JP2012084795A - Supply method of adhesive for temporarily fixing mounting component, manufacturing method of semiconductor device, substrate for mounting component and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a supply method of adhesive for temporarily fixing a mounting component in which a thickness of adhesive corresponding to the type of a mounting component can be obtained easily by single print process, and to provide a manufacturing method of a semiconductor device, a substrate for mounting a component and a semiconductor device.SOLUTION: A mask 1 having a plurality of mask openings 1a, 1a, 1aof different plane areas and a substrate 2 are superimposed while facing one surface 1A of the mask 1 and the surface 2A of the substrate 2 to each other. In a state where the mask 1 and the substrate 2 are superimposed, an adhesive 3 is supplied to fill the interior of each mask opening 1a, 1a, 1aand to be left on the other surface 1B of the mask 1. When the mask 1 is separated from the substrate 2 subsequently, a plurality of adhesive portions 3a, 3b, 3c are formed of the adhesive 3 on the surface 2A of the substrate 2.

Description

  The present invention relates to a method for supplying an adhesive for temporarily fixing a mounted component, a method for manufacturing a semiconductor device, a substrate for mounting a component, and a semiconductor device, and in particular, before soldering the mounted component to the substrate, temporarily mounting the mounted component to the substrate. A method of supplying an adhesive for temporarily fixing a mounting component for supplying an adhesive for fixing to a substrate, a method of manufacturing a semiconductor device using the method, a substrate for mounting components manufactured by the method, and a semiconductor device It is.

  When mounting components on a board such as a printed wiring board, a method of soldering the mounting parts to the conductive portion of the board by jetting molten solder onto the board (hereinafter referred to as “flow soldering”) Is used. Before the mounting component is soldered to the conductive portion of the substrate using this method, it is necessary to temporarily fix the mounting component to the flow soldering surface of the substrate that the molten solder contacts.

  This temporary fixing method is described in, for example, JP-A-4-040262 (Patent Document 1), JP-A-7-202398 (Patent Document 2), and the like. Generally, as described in JP-A-4-040262, an adhesive is applied to a printed circuit board by a dispenser, and after mounting the electronic component on the substrate, the adhesive is cured to mount the electronic component on the substrate. There is a method of temporarily fixing. In addition, as described in JP-A-7-202398, an adhesive is applied to a circuit board by a screen printing method through a mask having a predetermined pattern, and after mounting components, the adhesive is applied. There is also a method of curing and temporarily fixing the mounted component to the circuit board.

JP-A-4-040262 JP-A-7-202398

  For mounting parts mounted on the flow soldering surface of the board, for example, resistors and capacitors generally called 3216 square chips and 1608 square chips, SOP (Small Outline Package), QFP (Quad Flat Package), etc. There are a wide variety of types.

  The gap (hereinafter referred to as “stand-off”) between the electrodes of these mounted components and the bottom surface of the body differs for each component. This standoff is about a dozen μm or so in the thickness of electrode plating in a square chip. In addition, SOP and QFP are at least 0.1 mm according to these IC (Integrated Circuit) package specification guidelines (EIAJ ED-7311-19 and ED-7311A) prescribed by Japan Electronics and Information Technology Industries Association (JEITA), for example. Has a standoff of up to 0.3mm.

  When mounting these mounting components on a substrate, it is necessary to temporarily fix the mounting component to the substrate by supplying an adhesive having a thickness corresponding to the standoff. That is, it is necessary to reduce the thickness of the adhesive for a mounting component with a low standoff, and to increase the thickness of the adhesive for a mounting component with a high standoff.

  However, the dispenser described in JP-A-4-040262 cannot control the thickness of the adhesive even if the discharge amount of the adhesive can be controlled. For this reason, it is not possible to supply an adhesive having a thickness suitable for the standoff. Therefore, when the thickness of the adhesive is reduced in a mounting component with a high standoff, the adhesive does not reach the body part of the mounting component, and the mounting component cannot be temporarily fixed to the substrate.

  Further, if the adhesive is excessively supplied to the mounting component with a low standoff, the adhesive may protrude in a large amount from the adhesive supply position when the mounting component is mounted on the substrate. In this case, an adhesive adheres to the electrode of the mounting component or the pad on the substrate. Further, when the thickness of the adhesive is increased in a mounting component having a low standoff, a gap is generated between the electrode of the mounting component and the pad on the substrate. In this way, if adhesive adheres to the electrode of the mounting component or the pad on the board, or if a gap is generated between the electrode of the mounting part and the pad on the board, the solder will be removed during flow soldering. There was a possibility of poor bonding.

  In the printing method described in JP-A-7-202398, the thickness of the adhesive is determined by the thickness of the mask having a predetermined pattern. For this reason, in order to control the thickness of the adhesive, it is necessary to change the thickness of the mask, and various adhesive thicknesses suitable for different types of mounting parts with different standoffs are supplied in a single printing process. Can not do it.

