CN101183640A - Method for preparing bonding zone on surface of wafer carrier as well as stencilling apparatus for preparing the bonding zone - Google Patents
Method for preparing bonding zone on surface of wafer carrier as well as stencilling apparatus for preparing the bonding zone Download PDFInfo
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- CN101183640A CN101183640A CNA2007101871122A CN200710187112A CN101183640A CN 101183640 A CN101183640 A CN 101183640A CN A2007101871122 A CNA2007101871122 A CN A2007101871122A CN 200710187112 A CN200710187112 A CN 200710187112A CN 101183640 A CN101183640 A CN 101183640A
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000007639 printing Methods 0.000 claims abstract description 75
- 238000005516 engineering process Methods 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims description 151
- 239000000853 adhesive Substances 0.000 claims description 150
- 238000002360 preparation method Methods 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 29
- 230000008569 process Effects 0.000 claims description 14
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 112
- 239000010410 layer Substances 0.000 description 47
- 238000003475 lamination Methods 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000011230 binding agent Substances 0.000 description 11
- 239000011148 porous material Substances 0.000 description 10
- 230000000630 rising effect Effects 0.000 description 10
- 210000002421 cell wall Anatomy 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 235000013580 sausages Nutrition 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 244000287680 Garcinia dulcis Species 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003516 pericardium Anatomy 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000000306 recurrent effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2901—Shape
- H01L2224/29016—Shape in side view
- H01L2224/29017—Shape in side view being non uniform along the layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2901—Shape
- H01L2224/29016—Shape in side view
- H01L2224/29018—Shape in side view comprising protrusions or indentations
- H01L2224/29019—Shape in side view comprising protrusions or indentations at the bonding interface of the layer connector, i.e. on the surface of the layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
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- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83856—Pre-cured adhesive, i.e. B-stage adhesive
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- H01L2924/06—Polymers
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Abstract
The invention relates to a method for manufacturing a bonding section on the surface of a wafer carrier which attaches at least one wafer to the bonding section. In addition, the invention relates to a device for manufacturing the bonding section. The bonding section has an inner area and a periphery area in order to use a half-solidified bond which forms a bottoming thixotrope and has an increased surface tension. The method includes follow steps: coating the bond on the surface of the wafer carrier by printing with the help of a template printing technology, removing the template, wherein, the bonding section is formed and the periphery area of the bonding section is higher than the inner area, and forming the convex surface of the printing bonding section under the influence of the increased surface tension within a preconcerted latency time after printing.
Description
Technical field
Embodiments of the invention are usually directed to a kind of method of making bonding zone on the surface of chip carrier, are used for subsequently at least one die attach in this bonding zone.And embodiments of the invention are usually directed to a kind of device that is used to make bonding zone.
Background technology
The packing of integrated circuit, wafer or encapsulation are to make one of importance of the electronic device that comprises wafer.This packing is used for die attach in printed circuit board (PCB), and is used for the integrated circuit on the wafer is connected with the circuit of printed circuit board (PCB).Thus, the packing or the process of encapsulated wafer at first comprise with die attach in carrier for example, be attached to for example so-called substrate, and subsequently the connector (pad) of wafer is incorporated into the connector of carrier, for example in FBGA-packing (thin space ball grid array), these are in conjunction with being provided with by by rows spherical solder joint on the carrier downside.In so-called chip on board BGAs (BOC-BGA), wafer is installed on the carrier or substrate with ventricumbent connector, and wherein this carrier comprises otch (slot), and the wafer connector is arranged on this otch.
A kind of being used for for example comprise by means of stencilization technology printing binder on carrier, and precuring subsequently is coated on the widely used method of die attach in carrier in the adhesive of carrier with the form of the bonding zone of mint-mark.Then, carry out the wafer combination by location and a plurality of wafers of lamination on carrier, and and then carry out the curing of adhesive.Although this technology is particularly suitable for making a plurality of elements, this technology also relates to and lures into air when attached wafer in (when carrying out lamination) adhesive layer between wafer and carrier and produce the risk of bubble.This defective may be during the reflow soldering of carrying out subsequently, for example owing to so-called explosion effect causes the badly damaged of wafer.
Traditionally, in said method, in stencilization technology,, use squeegee (squeegee) and masterplate printing binder on the surface of carrier by means of traditional printing machine.Because good forming stability preferably uses the thixotrope adhesive for this method, thereby make bonding zone keep its shape in printing and after removing masterplate.But, show that the surface in the printing adhesion district that makes by this method forms inhomogeneously.Specifically, the heart and interior zone comprise pit respectively with respect to fringe region therein in this printing adhesion district.When the adhesive that is bonded in the edge that defines the masterplate hole is pulled upwardly, and because moving of squeegee produces this unfavorable shape of bonding zone when peeling off masterplate.Because employed adhesive is set to this fact of thixotrope, it keeps the recessed shape of cross-section center when crossing semi-solid preparation.During lamination subsequently, by exerting pressure wafer is coated on bonding zone, wherein the layer thickness of adhesive reduces.Because the edge of bonding zone is higher than this fact of center of bonding zone, during the mobile/displacement of the adhesive between wafer and the carrier, may occur adhesive edges each other very near and flow together at a plurality of differences place, make the air that lures between them not overflow and be retained between wafer and the bonding zone as dangerous pore.Along with the increase of the size of the wafer for the treatment of lamination, the risk that forms this pore or bubble also increases.
Traditionally, in order to overcome this problem, come the dispense liquid adhesive, rather than adhesive is coated on carrier by means of stencilization technology by means of the hollow needle in the distributor header.As a rule, this adhesive is a liquid-state epoxy resin.By this method, can avoid the recurrent formation that lures into air in the said method.But this method especially has and is characterised in that it can not carry out continuously economically and be very slow, is disadvantageous method therefore.And the carrier that is provided with adhesive can not store.Thus, be necessary very much after dispense adhesive, to proceed immediately the wafer combination.Another feature of this method is, especially when use has the thin carrier on big surface, may form carrier with flexible and uneven mode, this will cause applying the adhesive layer of different-thickness when dispense adhesive, and during lamination, bring the risk of polluting wafer, if especially wafer is relatively very thin all the more so, and this can cause the overbending of wafer in addition.
In addition, as the replacement of using thixotrope or liquid adhesive, can use bonding paillon foil to form bonding zone.In the method, at first, must suitably cut this bonding paillon foil, it can be attached to carrier then.According to the kind of institute's materials used, can carry out semi-solid preparation to bonding paillon foil then.Then carry out the curing that the wafer lamination is connected with adhesive.But these bonding paillon foils are very expensive, and need very complicated technology even coating processes, make this method especially not be suitable for batch process.
Summary of the invention
In an embodiment of the present invention, provide a kind of method and apparatus of making bonding zone on carrier, wherein making has bonding zone, this method to be configured to by avoiding luring in adhesive into air etc. and attached wafer, and this method is suitable for producing in batches.
