CN101192816B - 制造声波器件的方法 - Google Patents

制造声波器件的方法 Download PDF

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Publication number
CN101192816B
CN101192816B CN2007101960361A CN200710196036A CN101192816B CN 101192816 B CN101192816 B CN 101192816B CN 2007101960361 A CN2007101960361 A CN 2007101960361A CN 200710196036 A CN200710196036 A CN 200710196036A CN 101192816 B CN101192816 B CN 101192816B
Authority
CN
China
Prior art keywords
conductive pattern
acoustic wave
forming
electrode
wave element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101960361A
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English (en)
Chinese (zh)
Other versions
CN101192816A (zh
Inventor
相川俊一
木村丈儿
津田庆二
井上和则
松田隆志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Fujitsu Ltd
Fujitsu Media Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fujitsu Media Devices Ltd filed Critical Fujitsu Ltd
Publication of CN101192816A publication Critical patent/CN101192816A/zh
Application granted granted Critical
Publication of CN101192816B publication Critical patent/CN101192816B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/64Filters using surface acoustic waves
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/4908Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49789Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798Dividing sequentially from leading end, e.g., by cutting or breaking

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN2007101960361A 2006-11-28 2007-11-28 制造声波器件的方法 Expired - Fee Related CN101192816B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-320892 2006-11-28
JP2006320892 2006-11-28
JP2006320892A JP2008135999A (ja) 2006-11-28 2006-11-28 弾性波デバイスおよびその製造方法

Publications (2)

Publication Number Publication Date
CN101192816A CN101192816A (zh) 2008-06-04
CN101192816B true CN101192816B (zh) 2010-06-23

Family

ID=39462935

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101960361A Expired - Fee Related CN101192816B (zh) 2006-11-28 2007-11-28 制造声波器件的方法

Country Status (4)

Country Link
US (1) US7721411B2 (enExample)
JP (1) JP2008135999A (enExample)
KR (1) KR100891419B1 (enExample)
CN (1) CN101192816B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5714361B2 (ja) * 2011-03-01 2015-05-07 日本碍子株式会社 端子電極形成方法及びそれを用いた圧電/電歪素子の製造方法
JP5848079B2 (ja) * 2011-09-26 2016-01-27 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP5882053B2 (ja) * 2011-12-28 2016-03-09 太陽誘電株式会社 弾性波デバイスの製造方法
WO2013114919A1 (ja) 2012-01-30 2013-08-08 株式会社村田製作所 電子部品の製造方法
JP6044643B2 (ja) * 2012-12-05 2016-12-14 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
WO2015025618A1 (ja) * 2013-08-20 2015-02-26 株式会社 村田製作所 弾性表面波デバイス及びその製造方法
CN104241518B (zh) * 2014-08-29 2017-03-15 北京长峰微电科技有限公司 一种声表面波器件晶圆钝化方法
GB2571361B (en) * 2018-03-02 2020-04-22 Novosound Ltd Ultrasound array transducer manufacturing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6367133B2 (en) * 2000-03-15 2002-04-09 Murata Manufacturing Co., Ltd. Method of manufacturing surface acoustic wave apparatus
CN1489285A (zh) * 2002-09-04 2004-04-14 ��ʿͨý�岿Ʒ��ʽ���� 表面声波器件、滤波器装置和制造表面声波器件的方法
EP1414149A1 (en) * 2001-07-02 2004-04-28 Matsushita Electric Industrial Co., Ltd. Method for manufacturing surface acoustic wave device
CN1495999A (zh) * 2002-08-13 2004-05-12 ��ʿͨý��������ʽ���� 声波器件及其制作方法
CN1518213A (zh) * 2003-01-28 2004-08-04 ��ʿͨý�岿Ʒ��ʽ���� 表面声波器件及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03293808A (ja) * 1990-04-11 1991-12-25 Fujitsu Ltd 弾性表面波素子の製造方法
JP3329696B2 (ja) 1997-07-08 2002-09-30 株式会社東芝 半導体装置の製造方法
JP2002141762A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd 弾性表面波フィルタの製造方法
JP3818147B2 (ja) * 2001-12-18 2006-09-06 松下電器産業株式会社 Sawデバイスの製造方法
JP2004056036A (ja) 2002-07-24 2004-02-19 Sony Corp 半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6367133B2 (en) * 2000-03-15 2002-04-09 Murata Manufacturing Co., Ltd. Method of manufacturing surface acoustic wave apparatus
EP1414149A1 (en) * 2001-07-02 2004-04-28 Matsushita Electric Industrial Co., Ltd. Method for manufacturing surface acoustic wave device
CN1495999A (zh) * 2002-08-13 2004-05-12 ��ʿͨý��������ʽ���� 声波器件及其制作方法
CN1489285A (zh) * 2002-09-04 2004-04-14 ��ʿͨý�岿Ʒ��ʽ���� 表面声波器件、滤波器装置和制造表面声波器件的方法
CN1518213A (zh) * 2003-01-28 2004-08-04 ��ʿͨý�岿Ʒ��ʽ���� 表面声波器件及其制造方法

Also Published As

Publication number Publication date
KR100891419B1 (ko) 2009-04-02
US20080122318A1 (en) 2008-05-29
KR20080048404A (ko) 2008-06-02
JP2008135999A (ja) 2008-06-12
US7721411B2 (en) 2010-05-25
CN101192816A (zh) 2008-06-04

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Free format text: FORMER OWNER: FUJITSU LTD.

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20100802

Address after: Kanagawa

Co-patentee after: Taiyo Yuden Co., Ltd.

Patentee after: Fujitsu Media Devices Ltd

Address before: Kanagawa

Co-patentee before: Fujitsu Ltd.

Patentee before: Fujitsu Media Devices Ltd

ASS Succession or assignment of patent right

Free format text: FORMER OWNER: TAIYO YUDEN CO., LTD.

Owner name: TAIYO YUDEN CO., LTD.

Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD

Effective date: 20101201

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: KANAGAWA PREFECTURE, JAPAN TO: TOKYO, JAPAN

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Address after: Tokyo, Japan, Japan

Patentee after: Taiyo Yuden Co., Ltd.

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Co-patentee before: Taiyo Yuden Co., Ltd.

Patentee before: Fujitsu Media Devices Ltd

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100623

Termination date: 20111128