  Therefore, if the adhesive is printed to a thickness that matches the mounting component with a low standoff, the adhesive does not reach the body portion of the mounting component with a high standoff, and the mounting component cannot be temporarily fixed. Also, if the adhesive is printed to a thickness that matches the high stand-off mounting component, the adhesive will be excessive on the low stand-off mounting component, as described above, on the mounting component electrodes and the pads on the board. In some cases, the adhesive adheres and soldering cannot be performed, or the electrodes of the mounted components are separated from the pads on the substrate, and soldering cannot be performed.

  The present invention has been made in view of the above problems, and the purpose thereof is an adhesive for temporarily fixing a mounting component that can easily obtain an adhesive thickness suitable for each type of mounting component in a single printing process. Supply method, semiconductor device manufacturing method, component mounting substrate, and semiconductor device.

  The mounting component temporary fixing adhesive supply method of the present invention is for mounting component temporary fixing for supplying an adhesive for temporarily fixing a mounting component to a substrate before soldering the mounting component to the substrate. An adhesive supply method includes the following steps.

  First, a substrate is prepared. Then, the mask and the substrate are overlapped with one surface of the mask having a plurality of through-holes having different planar areas facing the surface of the substrate. Then, in a state where the substrate and the mask are overlapped, an adhesive is supplied so as to fill the inside of each of the plurality of through holes to adhere to the surface of the substrate and to leave on the other surface of the mask. By attaching the adhesive to the surface of the substrate and then separating the mask from the substrate, a plurality of adhesive portions are formed on the surface of the substrate from the adhesive.

  According to the method for supplying the adhesive for temporarily mounting components of the present invention, the adhesive is filled in the plurality of through holes provided in the mask and having different plane areas, and the adhesive is left on the mask surface. As a result, when the mask is separated from the substrate, a plurality of adhesive portions having different thicknesses can be formed on the substrate, and an adhesive thickness corresponding to the component type can be easily obtained in a single printing process. Can do.

  Moreover, by leaving the adhesive on the other surface of the mask and separating the mask from the substrate, an adhesive part having a thickness equal to or greater than the thickness of the mask can be formed. Get higher.

  The component mounting substrate of the present invention is a component mounting substrate for temporarily fixing and soldering a mounted component, and includes a substrate and a plurality of adhesive portions. The plurality of adhesive portions are formed on the surface of the substrate, and are for temporarily fixing the mounting component to the substrate. The plurality of adhesive portions have different plane areas and have different thicknesses.

  According to the component mounting board of the present invention, the plurality of adhesive portions formed on the board have different plane areas and thicknesses. Thereby, it is possible to supply an adhesive having a thickness suitable for each type of mounted component.

  As described above, according to the present invention, it is possible to easily obtain an adhesive thickness suitable for each type of mounted component.

It is a schematic sectional drawing which shows the 1st process of the supply method of the adhesive for temporarily mounting components in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 2nd process of the supply method of the adhesive for temporarily mounting components in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 3rd process of the supply method of the adhesive for mounting component temporary fixing in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 4th process of the supply method of the adhesive for temporarily mounting components in Embodiment 1 of this invention. It is a schematic perspective view which shows a mode that an adhesive agent is apply | coated using the squeegee in the supply method of the adhesive for temporarily mounting components in Embodiment 1 of this invention. It is a front view which shows the structure of the squeegee used for the supply method of the adhesive for temporarily mounting components in Embodiment 1 of this invention. It is a schematic sectional drawing which follows the VII-VII line of FIG. It is a figure which shows the relationship between the opening dimension of a mask opening part (through-hole) provided in the mask, tack force, and shear force. It is the schematic plan view (A) and schematic side view (B) which show the 1st process of the method of manufacturing a semiconductor device using the supply method of the mounting component temporary fixing adhesive in Embodiment 1 of this invention. It is the schematic plan view (A) and schematic side view (B) which show the 2nd process of the method of manufacturing a semiconductor device using the supply method of the mounting component temporary fixing adhesive in Embodiment 1 of this invention. It is the schematic plan view (A) and schematic side view (B) which show the 3rd process of the method of manufacturing a semiconductor device using the supply method of the adhesive for temporarily mounting components in Embodiment 1 of this invention. It is the schematic plan view (A) and schematic side view (B) which show the 4th process of the method of manufacturing a semiconductor device using the supply method of the mounting component temporary fixing adhesive in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 1st process of the supply method of the adhesive for temporarily mounting components in Embodiment 2 of this invention. It is a schematic sectional drawing which shows the 2nd process of the supply method of the adhesive for temporary mounting components in Embodiment 2 of this invention. It is a schematic sectional drawing which shows the 3rd process of the supply method of the adhesive for temporarily mounting components in Embodiment 2 of this invention. It is a figure which shows the experimental data which show the relationship between the opening dimension in Embodiment 2 of this invention, and the printing height of an adhesive agent.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, a method for supplying an adhesive for temporarily mounting components in Embodiment 1 will be described with reference to FIGS.

