CN101102661A - Micro modular pasting header for high speed fully automatic chip machine - Google Patents

Micro modular pasting header for high speed fully automatic chip machine Download PDF

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Publication number
CN101102661A
CN101102661A CNA2006100895765A CN200610089576A CN101102661A CN 101102661 A CN101102661 A CN 101102661A CN A2006100895765 A CNA2006100895765 A CN A2006100895765A CN 200610089576 A CN200610089576 A CN 200610089576A CN 101102661 A CN101102661 A CN 101102661A
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China
Prior art keywords
vacuum
module
mounts
frame
miniature
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CNA2006100895765A
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Chinese (zh)
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CN100446652C (en
Inventor
刘强
吴文镜
郑妍
袁松梅
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Beihang University
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Beihang University
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Abstract

The invention comprises a securing frame, a chip placement head and chip placement module and a vacuum module. Said securing frame is a dustpan-like frame composed of a main frame and a slave frame; the chip placement module is a cuboid; the vacuum module is located above the securing frame; based on the securing frame, the chip placement module and vacuum module are secured on the securing frame; during operation, in each moment only one surface-mounted component acts; each surface-mounted component acts sequentially; the vacuum system fits the hollow axle action to control the vacuum source to generate or destroy the press control in order to absorbing or place the chip by the hollow axle.

