CN102065668A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN102065668A
CN102065668A CN2009103098528A CN200910309852A CN102065668A CN 102065668 A CN102065668 A CN 102065668A CN 2009103098528 A CN2009103098528 A CN 2009103098528A CN 200910309852 A CN200910309852 A CN 200910309852A CN 102065668 A CN102065668 A CN 102065668A
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spring
hole
base
aperture
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CN102065668B (zh
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邱鸿年
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200910309852.8A priority Critical patent/CN102065668B/zh
Priority to US12/637,758 priority patent/US20110114295A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/08—Fastening; Joining by clamping or clipping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，包括一底座及至少一弹簧扣件，该底座上设有供该弹簧扣件穿过的阶梯孔，该孔壁沿轴向形成一开口，该开口将该孔壁分割成相互间隔的两个弹臂，该杆体部的外围形成一环形突起，该杆体部的环形突起挤压该阶梯孔的小孔使该孔壁的两个弹臂外扩弹性变形，该环形突起穿过该阶梯孔的小孔后抵靠在该阶梯孔的台阶的底部，同时该孔壁的两个弹臂恢复弹性形变使该弹簧卡挚于该弹簧扣件的头部与该阶梯孔的台阶之间。与现有技术相比，本发明通过底座上的弹臂与环形突起形成的卡扣结构代替扣环，减少了扣环组装和材料成本，消除了扣环脱落引起电路板短路的风险。

Description

散热装置
技术领域
本发明涉及一种散热装置，尤指一种用于发热电子元件的散热装置。
背景技术
当前，随着计算机产业的迅速发展，微处理芯片等发热电子元件产生的热量愈来愈多。为将该多余的热量有效散发，现有的方法是在发热电子元件的表面贴设一散热器，将发热电子元件产生的热量散发，并利用弹簧螺丝将该散热器固定在电路板上。散热器上设有若干通孔，弹簧螺丝的螺纹通过该通孔，并与电路板上的螺纹孔形成螺纹连接。为了便于运输，往往通过扣环将弹簧螺丝与散热器预先组装在一起，使之在运输过程中不脱离散热器。当将散热器安装到电路板上后，该扣环没有任何功用。扣环可以是0型环或者E型环。
由于散热器安装完成后，扣环不能起到任何功效，增加了材料成本和制造成本，而且可能因为装配不当造成扣环的扣合不紧密，尤其当扣环是金属材质时，其脱落后会造成电路板短路的危险。
发明内容
鉴于此，有必要提供一种可方便实现预组装且成本低廉的散热装置。
一种散热装置，包括一底座及至少一弹簧扣件，该弹簧扣件包括头部及杆体部，杆体部上套设有一弹簧，该底座上设有供该弹簧扣件穿过的阶梯孔，该阶梯孔包括一大孔与一小孔，该大孔和小孔之间形成一台阶，该底座于该阶梯孔的外围形成环抱该阶梯孔的孔壁，该孔壁沿轴向形成一开口，该开口将该孔壁分割成相互间隔的两个弹臂，该杆体部的外围形成一环形突起，该杆体部的环形突起挤压该阶梯孔的小孔使该孔壁的两个弹臂外扩弹性变形，该环形突起穿过该阶梯孔的小孔后抵靠在该阶梯孔的台阶的底部，同时该孔壁的两个弹臂恢复弹性形变使该弹簧卡挚于该弹簧扣件的头部与该阶梯孔的台阶之间。
与现有技术相比，本发明通过底座上的弹臂与环形突起形成的卡扣结构代替扣环，减少了扣环组装和材料成本，消除了扣环脱落引起电路板短路的风险。
附图说明
图1为本发明的一较佳实施例中散热装置与电路板的爆炸示意图。
图2为图1中散热装置的立体组装图。
图3为图2中沿III-III的部分剖视图。
具体实施方式
下面参照附图，进一步说明该散热装置1。如图1所示，该散热装置1包括底座10、若干弹簧扣件11、热管12及散热片组13。热管12的一端铺设于底座10的上表面，另一端贯穿于散热片组13。电路板2上的发热电子元件3贴附于底座10的下表面。底座10吸收发热电子元件3所发出的热量，热管12将热量从底座10传递到散热片组13从而散发到空气中。
请一并参阅图2图3，本实施例中该弹簧扣件11为一弹簧螺丝，该弹簧扣件11包括头部110、杆体部111及弹簧116，杆体部111的底端设置有螺纹112。弹簧扣件11的螺纹112与电路板2上的螺纹孔20构成螺纹连接。在靠近杆体部111的底端的外表面上突出形成有一环形突起113，环形突起113的底端形成导引环形突起113向下运动的斜面114。头部110与环形突起113之间于杆体部111的外表面形成一凹槽115，弹簧116套在该凹槽115中。安装弹簧扣件11时，由于弹簧116的弹性形变，可以使得底座10和发热电子元件3之间具有一定压力，使得两者贴合更加紧密，散热效果更好。弹簧扣件11的类型较多，在此不一一赘述，凡是带有弹簧116的扣件都在本发明的范围内。
该底座10是一长方体结构，其四角处分别设有一套筒101，每一套筒101内开设一阶梯孔102，包括位于顶端的大孔103和位于底端的小孔104，大孔103和小孔104之间形成一台阶105，弹簧116的直径小于该大孔103直径，弹簧116的直径大于该小孔104的直径，杆体部111的环形突起113的直径略大于该小孔104的直径。套筒101于阶梯孔102的外围形成环抱该阶梯孔102的孔壁106，该孔壁106沿轴向形成一开口107，该开口107将该孔壁106分割成相互间隔的两个弹臂108，即该底座10于每一四角处设有两个相对的弹臂108，该两个弹臂108相互间隔且可弹性变形，该两个弹臂108合抱形成阶梯孔102。
将弹簧扣件11预组装到底座10时，将弹簧扣件11置入套筒101的阶梯孔102中且螺纹112穿过小孔104，然而台阶105阻挡环形突起113。按压弹簧扣件11的头部110，环形突起113的斜面114向外撑开两个弹臂108，使得小孔104的孔径增大，在斜面114的导引下，环形突起113伸入小孔104内，使两个弹臂108外扩弹性变形。环形突起113通过小孔104后该环形突起113抵靠在该阶梯孔102的台阶105的底部，同时两个弹臂108恢复原形，小孔104的孔径恢复，从而环形突起113被阻挡在套筒101的台阶105底部，弹簧116被卡挚于该弹簧扣件11的头部110与该阶梯孔102的台阶105之间，阶梯孔102的台阶105位于该弹簧116与该环形突起113之间，弹簧扣件11被固定于底座10上。