  Referring to FIG. 1, first, for example, a printed wiring board is prepared as a substrate 2. On this substrate 2, for example, a metal mask (a mask in which a metal plate such as stainless steel is provided with an opening with a laser or the like) is superimposed as the mask 1 after being aligned with the substrate 2. At this time, the surface 2A of the substrate 2 and the one surface 1A of the mask 1 are overlapped so as to face each other, and after the overlapping, the surface 2A of the substrate 2 and the one surface 1A of the mask 1 are in close contact with each other.

The mask 1 is a screen printing plate having a constant thickness provided with openings at desired adhesive supply positions, and has a plurality of mask openings (through holes) 1a ₁ , 1a ₂ , 1a ₃ . The plurality of mask openings 1a ₁ , 1a ₂ , 1a ₃ have different plane areas. The surface 2A of the substrate 2 is exposed from each of the mask openings 1a ₁ , 1a ₂ , 1a ₃ .

Here, the plane area of the mask opening is an opening area of the mask opening in a plan view when viewed from a direction perpendicular to the surface 2A of the substrate 2. In the present embodiment, the plane area of the mask opening 1a ₁ is the largest, and the plane area decreases in the order of the mask openings 1a ₂ and 1a ₃ .

The planar shape of each of the mask openings 1a ₁ , 1a ₂ , 1a ₃ may be any of a perfect circle shape, an elliptical shape, a rectangular shape, a track shape, an irregular shape, and the like. When the planar shape of each of the mask openings 1a ₁ , 1a ₂ , 1a ₃ is a perfect circle, the diameter of the mask opening 1a ₁ is the largest, and the diameter decreases in the order of the mask openings 1a ₂ , 1a _3. It has become.

When the planar shape of each of the mask openings 1a ₁ , 1a ₂ , 1a ₃ is a perfect circle, the thickness of the mask 1 with respect to the diameter of the mask opening 1a ₁ is preferably less than 0.3. The thickness of the mask 1 with respect to the diameter of the opening 1a ₂ is preferably 0.3 or more and less than 0.5, and the thickness of the mask 1 with respect to the diameter of the mask opening 1a ₃ is preferably 0.5 or more.

  Further, it is preferable that one surface 1A of the portion of the mask 1 facing the substrate 2 and the surface 2A of the portion of the substrate 2 facing the mask 1 are both flat.

  Referring to FIG. 2, adhesive 3 is placed on the other surface (back surface of one surface 1 </ b> A) 1 </ b> B of mask 1 with substrate 2 and mask 1 being overlapped. The adhesive 3 is, for example, a thermosetting epoxy resin, but is not limited to this, and may be a thermosetting resin other than this or other resin. Thereafter, the squeegee 6 </ b> A moves along the other surface 1 </ b> B of the mask 1 while pressing the adhesive 3 against the other surface 1 </ b> B side of the mask 1.

As shown in FIGS. 6 and 7, the squeegee 6A used at this time has a step 6a of approximately 0.1 mm to 0.5 mm at its end. Due to the step 6a, a recess 6a ₁ is formed at the center of the end of the squeegee 6A, and a protrusion 6a ₂ is formed at both ends of the end.

With reference to FIG. 5, the squeegee 6 </ b> A moves along the other surface 1 </ b> B of the mask 1 while being pressed against the mask 1 with the end portion having the step 6 a facing the other surface 1 </ b> B of the mask 1. Thereby, the adhesive 3 is applied to the surface 2A of the substrate 2 with the mask 1 interposed. When the squeegee 6A is pressed against the mask 1, the end of the squeegee 6A that faces the other surface 1B of the mask 1 has a step 6a. Therefore, the step 6a causes the end of the squeegee 6A and the other surface 1B of the mask 1 to A portion having a large distance and a portion having a small distance are generated. That is, the distance between the end of the squeegee 6A and the other surface 1B of the mask 1 increases at the concave portion 6a ₁ caused by the step 6a and decreases at the convex portion 6a ₂ . At this time, the convex portion 6a ₂ of the squeegee 6A is preferably in contact with the other surface 1B of the mask 1, and in this case, the distance between the other surface 1B of the mask 1 and the convex portion 6a ₂ of the squeegee 6A is substantially equal. Therefore, it becomes 0.

If the convex portion 6a ₂ of the squeegee 6A adhesive 3 to move the squeegee 6A remains in contact with the other surface 1B of the mask 1 is applied, between the other surface 1B of the recess 6a ₁ and the mask 1 of the squeegee 6A The adhesive 3 is left in the region 7, and the adhesive 3 does not remain between the convex portion 6 a ₂ and the other surface 1 B of the mask 1.

Referring to FIG. 3, in this step of supplying adhesive 3, adhesive 3 pressed against mask 1 by squeegee 6 </ b> A is placed inside each of a plurality of mask openings 1 a ₁ , 1 a ₂ , 1 a _3. Fill and adhere to the surface 2 A of the substrate 2. The adhesive 3 on the other surface 1B of the mask 1 in the region 7 between the other surface 1B of the recess 6a ₁ and the mask 1 of the squeegee 6A, for example, remains with a thickness of 0.5mm or more 0.1 mm.

