CN101185379B - 用于可定制电子器件的通用图案化导体 - Google Patents

用于可定制电子器件的通用图案化导体 Download PDF

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Publication number
CN101185379B
CN101185379B CN2006800188086A CN200680018808A CN101185379B CN 101185379 B CN101185379 B CN 101185379B CN 2006800188086 A CN2006800188086 A CN 2006800188086A CN 200680018808 A CN200680018808 A CN 200680018808A CN 101185379 B CN101185379 B CN 101185379B
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China
Prior art keywords
continuous slice
conduction pattern
layer
continuous
product
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Expired - Fee Related
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CN2006800188086A
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English (en)
Chinese (zh)
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CN101185379A (zh
Inventor
乔治·F·扬博尔
迈克尔·J·罗布瑞特
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN101185379A publication Critical patent/CN101185379A/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006800188086A 2005-05-02 2006-04-27 用于可定制电子器件的通用图案化导体 Expired - Fee Related CN101185379B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/120,025 2005-05-02
US11/120,025 US7745733B2 (en) 2005-05-02 2005-05-02 Generic patterned conductor for customizable electronic devices
PCT/US2006/016099 WO2006118971A2 (en) 2005-05-02 2006-04-27 Generic patterned conductor for customizable electronic devices

Publications (2)

Publication Number Publication Date
CN101185379A CN101185379A (zh) 2008-05-21
CN101185379B true CN101185379B (zh) 2010-11-03

Family

ID=36997480

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800188086A Expired - Fee Related CN101185379B (zh) 2005-05-02 2006-04-27 用于可定制电子器件的通用图案化导体

Country Status (7)

Country Link
US (1) US7745733B2 (https=)
EP (1) EP1878327A2 (https=)
JP (1) JP2008541430A (https=)
KR (1) KR101225363B1 (https=)
CN (1) CN101185379B (https=)
TW (1) TW200707471A (https=)
WO (1) WO2006118971A2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7864160B2 (en) * 2005-10-05 2011-01-04 3M Innovative Properties Company Interleaved electrodes for touch sensing
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
US7651830B2 (en) * 2007-06-01 2010-01-26 3M Innovative Properties Company Patterned photoacid etching and articles therefrom
US8089604B2 (en) * 2007-06-26 2012-01-03 3M Innovative Properties Company Liquid crystal display panel and methods of manufacturing the same
JP5655567B2 (ja) * 2008-10-06 2015-01-21 旭硝子株式会社 電子デバイス用基板、その製造方法、これを用いた電子デバイス、その製造方法及び有機ｌｅｄ素子用基板
US8711113B2 (en) 2011-02-07 2014-04-29 3M Innovative Properties Company Modular connector for touch sensitive device
KR20120130990A (ko) * 2011-05-24 2012-12-04 삼성전자주식회사 디지타이저 통합형 디스플레이
JP6117620B2 (ja) * 2012-06-07 2017-04-19 日東電工株式会社 タッチパネル部材及びその製造方法
KR20140033785A (ko) * 2012-09-10 2014-03-19 삼성전기주식회사 디지타이저
CN105265029B (zh) 2013-04-30 2018-02-02 阿莫绿色技术有限公司 柔性印刷电路板及其制造方法
GB2519587A (en) * 2013-10-28 2015-04-29 Barco Nv Tiled Display and method for assembling same
CN111712047B (zh) * 2020-06-29 2022-07-19 深圳市烯牛实业有限公司 一种贴合装置、柔性电路板贴合机及贴合方法
US12008204B2 (en) * 2021-10-04 2024-06-11 Google Llc Scalable gesture sensor for wearable and soft electronic devices

