CN101162744A - Technological process of LED fluorescent powder coating - Google Patents
Technological process of LED fluorescent powder coating Download PDFInfo
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- CN101162744A CN101162744A CNA2006100630321A CN200610063032A CN101162744A CN 101162744 A CN101162744 A CN 101162744A CN A2006100630321 A CNA2006100630321 A CN A2006100630321A CN 200610063032 A CN200610063032 A CN 200610063032A CN 101162744 A CN101162744 A CN 101162744A
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Abstract
The invention discloses a technique of providing LED fluorescent powder. The flow of the technique is the moulding of a silica gel cushion, the arrangement of the silica gel cushion, tack crystal glue, the fixation of crystal, the solidifying of the fixation of crystal, the wire welding, the application of the fluorescent powder, the solidifying of the fluorescent powder and package as well as moulding, which form an LED light. Because the processing method is fixedly provided with a silica gel cushion for controlling the size of gap on the periphery of silicon slice fixed on a base, the space thickness of the filled fluorescent powder is guaranteed to be even. Therefore, the applied fluorescent powder is smooth and even, thereby ensuring the even and saturated facula or light color generated by the illumination of processed LED light and avoiding the phenomenon of blue block or yellow block or blue ring or yellow ring existing in facula or light color generated by the illumination of LED caused by uneven application of the fluorescent powder.
Description
[technical field]
The present invention relates to the process of relevant a kind of LED fluorescent material coating.
[background technology]
Frequent various light fixtures of contact in daily life, wherein,, power saving little because of LED (light-emitting diode) volume, vibration strength is good is widely adopted.See also Fig. 1, shown in Figure 2, the technological process of existing white light LED fluorescent powder coating is:
Put crystal-bonding adhesive: 1 of crystal-bonding adhesive is overlayed on the corresponding position on the pedestal 3 that is used for fixing wafer 2, this crystal-bonding adhesive 1 can be conducting resinl or the epoxy resin that has viscosity.
Gu brilliant curing: wafer 2 is positioned on the pedestal 3 that scribbles crystal-bonding adhesive 1, and itself and crystal-bonding adhesive 1 closely are pasted on the pedestal 3, then, the wafer 2 that is pasted on the pedestal 3 is dried together, this wafer 2 is fixed on the pedestal 3.
Bonding wire: the two ends of conductive lead 4 are welded in respectively on wafer 2 and the conductive pedestal 3.
Fluorescent material coating: after welding finishes, at the fluorescent material 5 of wafer 2 surface coated one deck yellow.
Fluorescent powder curing: the wafer 2 that will be coated with fluorescent material 5 send to be put oven interior and dries, and makes that its yellow fluorescent powder 5 is fixed-type in wafer 2 surfaces.
Encapsulated moulding: after the fluorescent material coating is finished, wafer 2 is packaged in the housing of plastic rubber shaping, thereby forms the LED lamp.