Description

Micro modular pasting header for high speed fully automatic chip machine
(1) technical field
The present invention relates to the chip mounter field of SMT (Surface Mount Technology, surface mounting technology), be specifically related to the chip mounter that a kind of electron surface mounts and the technical field of mounting head assembly thereof.
(2) background technology
Surface mounting technology (SMT) originates from the end of the fifties, the thick film hybrid integrated circuit that occurs along with the invention of semiconductor integrated circuit.Because the ceramic substrate quality is hard, be not easy to punching and carry out the components and parts plug-in mounting, begin to adopt chip components and parts, so sheet capacitor, plate resistor have occurred, active components and parts then adopt nude film to assemble with forms such as wire bond or flip-chips.After entering the seventies, the application of hybrid integrated circuit begins to be expanded to industry and civil area by military domain, and production scale enlarges rapidly.The beginning of the eighties at the end of the seventies, traditional printed circuit board is pegged graft by original through hole and is assembled, use for reference the technology of hybrid circuit, progressively change into based on mounted on surface, this package thickness is thin, volume is little, reliability is high and the characteristics of being convenient to automated production make it progressively become the dominant technology of electronics assembling.Along with electronic product develops rapidly to portable, miniaturization, networking and multimedia direction, SMT is just obtaining application more and more widely in electronics industry, and has partly or entirely replaced conditional electronic dress connection technology in a lot of fields.
Chip mounter is the equipment of most critical in the SMT production line, and it has often accounted for the over half of whole production line investment.Chip mounter is broadly divided into four types at present: movable arm type, combined type, rotating disc type and large-scale parallel system.Different types of chip mounter respectively has quality, depends on that usually to the requirement of system, also there are certain balance in application or technology between its speed and precision.Although chip mounter is of a great variety, integrates and to be summarised as following four parts composition briefly: mounting head system, feeding system, printed circuit board (PCB) (pcb board) transmission system and management control system.Wherein the mounting head system is the core of chip mounter, and it will finish chip pickup to the overall process that mounts exactly on the pcb board, is determining the structure and the main performance of chip mounter.
From the function aspects that mounting head will be finished, mounting head should comprise Z axis motion system, θ angle control system, vacuum system.What wherein the Z axis motion system was finished chip mounts motion up and down, and the θ angle control system is finished the biased error of chip and proofreaied and correct, and vacuum system is finished picking up and placing of chip.Correlation technique mainly can be divided into following a few class both at home and abroad at present: one, the Z axle adopts traditional drive system of gear/tooth bar, and actuator is simple, but control precision is difficult to improve; Two, the Z axle adopts servomotor/steel wire/roller, and rotatablely moving of motor is converted into moving up and down of Z axle, and this type systematic assembling is complicated, and precision is not high, if will realize the many vacuum nozzle system of single head, structure will be complicated more; Three, the Z axle adopts stepping motor and band transmission synchronously, motor rotatablely moved be converted into rectilinear motion, single suction nozzle is designed to a module, comprise two stepping motors, a responsible Z axle motion, a responsible θ angle control, there is certain precision in such system, and can be according to user's request independent assortment suction nozzle quantity, but the volume of such kind of drive single module system and quality are all very big, make up the rotator inertia that has increased mounting head behind many suction nozzles exponentially, in order to guarantee the useful life of placement accuracy and machine, correspondingly can only increase and hang this mounting head, and drive the size and the weight of the guide rail frame of its translation, finally cause the huge heaviness of machine volume, the also corresponding increase of cost.
At present, placement equipment just develops towards high speed, high accuracy, intellectuality, flexible manufacturing system (FMS), direction such as multi-functional.Because the mounting head system shortcoming separately of above-mentioned several types has limited popularizing of its development and correlation technique to a certain extent.
(3) summary of the invention
At the above-mentioned shortcoming of prior art, the present invention is a starting point with the modular design method, provides a kind of layout simple, simple for structure, and easily reorganization makes things convenient for the autonomous micromodule mounting head that customizes of user.
Technical solution of the present invention is a kind of micromodule mounting head, this mounting head comprises fixed frame, mounts module and vacuum module, it is characterized in that: described fixed frame is the dustpan-shaped framework that is made of main frame and sub-frame, and this dustpan-shaped framework has the locating surface of level and vertical direction; The described module profile that mounts is a cuboid, and the bottom surface that mounts module of this cuboid and side are locating surface, match with the locating surface of fixed frame; Described vacuum module be positioned at fixed frame directly over.
Described fixed frame comprises main frame and sub-frame, and there is baffle plate on main frame three limits, upper end open, the power supply cable picks out, and there are two row's countersunk head screwed holes the main frame back, and there is row's screwed hole the lower end, the upper end has the vacuum module that screwed hole is installed, and both sides have sub-frame that screwed hole is installed; Described sub-frame is U type structure, is fixed on the middle part of main frame; Main frame fixedly mounts with sub-frame and mounts module;
The described module that mounts is combined by one group of miniature arrangements of components that mounts of two degrees of freedom, miniaturely mounts the rectangular configuration that assembly is a flat, is the profile of a cuboid after several such combination of components; This miniature component internal that mounts is made of two miniature precision DC servomotors, one group of miniature elevating screw and predetermined gear driving member; There is a hollow shaft output the described miniature assembly lower end that mounts, and there are a vacuum input interface and a cable output interface in the upper end; Described hollow shaft output has two degrees of freedom, and one is the rectilinear motion of Z direction, and one is the rotation of θ angular direction, and its motion realizes by elevating screw transmission control and gear drive control with two miniature precision DC servomotors respectively;
Described vacuum module comprises one group of vacuum generator, one group of vacuum steam supply valve, one group of destructive valve, one group of vacuum pressure switch, and these devices and parts all are installed on the circuit board; The vacuum module is responsible for the generation of vacuum source and the absorption of chip is placed; Described circuit board has a vacuum pumping delivery outlet;
The described bolt of module by the main frame back side two row's countersunk head screwed holes that mount is fastened on the main frame, and sub-frame strides across the middle part that mounts module, further fixedly mounts module; Described vacuum module is installed in the upper end of main frame by the circuit board bolt;