In an embodiment of the present invention, a kind of method that is used for making bonding zone on the surface of chip carrier is provided, be used for subsequently die attach in this bonding zone, wherein this bonding zone can comprise interior zone and fringe region, so that use the capillary semi-solid preparation adhesive that is set to bottoming thixotrope (under-thixotrope) and has increase, and by printing this adhesive is coated on the surface of carrier by means of stencilization technology, masterplate is peeled off, wherein at first form bonding zone, the fringe region of this bonding zone forms highly with respect to interior zone, and during the predetermined stand-by period after printing, under the capillary influence that increases, form the convex surface in this printing adhesion district.
Therefore, according to the bonding zone of this method manufacturing not therein pericardium draw together pit, but the portion zone can have bigger layer thickness than its fringe region within it.Because the bonding zone of this form, during the lamination wafer, adhesive under any circumstance all towards the fringe region displacement of bonding zone, makes can not form pore in bonding zone or between wafer and bonding zone and in adhesive layer.In addition, by the bonding zone that forms according to the embodiment of the invention is set, because the adhesive of bonding zone is shifted towards lateral region in the zone internally at least, so can realize, after lamination even under the situation of inhomogeneous (being crooked carrier), this bonding zone has equal bondline thickness.And the thin carrier that has big surface when use adheres to the size that has may be greater than 50mm
2Scope in than wafer the time, can use this method.In addition, according to embodiments of the invention, this bonding zone also is suitable for the extremely thin wafer of lamination.Owing to use stencil printing process to form this fact of bonding zone, can in a processing step, on carrier, make a plurality of bonding zones.This adhesive that is used to print is a viscosity, makes it remain in the Printing Zone and can not flow away.In addition, owing to use the semi-solid preparation adhesive to print this fact, thus a plurality of carriers that have a plurality of bonding zones respectively can be contained in the magazine (magazine) together, and therefore can store so that carry out semi-solid preparation.After semi-solid preparation, promptly, be cured into semi-cured state (B stage) afterwards at adhesive, for example carrier can be retained in these magazines, perhaps it can be encapsulated as batch of material (batch), and be stored temporarily in suitable position up to lamination with wafer, if necessary even store several weeks.
Because bonding at the adhesive of masterplate bore edges at least, can after removing masterplate, form bonding zone immediately, and has pit at the center of bonding zone, because the surface tension of the increase of adhesive, shrink during the predetermined stand-by period and the formation convex on the surface of this bonding zone, wherein Zui Da layer thickness is positioned at the center of bonding zone, this center by have than around the small thickness around fringe region surround.In order to realize the convex on bonding zone surface, use the adhesive that is set at bottoming thixotrope (being also referred to as little thixotrope or auxiliary thixotrope).After the stand-by period, can experience semi-solid preparation so in interior zone, have the carrier of maximum layer thickness, wherein during waiting time, form convex surface, and since surface tension waiting time of the increase of the adhesive that uses can be scheduled to.
According to the replacement form of this embodiment, can set the stand-by period that is used for forming convex surface with respect to the size of bonding zone by the layer thickness of printing binder.
Say objectively, for example, this means, have than aperture and masterplate that replace big masterplate thickness by use, can on the carrier than the zonule on printing complete wetting wafer required adhesive volume, taken less bottom area and replaced bonding zone thereby form with big layer thickness.Because the bonding zone among this embodiment is surperficial less, for example this bonding zone may have the length identical with bonding zone in the foregoing description but width smaller, so during the short stand-by period, under the capillary influence that increases, form convex surface.Because use thicker masterplate in order to print less adhesive surface, so will print the adhesive of accurate amount on carrier, this is essential for the corresponding wafer area of complete wetting basically.Because semi-solid preparation adhesive afterwards is fusing once more under the influence of pressure and heat, so the adhesive under the wafer is displaced to lateral edge region at least from the center, thereby the downside of wafer is wetting by adhesive fully.
According to another embodiment of the present invention, during the stand-by period, the bonding zone of printing can bear the temperature of increase.Therefore, can reduce the stand-by period that is used to form convex surface.
According to still another embodiment of the invention, during the stand-by period, the carrier with printing adhesion district can be stored in the gas, can reduce the stand-by period that is used to form convex surface thus.
In another embodiment of the present invention, provide a kind of semi-solid preparation adhesive that is set to thixotrope by use on the surface of chip carrier, to make the method for bonding zone, be used for subsequently die attach in this bonding zone, by means of stencilization technology this semi-solid preparation adhesive is printed on the surface of carrier, wherein by the pit in the squeegee edge that is formed on squeegee, the printing adhesion district can be formed on interior zone, the layer thickness that this interior zone has wherein forms at least two bonding zones for each wafer at least greater than the layer thickness in the lateral edge region.
In stencilization technology according to the above embodiment of the present invention, be set to the semi-solid preparation adhesive of thixotrope can be on the respective surfaces that masterplate is placed on carrier after, form with roller or sausage (sausage) is coated on this masterplate, and is stretched to the top in the hole in the masterplate by means of squeegee.By make squeegee now in its squeegee edge (promptly squeegee through the edge above the masterplate in) have pit, form the upside of bonding zone, so that in its interior zone, have certain altitude (elevation) corresponding to pit.Owing to will form bigger layer thickness in the interior zone of bonding zone, so should be appreciated that, the squeegee pits forms with respect to the hole in the masterplate and arranges accordingly.According to this embodiment of the invention, bonding zone edge coating direction in two lateral edge region has the less layer thickness corresponding to masterplate thickness, and because the pit in the squeegee, bonding zone has bigger layer thickness in interior zone, this is because adhesive is not shifted in the zone of pit, and wherein the interior zone of Sheng Gaoing extends to whole bonding zone top along the coating direction.By replacing traditional squeegee with squeegee simply, can utilize conventional art to make bonding zone according to the embodiment of the invention with smooth squeegee edge with pit.
According to the replacement form of this embodiment, pit can form rectangle, trapezoidal, the shape of one section circle or the combination of these shapes.For example, have trapezoidal shape (than minor face being formed in two parallel edges pit upside) or having among the embodiment of one section round-shaped pit, realized that not only bonding zone has bigger layer thickness in pit areas, and the height self shape thereon side have narrower height part.Therefore, when with the wafer layer ballast carrier, make adhesive be shifted towards fringe region, and avoided the locking (lock-in) of pore and in adhesive or between bonding zone and the wafer, produced bubble from the center that raises.
According to another embodiment of the present invention, the pit bight of the pit in the squeegee edge can be round.If the pit bight is round, then adhesive can scatter and can not accumulate in the bight in better mode, accumulates in to cause the inhomogeneous coating of adhesive in these zones in the bight.Thus, the bight of the transition position between the adjacent transverse edge in the pit inside and squeegee edge and pit can be round.
According to another embodiment, pit can form by the narrow groove that extends to the depths in the squeegee.
According to another embodiment of the present invention, the interior zone of bonding zone can be formed on the center by two bonding zones that lateral edge region defined.
