CN101195911B - 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 - Google Patents
在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 Download PDFInfo
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- CN101195911B CN101195911B CN2006101659030A CN200610165903A CN101195911B CN 101195911 B CN101195911 B CN 101195911B CN 2006101659030 A CN2006101659030 A CN 2006101659030A CN 200610165903 A CN200610165903 A CN 200610165903A CN 101195911 B CN101195911 B CN 101195911B
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- 229920003169 water-soluble polymer Polymers 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101659030A CN101195911B (zh) | 2006-12-08 | 2006-12-08 | 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 |
| TW95147751A TW200827482A (en) | 2006-12-08 | 2006-12-18 | Pre-treatment solution and method of forming a layer of a coating metal on a plastics surface containing substrate |
| EP06077232A EP1942207A1 (fr) | 2006-12-08 | 2006-12-18 | Solution de prétraitement et procédé de formation d'une couche d'un métal de revêtement sur un substrat doté d'une surface en plastique |
| PCT/EP2007/011201 WO2008068049A1 (fr) | 2006-12-08 | 2007-12-10 | Solution de prétraitement et procédé de formation d'une couche d'un métal de revêtement sur un substrat comprenant une surface en plastique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101659030A CN101195911B (zh) | 2006-12-08 | 2006-12-08 | 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101195911A CN101195911A (zh) | 2008-06-11 |
| CN101195911B true CN101195911B (zh) | 2011-06-22 |
Family
ID=38016975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101659030A Expired - Fee Related CN101195911B (zh) | 2006-12-08 | 2006-12-08 | 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1942207A1 (fr) |
| CN (1) | CN101195911B (fr) |
| TW (1) | TW200827482A (fr) |
| WO (1) | WO2008068049A1 (fr) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2639333A1 (fr) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Procédé de métallisation de surfaces en matière synthétique non conductrices |
| EP2639332A1 (fr) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Procédé de métallisation de surfaces en matière synthétique non conductrices |
| CN104540655A (zh) * | 2012-05-14 | 2015-04-22 | 汽车专利管理和利用有限公司 | 塑料制复合材料组件 |
| LT6070B (lt) * | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
| US9364822B2 (en) | 2013-06-28 | 2016-06-14 | Rohm And Haas Electronic Materials Llc | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds |
| CN108138323B (zh) * | 2015-07-30 | 2020-08-04 | 巴斯夫欧洲公司 | 用于金属化的塑料表面的预处理方法 |
| US20180202048A1 (en) * | 2015-07-30 | 2018-07-19 | Basf Se | Process for metallizing plastic surfaces |
| EP3144414B1 (fr) * | 2015-09-21 | 2022-11-23 | Airbus Defence and Space GmbH | Traitement enzymatique d'objets en polyamide à des fins de métallisation |
| CN109778152A (zh) * | 2017-11-10 | 2019-05-21 | 中国科学院大连化学物理研究所 | 一种高比表面积钯/聚合物复合膜的改进化学镀方法 |
| CN108251874B (zh) * | 2018-01-24 | 2019-08-16 | 永星化工(上海)有限公司 | 适于电镀的功能性树脂组合物上涂布金属层的预处理溶液 |
| CN113853452A (zh) * | 2019-05-17 | 2021-12-28 | 希德泰克基金会 | 可透光的金属涂层及其制造方法 |
| CN117178076A (zh) * | 2021-03-29 | 2023-12-05 | 哈索赫伯特施密特有限两合公司 | 聚酰胺的酸洗 |
| CN113293362B (zh) * | 2021-05-25 | 2022-02-11 | 吉安宏达秋科技有限公司 | 一种化学镀铜膨松液及其制备方法和应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
| US5296020A (en) * | 1991-04-11 | 1994-03-22 | Bayer Aktiengesellschaft | Formulation for the activation of substrate surfaces for currentless metallization thereof |
| CN1508287A (zh) * | 2002-12-18 | 2004-06-30 | 用于塑料电镀的基底的活化方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3339857A1 (de) * | 1983-11-04 | 1985-05-15 | Bayer Ag, 5090 Leverkusen | Verfahren zur vorbehandlung von polyamidsubstraten fuer die stromlose metallisierung |
| DE4412463C3 (de) * | 1994-04-08 | 2000-02-10 | Atotech Deutschland Gmbh | Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung |
| DE19740431C1 (de) * | 1997-09-11 | 1998-11-12 | Atotech Deutschland Gmbh | Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats |
-
2006
- 2006-12-08 CN CN2006101659030A patent/CN101195911B/zh not_active Expired - Fee Related
- 2006-12-18 EP EP06077232A patent/EP1942207A1/fr not_active Withdrawn
- 2006-12-18 TW TW95147751A patent/TW200827482A/zh unknown
-
2007
- 2007-12-10 WO PCT/EP2007/011201 patent/WO2008068049A1/fr active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
| US5296020A (en) * | 1991-04-11 | 1994-03-22 | Bayer Aktiengesellschaft | Formulation for the activation of substrate surfaces for currentless metallization thereof |
| CN1508287A (zh) * | 2002-12-18 | 2004-06-30 | 用于塑料电镀的基底的活化方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1942207A1 (fr) | 2008-07-09 |
| TW200827482A (en) | 2008-07-01 |
| WO2008068049A1 (fr) | 2008-06-12 |
| CN101195911A (zh) | 2008-06-11 |
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Granted publication date: 20110622 Termination date: 20171208 |