Claims (6)

1.一种散热装置，包括一底座及至少一弹簧扣件，该弹簧扣件包括头部及杆体部，杆体部上套设有一弹簧，该底座上设有供该弹簧扣件穿过的阶梯孔，该阶梯孔包括一大孔与一小孔，该大孔和小孔之间形成一台阶，该底座于该阶梯孔的外围形成环抱该阶梯孔的孔壁，其特征在于，该孔壁沿轴向形成一开口，该开口将该孔壁分割成相互间隔的两个弹臂，该杆体部的外围形成一环形突起，该杆体部的环形突起挤压该阶梯孔的小孔使该孔壁的两个弹臂外扩弹性变形，该环形突起穿过该阶梯孔的小孔后抵靠在该阶梯孔的台阶的底部，同时该孔壁的两个弹臂恢复弹性形变使该弹簧卡挚于该弹簧扣件的头部与该阶梯孔的台阶之间。
2.根据权利要求1所述的散热装置，其特征在于，该弹簧扣件为一弹簧螺丝，该弹簧扣件的底端设置有螺纹。
3.根据权利要求1所述的散热装置，其特征在于，该弹簧的外径大于该小孔的直径，该环形突起的直径大于该小孔的直径。
4.根据权利要求1所述的散热装置，其特征在于，该环形突起的底部形成一用于导引该环形突起向下伸入该小孔中的斜面。
5.根据权利要求1所述的散热装置，其特征在于，该底座上设有一套筒，该阶梯孔设置在该套筒内。
6.根据权利要求1所述的散热装置，其特征在于，该散热装置还包括一热管及一散热片组，该热管的一端与底座连接，该热管的另一端与散热片组连接。
CN200910309852.8A 2009-11-17 2009-11-17 散热装置 Expired - Fee Related CN102065668B (zh)

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CN200910309852.8A CN102065668B (zh) 2009-11-17 2009-11-17 散热装置
US12/637,758 US20110114295A1 (en) 2009-11-17 2009-12-15 Heat dissipation module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304750A (zh) * 2015-05-15 2017-01-04 富瑞精密组件（昆山）有限公司 散热器及其制造方法

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US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
TWI425907B (zh) * 2010-09-21 2014-02-01 Delta Electronics Inc 電子元件和散熱裝置之組合結構及其絕緣元件
CN103019331B (zh) * 2011-09-26 2015-08-05 鸿富锦精密工业(武汉)有限公司 支撑装置
US8976528B2 (en) * 2012-06-08 2015-03-10 Apple Inc. Fasteners and dual-thickness thermal stages in electronic devices
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point

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US2119520A (en) * 1936-07-20 1938-06-07 Harry G Brokering Bolt or pin and retaining member
FR2188714A5 (zh) * 1972-06-08 1974-01-18 Gkn Screws Fasteners Ltd
US7609522B2 (en) * 2006-12-01 2009-10-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
CN101522010B (zh) * 2008-02-29 2012-09-19 富准精密工业(深圳)有限公司 散热装置及其制造方法
CN101583257B (zh) * 2008-05-16 2012-09-19 富准精密工业(深圳)有限公司 固定装置组合
CN101588697B (zh) * 2008-05-23 2012-05-23 富准精密工业(深圳)有限公司 固定装置组合
CN101594765B (zh) * 2008-05-28 2013-03-20 富准精密工业(深圳)有限公司 散热装置及其固定结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304750A (zh) * 2015-05-15 2017-01-04 富瑞精密组件（昆山）有限公司 散热器及其制造方法

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