CN101223635A - 用于高物流量自动化物料搬运系统的模块终端 - Google Patents
用于高物流量自动化物料搬运系统的模块终端 Download PDFInfo
- Publication number
- CN101223635A CN101223635A CNA2006800255004A CN200680025500A CN101223635A CN 101223635 A CN101223635 A CN 101223635A CN A2006800255004 A CNA2006800255004 A CN A2006800255004A CN 200680025500 A CN200680025500 A CN 200680025500A CN 101223635 A CN101223635 A CN 101223635A
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- China
- Prior art keywords
- container
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- conveying system
- conveyer
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
Claims (40)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68138905P | 2005-05-16 | 2005-05-16 | |
US60/681,389 | 2005-05-16 | ||
US69778505P | 2005-07-08 | 2005-07-08 | |
US60/697,785 | 2005-07-08 | ||
PCT/US2006/018568 WO2006124683A2 (en) | 2005-05-16 | 2006-05-15 | Modular terminal for high-throughput amhs |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101223635A true CN101223635A (zh) | 2008-07-16 |
CN101223635B CN101223635B (zh) | 2010-05-19 |
Family
ID=36968681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800255004A Expired - Fee Related CN101223635B (zh) | 2005-05-16 | 2006-05-15 | 用于高物流量自动化物料搬运系统的模块终端 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7798759B2 (zh) |
EP (1) | EP1883958A2 (zh) |
JP (1) | JP5152700B2 (zh) |
KR (1) | KR100965525B1 (zh) |
CN (1) | CN101223635B (zh) |
WO (1) | WO2006124683A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019119936A1 (zh) * | 2017-12-20 | 2019-06-27 | 北京京东尚科信息技术有限公司 | 货物传输系统、方法和装置 |
CN114162509A (zh) * | 2015-04-15 | 2022-03-11 | 奥卡多创新有限公司 | 物品处理系统与方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7410340B2 (en) * | 2005-02-24 | 2008-08-12 | Asyst Technologies, Inc. | Direct tool loading |
US20090067957A1 (en) * | 2007-09-06 | 2009-03-12 | Mitsuhiro Ando | Transport system with buffering |
US7992734B2 (en) * | 2008-01-11 | 2011-08-09 | International Business Machines Corporation | Semiconductor automation buffer storage identification system and method |
DE102008036564B4 (de) * | 2008-07-30 | 2010-09-30 | SSI Schäfer PEEM GmbH | Skalierbarer Versandpuffer mit integrierter Sortierfunktion und Verfahren dazu |
US9214372B2 (en) * | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
CN102804355B (zh) | 2009-05-18 | 2015-05-27 | 布鲁克斯自动化公司 | 基片容器存储系统 |
US8882433B2 (en) | 2009-05-18 | 2014-11-11 | Brooks Automation, Inc. | Integrated systems for interfacing with substrate container storage systems |
WO2010135205A2 (en) * | 2009-05-18 | 2010-11-25 | Crossing Automation, Inc. | Integrated systems for interfacing with substrate container storage systems |
US8275480B2 (en) * | 2009-11-17 | 2012-09-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Methods and systems for transporting parts from a primary process to a secondary process in a first in, first out fashion |
WO2012092301A2 (en) * | 2010-12-29 | 2012-07-05 | Intevac, Inc. | Method and apparatus for masking substrates for deposition |
US9558978B2 (en) | 2012-05-04 | 2017-01-31 | Kla-Tencor Corporation | Material handling with dedicated automated material handling system |
WO2015109315A2 (en) * | 2014-01-20 | 2015-07-23 | Brooks Automation, Inc. | Portable cryogenic workstation |
JP6549310B2 (ja) * | 2016-03-22 | 2019-07-24 | 株式会社新川 | 基板供給ユニット及びボンディング装置 |
US10611570B1 (en) | 2016-10-25 | 2020-04-07 | Karen Lynnette Washington | Apparatus, system, and method for a drive-through grocery service |
US11279559B1 (en) | 2017-10-24 | 2022-03-22 | Hotberry, Llc | Intelligent shelves for automated distribution of products |
US11011402B2 (en) * | 2018-06-27 | 2021-05-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Transport system of semiconductor fabrication facility, associated movable container and method |
JP7255615B2 (ja) * | 2021-01-29 | 2023-04-11 | 村田機械株式会社 | コンベアシステム |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1294875B (de) * | 1966-04-14 | 1969-05-08 | Standard Elektrik Lorenz Ag | Aufzug zum selbsttaetigen Beladen einer hochgelegenen Foerderanlage |
IT1260039B (it) * | 1992-02-24 | 1996-03-28 | Metodo di transito per piccoli oggetti all'interno di camere di trattamento, e suoi mezzi attuatori | |
ES2078717T3 (es) | 1992-08-04 | 1995-12-16 | Ibm | Aparato de reparticion con un sistema de distribucion y alimentacion de gas para manipular y almacenar recipientes transportables estancos a presion. |
JP3669057B2 (ja) * | 1996-06-03 | 2005-07-06 | アシスト シンコー株式会社 | ストッカへの搬送システム |
US5980183A (en) | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
US6039169A (en) * | 1998-05-05 | 2000-03-21 | Gima S.P.A. | Multilevel storage device for containers, in particular CD cases |
JP2000124284A (ja) | 1998-10-13 | 2000-04-28 | Hitachi Kiden Kogyo Ltd | 搬送装置 |