  Referring to FIG. 4, printing is completed by separating mask 1 from substrate 2 after attaching adhesive 3 to surface 2 </ b> A of substrate 2. Thereby, a plurality of adhesive portions 3 a, 3 b, 3 c are formed on the surface 2 </ b> A of the substrate 2 from the adhesive 3.

  Of the plurality of adhesive portions 3a, 3b and 3c formed on the surface 2A of the substrate 2, the adhesive portion having a large flat area is formed thicker than the adhesive portion having a small flat area. That is, the adhesive part 3a having a larger planar area than the adhesive part 3b is formed thicker than the adhesive part 3b, and the adhesive part 3b having a larger planar area than the adhesive part 3c is formed thicker than the adhesive part 3c. Is done. In this way, the supply of the mounting component temporary fixing adhesive of the present embodiment is completed.

  Thereafter, the mounting component is mounted so as to adhere to each of the adhesive portions 3a, 3b, and 3c on the surface 2A of the substrate 2 (not shown), and each of the adhesive portions 3a, 3b, and 3c is cured (see FIG. Flow soldering is performed (not shown), and the assembly of the printed wiring board is completed.

  In the above method, the present inventors have found that an adhesive portion having a large flat area is formed thicker than an adhesive portion having a small flat area among the plurality of adhesive portions 3a, 3b, and 3c. This will be described below.

In the present embodiment, the adhesive 3 is filled into each of the mask openings 1a ₁ , 1a ₂ , 1a ₃ and left on the other surface 1B of the mask 1, and then the mask 1 is removed from the substrate 2. To be separated. At this time, the tack force Ft is generated between the surface 2A of the adhesive 3 and the substrate 2, the shearing force Fs between the inner wall of the adhesive 3 and the mask opening 1a _1, 1a _2, 1a ₃ Arise. The tack force is a quantification of the stickiness of the adhesive 3 with respect to the substrate 2, and the adhesive 3 is peeled off from the substrate 2 when a force greater than the tack force is applied. If a force greater than the shearing force is applied, the adhesive 3 is peeled off from the wall surface of the mask opening of the mask 1.

The tack force Ft is a function of the plane area of the mask openings 1a ₁ , 1a ₂ , 1a ₃ , and the shear force Fs is a function of the inner wall area of the mask openings 1a ₁ , 1a ₂ , 1a ₃ , and the tack force Ft and Each of the shear forces Fs is also a function of the opening dimensions of the mask openings 1a ₁ , 1a ₂ , 1a ₃ .

  FIG. 8 shows the relationship between the tack force Ft and the shearing force Fs with respect to the opening size, with the thickness of the mask 1 being constant. When the opening size is small, Ft <Fs, and when the opening size is large, Ft> Fs.

  When Ft <Fs, the tack force Ft of the adhesive 3 is lost to the shear force Fs. For this reason, when the mask 1 is separated from the substrate 2, the adhesive 3 cannot be sheared and remains attached to the inner wall of the mask opening. Therefore, most of the adhesive 3 filled in the mask opening does not remain on the substrate 2 to the extent that a part of the adhesive 3 in contact with the substrate 2 adheres to the substrate 2.

  If Ft> Fs, the tack force Ft of the adhesive 3 is superior to the shear force Fs. For this reason, the adhesive 3 is sheared by the inner wall of the mask opening when the mask 1 is separated from the substrate 2, so that the adhesive 3 is left on the substrate 2.

  For example, when the thickness of the mask 1 is t at a certain opening dimension, and the tack force Ft is twice the shear force Fs, that is, Ft = 2 × Fs, Ft> Fs, so the adhesive 3 is the substrate 2 Is left on the surface 2A. In addition, since Ft = 2Fs, the adhesive 3 having a thickness twice as large as the shear force Fs necessary for shearing the adhesive 3 having the thickness t of the mask 1, that is, twice the thickness t of the mask 1 can be sheared. The tack force Ft is as follows.

  Therefore, when the tack force Ft is larger than the shear force Fs, the adhesive 3 having a thickness equal to or greater than the thickness t of the mask 1 can be removed by the difference Ft−Fs. When Ft≈Fs, there is a possibility that it can be both of the above-mentioned cases. However, since the adhesive 3 is in a paste form having a relatively soft viscosity, the adhesive 3 corresponding to the shearing force Fs corresponding to the tack force Ft is left on the surface 2A of the substrate 2.

From the above, as shown in FIG. 4, since Ft> Fs at the location where the large mask opening 1 a ₁ is provided, the thickness of the mask 1 and the thickness of the adhesive 3 left on the mask 1 are combined. Part 3a is formed. Further, since Ft≈Fs at the location where the intermediate mask opening 1a ₂ is provided, even if the adhesive 3 filled in the mask opening 1a ₂ is transferred, the adhesive 3f remaining on the mask 1 is not transferred, but is masked. The adhesive portion 3b having the same thickness as 1 is formed. In addition, since Ft <Fs in the small mask opening 1a ₃ , the adhesive 3 itself filled in the mask opening 1a ₃ does not come out, and only a part of the adhesive 3 in contact with the surface 2A of the substrate 2 is transferred. Therefore, an adhesive part 3c having a thickness equal to or smaller than the thickness of the mask 1 is formed.