According to alternative embodiment, the interior zone of bonding zone can depart from the center of the bonding zone that is defined by two lateral edge region and form.
By the layout of the pit in the squeegee edge with respect to the hole in the masterplate, according to size and other technical need of bonding zone, the layout of the interior zone of bonding zone or location and have maximum layer thickness the zone layout or the location can freely set.
For example, bonding zone can form with the form of the local bonding zone of two or more elongated narrow shapes, the local bonding zone of these narrow shapes is respectively formed in its interior zone under the capillary influence that increases, the layer thickness that described interior zone has is greater than the layer thickness in the lateral edge region, and wherein said local bonding zone is arranged with the form of similar x.For example, print these local bonding zones, make the free end of described local bonding zone extend towards a bight that is essentially rectangle or square bonding zone respectively.Because relative to each other the setting in above-mentioned setting of local bonding zone has realized avoiding when the lamination wafer, in adhesive or the locking of the pore between adhesive and the wafer.The wiping of fusing is in the respective regions between the part of local bonding zone adjacent one another are, and the surface corresponding to wafer (bonding zone) downside is expanded on carrier, this carrier is corresponding to bonding zone, and the convex upside by local bonding zone supports in addition.
By means of the hole in the masterplate, the bonding zone that forms according to the embodiment of the invention forms forr a short time than corresponding wafer surface accordingly, this is because under the influence of heat and pressure during in conjunction with wafer, the semi-solid preparation adhesive under the entire wafer surface be flowing in this fact that also enters into those zones that are not provided with adhesive after the printing.Say objectively, this means that the size and dimension of bonding zone can form in a different manner by wafer surface to be adhered to.But, should on bonding zone, print such amount of binder at least, this amount of binder is enough to and can expands ground attached wafer and have required layer thickness from the center towards its fringe region.
And the squeegee by adopting and use corresponding masterplate and/or corresponding formation simply respectively and by the coating suitable adhesive can carry out in printing machine that has existed and typography according to the manufacturing of the bonding zone of the embodiment of the invention.
According to the replacement form of these embodiment,, can use the adhesive that is set at thixotrope for for the formed bigger layer thickness of the pit in the squeegee.Therefore, when the interior zone of the rising of making bonding zone by means of the squeegee pit, because the good forming stability of adhesive after removing masterplate, can keep the height that is caused by pit.Even adhesive edges is pulled upwardly a bit, and because the edge in the hole in adhesive and the masterplate is bonding, and make adhesive edges remain on the edge of bonding zone in this position, interior zone also forms De Genggao with respect to fringe region, thereby make when fusing, adhesive is shifted from the top towards these fringe regions that form more smooth or thinlyyer, thereby and can avoid air holes.
Constructing among the embodiment of bonding zone with the form of the local bonding zone of two or more elongated narrow shapes, local bonding zone can have the width (under situation with little capillary bottoming thixotrope adhesive of increasing width can reach about 3mm) of about 1mm to about 2mm, thereby no matter whether use the thixotrope adhesive, all can form curved surface or convex shape under the capillary influence at this adhesive during the stand-by period.
According to another embodiment of the present invention, form after the bigger layer thickness in interior zone, the semi-solid preparation adhesive that is printed on the carrier is cured into semi-cured state (B stage) by means of first curing schedule.Mention as its place in this document, the use of semi-solid preparation adhesive has such effect, promptly after the bonding zone precuring on being printed in identical carrier, carrier can be stored in magazine or the batch of material for a long time, as desired in logic.In addition, got rid of the risk of polluting when handling carrier, up to wafer being carried out combination by means of this adhesive.
According to the replacement form of this embodiment, first curing schedule can carry out the about 10 minutes time to 2 hours scopes at about 90 ℃ to about 170 ℃ temperature range.The curing of adhesive causes the partial lateral of adhesive construction crosslinked, and makes adhesive enter the so-called B stage.
According to the replacement form of this embodiment, first curing schedule can carry out about 60 minutes time under about 100 ℃ temperature.
For the necessary parameter of first curing schedule, such as time and temperature, correspondingly depend on employed adhesive material, wherein for every kind of material, temperature and time can change in the mode of relative broad, this means can adopt the less time under the higher temperature or can adopt the more time under lower temperature.
According to the progress of one of embodiment of the invention, form at least one bonding zone for each wafer.If wafer has source (that is, upwards the pad that shows) to be arranged on the carrier with it, and if wafer on whole surface, be attached to carrier basically with its active side, then above-mentioned situation can appear.
According to another embodiment, form at least two bonding zones for each wafer.For example, if wafer is installed on the downward carrier or substrate surface, the situation that a wafer is provided with two bonding zones then can appear, forming in the correspondingly contiguous carrier of bonding zone preferably wherein in conjunction with passage, by this in conjunction with passage occur with carrier on the wafer that is connected connect up.
For the replacement of mentioning embodiment at last, under special circumstances, it also is feasible forming more than two (for example four) bonding zones for each wafer, and described bonding zone in most cases forms with even number.
In addition, embodiments of the invention comprise the plate printing device that is used for wafer printing adhesion district.
This plate printing device is used to print the semi-solid preparation adhesive that is set to thixotrope, can on the surface of chip carrier, make bonding zone by means of this plate printing device, be used for subsequently die attach in this bonding zone, thereby make this bonding zone in a zone, have the layer thickness of increase, according to embodiment, this plate printing device can comprise:
Masterplate has at least one hole in this masterplate; And squeegee, this squeegee comprises the pit of long narrow flute profile formula at least in its squeegee edge, this pit aligns with the hole in the masterplate when printing.
By means of plate printing device according to this embodiment, because the narrow groove of length in the zone at squeegee edge, the bonding zone that has predetermined big layer thickness with formation, squeegee is being directed in this zone on the hole of its groove in masterplate, and wherein big layer thickness of adhesive is especially for example determined by the rheological behavior of well width, squeegee thickness and adhesive.In other words, can use the squeegee of structure by this way, promptly form bonding zone with squeegee with long narrow groove, this bonding zone is formed in the zone of groove with the layer thickness of the increase that limited, regardless of the length of groove self, corresponding height is greater than the bonding zone zone around this big layer thickness.Even the fringe region of bonding zone is pulled upwardly a little owing to adhesive properties, for example by after printing, removing masterplate, these fringe regions are by the jack-up by means of the formed big layer thickness of groove, thereby when having avoided lamination wafer afterwards, lure blowhole in the individual adhesive between adhesive and wafer and then form bubble.
The predetermined little well width and the rheological behavior of adhesive make the adhesive of limited amount enter this groove.One of effect of the embodiment of this squeegee that has long narrow groove in the squeegee edge is, after squeegee uses a period of time or often uses, even owing to wearing and tearing appear in the abrasion at squeegee edge, thereby the length of groove reduces, and also can form bigger adhesive phase thickness.Therefore, Gou Zao squeegee can use the relatively long time interval by this way, thereby only just is necessary to change squeegee after the relatively long time interval.For squeegee, its pit has the shape of qualification, be used for applying the adhesive of limited amount with the form of big layer thickness, this causes the pit vertical with the squeegee direction to reduce with for example abrasion owing to the squeegee edge, contrasts thereby the adhesive that can not apply q.s forms the risk of bonding zone.
