CN101204890B - 印刷平滑微尺度特征的方法以及印刷系统 - Google Patents

印刷平滑微尺度特征的方法以及印刷系统 Download PDF

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Publication number
CN101204890B
CN101204890B CN2007101603044A CN200710160304A CN101204890B CN 101204890 B CN101204890 B CN 101204890B CN 2007101603044 A CN2007101603044 A CN 2007101603044A CN 200710160304 A CN200710160304 A CN 200710160304A CN 101204890 B CN101204890 B CN 101204890B
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CN
China
Prior art keywords
printing
substrate
printed
test pattern
droplet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101603044A
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English (en)
Chinese (zh)
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CN101204890A (zh
Inventor
U·斯里尼瓦桑
S·D·怀特
E·J·什拉德
S·E·里迪
S·J·林布
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palo Alto Research Center Inc
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Palo Alto Research Center Inc
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Publication date
Application filed by Palo Alto Research Center Inc filed Critical Palo Alto Research Center Inc
Publication of CN101204890A publication Critical patent/CN101204890A/zh
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Publication of CN101204890B publication Critical patent/CN101204890B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ink Jet (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2007101603044A 2006-12-20 2007-12-19 印刷平滑微尺度特征的方法以及印刷系统 Expired - Fee Related CN101204890B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/642146 2006-12-20
US11/642,146 US7524015B2 (en) 2006-12-20 2006-12-20 Method of printing smooth micro-scale features

Publications (2)

Publication Number Publication Date
CN101204890A CN101204890A (zh) 2008-06-25
CN101204890B true CN101204890B (zh) 2011-11-23

Family

ID=39146883

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101603044A Expired - Fee Related CN101204890B (zh) 2006-12-20 2007-12-19 印刷平滑微尺度特征的方法以及印刷系统

Country Status (6)

Country Link
US (1) US7524015B2 (cg-RX-API-DMAC7.html)
EP (1) EP1937045B1 (cg-RX-API-DMAC7.html)
JP (1) JP4748606B2 (cg-RX-API-DMAC7.html)
CN (1) CN101204890B (cg-RX-API-DMAC7.html)
DE (1) DE602007010891D1 (cg-RX-API-DMAC7.html)
TW (1) TWI397360B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
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US11687065B2 (en) 2020-12-18 2023-06-27 Industrial Technology Research Institute Method and system for generating and updating position distribution graph

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US8968985B2 (en) * 2007-03-30 2015-03-03 Palo Alto Research Center Incorporated Method and system for patterning a mask layer
US8551556B2 (en) * 2007-11-20 2013-10-08 Palo Alto Research Center Incorporated Method for obtaining controlled sidewall profile in print-patterned structures
US8251476B2 (en) 2010-02-03 2012-08-28 Xerox Corporation Ink drop position correction in the process direction based on ink drop position history
US8262190B2 (en) 2010-05-14 2012-09-11 Xerox Corporation Method and system for measuring and compensating for process direction artifacts in an optical imaging system in an inkjet printer
US8721026B2 (en) 2010-05-17 2014-05-13 Xerox Corporation Method for identifying and verifying dash structures as candidates for test patterns and replacement patterns in an inkjet printer
CN102186309B (zh) * 2011-03-22 2013-03-20 鞍山市正发电路有限公司 激光直接成像全印刷电路
US20140060144A1 (en) * 2012-08-30 2014-03-06 Illnois Tool Works Inc. Method and apparatus for calibrating dispensed deposits
US8840223B2 (en) 2012-11-19 2014-09-23 Xerox Corporation Compensation for alignment errors in an optical sensor
US8764149B1 (en) 2013-01-17 2014-07-01 Xerox Corporation System and method for process direction registration of inkjets in a printer operating with a high speed image receiving surface
US9144818B2 (en) 2013-03-13 2015-09-29 Illinois Tool Works Inc. Method and apparatus for dispensing a viscous material on a substrate
US9374905B2 (en) * 2013-09-30 2016-06-21 Illinois Tool Works Inc. Method and apparatus for automatically adjusting dispensing units of a dispenser
US9357686B2 (en) 2013-11-14 2016-05-31 Illinois Tool Works Inc. Dispensing apparatus having substrate inverter system and clamping system, and method for dispensing a viscous material on a substrate
US9662675B2 (en) 2014-07-31 2017-05-30 Illinois Tool Works Inc. External inverter system for variable substrate thickness and method for rotating a substrate
US11108918B2 (en) 2017-01-17 2021-08-31 Hewlett-Packard Development Company, L.P. Assessing print quality using intensity histograms and perimeter lengths
GB2566112B (en) * 2017-09-05 2022-10-12 Arrayjet Ltd Method and device for producing printed microarrays
CN112970337B (zh) 2019-02-14 2022-05-24 奥宝科技有限公司 用于制备具有高度密集导体的pcb产品的方法及设备
JPWO2023058227A1 (cg-RX-API-DMAC7.html) * 2021-10-08 2023-04-13

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CN1561158A (zh) * 2004-03-08 2005-01-05 叶建乐 印制电路板制造工艺流程
CN1612048A (zh) * 2003-10-30 2005-05-04 富士胶片株式会社 印刷电路板的制造方法
US20050145832A1 (en) * 2003-12-30 2005-07-07 Bernhard Wessling Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto

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JPH01261886A (ja) 1988-04-12 1989-10-18 Matsushita Electric Ind Co Ltd 厚膜描画方法
JPH0210884A (ja) * 1988-06-29 1990-01-16 Matsushita Electric Ind Co Ltd 厚膜描画方法
JPH0632361B2 (ja) * 1988-07-30 1994-04-27 ジューキ株式会社 回路形成装置における描画ピッチ設定装置
US5843847A (en) * 1996-04-29 1998-12-01 Applied Materials, Inc. Method for etching dielectric layers with high selectivity and low microloading
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JP4040161B2 (ja) * 1998-04-03 2008-01-30 キヤノン株式会社 プリント位置合わせ方法およびプリント装置
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US6972261B2 (en) * 2002-06-27 2005-12-06 Xerox Corporation Method for fabricating fine features by jet-printing and surface treatment
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CN1612048A (zh) * 2003-10-30 2005-05-04 富士胶片株式会社 印刷电路板的制造方法
US20050145832A1 (en) * 2003-12-30 2005-07-07 Bernhard Wessling Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto
CN1561158A (zh) * 2004-03-08 2005-01-05 叶建乐 印制电路板制造工艺流程

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11687065B2 (en) 2020-12-18 2023-06-27 Industrial Technology Research Institute Method and system for generating and updating position distribution graph

Also Published As

Publication number Publication date
US7524015B2 (en) 2009-04-28
JP2008160105A (ja) 2008-07-10
DE602007010891D1 (de) 2011-01-13
TW200908835A (en) 2009-02-16
TWI397360B (zh) 2013-05-21
EP1937045A1 (en) 2008-06-25
CN101204890A (zh) 2008-06-25
EP1937045B1 (en) 2010-12-01
JP4748606B2 (ja) 2011-08-17
US20080150989A1 (en) 2008-06-26

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Granted publication date: 20111123

Termination date: 20211219