That is, a mask opening 1a ₁ having an opening dimension (opening area) satisfying Ft> Fs, a mask opening 1a ₂ having an opening dimension (opening area) satisfying Ft≈Fs, and an opening dimension (opening) satisfying Ft <Fs. By providing the mask opening 1a ₃ having an area) in the mask 1, adhesive layers 3a, 3b and 3c having different thicknesses can be obtained.

  As described above, when the mounting component temporary fixing adhesive supply method of the present embodiment is used, it is possible to realize mounting component temporary fixing adhesives having different thicknesses by one printing.

  Next, as a method of manufacturing a semiconductor device using the mounting component temporary fixing adhesive supply method of the present embodiment, a case where square chip components and SOP are mounted on a printed wiring board will be described with reference to FIGS. I will explain.

  With reference to FIGS. 9A and 9B, first, for example, a printed wiring board is prepared as the substrate 2. The printed wiring board 2 is a board on which a printed wiring (conductive portion) is formed, and includes a base material 2a and a printed wiring 2b formed on the surface of the base material 2a.

  FIGS. 9A and 9B show the SOP mounting portion on the right side, and a pad 2b as a printed wiring for electrically connecting to the SOP electrode is formed on the mounting portion. Yes. 9A and 9B show a corner chip component mounting portion on the left side, and a pad as a printed wiring for electrically connecting to the electrode of the corner chip component is shown on the mounting portion. 2b is formed.

  Referring to FIGS. 10A and 10B, a plurality of adhesive portions 3d on the surface 2A of the printed wiring board 2 using the above-described method for supplying the mounting component temporary fixing adhesive of the present embodiment, 3e is formed by printing. At this time, the adhesive portion 3d formed on the SOP mounting portion is formed to have a larger plane area and a larger thickness than the adhesive portion 3e formed on the square chip component mounting portion.

  Referring to FIGS. 11A and 11B, the SOP 10A is mounted on the SOP mounting portion so as to adhere to the adhesive portion 3d, and the square chip 10B is bonded to the adhesive portion 3e on the corner chip component mounting portion. Mounted on. In this state, the adhesive portions 3d and 3e are cured.

At this time, the standoff SO1 of the SOP 10A is relatively large, but the thickness of the adhesive portion 3d is also relatively thick. For this reason, the body part 10a _{1 of the} SOP 10A is appropriately bonded by the adhesive part 3d. Also adhere to the pad 2b of the adhesive portion 3d is the electrode 10a ₂ and the substrate 2 of SOP10A protrudes also be prevented, and the electrode 10a ₂ and the pad 2b can also be prevented to leave.

Further, the standoff SO2 of the square chip 10B is relatively small, but the thickness of the adhesive portion 3e is also relatively thin. For this reason, the body portion 10b ₁ of the corner chip 10B is appropriately bonded by the adhesive portion 3e. Also to be attached to the electrode 10b ₂ and the pad 2b of the substrate 2 of the corner chip 10B protrude adhesive portion 3e is also prevented, and the electrode 10b ₂ and the pad 2b can also be prevented to leave.

Referring to FIGS. 12A and 12B, flow soldering is performed in this state. Thereby, the electrode 10a ₂ of the SOP 10A and the pad 2b on the substrate 2 are electrically connected by the solder 15. Further, the electrode 10b ₂ of the square chip 10B and the pad 2b on the substrate 2 are electrically connected by the solder 15. As a result, a semiconductor device in which mounting components (for example, semiconductor elements) such as the SOP 10A and the square chip 10B are mounted on the printed wiring board 2 is completed.

  Next, a configuration of the component mounting substrate manufactured by the method of supplying the mounting component temporary fixing adhesive of the present embodiment and the semiconductor device manufactured by the method of manufacturing the semiconductor device of the present embodiment will be described with reference to FIG. This will be described with reference to (A) and (B).

  Referring to FIGS. 12A and 12B, the component mounting board of the present embodiment is a component mounting board for temporarily fixing and soldering a mounted component, and includes a plurality of boards 2 and a plurality of boards. Adhesive portions 3d and 3e.

  The board | substrate 2 is a printed wiring board, for example, and has the base material 2a and printed wiring (conductive part) 2b, such as a pad formed in the surface of the base material 2a. The adhesive portions 3d and 3e are for temporarily fixing a mounted component to the surface 2A of the substrate 2, and are formed on the surface 2A of the substrate 2.

  The adhesive portion 3d and the adhesive portion 3e have different plane areas and have different thicknesses. For example, the adhesive part 3d has a larger plane area than the adhesive part 3e, and has a thicker thickness than the adhesive part 3e.

