CN101137277B - 散热装置组合及其所使用的扣具 - Google Patents

散热装置组合及其所使用的扣具 Download PDF

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CN101137277B
CN101137277B CN200610062435.4A CN200610062435A CN101137277B CN 101137277 B CN101137277 B CN 101137277B CN 200610062435 A CN200610062435 A CN 200610062435A CN 101137277 B CN101137277 B CN 101137277B
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CN101137277A (zh
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胡哲诚
杨志豪
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种散热装置组合及其所使用的扣具,该散热装置组合包括散热器及若干扣具,该散热器包括基座,所述扣具包括头部、弹性体及杆体,该头部向下设有扣臂,扣臂的末端形成扣钩,该杆体上设有挡块及挡止部,挡块位于杆体的顶端,该扣臂通过扣钩与挡块扣合,使得该头部及该杆体结合形成一个整体且该弹性体设于该头部与该挡止部之间,该基座上对应这些扣具设有穿孔,该穿孔的边缘对应该杆体的挡止部设置有缺口,这些扣具的杆体及挡止部分别沿这些穿孔及缺口穿过该基座后转动一定角度将挡止部抵接至这些穿孔的边缘上,该弹性体被限制于该头部及该基座之间。本发明散热装置组合具有操作简便的优点。

Description

散热装置组合及其所使用的扣具
技术领域
本发明涉及一种散热装置组合,特别是一种适用于发热电子元件的散热装置组合及其所使用的扣具。
背景技术
当前,随着计算机产业的迅速发展,微处理芯片等发热电子元件产生的热量愈来愈多,为将该多余的热量有效散发,现有的方法是在发热电子元件的表面贴设一散热器,并利用扣具对该散热器进行固定,将发热电子元件产生的热量强制散去。例如,中国专利第200320123778.9号公开一种散热装置的固定结构,该散热装置包括一导热板及若干扣具,每一扣具包括一螺栓、一弹簧及一扣环,该弹簧套设于该螺栓上,该导热板上设有若干穿孔,该螺栓的下端穿过这些穿孔并压缩该弹簧,同时,将该扣环固定在该螺栓的下端限制该弹簧回弹,从而将该扣具固定至该导热板上。
然而,该扣环呈一薄片状,拆装不易,而且容易受力变形从该螺栓上脱落,对其他元件如电路板等造成短路或损坏。
发明内容
有鉴于此,有必要提供一种便于操作的散热装置组合及其所使用的扣具。
该散热装置组合包括散热器及若干扣具,该散热器包括基座,所述扣具包括头部、弹性体及杆体,该头部向下设有扣臂,扣臂的末端形成扣钩,该杆体上设有挡块及挡止部,挡块位于杆体的顶端,该扣臂通过扣钩与挡块扣合,使得该头部及该杆体结合形成一个整体且该弹性体设于该头部与该挡止部之间,该基座上对应这些扣具设有穿孔,该穿孔的边缘对应该杆体的挡止部设置有缺口,这些扣具的杆体及挡止部分别沿这些穿孔及缺口穿过该基座后转动一定角度将挡止部抵接至这些穿孔的边缘上,该弹性体被限制于该头部及该基座之间。
该扣具包括头部、杆体及弹性体,该头部设置在该杆体的顶端,该头部向下设有扣臂,扣臂的末端形成扣钩,该杆体的顶端设有挡块,该扣臂通过扣钩与挡块扣合,使得该头部及该杆体结合形成一个整体,该杆体的底端向外与杆体一体形成至少两挡止部,该杆体的底端向下延伸形成固定结构,该弹性体为弹簧,套设在该杆体上并被限制于该头部与所述挡止部之间。
与现有技术相比,通过该挡止部及该缺口的设置,使该扣具可方便且稳固地组装至该散热器上,不易脱落,从而具有操作简便的优点。
附图说明
下面参照附图结合实施例作进一步的描述:
图1为本发明散热装置组合其中一实施例的立体分解图。
图2为图1所示散热装置组合中扣具的立体分解图。
图3为图1所示散热装置组合中扣具的组装侧视图。
图4为图1所示散热装置组合除去扣具的上视图。
图5为图1所示散热装置组合中扣具预组装过程中的立体图。
图6为图1所示散热装置组合中扣具预组装后的立体图。
图7为图6所示散热装置组合的A部放大图。
图8为图1所示散热装置组合的立体组装图。
