CN101241267A - Assembled luminous diode backlight module group - Google Patents
Assembled luminous diode backlight module group Download PDFInfo
- Publication number
- CN101241267A CN101241267A CNA2008100844917A CN200810084491A CN101241267A CN 101241267 A CN101241267 A CN 101241267A CN A2008100844917 A CNA2008100844917 A CN A2008100844917A CN 200810084491 A CN200810084491 A CN 200810084491A CN 101241267 A CN101241267 A CN 101241267A
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- backlight
- module
- multilayer structure
- conductive layer
- adamas
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Abstract
The invention relates to a combined type light emitting diode back light module, the composition units thereof are substantially back light module units. The units comprise one or a plurality of light emitting diodes, are disposed and packaged on a radiating plate with a multi-layer structure diamond insulating heat-conductive layer. One or more groups of back light module units are fixed on the frame to combine backlight bodies of different sizes.
Description
Technical field
The present invention relates to the application of heat dissipation technology, concrete a kind of tool assembled luminous diode module backlight, this combined type back light module unit structure can be applicable to assembling such as LCD and use.
Background technology
Along with improving constantly of electronic package power, the work waste heat increases and not equivalent raising of discharge capacity, causes assembly temperature rising work efficiency to reduce the problem of damaging assembly even.Self-criticism LED backlight module radiating mode commonly used contacts with heating radiator by circuit substrate, thermal grease as light-emitting diode component, makes the heat of electric appliance component be transmitted to the heating radiator discharge.Right actual the use shows that present radiating mode still exists following several thermal resistance shortcomings, one. between heating radiator and the light-emitting diode component, and the high thermal resistance macromolecule layer structure that exists insulation-encapsulated to use; Two. the light emitting diode electronic package is installed on the circuit substrate of high thermal resistance insulation; Three. use thermal grease between each structural sheet, because of the thermal grease pyroconductivity has only 1-5w/km, and interface can exist bubble and fault of construction etc., causes the thermal instability of product.Therefore large scale module backlight more has above-mentioned problem to exist, the improvement scheme is handled to improve palliatives such as radiator fins area or raising rotation speed of the fan at present, this method fails rationally to solve above listed heat dissipation problem, cause high-power large scale light emitting diode indicator rerum natura to stablize, and cause the quick reduction problem in serviceable life.
Summary of the invention
Purpose of the present invention is effectively to solve the heat dissipation problem of above-mentioned LED backlight module globality, and proposes a kind of tool assembled luminous diode module backlight.
The objective of the invention is to be achieved through the following technical solutions.
It is made up of a kind of tool assembled luminous diode module backlight a group or more module group unit backlight substantially, described module group unit backlight substantially by heat radiation backboard with fin as the main structure body, heat absorption end face at the heat radiation backboard is shaped on multilayer structure adamas insulating heat-conductive layer, and on multilayer structure adamas insulating heat-conductive layer, be packaged with one or more light emitting diodes, the combination of whole LED backlight module, it is module group unit backlight substantially by a group or more, be fixed on the group frame, become the module backlight of different size.
Described heat radiation backboard is the plate-like structure of being made by copper, aluminium, titanium, magnesium alloy with radiating fin.
Described heat radiation backboard is on the heat absorption end face of heat radiation backboard, and comprehensive or part is made as multilayer structure adamas insulating heat-conductive layer.
The adamas insulating heat-conductive layer of described multilayer structure, its multilayer structure are divided into two-layer up and down, and the substrat structure of the diamond layer of lower floor is made by sheet metal or metal oxide.
The adamas insulating heat-conductive layer of described multilayer structure, its multilayer structure divides two-layer up and down, and the diamond layer substrat structure of lower floor is combined with metal powder by diamond dust and makes.
The adamas insulating heat-conductive layer of described multilayer structure, its multilayer structure are divided into two-layer up and down, and the diamond layer structure on upper strata can be bored carbon (DLC), SiC or AlN and be made by artificially synthesizing diamond, class.
The adamas insulating heat-conductive layer of described multilayer structure on the insulating heat-conductive layer, is manufactured with supply line so that light emitting diode to be installed.
Described group frame, its space can be fixed in a group or more module group unit backlight substantially on the framework, to form the assembly backlight of different size.
The present invention efficiently solves the heat dissipation problem of LCD, specifically is the heat dissipation problem that has solved LED backlight module globality, can make the rerum natura of high-power large scale light emitting diode indicator stable, and improve its serviceable life.
Description of drawings
Fig. 1 is the present invention's module group unit structural representation backlight substantially;
Fig. 2 is an assembled luminous diode back light module unit structure synoptic diagram.