Description of drawings
In the accompanying drawings, identical reference symbol identical parts of ordinary representation in different views.It is pro rata that accompanying drawing needs not to be, and opposite emphasis is placed on usually and illustrates on the principle of the present invention.In description subsequently, with reference to the accompanying drawing of back different embodiments of the invention are described, in the accompanying drawing:
The schematic diagram of the process when Fig. 1 shows lamination according to the embodiment of the invention and has the carrier of wafer with front view and vertical view respectively, wherein, bonding zone before the lamination has been shown (A), the bonding zone during the lamination has been shown in (B), and (C) shown the bonding zone after the lamination;
The order of each step when Fig. 2 shows according to the formation bonding zone on carrier of the embodiment of the invention;
Fig. 3 shows the formation of bonding zone on carrier according to the modification of Fig. 2 embodiment;
Fig. 4 shows according to another embodiment of the present invention and form the mode (A) of bonding zone and (B) on carrier;
Fig. 5 shows the formation of bonding zone on carrier according to further embodiment of this invention;
Fig. 6 shows the chip carrier with a plurality of bonding zones;
Fig. 7 shows the embodiment of the squeegee of plate printing device;
Fig. 8 shows by the sectional view of the squeegee with kerf of structure by different way according to the embodiment of the invention;
Fig. 9 shows the zoomed-in view according to the squeegee edge of the embodiment of the invention.
Embodiment
In the view (A) of Fig. 1, show the part of carrier 200, on this carrier, be formed with bonding zone 100 according to embodiments of the invention by means of stencilization technology.The layer thickness that printed bonding zone 100 has in the portion zone 101 within it is bigger than the layer thickness that has in its fringe region 102.As seen in Fig., initial, the bottom area of the bonding zone 100 after the printing is less than treating by the bottom area of the wafer 300 of lamination.
In view (B), as can be seen, the (not shown) wafer 300 that applies by pressure and heat is applied to bonding zone 100, and wherein, originally wafer 300 only contacts the interior zone 101 of the rising of bonding zone 100.In an embodiment of the present invention, the adhesive of bonding zone is because the semi-solid preparation adhesive that heat and pressure can melt.On the right-hand side of view (B), as can be seen, the interior zone 101 of the rising that schematically shows of bonding zone 100 extends in a certain direction, and have than two fringe regions 102 of small thickness at the contiguous interior zone 101 of sidepiece respect to one another basically and form, for example, wherein two of interior zone 101 longitudinal end regions also form from upside downwards with outward-dipping.Two arrows of zone 101 beginnings are internally represented two main directions, and when zone 101 upside is when downward direction promotes or be pressed on the carrier 200 internally with wafer 300, the adhesive of fusing flows or displacement along described main direction.And, from view (B) as can be seen, when the lamination wafer, avoid the locking of pore thus, and then in adhesive or between adhesive and wafer 300, produced bubble.
In the view (C) of Fig. 1, show lamination process end and wafer 300 finally are attached to carrier 200 by means of the adhesive that is in its rearmost position state, wherein suppose the semi-solid preparation adhesive because its excellent adhesion characteristic, fixedly connected with wafer 300 on the one hand, fixedly connected with carrier 200 on the other hand.(C) it can also be seen that from view, and the adhesive of bonding zone 100 has been expanded and exceeded its original printing zone, and wherein in this embodiment, wafer 300 is surrounded by adhesive edge 110 at smooth all around transverse edge place.But, thus, adhesive area 110 not can so that the source that has of wafer may project upwards with the contacted mode of adhesive.Although this is not shown in Fig. 1, carrier 200 can comprise a plurality of such bonding zones 100, and wafer 300 is attached to each bonding zone.Described a plurality of bonding zone 100 is made by being printed on the whole carrier 200 in a processing step.Be suitable for adhering to according to the bonding zone of embodiment and have size that about 4mm multiply by about 5mm and multiply by the wafer of the size of about 25mm up to about 20mm, wherein said wafer can have the thickness of about at least 50 μ m.
Step (A), (B) and order (C) when Fig. 2 shows according to the manufacturing bonding zone 100 of the embodiment of the invention.
In Fig. 2, the part of carrier 200 has been shown with cross-sectional view, its bottom area W (length) * W (width) (not shown) is corresponding to the area of wafer to be attached, wafer is attached to carrier 200 by this part, thereby the transverse edge of accompanying wafer aligns with the transverse edge of the described part W of carrier 200.Center in the zone that is covered by wafer 300, passing carrier 200 is formed with in conjunction with passage 201, this carrier top is provided with and remains the welding disking area of the wafer that quilt cover installs down, thereby can combining or distribution by the contact point (not shown) on the downside of this contact point that carries out wafer in conjunction with passage and carrier 200.In this chip on board was installed, each wafer was attached to the upside of carrier by means of two bonding zones 100 of adjacent setting, and wherein each in two bonding zones self all forms according to embodiments of the invention.
As the view (A) of Fig. 2 as seen, first masterplate 400 is positioned at the surface of the wafer to be installed of carrier 200, as the situation in each the traditional printing technology under creating conditions.Form porosely 410 in masterplate 400, these holes are filled adhesive during printing, and wherein the zone on the carrier 200 determines that by the peripheral edge that defines hole 410 described zone takies bonded district 100 after printing binder.At view (B) with among the embodiment (C), the bonding zone 100 of printing around on by adhesive free edge 202 around, wherein during lamination subsequently, adhesive free edge 202 can be wetting by the displacement adhesive of fusing.
After the masterplate 400 of location, above the free upside of masterplate 400,, and in this process, adhesive is pressed in the hole 410 of masterplate 400 for example by means of of the very adhesive pull-up of viscosity of form of squeegee (not shown) with ball.The semi-solid preparation adhesive that is used for this purpose is set to bottoming thixotrope or little thixotrope or auxiliary thixotrope, and has the surface tension of increase.
After printing binder, masterplate 400 is separated with carrier 200 by removing.As the view (B) of Fig. 2 as seen, at first form bonding zone 100 by printing, in cross-sectional view, this bonding zone heart zone therein has pit 109, and this bonding zone forms correspondingly higherly at its fringe region 108.This cross-sectional form of preparation bonding zone 100, the adhesive that is bonded on the one hand 410 edges, hole of masterplate 400 when removing masterplate forms, and on the other hand can be at squeegee with a part of adhesive expansion or guide and portal at 410 o'clock by due to the squeegee.