图9为本发明散热装置组合另一实施例中扣具的立体分解图。
图10为图9所示扣具的组装侧视图。
具体实施方式
图1所示为本发明散热装置组合第一实施例的立体分解图,该散热装置组合100包括若干扣具10、一散热器20、一风扇30及一热管40。
该散热器20包括一基座22及若干散热片24,该风扇30位于基座22的一侧,该风扇30为一离心式风扇,这些散热片24设在该风扇30的出风口处。该基座22由金属材料如铜、铝、铝合金等制成,该基座22与一发热电子元件(图未示)热连接。该基座22的四角上设有若干套筒222,供这些扣具10穿设。每一扣具10包括一头部12、一弹性体14及一杆体16。
该热管40连接该基座22及这些散热片24,将该基座22上的热量传递至这些散热片24上。该风扇30用于对这些散热片24进行强制散热。
请参照图2,该扣具10的头部12向下延伸设有相对的两扣臂122,每一扣臂122的末端向内弯折设有一扣钩123,且每一扣臂122的内侧有一部分材料被去掉以形成第一斜面122a。该弹性体14为一弹簧。该杆体16包括一圆柱形本体162,该本体162的底端向下延伸形成一固定结构,在本实施例中,该固定结构为一螺柱164,该本体162的直径大于该螺柱164的直径。该本体162顶端两侧对应该头部12的两扣臂122分别设有一容置槽162a,每一容置槽162a的底部向外凸伸设有一挡块162b,每一挡块162b的外表面形成与上述第一斜面122a相匹配形状的第二斜面162c,这些第二斜面162c可导引该头部12的扣臂122滑入,以使该头部12的两扣臂122可通过扣钩123分别与该两挡块162b相扣合,使得该头部12及该杆体16结合形成一个整体。该螺柱164上设有螺纹,以便同电路板(图未示)等元件锁合。该本体162的相对两侧于靠近该螺柱164处分别向外凸伸设有一挡止部166。
请参照图2及图3,组装该扣具10时,先将该弹性体14沿杆体16的顶端向下套设于该杆体16的本体162上,接着将该头部12与该杆体16扣合形成一个整体。该弹性体14的上端可抵压在该头部12上,该杆体16的挡止部166形成的最大宽度大于该弹性体14的内径,使得该弹性体14被限制在该头部12及该挡止部166之间,不易脱落(如图3所示)。
请参照图4,每一套筒222包括一底部222a,该底部222a上设有一穿孔222b,该穿孔222b的大小基本与杆体16的本体162的外径相当,该穿孔222b的边缘还设有相对的两缺口222c,该两缺口222c的设置与该杆体16的挡止部166对应,使得该挡止部166在对准时恰好可以穿过这些缺口222c,而当该挡止部166与这些缺口222c偏离一定角度时即被该穿孔222b的边缘挡止。
请参照图5至图8,预组装这些扣具10至该基座22上时,将这些组装有弹性体14的扣具10放置于这些套筒222内,按压该扣具10的头部12,使该杆体16的螺柱164及挡止部166沿这些缺口222c穿过该套筒222的底部222a的穿孔222b(如图5所示),接着,旋转该扣具10,使杆体16的挡止部166抵接在穿孔222b的边缘(如图6及图7所示),取消按压,该扣具10的头部12及该套筒222的底部222a将该弹性体14压缩,从而将这些扣具10预组装至该散热器20的基座22上(如图8所示)。通过将螺柱164锁合在电路板上,即可将该散热装置组合100固定至发热电子元件上进行散热。
请参照图9,其所示为本发明另一实施例中扣具10a的立体分解图。该扣具10a与第一实施例的区别在于,该头部12a与该杆体16a为一体成型,这些挡止部166a形成的最大宽度小于或等于该弹性体14的内径,使得该弹性体14可从该杆体16a的底端套设至该杆体16a的本体162a上,并可与该头部12a抵顶。请参照图10,为防止该弹性体14从该杆体16a上脱落,位于该杆体16a左侧的挡止部166a向外凸伸的长度大于位于该杆体16a右侧的挡止部166a向外凸伸的长度,使得该弹性体14被位于该杆体16a左侧的挡止部166a挡止,不易脱落。通过该两挡止部166a同样可将该扣具10a预组装至上述散热器20的基座22上。
由以上叙述可知,通过该杆体16或16a的挡止部166或166a及该套筒222的穿孔222b及缺口222c的设置,使得该扣具10或10a可以方便地组装至该散热器20上。由于该挡止部166或166a与该杆体16或16a一体成型,故该扣具10或10a与该散热器20的基座22结合牢固,不易脱落。
可以理解地,上述螺柱164亦可用其他固定结构如卡扣、倒钩或具有互锁功能的结构替代。

Claims (8)

