CN101099188B - Tft基板及其制造方法、以及具备a1配线的透明导电膜层叠基板及其制造方法、以及具备a1配线的透明导电膜层叠电路基板及其制造方法、以及氧化物透明导电膜材料 - Google Patents
Tft基板及其制造方法、以及具备a1配线的透明导电膜层叠基板及其制造方法、以及具备a1配线的透明导电膜层叠电路基板及其制造方法、以及氧化物透明导电膜材料 Download PDFInfo
- Publication number
- CN101099188B CN101099188B CN2005800463271A CN200580046327A CN101099188B CN 101099188 B CN101099188 B CN 101099188B CN 2005800463271 A CN2005800463271 A CN 2005800463271A CN 200580046327 A CN200580046327 A CN 200580046327A CN 101099188 B CN101099188 B CN 101099188B
- Authority
- CN
- China
- Prior art keywords
- nesa coating
- film
- addition
- oxide
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 247
- 238000000034 method Methods 0.000 title claims abstract description 148
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 95
- 239000000463 material Substances 0.000 title claims description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 140
- 239000002184 metal Substances 0.000 claims abstract description 140
- 239000000203 mixture Substances 0.000 claims abstract description 81
- 238000000576 coating method Methods 0.000 claims description 402
- 239000011248 coating agent Substances 0.000 claims description 398
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 348
- 239000011701 zinc Substances 0.000 claims description 244
- 238000005530 etching Methods 0.000 claims description 217
- 238000009826 distribution Methods 0.000 claims description 173
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 154
- 239000007864 aqueous solution Substances 0.000 claims description 145
- 235000006408 oxalic acid Nutrition 0.000 claims description 116
- 239000000243 solution Substances 0.000 claims description 93
- 229910001887 tin oxide Inorganic materials 0.000 claims description 93
- 229910052725 zinc Inorganic materials 0.000 claims description 82
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 79
- 229910000838 Al alloy Inorganic materials 0.000 claims description 54
- 229910052718 tin Inorganic materials 0.000 claims description 51
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 45
- 238000000059 patterning Methods 0.000 claims description 39
- 229910052779 Neodymium Inorganic materials 0.000 claims description 26
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 23
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 23
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- 229910052726 zirconium Inorganic materials 0.000 claims description 18
- 229910052750 molybdenum Inorganic materials 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 229910052758 niobium Inorganic materials 0.000 claims description 15
- 229910052721 tungsten Inorganic materials 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 abstract description 14
- 239000000956 alloy Substances 0.000 abstract description 14
- 230000004888 barrier function Effects 0.000 abstract description 14
- 239000004020 conductor Substances 0.000 abstract description 11
- LIFHVOVNSMHTKB-UHFFFAOYSA-N [O-2].[Zn+2].[Sn+2]=O.[O-2].[In+3] Chemical compound [O-2].[Zn+2].[Sn+2]=O.[O-2].[In+3] LIFHVOVNSMHTKB-UHFFFAOYSA-N 0.000 abstract 1
- 239000010408 film Substances 0.000 description 383
- 230000000052 comparative effect Effects 0.000 description 123
- 239000011521 glass Substances 0.000 description 82
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 76
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 75
- 238000006243 chemical reaction Methods 0.000 description 65
- 239000004973 liquid crystal related substance Substances 0.000 description 64
- 230000036647 reaction Effects 0.000 description 64
- 238000005477 sputtering target Methods 0.000 description 62
- 239000007789 gas Substances 0.000 description 60
- 229910052581 Si3N4 Inorganic materials 0.000 description 44
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 44
- 230000005540 biological transmission Effects 0.000 description 35
- 229910044991 metal oxide Inorganic materials 0.000 description 34
- 230000008859 change Effects 0.000 description 31
- 150000004706 metal oxides Chemical class 0.000 description 30
- 230000008569 process Effects 0.000 description 29