In the process that above-mentioned fluorescent material 5 applies, solidifies, fluorescent material 5 is dome shape and distributes on wafer 2 surfaces, the thickness of fluorescent material 5 that is coated on 2 four angles of wafer is relatively thin, the blue light of blue wafer 2 is with after yellow fluorescent powder 5 mixes, the hot spot or photochromic middle blue piece, the blue circle of occurring that cause the LED lamp to send when illumination can appear leaking the blue light phenomenon.Equally, because of be coated on wafer 2 directly over and the thickness of the fluorescent material 5 of below relatively thick, cause easily hot spot that the LED lamp sends when illumination or photochromic in yellow piece, yellow circle appear.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of process of LED fluorescent material coating, the hot spot of the LED lamp that processes by this method or photochromic even, saturated, can avoid hot spot that the LED lamp sends when illumination or photochromic in blue piece or yellow piece, blue circle or yellow circle appear.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of process of LED fluorescent material coating is provided, may further comprise the steps:
The moulding silicagel pad: with the liquid-state silicon gel injection moulding in silica gel mould inside, then, the liquid-state silicon gel that is opposite to silica gel mould inside toasts, make its curing molding go out to have the silicagel pad of cavity volume, the shape that is arranged at the cavity volume in the silicagel pad is similar to the shape of wafer, and the volume of cavity volume is greater than the volume of wafer;
Silicagel pad is installed: silicagel pad is fixedly installed on the conductive pedestal that is used for fixing wafer;
Point crystal-bonding adhesive: be coated with crystal-bonding adhesive in the cavity volume of the silicagel pad on being installed on pedestal;
Gu it is brilliant: as in the silicagel pad cavity volume inside that scribbles crystal-bonding adhesive, to make gap length between the medial margin of the lateral border of wafer and silicagel pad equal gap length between the end face of the end face of wafer and silicagel pad the wafer fixed placement;
Gu brilliant curing: the wafer that will consolidate behind the crystalline substance toasts, and the oven dry crystal-bonding adhesive is fixed on the pedestal in the silicagel pad wafer;
Bonding wire: the two ends of conductive lead are welded in respectively on the lug of wafer and on the conductive pedestal;
Fluorescent material coating: be coated with fluorescent material around the wafer behind bonding wire, make fluorescent material be filled in the lateral border of wafer and the gap between the silicagel pad and in the gap between the end face of the end face of wafer and silicagel pad;
Fluorescent powder curing: the wafer that will be coated with fluorescent material send to put in the baking oven dries, and makes fluorescent powder curing in wafer surface, makes the silicagel pad fusing simultaneously;
Encapsulated moulding: again with the wafer package behind the curing molding in the housing of plastic rubber shaping.
The present invention also provides the process of another kind of LED fluorescent material coating, may further comprise the steps:
The moulding silicagel pad: with the liquid-state silicon gel injection moulding in silica gel mould inside, then, the liquid-state silicon gel that is placed in silica gel mould inside is toasted, make its curing molding go out to have the silicagel pad of cavity volume, the shape that is arranged at the cavity volume in the silicagel pad is similar to the shape of wafer, and the volume of cavity volume is greater than the volume of wafer;
Point crystal-bonding adhesive: be coated with crystal-bonding adhesive on the pedestal of wafer being used for fixing;
Gu brilliant: with the wafer fixed placement on the pedestal of coating crystal-bonding adhesive;
Silicagel pad is installed: silicagel pad is fixedly installed on the pedestal of lateral border of the wafer behind the solid crystalline substance, makes gap length between the medial margin of the lateral border of wafer and silicagel pad equal gap length between the end face of the end face of wafer and silicagel pad;
Gu brilliant curing: the wafer that will install after the silicagel pad toasts, and dries crystal-bonding adhesive, and wafer and silicagel pad are fixed on the pedestal;
Bonding wire: the two ends of conductive lead are welded in respectively on the wafer lug behind solid brilliant the curing and on the conductive pedestal;
Fluorescent material coating: be coated with fluorescent material around the wafer behind bonding wire, make fluorescent material be filled in the gap between the medial margin of the lateral border of wafer and silicagel pad and in the gap between the end face of wafer top surface and silicagel pad;
Fluorescent powder curing: the wafer that will be coated with fluorescent material send to be put oven interior and dries, and makes fluorescent powder curing in wafer surface, makes the silicagel pad fusing simultaneously;
Encapsulated moulding: again with the wafer package behind the curing molding in the housing of plastic rubber shaping.
Compared with prior art, beneficial effect of the present invention: because of fixed installation in the above-mentioned processing method is useful on the silicagel pad that the gap length of the wafer periphery on the pedestal is fixed in control, its space thickness that can guarantee to fill fluorescent material is even, therefore, the fluorescent material of coating is smooth evenly, thereby make hot spot that the LED lamp process sends or photochromic even, saturated when illumination, the hot spot that the LED that can avoid causing because of the fluorescent material crawling sends when illumination or photochromic in blue piece or yellow piece, blue circle or yellow circle phenomenon appear.