Because the set characteristic of adhesive, that is since its surface tension with and the behavior of bottoming thixotrope, the scheduled wait time durations after printing forms convex surface, shown in view (C) on bonding zone 100.The layer thickness that has in the portion zone 101 within it of the bonding zone 100 of Xing Chenging is greater than the layer thickness in its zone, edge 102 thus.After the stand-by period finished, the carrier with printing binder (its bigger layer thickness is formed in the interior zone) can be solidified into semi-cured state (B stage) by means of curing schedule.Guaranteed in wafer cohesive process subsequently, not have air can enter between bonding zone 100 and the wafer (not shown) with the bonding zone 100 that this mode in the view (C) forms.
According to embodiments of the invention, be used to form the required stand-by period of convex surface, promptly convert required time of cross-sectional form to according to the bonding zone of view (C) according to the cross-sectional form of the bonding zone of view (B), during printing or after printing, can change by influencing bonding zone, the described stand-by period is pre-determined or is set by the inherent characteristic of adhesive on the one hand, and on the other hand by pre-determining about the area of printed adhesive layer and the other factors of thickness.
A kind of possibility of quickening the convex surface of formation bonding zone 100 is, the temperature that bonding zone 100 experience are increased.
The another kind of possibility of quickening the convex surface of formation bonding zone 100 is, after printing bonding zone 100 is stored in the gas.
Another possibility that quicken to form the convex surface of bonding zone 100 is, with respect to the formation of the layer thickness of the printed adhesive of size impact of adhesive surface.
In the view of the left-hand side of Fig. 3, show relatively thin masterplate 400 by example with for example about 75 μ m thickness, for example, the area of about 8mm is multiply by in the hole 411 of this masterplate around about 4mm.By means of this masterplate 400, can printing adhesion district 100, the bonding zone 100 that this bonding zone for example is similar to the view (B) according to Fig. 2 forms, and needs the predetermined stand-by period that is used to form convex surface.
But, use is according to the masterplate 401 of right-hand side view among Fig. 3 if replace masterplate 400, this masterplate 401 has bigger thickness, the thickness of 120 μ m for example, and the hole 412 of this masterplate centers on the less surface that for example about 3mm multiply by about 7mm, then can printing adhesion district 1000, being parallel to bearer plane of this bonding zone and the cross-sectional area that forms is less relatively, this bonding zone in return has bigger layer thickness.Because the cross-sectional area that reduces, the convex surface form of bonding zone 1000 forms rapidlyer under the set capillary influence of adhesive, and after the stand-by period that reduces finished, the layer thickness that this convex surface has in the portion zone 1010 within it was greater than at its layer thickness in lateral edge region 1020 at least.
Because the adhesive of the bonding zone 1000 that forms by this way, impression same amount during approximately with the bonding zone 100 that forms according to the view (B) of Fig. 2.Use the adhesive of described amount, so that can come complete wetting wafer (in the right-hand side view of Fig. 3, a side length of wafer is come mark with W) basically by enough adhesives that is attached to its side of waiting.In one embodiment of the invention, at this narrow and high relatively bonding zone 1000 of the center in the zone for the treatment of attached wafer printing.Because use the semi-solid preparation adhesive to make bonding zone 1000 these facts, during with the wafer lamination, the adhesive of the bonding zone 1000 of Xing Chenging also can melt under the effect of pressure and heat by this way, and can expansion fully equably under wafer.
Explain another embodiment of the present invention based on Fig. 4, wherein show the different device for carrying out said that are used to make bonding zone 100 with (B) by means of explanatory view (A).
At each view (A) of Fig. 4 with (B), show the part of carrier 200, BOC is applied on the zone of this carrier in conjunction with wafer.Discussed as its place at presents, in order to adhere to these wafers, be formed with two vertical bonding zones 100 illustrating on the part of carrier 200, described two bonding zones are arranged parallel to each other basically, and illustrate with cross section.
In hitherto known stencil printing process, by means of the squeegee that above masterplate, guides, printing binder on carrier.In order to form the layer thickness that has in its interior zone at least greater than the bonding zone 100 of the layer thickness in the lateral edge region, by means of the pit 502 in the squeegee edge 501 that is formed on squeegee 500, in the interior zone 101 of printed bonding zone 100, form bigger layer thickness.
As view (A) as seen, in the squeegee edge 501 (promptly, guiding squeegee 500 promotes forward in the edge of adhesive in the surface of masterplate (not shown)) pit 502 form trapezoidal shape, the smaller portions in two parts that are set parallel to each other form the top edge of pit 502.
The form that adapts to pit 502, the interior zone 101 of the rising of bonding zone 100 forms along the print direction of squeegee 500, thereby the thickness that adapts to masterplate, the fringe region 102 of bonding zone 100 forms has less layer thickness, because above the corresponding region in masterplate hole, squeegee 500 with smooth squeegee marginal portion 511 of defining pit 502 is expanded on the horizontal plane of masterplate upside substantially, so can residually not protrude in the adhesive residue on the masterplate hole herein.But the pit in the squeegee edge for example also can form the shape of one section circle, the triangle with the summit that is directed upwards towards, rectangle etc.
(A) it can also be seen that from view, pit 502 is arranged in the squeegee 500 with respect to the hole in the masterplate (not shown), thereby the center between two planar edge zones 102 of the same size of bonding zone 100 accurately forms cross section and is the interior zone 101 of trapezoidal rising.But, also can by with the pit in the squeegee 500 502 with respect to the hole in the masterplate with the asymmetric manner setting, and the interior zone 101 that will have big layer thickness is provided with to such an extent that further be displaced to one of two fringe regions 102.Because be directed this fact above the whole hole of squeegee 500 in masterplate, so the interior zone 101 of the rising of bonding zone 100 extends above the whole length in hole along the squeegee print direction, the situation of bonding zone 100 is also like this.
In addition, all bights of pit 502 can form and have radius.Thisly be configured with the even coating that is beneficial to adhesive.
Because employed adhesive is set to this fact of thixotrope among this embodiment, so after printing, keep by the shape of cross section of the formed bonding zone 100 of printing.
When on the part of the carrier 200 that is provided with two bonding zones 100, carrying out after the intermediate steps of semi-solid preparation of adhesive the lamination wafer, the adhesive melts of bonding zone 100, wherein the adhesive of the rising interior zone 101 of two bonding zones 100 correspondingly from the center towards fringe region 102 displacement or flow, wherein the adhesive in the fringe region 102 also melts, thereby among those not printing zone Z that finally covered by wafer that adhesive also flow to bonding zone, so that guarantee that adhesive and carrier 200 are lip-deep bonding in maximum possible.Because this structure of bonding zone 100 has been avoided may forming pore between wafer and bonding zone 100 during the lamination.
But, unlike shown embodiment, replacedly, bonding zone can be configured such that adhesive not exclusively expands under wafer area to be attached in fusion process, thereby even make the initial zone that is not printed on the carrier the wafer lamination after also maintenance do not have adhesive.For example, if only allow adhesive for example narrow shape in conjunction with passage in slightly as seen or not as seen, then above-mentioned situation can be necessary so that can not pollute on the wafer in conjunction with contact.