1.一种散热装置组合,包括散热器及若干扣具,该散热器包括基座,所述扣具包括头部、弹性体及杆体,其特征在于,该头部向下设有扣臂,扣臂的末端形成扣钩,该杆体上设有挡块及挡止部,挡块位于杆体的顶端,该扣臂通过扣钩与挡块扣合,使得该头部及该杆体结合形成一个整体且该弹性体设于该头部与该挡止部之间,该基座上对应所述扣具设有穿孔,该穿孔的边缘对应该杆体的挡止部设置有缺口,所述扣具的杆体及挡止部分别沿所述穿孔及缺口穿过该基座后转动一定角度将所述挡止部抵接至所述穿孔的边缘上,该弹性体被限制于该头部及该基座之间。
2.根据权利要求1所述的散热装置组合,其特征在于,该基座上设有若干套筒,所述套筒包括底部,所述穿孔分别设置在所述套筒的底部上。
3.根据权利要求1所述的散热装置组合,其特征在于,该杆体的顶端对应该头部的扣臂设有容置槽,所述挡块设置在所述容置槽内。
4.根据权利要求1所述的散热装置组合,其特征在于,该弹性体为弹簧且套设在该杆体上,所述挡止部形成的最大宽度大于该弹簧内径。
5.根据权利要求1所述的散热装置组合,其特征在于,所述挡止部的数量为两个,分别自该杆体的相对两侧向外凸伸设置。
6.根据权利要求1所述的散热装置组合,其特征在于,还包括风扇及热管,该风扇设置在该基座的一侧,该风扇为离心风扇,该风扇的出风口处设置若干散热片,该热管连接于该基座与所述散热片之间。
7.一种扣具,包括头部、杆体及弹性体,其特征在于,该头部设置在该杆体的顶端,该头部向下设有扣臂,扣臂的末端形成扣钩,该杆体的顶端设有挡块,该扣臂通过扣钩与挡块扣合,使得该头部及该杆体结合形成一个整体,该杆体的底端向外与杆体一体形成至少两个挡止部,该杆体的底端向下延伸形成固定结构,该弹性体为弹簧,套设在该杆体上并被限制于该头部与所述挡止部之间。
8.根据权利要求7所述的扣具,其特征在于,所述挡止部形成的最大宽度大于该弹簧的内径,该弹簧从该杆体的顶端套置于该杆体的外周。
CN200610062435.4A 2006-09-01 2006-09-01 散热装置组合及其所使用的扣具 Expired - Fee Related CN101137277B (zh)

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* Cited by examiner, † Cited by third party
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CN103019331B (zh) * 2011-09-26 2015-08-05 鸿富锦精密工业(武汉)有限公司 支撑装置
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TWI537478B (zh) * 2013-10-09 2016-06-11 仁寶電腦工業股份有限公司 風扇模組
US9560792B2 (en) * 2015-01-30 2017-01-31 Netgear, Inc. Apparatus and method for heat sink assembly
CN108093598A (zh) * 2016-11-21 2018-05-29 英业达科技有限公司 散热装置及其导热组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771153A (en) * 1997-05-16 1998-06-23 Sheng; Lin Chun CPU heat dissipating apparatus
CN2682580Y (zh) * 2003-12-11 2005-03-02 东莞莫仕连接器有限公司 散热装置的固定结构
CN2727956Y (zh) * 2004-07-06 2005-09-21 鸿富锦精密工业(深圳)有限公司 散热器扣合装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2729045B1 (fr) * 1994-12-29 1997-01-24 Bull Sa Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes
US5730210A (en) * 1997-02-24 1998-03-24 Silicon Integrated Systems Corporation Heat sink having an assembling device
US5947191A (en) * 1997-05-07 1999-09-07 International Business Machines Electronics module heat sink with quick mounting pins
TW460109U (en) * 2000-03-15 2001-10-11 Foxconn Prec Components Co Ltd Cooling device
TW585387U (en) * 2000-04-20 2004-04-21 Foxconn Prec Components Co Ltd Heat sink locking device
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
US6498724B1 (en) * 2001-07-27 2002-12-24 Sen Long Chien Heat dissipation device for a computer
US6392889B1 (en) * 2001-08-21 2002-05-21 Foxconn Precision Components Co., Ltd. Fastener for heat sink
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
TW582581U (en) * 2002-04-15 2004-04-01 Tsun I Entpr Co Ltd Fastening structure of heat sink
TW545883U (en) * 2002-11-20 2003-08-01 Sunonwealth Electr Mach Ind Co Heat dissipating device
US6697256B1 (en) * 2003-02-06 2004-02-24 Sunonwealth Electric Machine Industry Co., Ltd. Fastening device for attaching a heat sink to heat producer
US6795317B1 (en) * 2003-07-15 2004-09-21 A-Sheng Liu Fastening device
TWM248206U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Clip for heat sink
CN2672712Y (zh) * 2003-11-21 2005-01-19 鸿富锦精密工业(深圳)有限公司 固定装置
CN2681329Y (zh) * 2003-12-19 2005-02-23 鸿富锦精密工业(深圳)有限公司 散热器固定装置
TWM244712U (en) * 2003-12-26 2004-09-21 Hon Hai Prec Ind Co Ltd Heat sink fastener
CN2699473Y (zh) * 2004-03-10 2005-05-11 鸿富锦精密工业(深圳)有限公司 散热器扣合装置
US7359200B2 (en) * 2005-08-26 2008-04-15 Illinois Tool Works Inc. Fastener with snap-on feature, heat dissipation assembly for central processing unit and method of using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771153A (en) * 1997-05-16 1998-06-23 Sheng; Lin Chun CPU heat dissipating apparatus
CN2682580Y (zh) * 2003-12-11 2005-03-02 东莞莫仕连接器有限公司 散热装置的固定结构
CN2727956Y (zh) * 2004-07-06 2005-09-21 鸿富锦精密工业(深圳)有限公司 散热器扣合装置

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