Among the figure: 1-module group unit backlight substantially, the 11-backboard that dispels the heat, 12-radiating fin, 13-multilayer structure adamas insulating heat-conductive layer, 131-diamond layer substrate, 132-diamond layer, 14-light-emitting diode component, 2-group frame
Embodiment
As shown in Figure 1, combined LED back light module unit structure of the present invention is made up of the high efficiency module group unit 1 backlight substantially of heat radiation, substantially module group unit backlight, comprise that a heat radiation backboard 11 is main body, this heat radiation backboard 11 is on the heat absorption end face of heating radiator, comprehensive or the local multilayer structure adamas insulating heat-conductive layer 13 of making, the multilayer structure of adamas insulating heat-conductive layer 13 divides two-layer up and down, lower floor is a diamond layer substrate 131, the upper strata is a diamond layer 132, make the radiating fin 12 of different demand shapes on the heat radiation end face of heat radiation backboard 11, one or more light-emitting diode components 14 are installed and are encapsulated on the top of this multilayer structure adamas insulating heat-conductive layer 13 on demand.Make up a group or more module group unit 1 backlight substantially during application, module group unit backlight substantially is fixed on the body framework 2 backlight of specific dimensions, to form the assembly backlight of different size.
As shown in Figure 2, make the heat radiation backboard 11 of module group unit 1 backlight substantially, make the radiating fin 12 of different demand shapes and size on the radiating surface of heat radiation backboard.On the heat radiation backboard heat absorption end face of module group unit backlight substantially, comprehensive or local lamination is made multilayer structure adamas insulating heat-conductive layer 13, the multilayer structure of adamas insulating heat-conductive layer divides two-layer up and down, and lower floor is a diamond layer substrat structure 131, and the upper strata is a diamond layer structure 132.Multilayer structure adamas insulating heat-conductive layer top at module group unit backlight substantially makes supply line on demand, and installs and the one or more light emitting diodes 14 of encapsulation.With a group or more module group unit backlight substantially, be fixed on the body group frame 2 backlight of specific dimensions, to form the body backlight of different size.
Claims (8)
1. tool assembled luminous diode module backlight, it is characterized in that: it is made up of a group or more module group unit backlight substantially, described module group unit backlight substantially by heat radiation backboard with fin as the main structure body, heat absorption end face at the heat radiation backboard is shaped on multilayer structure adamas insulating heat-conductive layer, and on multilayer structure adamas insulating heat-conductive layer, be packaged with one or more light emitting diodes, the combination of whole LED backlight module, it is module group unit backlight substantially by a group or more, be fixed on the group frame, become the module backlight of different size.
2. tool assembled luminous diode according to claim 1 module backlight is characterized in that: described heat radiation backboard is the plate-like structure of being made by copper, aluminium, titanium, magnesium alloy with radiating fin.
3. tool assembled luminous diode according to claim 1 module backlight is characterized in that: described heat radiation backboard is on the heat absorption end face of heat radiation backboard, and comprehensive or part is made as multilayer structure adamas insulating heat-conductive layer.
4. tool assembled luminous diode according to claim 1 module backlight, it is characterized in that: the adamas insulating heat-conductive layer of described multilayer structure, its multilayer structure is divided into two-layer up and down, and the substrat structure of the diamond layer of lower floor is made by sheet metal or metal oxide.
5. tool assembled luminous diode according to claim 1 module backlight, it is characterized in that: the adamas insulating heat-conductive layer of described multilayer structure, its multilayer structure divides two-layer up and down, and the diamond layer substrat structure of lower floor is combined with metal powder by diamond dust and makes.
6. tool assembled luminous diode according to claim 1 module backlight, it is characterized in that: the adamas insulating heat-conductive layer of described multilayer structure, its multilayer structure is divided into two-layer up and down, the diamond layer structure on upper strata can be bored carbon (DLC), SiC or AlN and be made by artificially synthesizing diamond, class.
7. tool assembled luminous diode according to claim 1 module backlight is characterized in that: the adamas insulating heat-conductive layer of described multilayer structure on the insulating heat-conductive layer, is manufactured with supply line so that light emitting diode to be installed.
8. tool assembled luminous diode according to claim 1 module backlight, it is characterized in that: described group frame, its space can be fixed in a group or more module group unit backlight substantially on the framework, to form the assembly backlight of different size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100844917A CN101241267A (en) | 2008-03-26 | 2008-03-26 | Assembled luminous diode backlight module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100844917A CN101241267A (en) | 2008-03-26 | 2008-03-26 | Assembled luminous diode backlight module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101241267A true CN101241267A (en) | 2008-08-13 |
Family
ID=39932909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100844917A Pending CN101241267A (en) | 2008-03-26 | 2008-03-26 | Assembled luminous diode backlight module group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101241267A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159886A (en) * | 2008-09-19 | 2011-08-17 | 欧司朗有限公司 | Illumination device comprising a light-emitting diode |
| WO2013007195A1 (en) * | 2011-07-11 | 2013-01-17 | 东莞巨扬电器有限公司 | High-power led illumination device |
-
2008
- 2008-03-26 CN CNA2008100844917A patent/CN101241267A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159886A (en) * | 2008-09-19 | 2011-08-17 | 欧司朗有限公司 | Illumination device comprising a light-emitting diode |
| US8686557B2 (en) | 2008-09-19 | 2014-04-01 | Osram Gesellschaft Mit Beschrankter Haftung | Illumination device comprising a light-emitting diode |
| WO2013007195A1 (en) * | 2011-07-11 | 2013-01-17 | 东莞巨扬电器有限公司 | High-power led illumination device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080813 |