Among the embodiment of the squeegee 510 of view in according to Fig. 4 (B), the form of pit is different from the pit in the view (A), and difference is that this dimple-shaped becomes to the depths and extends to narrow groove 512 in the squeegee 510.Owing to be formed on this groove 512 in the squeegee 510, rheological behavior according to adhesive, the adhesive flow of specified quantitative is in groove 512, thereby bonding zone 100 forms in a zone (above the hole at masterplate, groove 512 is directed along this zone) in have bigger layer thickness, wherein in the zone of bonding zone 100, squeegee 510 is directed above the hole of masterplate with itself even lower squeegee edge 511 or expands in described zone, forms the thickness of bonding zone 100 basically according to the thickness of masterplate.Therefore, bonding zone 100 the fringe region 102 of having that can form interior zone 101 and on both sides, define interior zone 101 with big layer thickness than small thickness.But not much else, the relatively large length of groove 512 can not influence the amount of binder that enters groove 512.Use an effect of the squeegee 510 that forms by this way to be, the influence of the formation of defined interior zone 101 with big layer thickness for example not frayed abrasion of 511 places, squeegee edge (that is).Therefore, squeegee 510 can be used for more relatively printing process.According to having and the advantage identical of this embodiment according to the bonding zone 100 of view among Fig. 4 (A) with squeegee 510 formed bonding zones 100 (this bonding zone comprises interior zone 101 with big layer thickness and has two fringe regions 102 than small thickness with respect to interior zone 101), be adhesive from the interior zone 101 that raises to fusing and the flow behavior of fringe region 102 up to entering regional Z, make and got rid of in adhesive or formation pore or bubble between wafer and bonding zone 100.
Based on the view among Fig. 5 (A), (B) and (C), explain the formation of the bonding zone on the carrier according to yet another embodiment of the invention.
Shown in the example view (A) of Fig. 5, on the surface of carrier (not shown), be provided with the local bonding zone 121 of elongated narrow shape of two bendings in adhesion area 120, in the vertical view of local bonding zone 121, these local bonding zones form the shape of similar x each other.Local bonding zone 121 is printed on the carrier by means of the stencilization process quilt, and wherein the layer thickness that has in the portion zone 1211 within it of each local bonding zone 121 is greater than the layer thickness in two lateral edge region 1212.During the stand-by period, under the capillary influence of adhesive, form the shape of cross section that to see from viewgraph of cross-section of local bonding zone 121.Because local bonding zone 121 has the Breadth Maximum of about 2mm, so, under the capillary influence of adhesive, all can form the shape of raised surface basically of local bonding zone 121 no matter whether use the adhesive that is set at thixotrope.For the combination by means of local bonding zone 121 of wafer being provided the adhesive of q.s, use the masterplate of corresponding thickness to come printing binder.
Because the layout of the similar x shape of two local bonding zones 121 shown in the view (A), realized avoiding in the wafer lamination process in adhesive or the locking of the pore between adhesive and wafer.
Adhesive flowed between carrier and wafer in which way during the view of Fig. 5 (B) was schematically illustrated in lamination, and wherein in view (B), (illustrating) wafer 300 is its final position of no show also.As can be seen, the adhesive 1201 of fusing at first is displaced in the corresponding zone between the adjacent part basically of local bonding zone 121.Because the layout and the convex surface thereof of the similar x shape of local bonding zone 121, avoided between local bonding zone 121, forming and lured into air or pore.
When wafer 300 enters into its final position with respect to carrier subsequently, form the bonding zone 1202 that generates by means of the adhesive of bonding zone 121, shown in view (C).From this view, can further find out, the adhesive that is formed at the bonding zone 1202 under the wafer 300 is gone up complete wetting substantially in conjunction with wafer 300 necessary adhesion areas 120, thereby except the bonding zone that formation avoids locking, can also be to the stable bonding zone that provides enough big that adheres to of wafer 300.
For attached wafer, can adopt one or two bonding zone that forms by the corresponding two or more local bonding zone 121 that is provided with by this way.
In Fig. 6, show the part of chip carrier 200 (being also referred to as substrate etc.), be formed with a plurality of bonding zones of being used on it in conjunction with the correspondence of a plurality of wafers 300 according at least one the foregoing description.Respectively at the center that is positioned with wafer 300 in zone, the carrier portion 220 of carrier 200 comprises in conjunction with passage 221, the described terminal connecting band (pad) that is provided with the wafer 300 of the installation that faces down in conjunction with passage, after wafer 300 is attached to carrier, by being connected on the described distribution that can carry out wafer 300 in conjunction with passage and carrier 200 downsides.In this embodiment, correspondingly on the both sides of groove 221, be provided with the bonding zone 100 that forms according to the embodiment of the invention.Therefore, for each wafer 300 of waiting to be attached to carrier portion 220, the masterplate that is used to print can comprise two holes of setting adjacent one another are, and described hole is positioned on the both sides of groove 221.After the masterplate of location, the squeegee that can be directed, printing semi-solid preparation adhesive (B stage adhesive) in the hole of masterplate by means of direction along arrow P.If in the squeegee edge of institute's use squeegee, be formed with pit (according to Fig. 4 502 or 512), for example correspondingly at the center in masterplate hole, and then at the center of bonding zone to be formed 100, then each bonding zone 100 centrally forms with the interior zone with increase bonding zone thickness in this case.According to the quantity of bonding zone adjacent one another are 100 to be formed in delegation, in the squeegee edge, form the pit of respective amount.Because this embodiment, in a processing step, whole carrier 200 can be provided with according to a plurality of bonding zones of the present invention.In the interior zone of bonding zone, form after the bigger layer thickness, a plurality of carriers 200 that each all can be had the semi-solid preparation adhesive of printing are contained in the magazine, and experiencing first solidification process together, adhesive is solidified into semi-cured state (B stage) in this first solidification process.After semi-solid preparation, if necessary, carrier for example can be stored several weeks in magazine.Carrier or substrate very unfertile land are provided with big surface, from but flexible, therefore can have irregularly shaped, carrier or substrate self can correspondingly experience suitable distortion, described carrier or substrate are usually for example by means of the suction of working surface being flattened or stretching, thereby the manufacturing of the bonding zone of arbitrary embodiment can be carried out on this carrier of initial out-of-flatness or bending according to the present invention, so that form the printing adhesion district of the interior zone with rising.
In Fig. 7, show exemplary embodiment about the structure of the squeegee 600 of masterplate.
As shown in Figure 7, from the squeegee edge 611 extend the narrow groove 610 of length up to the squeegee scraping blade can be basically and the angle at 611 one-tenths 90 ° at squeegee edge, it is straight basically that the cell wall of the defining slot 610 that wherein makes progress forms.But as shown by groove 620, this cell wall also can form the radius that has radius or intersect with vertical cell wall.Therefore, the structure that defines the cell wall part of described groove can be an any kind on its narrow side.
As shown, also can form the narrow groove of length in the squeegee 600 with the angle that departs from 90 ° with respect to the squeegee edge a little by the groove 630 among Fig. 7.Therefore, in fact needn't accurately described groove be set perpendicular to squeegee edge 611.