US6283692B1 (en) * | 1998-12-01 | 2001-09-04 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
US6435330B1 (en) * | 1998-12-18 | 2002-08-20 | Asyai Technologies, Inc. | In/out load port transfer mechanism |
US6089811A (en) * | 1998-12-25 | 2000-07-18 | Fujitsu Limited | Production line workflow and parts transport arrangement |
KR100603100B1 (ko) * | 1999-05-06 | 2006-07-20 | 동경 엘렉트론 주식회사 | 유리 기판의 반송 시스템 |
JP2000159304A (ja) * | 2000-01-01 | 2000-06-13 | Advanced Display Inc | カセットの搬送方法および該方法に用いる自動倉庫 |
US20020025244A1 (en) * | 2000-04-12 | 2002-02-28 | Kim Ki-Sang | Transfer system and apparatus for workpiece containers and method of transferring the workpiece containers using the same |
CH714282B1 (de) * | 2000-07-06 | 2019-04-30 | Murata Machinery Ltd | Lagersystem mit Förderelementen. |
JP3074688U (ja) * | 2000-07-07 | 2001-01-19 | 壽春 黒山 | オートラック装置 |
JP2002114324A (ja) * | 2000-10-06 | 2002-04-16 | Mitsubishi Heavy Ind Ltd | 倉庫設備 |
US6677690B2 (en) | 2001-02-02 | 2004-01-13 | Asyst Technologies, Inc. | System for safeguarding integrated intrabay pod delivery and storage system |
US6854583B1 (en) * | 2001-02-06 | 2005-02-15 | Middlesex General Industries, Inc. | Conveyorized storage and transportation system |
JP2002319609A (ja) | 2001-04-19 | 2002-10-31 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US20020187024A1 (en) * | 2001-06-12 | 2002-12-12 | Applied Materials, Inc. | Apparatus for storing and moving a carrier |
JP4220173B2 (ja) * | 2002-03-26 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | 基板の搬送方法 |
US20040081546A1 (en) | 2002-08-31 | 2004-04-29 | Applied Materials, Inc. | Method and apparatus for supplying substrates to a processing tool |
US6955197B2 (en) | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
JP3991852B2 (ja) * | 2002-12-09 | 2007-10-17 | 村田機械株式会社 | 天井搬送車システム |
JP2004238089A (ja) | 2003-02-03 | 2004-08-26 | Murata Mach Ltd | ストッカ |
ES2287440T3 (es) * | 2003-03-19 | 2007-12-16 | Cavanna S.P.A. | Dispositivo de transporte de articulos, en particular para maquinaria de embalaje automatica y procedimiento de uso correspondiente. |
US6990721B2 (en) * | 2003-03-21 | 2006-01-31 | Brooks Automation, Inc. | Growth model automated material handling system |
JP2004307125A (ja) * | 2003-04-04 | 2004-11-04 | Asyst Shinko Inc | 保管棚装置 |
JP4470576B2 (ja) * | 2003-05-20 | 2010-06-02 | ムラテックオートメーション株式会社 | 搬送システム |
JP2005167083A (ja) * | 2003-12-04 | 2005-06-23 | Daifuku Co Ltd | ガラス基板用の搬送設備 |
US7168905B1 (en) * | 2005-08-01 | 2007-01-30 | Worthwhile Products | Storage and retrieval system |
US8308418B2 (en) * | 2006-05-09 | 2012-11-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | High efficiency buffer stocker |
-
2006
- 2006-05-15 KR KR1020077029508A patent/KR100965525B1/ko active IP Right Grant
- 2006-05-15 US US11/433,980 patent/US7798759B2/en not_active Expired - Fee Related
- 2006-05-15 EP EP06759761A patent/EP1883958A2/en not_active Withdrawn
- 2006-05-15 JP JP2008512381A patent/JP5152700B2/ja not_active Expired - Fee Related
- 2006-05-15 WO PCT/US2006/018568 patent/WO2006124683A2/en active Application Filing
- 2006-05-15 CN CN2006800255004A patent/CN101223635B/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114162509A (zh) * | 2015-04-15 | 2022-03-11 | 奥卡多创新有限公司 | 物品处理系统与方法 |
WO2019119936A1 (zh) * | 2017-12-20 | 2019-06-27 | 北京京东尚科信息技术有限公司 | 货物传输系统、方法和装置 |
US11407591B2 (en) | 2017-12-20 | 2022-08-09 | Beijing Jingdong Zhenshi Information Technology Co., Ltd. | System, method, and apparatus for transporting goods |
Also Published As
Publication number | Publication date |
---|---|
EP1883958A2 (en) | 2008-02-06 |
CN101223635B (zh) | 2010-05-19 |
US20070128007A1 (en) | 2007-06-07 |
JP2008540299A (ja) | 2008-11-20 |
WO2006124683A2 (en) | 2006-11-23 |
US7798759B2 (en) | 2010-09-21 |
WO2006124683A3 (en) | 2007-03-22 |
JP5152700B2 (ja) | 2013-02-27 |
KR20080025068A (ko) | 2008-03-19 |
KR100965525B1 (ko) | 2010-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: MURATA AUTOMATIC MACHINERY CO., LTD. Free format text: FORMER OWNER: ASAISITE TECHNOLOGY COMPANY Effective date: 20091016 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20091016 Address after: Kyoto Japan Applicant after: Asyst Technologies Address before: American California Applicant before: Asyst Technologies Inc. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: MURATA MACHINERY CO., LTD. Free format text: FORMER OWNER: ASYST TECHNOLOGIES Effective date: 20130514 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130514 Address after: Kyoto Japan Patentee after: Murata Machinery Co., Ltd. Address before: Kyoto Japan Patentee before: Asyst Technologies |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20190515 |
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CF01 | Termination of patent right due to non-payment of annual fee |