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US3773989A (en) * 1970-11-26 1973-11-20 Plessey Handel Investment Ag Touch-wire overlay masks for cathode ray tubes
US4307961A (en) * 1979-04-02 1981-12-29 Western Electric Company, Inc. Apparatus for precisely aligning a pair of elements
GB2207815A (en) * 1987-07-16 1989-02-08 Crystalate Electronics Process for producing a programmed matrix
EP0471149A2 (en) * 1990-08-01 1992-02-19 Dynapro Thin Film Products, Inc. Method for the manufacture of electrical membrane panels having circuits on flexible plastic films
US6305073B1 (en) * 1999-12-29 2001-10-23 Gm Nameplate, Inc. One-sided electrode arrangement on an intermediate spacer for a touchscreen
CN1366445A (zh) * 2000-12-21 2002-08-28 索尼化学株式会社 多层柔性布线板的制造方法
CN1457227A (zh) * 2002-05-10 2003-11-19 华通电脑股份有限公司 以二次或二次以上压合制成印刷电路板使用的靶位制造方法
CN1475964A (zh) * 2002-08-13 2004-02-18 突破光电科技股份有限公司 触控屏上、下电极导通结构

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DE1919421C3 (de) 1969-04-17 1975-03-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtleiterplatte
US4446188A (en) 1979-12-20 1984-05-01 The Mica Corporation Multi-layered circuit board
JPS5745750A (en) * 1980-09-01 1982-03-15 Fanuc Ltd Transmission switching device having open line detecting function and industrial robot using said device
US5062016A (en) 1986-05-05 1991-10-29 Zupancic Derek J Set of structural brackets that allow electronic/electrical assemblies to be mounted within a computer enclosure
DE68927877T2 (de) 1988-12-19 1997-09-11 Sharp Kk Tafel mit integrierter Anzeige
US5543590A (en) 1992-06-08 1996-08-06 Synaptics, Incorporated Object position detector with edge motion feature
JPH07505015A (ja) 1992-06-15 1995-06-01 ディコネックス　パテンテ　アーゲー 回路板に設定自在の接続片を形成する方法および設定自在の接続片を有する回路板
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US5544018A (en) 1994-04-13 1996-08-06 Microelectronics And Computer Technology Corporation Electrical interconnect device with customizeable surface layer and interwoven signal lines
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US5945980A (en) 1997-11-14 1999-08-31 Logitech, Inc. Touchpad with active plane for pen detection
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3773989A (en) * 1970-11-26 1973-11-20 Plessey Handel Investment Ag Touch-wire overlay masks for cathode ray tubes
US4307961A (en) * 1979-04-02 1981-12-29 Western Electric Company, Inc. Apparatus for precisely aligning a pair of elements
GB2207815A (en) * 1987-07-16 1989-02-08 Crystalate Electronics Process for producing a programmed matrix
EP0471149A2 (en) * 1990-08-01 1992-02-19 Dynapro Thin Film Products, Inc. Method for the manufacture of electrical membrane panels having circuits on flexible plastic films
US6305073B1 (en) * 1999-12-29 2001-10-23 Gm Nameplate, Inc. One-sided electrode arrangement on an intermediate spacer for a touchscreen
CN1366445A (zh) * 2000-12-21 2002-08-28 索尼化学株式会社 多层柔性布线板的制造方法
CN1457227A (zh) * 2002-05-10 2003-11-19 华通电脑股份有限公司 以二次或二次以上压合制成印刷电路板使用的靶位制造方法
CN1475964A (zh) * 2002-08-13 2004-02-18 突破光电科技股份有限公司 触控屏上、下电极导通结构

Also Published As

Publication number Publication date
WO2006118971A2 (en) 2006-11-09
US20060246379A1 (en) 2006-11-02
KR20080003396A (ko) 2008-01-07
US7745733B2 (en) 2010-06-29
EP1878327A2 (en) 2008-01-16
TW200707471A (en) 2007-02-16
KR101225363B1 (ko) 2013-01-22
CN101185379A (zh) 2008-05-21
JP2008541430A (ja) 2008-11-20
WO2006118971A3 (en) 2007-01-11

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Granted publication date: 20101103