上具有粘性涂层的胶带。保护件300防止切割晶片10的过程中产生的碎片散落到喷墨部101和101’和/或焊盘区102和102’上。
最后,用切割工具沿着切割区11切割晶片10以将头芯片部12和12’彼此分开(参考图3a)。然后将保护件300去除。切割工具可以是,例如轮锯等。通过这种方法,相互独立的喷墨打印头100和100’制造完了,如图3k所示。
图4为示出了根据本发明具体实施方式中与喷墨打印头100相连接的FPC导线的截面图。如图4所示,喷墨打印头100的连接衬垫110与含有多条与连接衬垫相对应的导线510的FPC线路520相连。分隔壁140防止导线510与基底10a相接触。
正如上面的描述所体现的一样,根据本发明的一个喷墨打印头能够防止在晶片上切割出多个喷墨打印头的过程中产生散落的碎片,污染喷墨打印头结构。因此,打印质量可以得到保持,并且/或者由于污染喷墨打印头而产生的打印故障也能够得到避免。因为FPC的导线不与基底接触,电路短路也能得到避免。
尽管本发明展示和描述了一些实施例,但是本领域的技术人员应该意识到,在不脱离本发明的原理和精神的情况下,可以在这些实施例中做一些改变,其范围由权利要求及其等效物限定。
Claims (16)
1.一种喷墨打印头,包括:
具有焊盘区的基底;
设置在基底上与焊盘区相邻的喷墨部,用于喷射墨滴;
设置在焊盘区中的连接衬垫,用于向喷墨部发送电信号;和
沿着焊盘区的边缘分布的分隔壁,用于阻止基底边缘被切割时产生的碎片进入焊盘区,
其中,每个分隔壁都包括一个沿着焊盘区一侧延伸的延伸部和从延伸部延展出的弯曲部。
2.如权利要求1所述的喷墨打印头,其特征在于,在每个分隔壁中,弯曲部都与延伸部基本垂直设置。
3.如权利要求1所述的喷墨打印头,其特征在于,每个分隔壁都是一体形成的。
4.如权利要求1所述的喷墨打印头,其特征在于,所述喷墨部包括流动通路层,限定了用于储存墨的存墨腔,所述弯曲部延伸至与该流动通路层接触。
5.如权利要求1所述的喷墨打印头,其特征在于,所述喷墨部包括喷嘴层,限定了用于喷墨的喷嘴,弯曲部延伸至与该喷嘴层接触。
6.如权利要求1所述的喷墨打印头,其特征在于,所述喷墨部包括流动通路层,限定了用于储存墨的存墨腔,每个分隔壁包括由与流动通路层同样材料制成的第一层。
7.如权利要求6所述的喷墨打印头,其特征在于,所述喷墨部还包括一个设置在流动通路层上的喷嘴层,每个分隔壁具有一个设置在第一层上、由与喷嘴层相同的材料构成的第二层。
8.如权利要求7所述的喷墨打印头,其特征在于,每个分隔壁相对于基底具有和喷嘴层基本相同的高度。
9.一种喷墨打印头,包括:
具有焊盘区的基底;
设置在基底上与焊盘区相邻的喷墨部,该喷墨部包括流动通路层和设置在流动通路层上的喷嘴层;
设置在焊盘区中的多个连接衬垫,用于控制喷墨部;和
与基底边缘相邻、沿焊盘区三个侧边设置的分隔壁。
10.如权利要求9所述的喷墨打印头,其特征在于,所述焊盘区由流动通路层、喷嘴层和分隔壁共同限定。
11.一种在晶片上制造喷墨打印头的方法,包括:
在一块晶片的头芯片区上形成喷墨部和连接衬垫,该喷墨部和连接衬垫通过切割区彼此分离;
在焊盘区和切割区之间形成分隔壁,并形成喷墨部,以将衬底区从切割区中分开;
粘贴一保护件,以覆盖喷墨部、焊盘区和分隔壁;以及
沿着切割区切割晶片,把头芯片区彼此分隔。
12.如权利要求11所述的方法,其特征在于,形成分隔壁的步骤包括:
形成一个沿着每个焊盘区的一侧延伸的延伸部;和
形成一个从每个延伸部伸展出的弯曲部。
13.如权利要求12所述的方法,其特征在于,在每个分隔壁中,弯曲部与延伸部基本垂直设置。
14.如权利要求11所述的方法,其特征在于,形成喷墨部的步骤包括:形成限定存墨腔的流动通路层,其中,每个分隔壁都包括与流动通路层共同形成的第一层。
15.如权利要求14所述的方法,其特征在于,形成喷墨部的步骤包括:在流动通路层上形成喷嘴层,且每个分隔壁还包括与喷嘴层共同形成的第二层。
16.如权利要求15所述的方法,其特征在于,每个分隔壁相对于基底具有和喷嘴层基本相同的高度。
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CN102307732A (zh) * | 2009-02-06 | 2012-01-04 | 佳能株式会社 | 液体喷射头和喷墨打印装置 |
CN107443897A (zh) * | 2016-05-30 | 2017-12-08 | 佳能株式会社 | 记录元件基板、液体喷出头和液体喷出设备 |
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EP3781405A4 (en) | 2018-09-27 | 2021-12-01 | Hewlett-Packard Development Company, L.P. | BRACKETS INCLUDING FLUID EJECTION CHIPS |