  The semiconductor device of the present embodiment includes the above-described component mounting substrate and mounting components 10A and 10B such as SOP and square chips mounted on the component mounting substrate. The mounted component 10A bonded to the adhesive portion 3d having a large plane area and a large thickness has a relatively large standoff SO1. The mounted component 10B bonded to the adhesive portion 3e having a small flat area and a small thickness has a relatively small standoff SO2. A mounting component 10A having a relatively large standoff SO1 is, for example, an SOP, and a mounting component 10B having a relatively small standoff SO2 is, for example, a square chip.

The bottom surface of the body portion 10a ₁ of the mounting part 10A is in contact adhesive portion 3d, the bottom surface of the body portion 10b ₁ of the mounting part 10B is in contact with the adhesive portion 3e. The electrode (terminal) 10a ₂ of the mounting component 10A and the pad 2b of the substrate 2 are soldered by the solder 15, and the electrode (terminal) 10b _{2 of} the mounting component 10B and the pad 2b of the substrate 2 are soldered by the solder 15. Has been.

Next, the effect of this Embodiment is demonstrated.
According to the method of supplying the adhesive for temporarily mounting components according to the present embodiment, as shown in FIGS. 3 and 5, a plurality of mask openings 1a ₁ , 1a ₂ provided on the mask 1 and having different plane areas are provided. The adhesive 3 is filled in 1a ₃ and the adhesive 3 is left on the other surface 1B of the mask 1. Here, the relationship between the tack force Ft and the shear force Fs with respect to the plane area (opening area) of the mask openings 1a ₁ , 1a ₂ , 1a ₃ is as shown in FIG. Accordingly, when the mask 1 is separated from the substrate 2 as shown in FIG. 4, the adhesive portion having a large flat area is thicker than the adhesive portion having a small flat area among the plurality of adhesive portions 3a, 3b, and 3c. Will be formed. For this reason, a plurality of adhesive portions 3a, 3b, 3c having different thicknesses can be formed on the surface 2A of the substrate 2, and the thickness of the adhesive corresponding to the component type can be easily obtained by a single printing process. be able to.

For example, as shown in FIG. 12, a thick adhesive portion 3d can be used for bonding a mounting component 10A having a relatively large standoff SO1. Therefore, the body portion 10a ₁ of the mounting component 10A is appropriately bonded by the adhesive portion 3d, and the adhesive portion 3d protrudes and adheres to the electrode 10a ₂ of the mounting component 10A and the pad 2b on the substrate 2. It is prevented, and the electrode 10a ₂ and the pad 2b can also be prevented to leave.

Further, as shown in FIG. 12, an adhesive portion 3e having a small thickness can be used for bonding the mounting component 10B having a relatively small standoff SO2. Therefore, the body portion 10b ₁ of the mounting component 10B is appropriately bonded by the adhesive portion 3e, and the adhesive portion 3e protrudes and adheres to the electrode 10b ₂ of the mounting component 10B or the pad 2b on the substrate 2. It is also prevented that the electrode 10b ₂ and the pad 2b are separated from each other.

  Also, as shown in FIGS. 3 and 5, the adhesive 3 is left on the other surface 1 </ b> B of the mask 1, so that an adhesive portion 3 a thicker than the thickness of the mask 1 may be left on the surface 2 </ b> A of the substrate 2. It becomes possible. Thereby, the freedom degree of the thickness of an adhesive bond layer becomes high.

In addition, one surface 1A of the portion of the mask 1 facing the substrate 2 and the surface 2A of the portion of the substrate 2 facing the mask 1 are both flat. Thus, the mask 1 can be brought into close contact with the substrate 2, bleeding upon printing, i.e. the mask opening 1a _1, 1a _2, 1a ₃ gap prevented from adhesive 3 enters between the mask 1 and the substrate 2 from Is done.

  According to the component mounting board of the present embodiment, the plurality of adhesive portions 3d and 3e formed on the board 2 have different plane areas and thicknesses. As a result, it is possible to supply the adhesive portions 3d and 3e having thicknesses suitable for the types of the mounting components 10A and 10B.

  The reason why the size of the step 6a provided on the squeegee 6A is 0.1 mm or more and 0.5 mm or less is as follows.

  If the thickness of the mask 1 is 0.2 mm, for example, the above-mentioned square chip has a small stand-off, so if the adhesive layer is as thick as the mask 1, the mounting component (square chip) can be securely Can be glued. However, in order to bond a mounted component having a standoff of about 0.3 mm such as QFP or SOP, the thickness of the adhesive 3 together with the thickness of the mask 1 is required to be 0.3 mm. That is, the thickness of the adhesive 3 applied on the other surface 1B of the mask 1 is required to be 0.1 mm or more. According to JEITA, SOP and QFP also have a package standard having a stand-off of 0.5 mm at the maximum. In this case, it is necessary to apply the adhesive 3 having a thickness of 0.5−0.2 = 0.3 mm on the other surface 1B of the mask 1. If an appropriate margin is added to 0.3 mm and an adhesive 3 having a thickness of 0.5 mm is applied on the other surface 1B of the mask 1, it is considered that most mounting components can be bonded. Accordingly, the size of the step 6a provided on the squeegee 6A is preferably 0.1 mm or more and 0.5 mm or less.