Described mounting in module and the vacuum module, the miniature corresponding vacuum generator of assembly, a vacuum steam supply valve, an air admission valve and the vacuum pressure switch of mounting; Vacuum takeoff on the circuit board with mount that the vacuum access port passes through soft pipe connection on the assembly; Miniaturely mount the quantity of assembly and the quantity of vacuum device can independently define according to user's request;
Described fixed frame, mount module and the vacuum module has constituted micro modular pasting header for high speed fully automatic chip machine.With the fixed frame is core, mounts module and the vacuum module is installed on the fixed frame; Each has only one to mount the assembly action constantly during work; Respectively mounting assembly moves successively; Mount in the assembly two miniature precision DC servomotors and implement accurate Z direction Position Control and the control of θ angle corner; The generation that vacuum system cooperates the hollow shaft action to control vacuum source reaches relevant pressure with destruction and regulates, and realizes absorption and the placement of hollow shaft to chip.
The invention has the advantages that: it takes into full account modular design method, is target with user and market actual demand, has realized mechanical assembly moduleization and control moduleization; The miniature assembly that mounts of two degrees of freedom among the present invention, control algolithm that this type systematic employing is advanced and corresponding accurate electricity, machine actuating equipment form complete control loop, the control precision height, response speed is fast, mounts the speed height, the machine volume size is little, the reliability height; The system integration and system optimization are convenient in modularized design; Adopt the assembly that mounts of miniature flat to make each suction nozzle distance between axles dwindle greatly, the volume mass of mounting head machinery assembly reduces greatly, thereby the weight and volume of XY driving and complete machine is reduced greatly.
(4) description of drawings
Fig. 1 is a schematic perspective view of the present invention;
Fig. 2 is a front view of the present invention;
Fig. 3 is a left view of the present invention;
Fig. 4 is a vertical view of the present invention;
Fig. 5 is a rearview of the present invention.
Number in the figure is described as follows:
1, hollow shaft 2, main frame 3, the miniature assembly that mounts
4, framework bolt 5, sub-frame 6, vacuum pressure switch
7, circuit board 8, vacuum steam supply valve 9, circuit board bolt
10, vacuum generator 11, cable output interface 12, air admission valve
13, vacuum takeoff 14, vacuum access port 15, connection flexible pipe
16, bottom set bolt 17, side set bolt I 18, side set bolt II
(5) embodiment
Micro modular pasting header for high speed fully automatic chip machine comprises fixed frame, mounts module and vacuum module, it is characterized in that:
As shown in Figure 1, described fixed frame is the dustpan-shaped framework that is made of main frame 2 and sub-frame 5, and this dustpan-shaped base of frame has a horizontal location face and a vertical locating surface; The described module profile that mounts is a cuboid, and the bottom surface that mounts module of this cuboid and side are locating surface, match with the locating surface of fixed frame; Described vacuum module be positioned at fixed frame directly over.
As Fig. 1, Fig. 3, shown in Figure 5, described fixed frame comprises main frame 2 and sub-frame 5, there is baffle plate on main frame 2 three limits, upper end open, the power supply cable picks out, and there are two row's countersunk head screwed holes main frame 2 back, and there is row's screwed hole the lower end, the upper end has the vacuum module that screwed hole is installed, and both sides have sub-frame 5 that screwed hole is installed; Described sub-frame 5 is U type structure, is fixed on the middle part of main frame 2; Main frame 2 mounts module with sub-frame 5 fixed installations;
Shown in Figure 3 as Fig. 1, the described module that mounts is arranged in a combination by 8 miniature assemblies 3 that mount of two degrees of freedom, and the miniature assembly 3 that mounts is the rectangular parallelepiped of flat, and 8 such arrangements of components combinations are the profile of a big cuboid afterwards; The described miniature assembly 3 lower end outputs that mount have a hollow shaft 1, and there are a vacuum input interface 14 and a cable output interface 11 in the upper end; Described hollow shaft 1 output has two degrees of freedom, and one is the rectilinear motion of Z direction, and one is the rotation of θ angular direction, and its motion realizes by elevating screw transmission control and gear drive control with two miniature precision DC servomotors respectively;
As Fig. 1, shown in Figure 3, described vacuum module comprises one group of vacuum generator 10, one group of vacuum steam supply valve 8, one group of destructive valve 12, one group of vacuum pressure switch 6, and these devices and parts all are installed on the circuit board 7; The vacuum module is responsible for the generation of vacuum source and the absorption of chip is placed; Described circuit board has a vacuum pumping delivery outlet 13;
As Fig. 1, Fig. 3, shown in Figure 5, the described module that mounts is fixed on the main frame on 2 by last bottom set bolt 16 and side set bolt I 17, side set bolt II 18, sub-frame 5 strides across the middle part that mounts module, is fixed on the main frame 2 by framework bolt 4; Described vacuum module is fixedly mounted on the upper end of main frame 2 by circuit board bolt 9;
Described mounting in module and the vacuum module, miniature assembly 3 corresponding 8, one air admission valves 12 of 10, one vacuum steam supply valves of a vacuum generator and the vacuum pressure switch 6 that mount; Vacuum takeoff 13 on the circuit board 7 with mount assembly 3 on vacuum access port 14 be communicated with by being connected flexible pipe 15; Miniaturely mount the quantity of assembly 3 and the quantity of vacuum device is 8 in this embodiment;
Described fixed frame, mount module and the vacuum module has constituted micro modular pasting header for high speed fully automatic chip machine.With the fixed frame is core, mounts module and the vacuum module is installed on the fixed frame; Each has only one to mount assembly action 3 constantly during work; Other assembly moves successively; Mount in the assembly 3 two miniature precision DC servomotors and implement accurate Z direction Position Control and the control of θ angle corner; The generation that vacuum system cooperates hollow shaft 1 action to control vacuum source reaches relevant pressure with destruction and regulates, and realizes the absorption and the placement of 1 pair of chip of hollow shaft.
For setting forth conveniently, mount the position that mounts assembly in the module and be called No. 1 position, No. 2 positions successively ... No. 8 positions, as follows for 8 mounting head specific embodiment flow processs that mount assembly:
The chip pick-up flow process: 1. hollow shaft is descending;
2. the vacuum steam supply valve is opened;
3. vacuum pressure switch is opened;
4. chip pick-up;
5. hollow shaft is up.
Chip pastes the journey of releasing: 1. hollow shaft is descending;
2. air admission valve is opened;
3. chip pastes and puts;
4. hollow shaft is up.
Mounting head workflow: 1. No. 1 position chip pick-up;
2. No. 2 position-No. 8 position chip pick-ups;
3. proofread and correct at θ angle, No. 1 position;
4. No. 1 position chip pastes and puts;
5. No. 8 position, No. 2 positions-is carried out the θ angle respectively and is proofreaied and correct to paste with chip and put;
6. entering operation 2. circulates and carries out;
7. mount and finish.