[description of drawings]
Fig. 1 is the schematic diagram of the technological process of LED fluorescent material coating in the prior art;
Fig. 2 is the schematic diagram of shape behind the LED fluorescent powder curing in the prior art;
Fig. 3 is the schematic diagram of a kind of technological process of LED fluorescent material coating among the present invention;
Fig. 4 for LED fluorescent powder curing among the present invention after the schematic top plan view of shape;
Fig. 5 for LED fluorescent powder curing among the present invention after the schematic cross-section of shape;
Fig. 6 is the schematic diagram of moulding silicagel pad among the present invention;
Fig. 7 is the schematic diagram of the technological process of another kind of LED fluorescent material coating among the present invention.
[embodiment]
See also Fig. 3 to shown in Figure 6, the present invention illustrates a kind of process of LED fluorescent material coating in conjunction with the embodiments, and it may further comprise the steps:
First step, the moulding silicagel pad: in silica gel mould inside, then, the liquid-state silicon gel that is opposite to silica gel mould inside toasts with the liquid-state silicon gel injection moulding, and making its curing molding is silicagel pad 6.Offer cavity volume 61 in the inside of this silicagel pad 6, the shape of this cavity volume 61 is similar to the shape of wafer 7, and the volume of cavity volume 61 is greater than the volume of wafer 7.
Second step is installed silicagel pad: above-mentioned silicagel pad 6 is fixedly installed on the conductive pedestal 8.
Third step, the some crystal-bonding adhesive: coating crystal-bonding adhesive 9 in the cavity volume 61 of the silicagel pad 6 on being installed on pedestal 8, the area of the bottom surface of its spreading area and wafer 7 is identical substantially, and this crystal-bonding adhesive 9 can be solder(ing) paste or emulsus mucus.
The 4th step, Gu it is brilliant: as in silicagel pad 6 cavity volumes 61 inside that scribble crystal-bonding adhesive 9, to make the gap A that forms between the medial margin of the lateral border of wafer 7 and silicagel pad 6 equal the height gap B that forms between the end face of the end face of wafer 7 and silicagel pad 6 wafer 7 fixed placement.
The 5th step, Gu brilliant curing: the wafer 7 after will above-mentioned solid crystalline substance toasts, and the crystal-bonding adhesive 9 between wafer 7 and the pedestal 8 is dried, promptly wafer 7 is fixed on the interior pedestal 8 of silicagel pad 6 cavity volumes 61.
The 6th step, bonding wire: the two ends of conductive lead 12 are welded in respectively on the lug of wafer 7 and on the conductive pedestal 8.This bonding wire mainly adopts the welding of ultrasonic wave bonding wire machine.
The 7th step, fluorescent material coating: the fluorescent material 13 that is coated with one deck yellow around the wafer 7 behind bonding wire, make fluorescent material 13 be filled in the gap between the medial margin of the lateral border of wafer 7 and silicagel pad 6 and in the gap between the end face of the end face of wafer 7 and silicagel pad 6, thereby make the fluorescent material 13 of coating wafer 7 surfaces smooth even, its consistency of thickness.
The 8th step, fluorescent powder curing: the wafer 7 that will be coated with fluorescent material 13 send to put in the baking oven dries, thereby makes fluorescent material 13 smooth uniform curing in wafer 7 surfaces, make simultaneously silicagel pad 6 fusing.
The 9th step, encapsulated moulding: again the wafer behind the curing molding 7 is packaged in the housing of plastic rubber shaping, thereby forms the LED lamp.
In sum, because of the silicagel pad 6 that is fixedly installed in wafer 7 peripheries in the above-mentioned processing method can guarantee that the fluorescent material of being filled is smooth evenly, therefore, can make hot spot that the LED lamp that processes sends or photochromic even, saturated when illumination, the hot spot that the LED lamp that can avoid causing because of the fluorescent material crawling sends when illumination or photochromic in the phenomenon of blue piece or yellow piece, blue circle or yellow circle appears.