JP7313884B2 (ja) * | 2019-04-22 | 2023-07-25 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
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JPH028057A (ja) * | 1988-06-28 | 1990-01-11 | Canon Inc | 液体噴射記録ヘッド |
JP2730481B2 (ja) * | 1994-03-31 | 1998-03-25 | 日本電気株式会社 | インクジェット記録ヘッドの製造方法 |
JP3604953B2 (ja) * | 1998-06-17 | 2004-12-22 | キヤノン株式会社 | 液体噴射記録ヘッド用素子基板の製造方法および液体噴射記録ヘッドの製造方法 |
US6764165B2 (en) * | 2002-09-30 | 2004-07-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device and method of manufacturing a fluid ejection device |
KR100452850B1 (ko) * | 2002-10-17 | 2004-10-14 | 삼성전자주식회사 | 잉크젯 프린터의 프린트 헤드 및 그 제조방법 |
US7229152B2 (en) * | 2003-10-31 | 2007-06-12 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with insulating feature |
KR20050072356A (ko) | 2004-01-06 | 2005-07-11 | 삼성전자주식회사 | 잉크젯 프린트 헤드칩들을 갖는 반도체 웨이퍼 및 그것을제조하는 방법 |
KR100560721B1 (ko) * | 2004-08-23 | 2006-03-13 | 삼성전자주식회사 | 금속 챔버층을 구비하는 잉크젯 헤드의 제조방법 및 그에의하여 제조된 잉크젯 헤드 |
JP2006281679A (ja) * | 2005-04-04 | 2006-10-19 | Canon Inc | 液体吐出ヘッドの製造方法および液体吐出ヘッド |
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Cited By (7)
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CN102307732A (zh) * | 2009-02-06 | 2012-01-04 | 佳能株式会社 | 液体喷射头和喷墨打印装置 |
US8523325B2 (en) | 2009-02-06 | 2013-09-03 | Canon Kabushiki Kaisha | Liquid ejection head and ink jet printing apparatus |
US8721047B2 (en) | 2009-02-06 | 2014-05-13 | Canon Kabushiki Kaisha | Liquid ejection head and ink jet printing apparatus |
CN102307732B (zh) * | 2009-02-06 | 2014-07-09 | 佳能株式会社 | 液体喷射头和喷墨打印装置 |
CN107443897A (zh) * | 2016-05-30 | 2017-12-08 | 佳能株式会社 | 记录元件基板、液体喷出头和液体喷出设备 |
CN107443897B (zh) * | 2016-05-30 | 2019-09-20 | 佳能株式会社 | 记录元件基板、液体喷出头和液体喷出设备 |
US10668719B2 (en) | 2016-05-30 | 2020-06-02 | Canon Kabushiki Kaisha | Recording element substrate, liquid ejection head, and liquid ejection apparatus |
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KR20080068237A (ko) | 2008-07-23 |
EP1946929A2 (en) | 2008-07-23 |
JP2008173972A (ja) | 2008-07-31 |
EP1946929A3 (en) | 2009-03-18 |
US20080174639A1 (en) | 2008-07-24 |
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