CN101188909B - 一种挠性线路板及其镀铜方法 - Google Patents
一种挠性线路板及其镀铜方法 Download PDFInfo
- Publication number
- CN101188909B CN101188909B CN2006101569693A CN200610156969A CN101188909B CN 101188909 B CN101188909 B CN 101188909B CN 2006101569693 A CN2006101569693 A CN 2006101569693A CN 200610156969 A CN200610156969 A CN 200610156969A CN 101188909 B CN101188909 B CN 101188909B
- Authority
- CN
- China
- Prior art keywords
- copper
- zone
- outer region
- wiring board
- intracardiac
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 54
- 239000010949 copper Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000007747 plating Methods 0.000 title abstract description 15
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 210000001138 tear Anatomy 0.000 description 2
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006101569693A CN101188909B (zh) | 2006-11-16 | 2006-11-16 | 一种挠性线路板及其镀铜方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006101569693A CN101188909B (zh) | 2006-11-16 | 2006-11-16 | 一种挠性线路板及其镀铜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101188909A CN101188909A (zh) | 2008-05-28 |
CN101188909B true CN101188909B (zh) | 2010-06-16 |
Family
ID=39481019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101569693A Withdrawn - After Issue CN101188909B (zh) | 2006-11-16 | 2006-11-16 | 一种挠性线路板及其镀铜方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101188909B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101951728B (zh) * | 2010-09-10 | 2012-01-25 | 广东依顿电子科技股份有限公司 | 一种硬制线路板代替软性线路板的生产方法 |
CN105979712B (zh) * | 2015-12-18 | 2019-02-26 | 昆山铨莹电子有限公司 | 一种异性塔垒式双面按键板制作方法 |
CN106098633B (zh) * | 2016-06-30 | 2019-05-21 | 广州兴森快捷电路科技有限公司 | 一种封装基板及其制作方法 |
CN114599164B (zh) * | 2022-03-11 | 2023-09-29 | 博敏电子股份有限公司 | 一种解决cob产品外层线路铜皮破损的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1802070A (zh) * | 2005-01-06 | 2006-07-12 | 日本梅克特隆株式会社 | 柔性印刷电路衬底的冲孔加工方法 |
CN1842254A (zh) * | 2005-03-29 | 2006-10-04 | 日立电线株式会社 | 双面布线印制电路板的制造方法、双面布线印制电路板及其基础原板 |
-
2006
- 2006-11-16 CN CN2006101569693A patent/CN101188909B/zh not_active Withdrawn - After Issue
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1802070A (zh) * | 2005-01-06 | 2006-07-12 | 日本梅克特隆株式会社 | 柔性印刷电路衬底的冲孔加工方法 |
CN1842254A (zh) * | 2005-03-29 | 2006-10-04 | 日立电线株式会社 | 双面布线印制电路板的制造方法、双面布线印制电路板及其基础原板 |
Also Published As
Publication number | Publication date |
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CN101188909A (zh) | 2008-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: A flexible circuit board and its copper plating method License type: Exclusive license Record date: 20080504 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201207 Address after: 214500 No.92, Central Road, Chengbei Industrial Park, Jingjiang Economic Development Zone, Taizhou City, Jiangsu Province Patentee after: Jingjiang Weilian Auto Parts Manufacturing Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211026 Address after: 214500 No. 18 Shannan Road, Chengbei Park, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jingjiang City Huaxin Technology Park Co.,Ltd. Address before: No.92, Central Road, Chengbei Industrial Park, Jingjiang Economic Development Zone, Taizhou City, Jiangsu Province, 214500 Patentee before: Jingjiang Weilian Auto Parts Manufacturing Co.,Ltd. |
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AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20100616 Effective date of abandoning: 20231114 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20100616 Effective date of abandoning: 20231114 |