(Embodiment 2)
Next, a method of supplying the mounting component temporary fixing adhesive in the second embodiment will be described with reference to FIGS.

Referring to FIG. 13, first, as in the first embodiment, for example, a printed wiring board is prepared as substrate 2, and after mask 1 is aligned with substrate 2, mask 1 and substrate 2 are overlaid. Like the mask 1 of the first embodiment, the mask 1 is a screen printing plate having a constant thickness in which openings are provided at desired adhesive supply positions, and a plurality of mask openings (through holes) 1a having different plane areas. ₁ , 1a ₂ , 1a ₃ .

  In a state where the substrate 2 and the mask 1 are overlapped, the adhesive 3 similar to that of the first embodiment is placed on the other surface 1B of the mask 1. Thereafter, the squeegee 6B moves while pressing the adhesive 3 against the other surface 1B side of the mask 1.

  The squeegee 6B used at this time is flat with no step as in the first embodiment at the end facing the other surface 1B of the mask 1 when the squeegee 6B is pressed against the mask 1. The difference from the squeegee 6A of the first embodiment.

In the first embodiment, the adhesive is left on the other surface 1B of the mask 1 by using the squeegee 6A provided with the step 6a. In contrast, in the present embodiment, the hardness and moving speed of the squeegee 6B are appropriate so that the squeegee 6B without a step when riding on the adhesive 3 rides on the adhesive 3 as shown in FIGS. Has been adjusted. As a result, as shown in FIG. 15, the adhesive 3 is left with a predetermined thickness on the other surface 1B of the mask 1, and the adhesive 3 is filled in the mask openings 1a ₁ , 1a ₂ , 1a ₃ . The

  That is, when the adhesive 3 is applied while being pressed against the mask 1 with the squeegee 6B, the end of the squeegee 6B facing the other surface 1B of the mask 1 rides on the adhesive 3 so that the squeegee 6B and the other surface 1B of the mask 1 are applied. And the adhesive 3 remains on the other surface 1B of the mask 1.

  Since the other steps are substantially the same as the method for supplying the mounting component temporary fixing adhesive and the method for manufacturing the semiconductor device of the first embodiment, description thereof will not be repeated. The configuration of the component mounting board and the semiconductor device manufactured according to the present embodiment is almost the same as the configuration of the component mounting substrate and the semiconductor device of the first embodiment, and therefore description thereof will not be repeated.

Also in such an adhesive printing process, as shown in FIG. 4, since Ft> Fs at the location where the large mask opening 1 a ₁ is provided, the thickness of the mask 1 and the thickness of the adhesive 3 left on the mask 1 The adhesive part 3a is formed with the combined thickness. Further, since Ft≈Fs at the portion where the intermediate mask opening 1a ₂ is provided, the adhesive 3 filled in the mask opening 1a ₂ is not transferred to the adhesive 3 left on the mask 1 even if transferred. The adhesive portion 3b having the same thickness as 1 is formed. In addition, since Ft <Fs in the small mask opening 1a ₃ , the adhesive 3 itself filled in the mask opening 1a ₃ does not come out, and only a part of the adhesive 3 in contact with the surface 2A of the substrate 2 is transferred. Therefore, an adhesive part 3c having a thickness equal to or smaller than the thickness of the mask 1 is formed.

  Next, the planar dimension (opening dimension) of the mask opening and the finished dimension (thickness) of the adhesive part when the component mounting substrate is manufactured by the method of supplying the mounting component temporary fixing adhesive of the present embodiment The experimental results of examining the relationship will be described with reference to FIG.

  In this experiment, for example, a metal mask 1 having a thickness of 200 μm, a urethane sword squeegee 6B having a hardness of 70, and an adhesive 3 having a viscosity of 380 Pa · s and a thixo index of 5 were used. The opening dimension (diameter) of the mask opening having a perfect planar shape of the metal mask 1 is changed from φ0.3 mm to φ1.0 mm in increments of 0.1 mm, and the adhesive 3 is applied on the metal mask 1 in each opening dimension. The squeegee 6B was moved at a speed of about 170 mm / sec for printing, and the height (finished dimension) of the transferred adhesive part was measured. The result is shown in FIG.

  From the results of FIG. 16, an adhesive part having a thickness of about 50 μm could be printed in a small mask opening having an opening size of φ0.3 mm or φ0.4 mm. An adhesive portion having a thickness of about 200 μm corresponding to the thickness of the metal mask 1 could be printed at an intermediate mask opening of φ0.5 mm or φ0.6 mm. Also, an adhesive part having a thickness of about 250 μm to about 300 μm could be printed at a large mask opening exceeding φ0.6 mm.

  As described above, in the metal mask 1, the squeegee 6B, the adhesive 3, and the printing conditions described above, a small φ0.3 mm to φ0.4 mm is required for a part having a standoff of about 10 μm or more such as a square chip part. Use a mask opening, use an intermediate mask opening of φ0.5mm or φ0.6mm for parts such as SOP and QFP with a standoff of about 200μm, and φ0.7mm for parts with a larger standoff. The present inventors have found that if printing is performed using the large mask openings described above, an adhesive having a height suitable for each standoff can be supplied in a single printing process.