See also shown in Figure 7, the process of another kind of LED fluorescent material coating among the present invention, the flow process of its process and the difference of the foregoing description are: the processing step that silicagel pad is installed can be positioned between the processing step and the solid brilliant processing step that solidifies of solid crystalline substance.The processing step of the installation silicagel pad that it is concrete is: the silicagel pad of moulding is installed on the pedestal of lateral border of the wafer behind the solid crystalline substance, makes the gap length that forms between the cavity volume medial margin on the lateral border of wafer and the silicagel pad equal the height gap size that forms between the end face of the end face of wafer and silicagel pad.Its solid brilliant processing step that solidifies is: already installed silicagel pad and wafer are toasted simultaneously, after crystal-bonding adhesive is dried, thereby wafer and silicagel pad all are fixed on the pedestal.
Adopt above-mentioned process, in the peripheral silicagel pad of installing of wafer, it can guarantee that equally the fluorescent material of being filled is smooth evenly after solid brilliant step, therefore, can make hot spot that the LED lamp that processes sends or photochromic even, saturated equally when throwing light on.
Claims (6)
1. the process of LED fluorescent material coating may further comprise the steps:
The moulding silicagel pad: with the liquid-state silicon gel injection moulding in silica gel mould inside, then, the liquid-state silicon gel that is opposite to silica gel mould inside toasts, make its curing molding go out to have the silicagel pad of cavity volume, the shape that is arranged at the cavity volume in the silicagel pad is similar to the shape of wafer, and the volume of cavity volume is greater than the volume of wafer;
Silicagel pad is installed: silicagel pad is fixedly installed on the conductive pedestal that is used for fixing wafer;
Point crystal-bonding adhesive: be coated with crystal-bonding adhesive in the cavity volume of the silicagel pad on being installed on pedestal;
Gu it is brilliant: as in the silicagel pad cavity volume inside that scribbles crystal-bonding adhesive, to make gap length between the medial margin of the lateral border of wafer and silicagel pad equal height gap size between the end face of the end face of wafer and silicagel pad the wafer fixed placement;
Gu brilliant curing: the wafer that will consolidate behind the crystalline substance toasts, and the oven dry crystal-bonding adhesive is fixed on the pedestal in the silicagel pad wafer;
Bonding wire: the two ends of conductive lead are welded in respectively on the lug of wafer and on the conductive pedestal;
Fluorescent material coating: be coated with fluorescent material around the wafer behind bonding wire, make fluorescent material be filled in the lateral border of wafer and the gap between the silicagel pad and in the gap between the end face of the end face of wafer and silicagel pad;
Fluorescent powder curing: the wafer that will be coated with fluorescent material send to put in the baking oven dries, and makes fluorescent powder curing in wafer surface, makes the silicagel pad fusing simultaneously;
Encapsulated moulding: again with the wafer package behind the curing molding in the housing of plastic rubber shaping.
2. the process of LED fluorescent material according to claim 1 coating is characterized in that: the crystal-bonding adhesive in described some crystal-bonding adhesive step is solder(ing) paste or emulsus mucus.
3. the process of LED fluorescent material coating according to claim 1 is characterized in that: adopt the welding of ultrasonic wave bonding wire machine in the described bonding wire step.