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 28
- 230000033228 biological regulation Effects 0.000 description 28
- 238000005245 sintering Methods 0.000 description 28
- 239000002245 particle Substances 0.000 description 25
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 24
- 230000008676 import Effects 0.000 description 24
- 238000004544 sputter deposition Methods 0.000 description 24
- 239000010410 layer Substances 0.000 description 21
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 20
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 18
- 230000007613 environmental effect Effects 0.000 description 18
- 150000002739 metals Chemical class 0.000 description 18
- 239000000843 powder Substances 0.000 description 18
- 239000010409 thin film Substances 0.000 description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 17
- 239000001301 oxygen Substances 0.000 description 17
- 229910052760 oxygen Inorganic materials 0.000 description 17
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 16
- 208000019901 Anxiety disease Diseases 0.000 description 16
- 230000036506 anxiety Effects 0.000 description 16
- 229910003437 indium oxide Inorganic materials 0.000 description 16
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 16
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 15
- 238000005259 measurement Methods 0.000 description 15
- 230000007797 corrosion Effects 0.000 description 14
- 238000005260 corrosion Methods 0.000 description 14
- 238000006073 displacement reaction Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 239000006104 solid solution Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 230000035508 accumulation Effects 0.000 description 13
- 238000009825 accumulation Methods 0.000 description 13
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 12
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 12
- 239000002585 base Substances 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 12
- 229910052738 indium Inorganic materials 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 10
- 238000000151 deposition Methods 0.000 description 10
- 238000011161 development Methods 0.000 description 10
- 238000005469 granulation Methods 0.000 description 10
- 230000003179 granulation Effects 0.000 description 10
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 9
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 8
- 238000002425 crystallisation Methods 0.000 description 8
- 230000008025 crystallization Effects 0.000 description 8
- 238000010348 incorporation Methods 0.000 description 8
- 239000004615 ingredient Substances 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 8
- 239000011268 mixed slurry Substances 0.000 description 8
- 238000005498 polishing Methods 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 8
- 239000011787 zinc oxide Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910006404 SnO 2 Inorganic materials 0.000 description 6
- 229910007717 ZnSnO Inorganic materials 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000004453 electron probe microanalysis Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000395 magnesium oxide Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 5
- 229910003310 Ni-Al Inorganic materials 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 229910001385 heavy metal Inorganic materials 0.000 description 5
- 229910052747 lanthanoid Inorganic materials 0.000 description 5
- 150000002602 lanthanoids Chemical class 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 5
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 4
- 229910005793 GeO 2 Inorganic materials 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- LXFUCSMCVAEMCD-UHFFFAOYSA-N acetic acid;nitric acid;phosphoric acid Chemical compound CC(O)=O.O[N+]([O-])=O.OP(O)(O)=O LXFUCSMCVAEMCD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 238000001802 infusion Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 238000000053 physical method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- KSOWEPLNZXOTOM-UHFFFAOYSA-N indium;oxalic acid Chemical compound [In].OC(=O)C(O)=O KSOWEPLNZXOTOM-UHFFFAOYSA-N 0.000 description 3