  In this experiment, it is considered that the point where Ft = Fs is in the range of the opening size of 0.5 mm to 0.6 mm.

Further, from this experimental result, the thickness (0.2 mm) of the mask 1 with respect to the diameter of the mask opening is 0.5 or more in the case of a small diameter of φ0.4 mm or less, and in the case of a large diameter of φ0.7 mm or more. Was less than 0.3, and in the case of an intermediate diameter of φ0.5 to φ0.6, it was also found that it was 0.3 or more and less than 0.5. Therefore, when the planar shape of each of the mask openings 1a ₁ , 1a ₂ , 1a ₃ shown in FIG. 13 is a perfect circle, the thickness of the mask 1 with respect to the diameter of the mask opening 1a ₁ is less than 0.3. The thickness of the mask 1 with respect to the diameter of the mask opening 1a ₂ is preferably 0.3 or more and less than 0.5, and the thickness of the mask 1 with respect to the diameter of the mask opening 1a ₁ is 0.5 or more. It is preferable.

In the first embodiment, the same result as that shown in FIG. 16 was obtained.
As described above, also in the present embodiment, it is possible to realize the supply of mounting component temporary fixing adhesives having different thicknesses by a single printing as in the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 mask, 1A one surface, 1a ₁ , 1a ₂ , 1a ₃ mask opening, 1B other surface, 2 substrate, 2A surface, 2a base material, 2b printed wiring (conductive portion, pad), 3 adhesive, 3a, 3b , 3c, 3d, 3e Adhesive part, 6A, 6B squeegee, 6a step, 6a ₁ concave part, 6a ₂ convex part, 7 region, 10A, 10B mounting part, 10a ₁ , 10b ₁ body part, 10a ₂ , 10b ₂ electrode .

Claims (10)

Before soldering the mounting component to the substrate, the mounting component temporary fixing adhesive supply method for supplying the substrate with an adhesive for temporarily fixing the mounting component to the substrate,
Preparing the substrate;
A step of overlapping the mask and the substrate so that one surface of the mask having a plurality of through-holes having different plane areas and the surface of the substrate face each other;
In a state where the substrate and the mask are overlapped, the adhesive is supplied so that the inside of each of the plurality of through holes is filled and adhered to the surface of the substrate and left on the other surface of the mask. Process,
Forming a plurality of adhesive portions from the adhesive on the surface of the substrate by separating the mask from the substrate after the adhesive is attached to the surface of the substrate. Supply method of temporary fixing adhesive.   The adhesive for temporarily mounting components according to claim 1, wherein an adhesive portion having a large flat area among the plurality of adhesive portions formed on the surface of the substrate is formed thicker than an adhesive portion having a small flat area. Agent supply method. The step of supplying the adhesive includes a step of applying the adhesive while pressing the adhesive against the mask with a squeegee,
When the squeegee is pressed against the mask, the end of the squeegee facing the other surface of the mask has a step, and the step is a portion where the distance from the other surface of the mask is small and a portion where the distance is large And
3. The method according to claim 1, wherein in the step of supplying the adhesive, the adhesive remains on the other surface of the mask between the large distance portion of the squeegee and the other surface of the mask. Supply method of adhesive for temporarily fixing mounted components. The step of supplying the adhesive includes a step of applying the adhesive while pressing the adhesive against the mask with a squeegee,
When the squeegee is pressed against the mask, an end of the squeegee that faces the other surface of the mask rides on the adhesive and has a gap between the other surface of the mask and the adhesive. The method for supplying an adhesive for temporarily fixing a mounting component according to claim 1, wherein the adhesive remains on the other surface of the mask.   The method for supplying an adhesive for temporarily mounting components according to claim 1, wherein the one surface of the portion of the mask facing the surface of the substrate is flat.   A semiconductor, further comprising a step of temporarily fixing the mounting component to at least one of the plurality of adhesive portions formed by the method for supplying an adhesive for temporarily fixing a mounting component according to claim 1. Device manufacturing method.   The method for manufacturing a semiconductor device according to claim 6, further comprising a step of soldering the mounting component to the substrate after temporarily fixing the mounting component to the substrate. A component mounting board for temporarily fixing and soldering a mounted component,
A substrate,
A plurality of adhesive portions formed on the surface of the substrate for temporarily fixing the mounting component to the substrate;
The component mounting board, wherein the plurality of adhesive portions have different plane areas and have different thicknesses.   The component mounting substrate according to claim 8, wherein an adhesive portion having a large flat area among a plurality of adhesive portions formed on the surface of the substrate is formed thicker than an adhesive portion having a small flat area. The component mounting board according to claim 8 or 9,
A plurality of mounting parts attached to the substrate by each of the plurality of adhesive portions,
A semiconductor device, wherein each of the plurality of mounting components is soldered to the substrate.

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