Claims (1)

1, a kind of micro modular pasting header for high speed fully automatic chip machine, it is characterized in that: this mounting head comprises fixed frame, mount module and vacuum module, described fixed frame is the dustpan-shaped framework that is made of main frame and sub-frame, this dustpan-shaped framework has the locating surface of level and vertical direction, there is baffle plate on main frame three limits, upper end open, the power supply cable picks out, there are two row's countersunk head screwed holes the main frame back, and there is row's screwed hole the lower end, and the upper end has the vacuum module that screwed hole is installed, both sides have sub-frame that screwed hole is installed, sub-frame is U type structure, is fixed on the middle part of main frame, and main frame fixedly mounts with sub-frame and mounts module; The described module profile that mounts is a cuboid, its bottom surface and side are locating surface, match with the locating surface of fixed frame, this mounts module is to be combined by one group of miniature arrangements of components that mounts of two degrees of freedom, this is miniature to mount the rectangular shape that assembly is a flat, predetermined such combination of components is the profile of a cuboid afterwards, this miniature component internal that mounts is by two miniature precision DC servomotors, one group of miniature elevating screw and predetermined gear driving member constitute, there is a hollow shaft output this miniature assembly lower end that mounts, there are a vacuum input interface and a cable output interface in the upper end, this hollow shaft output has two degrees of freedom, one is the rectilinear motion of Z direction, one is the rotation of θ angular direction, and its motion realizes by elevating screw transmission control and gear drive control with two miniature precision DC servomotors respectively; Described vacuum module be positioned at fixed frame directly over, the vacuum module comprises one group of vacuum generator, one group of vacuum steam supply valve, one group of destructive valve, one group of vacuum pressure switch, these devices and parts all are installed on the circuit board; The vacuum module is responsible for the generation of vacuum source and the absorption of chip is placed, and this circuit board has a vacuum pumping delivery outlet; This mounts the bolt of module by the main frame back side two row's countersunk head screwed holes and is fastened on the main frame, and sub-frame strides across the middle part that mounts module, further fixedly mounts module; This vacuum module is installed in the upper end of main frame by the circuit board bolt; This mounts in module and the vacuum module, the miniature corresponding vacuum generator of assembly, a vacuum steam supply valve, an air admission valve and the vacuum pressure switch of mounting; Vacuum takeoff on the circuit board with mount that the vacuum access port passes through soft pipe connection on the assembly; Miniaturely mount the quantity of assembly and the quantity of vacuum device can independently define according to user's request; This fixed frame, mounting module and the vacuum module has constituted micro modular pasting header for high speed fully automatic chip machine, is core with the fixed frame, mounts module and the vacuum module is installed on the fixed frame; Each has only one to mount the assembly action constantly during work; Respectively mounting assembly moves successively; Mount in the assembly two miniature precision DC servomotors and implement accurate Z direction Position Control and the control of θ angle corner; The generation that vacuum system cooperates the hollow shaft action to control vacuum source reaches relevant pressure with destruction and regulates, and realizes absorption and the placement of hollow shaft to chip.
CNB2006100895765A 2006-07-04 2006-07-04 Micro modular pasting header for high speed fully automatic chip machine Expired - Fee Related CN100446652C (en)