It can also be seen that from Fig. 7 according to embodiments of the invention, the width B of the length L of groove 610 and groove 610 can be with for example relative to each other greater than the design of 5: 1 relation.But, can (be L: B) be configured to reach 10: 1 also with the length of groove 610 and the relation of width.
According to embodiments of the invention, groove 610 can have the slot length of about 3mm to about 6mm.
According to embodiments of the invention, groove 610 can have the well width of about 140 μ m to about 250 μ m.
According to embodiments of the invention, the squeegee 600 with groove 610 can have the thickness D of about 0.10mm to about 0.40mm.
In Fig. 8, show the various possible shape of cross section of the groove that is formed in the squeegee 600.
From Fig. 8 as seen, groove (such as groove 610) can have rectangular shape.But as shown by groove 640, the cross section of described groove can be for trapezoidal, wherein being arranged on the front side along print direction in cross-sectional view than minor face in two parallel edges.According to another embodiment, the cross section of groove 650 also is trapezoidal, and wherein thus, the longer sides in two parallel edges is arranged on the front side along print direction in cross-sectional view.The cell wall respect to one another that shows groove 660 by groove 660 can have circular edge.According to another embodiment, as shown by groove 670, the cross section of the cell wall respect to one another of described groove can form circular arc.According to another embodiment of the present invention, the cross section of groove 680 can form the cell wall with expression isosceles triangle, and vertex of a triangle toward each other.
Fig. 9 shows the amplifier section according to the squeegee edge of the embodiment of the invention.
Squeegee 600 according to the plate printing device of the embodiment of the invention can comprise the narrow groove 610 of a plurality of length along its squeegee edge, wherein can see the amplifier section of the squeegee 600 with two grooves 610 among Fig. 9.Groove 610 shown in this embodiment for example has the approximately length of 4mm and the approximately width of 0.21mm.The groove end of the closure of defining slot 610 forms circular arc at this point.In the squeegee 600 according to this embodiment, the distance between two grooves 610 adjacent one another are is about 5mm, and the distance between wherein corresponding two adjacent slots for example according to the distance and the size of bonding zone to be formed, can freely be constructed.For example, the thickness D according to the squeegee 600 of this embodiment can be about 0.2mm.
Explain that as its place in presents the masterplate (not shown) of this plate printing device can comprise for example a plurality of holes, thereby make the quantity in hole corresponding to the quantity of the adhesive layer on carrier to be formed.That is, squeegee 600 can comprise a plurality of grooves 610, make the quantity of groove corresponding to the adjacent one another are and quantity in the hole that forms in delegation of corresponding masterplate, thereby each bonding zone to be formed is provided with the adhesive layer part of rising.Should be appreciated that from print direction, this masterplate can comprise the multirow hole.Thus, if for example wafer face is installed up, then can only form a bonding zone, down if perhaps for example wafer face is installed for each wafer to be adhered to, then form two bonding zones, as what for example discussed for embodiment according to Fig. 6 for each wafer.But,, corresponding bonding zone can be set in the interior zone of the bondline thickness with increase for each embodiment that mentions.
By means of the narrow groove 610 of the length in the squeegee 600, and owing to use the adhesive that is used to make bonding zone that is set to thixotrope, the rheological behavior of adhesive when having realized according to printing, in each groove 610, flow or rise the correspondingly adhesive of scheduled volume, thereby form the bonding zone of the bondline thickness with increase in a zone, groove 610 is directed above the hole of described zone in masterplate.Because the slot length of groove 610 correspondingly grows this fact of a certain amount than the adhesive that can rise or flow in groove, even so squeegee edge 611 can guarantee also that owing to frequent printing is worn and torn the form with certain altitude forms a certain amount of adhesive on bonding zone.Therefore, this is not the necessary precise length of the bondline thickness that is used to form increase of groove 610, as long as described flute length must be enough to make adhesive to rise in unimpeded mode in groove.For example, if the relation of slot length and well width is designed between 5: 1 to 10: 1, this is just guaranteed.
In other words, need not use the adhesion area that forms the rising with predetermined form of bonding zone according to the squeegee of the plate printing device of this embodiment, but can apply the adhesive of scheduled volume by means of long narrow groove, described adhesive can be set in certain zone on the bonding zone of being determined by described groove by well width.
For example, the squeegee 600 with flat rubber belting form can be contained in the corresponding squeegee guiding piece (not shown) with one of its vertical side.In addition, for example, squeegee 600 can correspondingly form the groove 610 of quantification and structure on two vertical side, thereby squeegee (promptly, the squeegee scraping blade) can after certain wearing and tearing, rotate, and can remain in the squeegee guiding piece with its side that weares and teares, thereby squeegee can use another untapped vertical side to apply.For example, squeegee 600 can remain in the squeegee guiding piece with respect to the angle of printing plane with 65 °, and can be directed above masterplate with this angle.For this reason, the zone of facing masterplate of squeegee 600 or the oblique angle that downside (it being expanded by this downside above masterplate) can be provided with 25 ° of angles, as Fig. 9 as can be seen, thus squeegee in the face of the downside of masterplate can be with the last side shifting of its whole surface along masterplate.
Although specifically illustrated and described the present invention with reference to specific embodiment, but those skilled in the art should understand that, do not deviating under the prerequisite of the spirit and scope of the present invention that limit by claims, can carry out various variations wherein form and details.Therefore, scope of the present invention is represented by claims, and is intended to comprise all changes that drop in claim equivalent meaning and the scope.
Claims (20)
1. method that is used on the surface of chip carrier making bonding zone, be used for subsequently die attach in described bonding zone, described bonding zone comprises interior zone and fringe region, so that use the capillary semi-solid preparation adhesive that is set at the bottoming thixotrope and has increase, described method comprises:
Described adhesive is coated on the surface of described carrier by printing by means of stencilization technology;
Remove described masterplate, wherein at first form bonding zone, the fringe region of described bonding zone forms highly with respect to interior zone; And
During the predetermined stand-by period after printing, under the capillary influence of described increase, form the convex surface of printed bonding zone.
2. method according to claim 1, wherein, the stand-by period that is used to form described convex surface is set by the layer thickness with respect to described bonding zone size of printed adhesive.
3. method according to claim 1, wherein, during the described stand-by period, printed bonding zone bears the temperature of increase.
4. method according to claim 1, wherein, during the described stand-by period, the described carrier with printed bonding zone is stored in the gas.
5. method according to claim 1 wherein, forms after the bigger layer thickness in described interior zone, and the described semi-solid preparation adhesive that is printed on the described carrier is cured into semi-cured state by means of first solidification process.
6. method according to claim 1 wherein, for each wafer, forms at least one bonding zone.
7. method according to claim 1 wherein, for each wafer, forms at least two bonding zones.