4. the process of LED fluorescent material coating may further comprise the steps:
The moulding silicagel pad: with the liquid-state silicon gel injection moulding in silica gel mould inside, then, the liquid-state silicon gel that is placed in silica gel mould inside is toasted, make its curing molding go out to have the silicagel pad of cavity volume, the shape that is arranged at the cavity volume in the silicagel pad is similar to the shape of wafer, and the volume of cavity volume is greater than the volume of wafer;
Point crystal-bonding adhesive: be coated with crystal-bonding adhesive on the pedestal of wafer being used for fixing;
Gu brilliant: with the wafer fixed placement on the pedestal of coating crystal-bonding adhesive;
Silicagel pad is installed: silicagel pad is fixedly installed on the pedestal of lateral border of the wafer behind the solid crystalline substance, makes gap length between the medial margin of the lateral border of wafer and silicagel pad equal height gap size between the end face of the end face of wafer and silicagel pad;
Gu brilliant curing: the wafer that will install after the silicagel pad toasts, and dries crystal-bonding adhesive, and wafer and silicagel pad are fixed on the pedestal;
Bonding wire: the two ends of conductive lead are welded in respectively on the wafer lug behind solid brilliant the curing and on the conductive pedestal;
Fluorescent material coating: be coated with fluorescent material around the wafer behind bonding wire, make fluorescent material be filled in the gap between the medial margin of the lateral border of wafer and silicagel pad and in the gap between the end face of wafer top surface and silicagel pad;
Fluorescent powder curing: the wafer that will be coated with fluorescent material send to be put oven interior and dries, and makes fluorescent powder curing in wafer surface, makes the silicagel pad fusing simultaneously;
Encapsulated moulding: again with the wafer package behind the curing molding in the housing of plastic rubber shaping.
5. the process of LED fluorescent material according to claim 4 coating is characterized in that: the crystal-bonding adhesive in described some crystal-bonding adhesive step is solder(ing) paste or emulsus mucus.
6. the process of LED fluorescent material coating according to claim 4 is characterized in that: adopt the welding of ultrasonic wave bonding wire machine in the described bonding wire step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100630321A CN100514683C (en) | 2006-10-09 | 2006-10-09 | Technological process of LED fluorescent powder coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100630321A CN100514683C (en) | 2006-10-09 | 2006-10-09 | Technological process of LED fluorescent powder coating |
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| Publication Number | Publication Date |
|---|---|
| CN101162744A true CN101162744A (en) | 2008-04-16 |
| CN100514683C CN100514683C (en) | 2009-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100630321A Expired - Fee Related CN100514683C (en) | 2006-10-09 | 2006-10-09 | Technological process of LED fluorescent powder coating |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102062367A (en) * | 2010-10-30 | 2011-05-18 | 象山中翔电子科技有限公司 | Led lamp panel and manufacturing method thereof |
| CN102339925A (en) * | 2010-07-22 | 2012-02-01 | 展晶科技(深圳)有限公司 | Packaging method of light-emitting elements |
| CN102437271A (en) * | 2011-12-12 | 2012-05-02 | 秦会斌 | Cache-on-board (COB) technology-based integrated light emitting diode (LED) packing method |
| US9239157B2 (en) | 2010-08-26 | 2016-01-19 | Rasit Özgüc | Light-emitting means, in particular for operation in lampholders for fluorescent lamps |
| CN110216054A (en) * | 2019-06-17 | 2019-09-10 | 安徽芯瑞达科技股份有限公司 | A kind of technique and its rubber-coated mechanism being uniformly coated on fluorescent solutions on PCB |
-
2006
- 2006-10-09 CN CNB2006100630321A patent/CN100514683C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339925A (en) * | 2010-07-22 | 2012-02-01 | 展晶科技(深圳)有限公司 | Packaging method of light-emitting elements |
| CN102339925B (en) * | 2010-07-22 | 2015-11-18 | 赛恩倍吉科技顾问（深圳）有限公司 | Packaging method of light-emitting elements |
| US9239157B2 (en) | 2010-08-26 | 2016-01-19 | Rasit Özgüc | Light-emitting means, in particular for operation in lampholders for fluorescent lamps |
| CN102062367A (en) * | 2010-10-30 | 2011-05-18 | 象山中翔电子科技有限公司 | Led lamp panel and manufacturing method thereof |
| CN102437271A (en) * | 2011-12-12 | 2012-05-02 | 秦会斌 | Cache-on-board (COB) technology-based integrated light emitting diode (LED) packing method |
| CN110216054A (en) * | 2019-06-17 | 2019-09-10 | 安徽芯瑞达科技股份有限公司 | A kind of technique and its rubber-coated mechanism being uniformly coated on fluorescent solutions on PCB |
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| Publication number | Publication date |
|---|---|
| CN100514683C (en) | 2009-07-15 |
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