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Application Number Priority Date Filing Date Title
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102264217A (en) * 2010-05-19 2011-11-30 先进装配系统有限责任两合公司 Mounting head of chip mounter, chip mounter and mounting process
CN105323976A (en) * 2014-07-30 2016-02-10 上海儒竞电子科技有限公司 Pneumatic system device
CN106304676A (en) * 2015-05-14 2017-01-04 广东木几智能装备有限公司 Light-type placement head in high precision
CN106304674A (en) * 2015-05-14 2017-01-04 广东木几智能装备有限公司 High-speed paster head
CN107333400A (en) * 2016-04-29 2017-11-07 深圳市炫硕智造技术有限公司 Depressed suction nozzle adsorption mechanism
CN110248532A (en) * 2019-06-25 2019-09-17 东莞市德速达精密设备有限公司 Double lightweight plug head
CN111788035A (en) * 2018-02-26 2020-10-16 环球仪器公司 Dispensing head, nozzle and method
CN112261865A (en) * 2020-10-13 2021-01-22 常州铭赛机器人科技股份有限公司 Surface mounting equipment and surface mounting method
US11375651B2 (en) 2018-02-26 2022-06-28 Universal Instruments Corporation Dispensing head, nozzle and method

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JP4183888B2 (en) * 2000-06-21 2008-11-19 松下電器産業株式会社 Electronic component mounting equipment
KR101065907B1 (en) * 2002-12-02 2011-09-19 파나소닉 주식회사 Component-supplying head device, component-supplying device, component-mounting device, and method of moving mounting head portion
JP2005228992A (en) * 2004-02-13 2005-08-25 Hitachi High-Tech Instruments Co Ltd Electronic component mounting apparatus

Cited By (19)

* Cited by examiner, † Cited by third party
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DE102010021069B4 (en) * 2010-05-19 2015-10-29 Asm Assembly Systems Gmbh & Co. Kg Placement head for a placement machine, placement machine and placement method
EP2389059B1 (en) * 2010-05-19 2016-06-22 ASM Assembly Systems GmbH & Co. KG Mounting head for a mounting machine, mounting machine and mounting method
CN102264217A (en) * 2010-05-19 2011-11-30 先进装配系统有限责任两合公司 Mounting head of chip mounter, chip mounter and mounting process
CN105323976B (en) * 2014-07-30 2018-02-16 上海儒竞电子科技有限公司 A kind of pneumatic system device
CN105323976A (en) * 2014-07-30 2016-02-10 上海儒竞电子科技有限公司 Pneumatic system device
CN106304674B (en) * 2015-05-14 2019-01-25 广东木几智能装备有限公司 High-speed paster head
CN106304674A (en) * 2015-05-14 2017-01-04 广东木几智能装备有限公司 High-speed paster head
CN106304676A (en) * 2015-05-14 2017-01-04 广东木几智能装备有限公司 Light-type placement head in high precision
CN107333400A (en) * 2016-04-29 2017-11-07 深圳市炫硕智造技术有限公司 Depressed suction nozzle adsorption mechanism
US11464146B2 (en) 2018-02-26 2022-10-04 Universal Instruments Corporation Dispensing head, nozzle and method
CN111788035A (en) * 2018-02-26 2020-10-16 环球仪器公司 Dispensing head, nozzle and method
CN112171263A (en) * 2018-02-26 2021-01-05 环球仪器公司 Spindle module, library and method
US11464147B2 (en) 2018-02-26 2022-10-04 Universal Instruments Corporation Spindle module, pick-and-place machine and method of assembly
US11375651B2 (en) 2018-02-26 2022-06-28 Universal Instruments Corporation Dispensing head, nozzle and method
US11382248B2 (en) 2018-02-26 2022-07-05 Universal Instruments Corporation Dispensing head
US11412646B2 (en) 2018-02-26 2022-08-09 Universal Instruments Corporation Spindle bank, pick-and-place machine and method of assembly
US11457549B2 (en) 2018-02-26 2022-09-27 Universal Instruments Corporation Spindle module, bank, and method
CN110248532A (en) * 2019-06-25 2019-09-17 东莞市德速达精密设备有限公司 Double lightweight plug head
CN112261865A (en) * 2020-10-13 2021-01-22 常州铭赛机器人科技股份有限公司 Surface mounting equipment and surface mounting method

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