8. a semi-solid preparation adhesive that is set to thixotrope by use is made the method for bonding zone on the surface of chip carrier, be used for subsequently die attach in described bonding zone, described semi-solid preparation adhesive is printed on by means of stencilization technology on the surface of described carrier, and described method comprises:
By the pit in the squeegee edge that is formed on squeegee, in interior zone, form the bonding zone of printing, the layer thickness that described interior zone has is at least greater than the layer thickness in the lateral edge region;
Wherein, form at least two bonding zones for each wafer.
9. method according to claim 8, wherein, described pit is with rectangle, trapezoidal, the shape of one section circle or being combined to form of these shapes.
10. method according to claim 8, wherein, the pit bight is round.
11. method according to claim 8, wherein, described pit forms by the narrow groove that extends to the depths in the described squeegee.
12. method according to claim 8, wherein, the described interior zone that is defined by two lateral edge region of described bonding zone is formed on the center of described bonding zone.
13. method according to claim 8, wherein, the described interior zone that is defined by two lateral edge region of described bonding zone departs from the center of described bonding zone and forms.
14. method according to claim 8 wherein, forms after the bigger layer thickness in described interior zone, the described semi-solid preparation adhesive that is printed on the described carrier is cured into semi-cured state by means of first solidification process.
15. method according to claim 14, wherein, described first curing schedule carries out about 60 minutes time under about 100 ℃ temperature.
16. plate printing device that is used to print the semi-solid preparation adhesive that is set to thixotrope, can on the surface of chip carrier, make bonding zone by means of described plate printing device, be used for subsequently die attach in described bonding zone, make described bonding zone comprise bigger layer thickness in presumptive area, described plate printing device comprises:
Masterplate has at least one hole in described masterplate; And
Squeegee,
Wherein, described squeegee comprises that in its squeegee edge at least one is long narrow
The pit of flute profile formula, described pit aligns with the hole in the described masterplate when printing.
17. plate printing device according to claim 16, wherein, the length of described groove and the width of described groove are relative to each other being that 5: 1 to 10: 1 relation is configured.
18. plate printing device according to claim 16, wherein, the length of described groove is in the scope of the extremely about 6mm of about 3mm.
19. plate printing device according to claim 16, wherein, the width of described groove at about 140 μ m to the scope of about 250 μ m.
20. plate printing device according to claim 16, wherein, described squeegee has about 0.10mm to the interior thickness of about 0.40mm scope.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006053916.8 | 2006-11-15 | ||
| DE102006053916A DE102006053916B3 (en) | 2006-11-15 | 2006-11-15 | Procedure for producing an adhesive surface on a surface of a die carrier, comprises pressing a self-hardenable adhesion adjusted under thixotropic with increased surface tension by a pattern pressing process on the surface of the carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101183640A true CN101183640A (en) | 2008-05-21 |
Family
ID=39400012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101871122A Pending CN101183640A (en) | 2006-11-15 | 2007-11-14 | Method for preparing bonding zone on surface of wafer carrier as well as stencilling apparatus for preparing the bonding zone |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN101183640A (en) |
| DE (1) | DE102006053916B3 (en) |
| TW (1) | TW200832570A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103773255A (en) * | 2012-10-22 | 2014-05-07 | 松下电器产业株式会社 | Method for attaching panel and apparatus therefor |
| CN105190844A (en) * | 2013-05-24 | 2015-12-23 | 富士电机株式会社 | Method for manufacturing semiconductor device |
| CN105378919A (en) * | 2014-05-28 | 2016-03-02 | 核心整合科技股份有限公司 | Semiconductor package sputtering method using liquid adhesive for electromagnetic interference shielding and sputtering apparatus therefor |
| CN108063111A (en) * | 2016-11-09 | 2018-05-22 | Imec 非营利协会 | A kind of method for semiconductor chip to be adhered to landing chip |
| CN109878189A (en) * | 2017-12-06 | 2019-06-14 | 3M创新有限公司 | The method for being used to form bending laminated products |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2961519B1 (en) | 2010-06-18 | 2012-07-06 | Commissariat Energie Atomique | CALIBRATION METHOD IN THICKNESS BETWEEN AT LEAST TWO SUBSTRATES |
| US9623644B2 (en) * | 2013-12-20 | 2017-04-18 | 3M Innovative Properties Company | Profiled coatings for enabling vacuumless lamination of stencil printed liquid optically clear adhesives |
| DE102022209196A1 (en) * | 2022-09-05 | 2024-03-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Method for printing a substrate with a sealant and/or adhesive, electrochemical cell with a printed seal |
| DE102022209194A1 (en) | 2022-09-05 | 2024-03-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Device and method for printing a substrate with a sealant and/or adhesive |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5659952A (en) * | 1994-09-20 | 1997-08-26 | Tessera, Inc. | Method of fabricating compliant interface for semiconductor chip |
| US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
| US6784555B2 (en) * | 2001-09-17 | 2004-08-31 | Dow Corning Corporation | Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
| US6967123B2 (en) * | 2002-04-11 | 2005-11-22 | Agilent Technologies, Inc. | Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method |
| US7129590B2 (en) * | 2003-05-14 | 2006-10-31 | Intel Corporation | Stencil and method for depositing material onto a substrate |
| KR100690960B1 (en) * | 2004-06-24 | 2007-03-09 | 삼성전자주식회사 | Manufacturing method having screen printing process for semiconductor chip package |
-
2006
- 2006-11-15 DE DE102006053916A patent/DE102006053916B3/en not_active Expired - Fee Related
-
2007
- 2007-11-07 TW TW096142142A patent/TW200832570A/en unknown
- 2007-11-14 CN CNA2007101871122A patent/CN101183640A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103773255A (en) * | 2012-10-22 | 2014-05-07 | 松下电器产业株式会社 | Method for attaching panel and apparatus therefor |
| CN105190844A (en) * | 2013-05-24 | 2015-12-23 | 富士电机株式会社 | Method for manufacturing semiconductor device |
| CN105190844B (en) * | 2013-05-24 | 2017-08-22 | 富士电机株式会社 | The manufacture method of semiconductor device |
| US9972521B2 (en) | 2013-05-24 | 2018-05-15 | Fuji Electric Co., Ltd. | Method for manufacturing semiconductor device to facilitate peeling of a supporting substrate bonded to a semiconductor wafer |
| CN105378919A (en) * | 2014-05-28 | 2016-03-02 | 核心整合科技股份有限公司 | Semiconductor package sputtering method using liquid adhesive for electromagnetic interference shielding and sputtering apparatus therefor |
| CN105378919B (en) * | 2014-05-28 | 2018-06-05 | 核心整合科技股份有限公司 | The sputtering method and its sputtering equipment of semiconductor package part EMI shieldings are used for using liquid adhesive |
| CN108063111A (en) * | 2016-11-09 | 2018-05-22 | Imec 非营利协会 | A kind of method for semiconductor chip to be adhered to landing chip |
| CN109878189A (en) * | 2017-12-06 | 2019-06-14 | 3M创新有限公司 | The method for being used to form bending laminated products |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006053916B3 (en) | 2008-06-19 |
| TW200832570A (en) | 2008-08-01 |
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