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- NGCDGPPKVSZGRR-UHFFFAOYSA-J 1,4,6,9-tetraoxa-5-stannaspiro[4.4]nonane-2,3,7,8-tetrone Chemical compound [Sn+4].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O NGCDGPPKVSZGRR-UHFFFAOYSA-J 0.000 description 2
- 241000294743 Gamochaeta Species 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910005728 SnZn Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 210000000981 epithelium Anatomy 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000003891 oxalate salts Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000010129 solution processing Methods 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-N iron;hydrochloride Chemical compound Cl.[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Landscapes
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Liquid Crystal (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP005499/2005 | 2005-01-12 | ||
JP005569/2005 | 2005-01-12 | ||
JP005637/2005 | 2005-01-12 | ||
JP2005005499A JP2006195077A (ja) | 2005-01-12 | 2005-01-12 | Al配線を備えた透明導電膜積層基板及びその製造方法。 |
JP2005005569A JP2006196616A (ja) | 2005-01-12 | 2005-01-12 | 酸化物透明導電膜材料及びAl配線を備えた透明導電膜積層回路基板及びその製造方法。 |
JP2005005637A JP4700352B2 (ja) | 2005-01-12 | 2005-01-12 | Tft基板及びその製造方法 |
JP017748/2005 | 2005-01-26 | ||
JP2005017748A JP2006210033A (ja) | 2005-01-26 | 2005-01-26 | Al配線を備えた透明導電膜積層回路基板及びその製造方法。 |
PCT/JP2005/023344 WO2006075483A1 (ja) | 2005-01-12 | 2005-12-20 | TFT基板及びその製造方法、及び、Al配線を備えた透明導電膜積層基板及びその製造方法、及び、Al配線を備えた透明導電膜積層回路基板及びその製造方法、及び、酸化物透明導電膜材料 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101715893A Division CN101880859B (zh) | 2005-01-12 | 2005-12-20 | 溅射标靶 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101099188A CN101099188A (zh) | 2008-01-02 |
CN101099188B true CN101099188B (zh) | 2011-09-28 |
Family
ID=36801216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800463271A Expired - Fee Related CN101099188B (zh) | 2005-01-12 | 2005-12-20 | Tft基板及其制造方法、以及具备a1配线的透明导电膜层叠基板及其制造方法、以及具备a1配线的透明导电膜层叠电路基板及其制造方法、以及氧化物透明导电膜材料 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2006195077A (ja) |
CN (1) | CN101099188B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101625977B (zh) * | 2008-07-11 | 2011-08-31 | 台湾薄膜电晶体液晶显示器产业协会 | 薄膜晶体管的制造方法 |
KR102047354B1 (ko) | 2010-02-26 | 2019-11-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
TW201341563A (zh) * | 2012-07-10 | 2013-10-16 | Solar Applied Mat Tech Corp | 濺鍍靶材及氧化金屬薄膜 |
KR102123529B1 (ko) | 2013-03-28 | 2020-06-17 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
JP6419610B2 (ja) * | 2015-03-12 | 2018-11-07 | リンテック株式会社 | 透明導電膜積層用フィルム、その製造方法および透明導電性フィルム |
JP6487123B2 (ja) * | 2017-01-31 | 2019-03-20 | 堺ディスプレイプロダクト株式会社 | 有機el表示装置およびその製造方法 |
CN109546006B (zh) * | 2018-12-17 | 2020-09-08 | 武汉华星光电半导体显示技术有限公司 | 柔性oled显示面板及其制作方法 |
JP7412926B2 (ja) * | 2019-08-30 | 2024-01-15 | 芝浦メカトロニクス株式会社 | 成膜装置、成膜ワーク製造方法 |
JP2021137993A (ja) * | 2020-03-03 | 2021-09-16 | デクセリアルズ株式会社 | 導電性積層体及びこれを用いた光学装置、導電性積層体の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6280861B1 (en) * | 1996-05-29 | 2001-08-28 | Idemitsu Kosan Co., Ltd. | Organic EL device |
CN1508615A (zh) * | 2002-12-19 | 2004-06-30 | 株式会社神户制钢所 | 电子器件及其制造方法、溅射靶 |
-
2005
- 2005-01-12 JP JP2005005499A patent/JP2006195077A/ja not_active Withdrawn
- 2005-12-20 CN CN2005800463271A patent/CN101099188B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6280861B1 (en) * | 1996-05-29 | 2001-08-28 | Idemitsu Kosan Co., Ltd. | Organic EL device |
CN1508615A (zh) * | 2002-12-19 | 2004-06-30 | 株式会社神户制钢所 | 电子器件及其制造方法、溅射靶 |
Also Published As
Publication number | Publication date |
---|---|
JP2006195077A (ja) | 2006-07-27 |
CN101099188A (zh) | 2008-01-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101099188B (zh) | Tft基板及其制造方法、以及具备a1配线的透明导电膜层叠基板及其制造方法、以及具备a1配线的透明导电膜层叠电路基板及其制造方法、以及氧化物透明导电膜材料 | |
CN101880859B (zh) | 溅射标靶 | |
CN101076869B (zh) | 透明电极及其制造方法 | |
CN1918672B (zh) | 薄膜晶体管、薄膜晶体管基板、液晶显示装置、溅射靶、透明导电膜、透明电极及它们的制造方法 | |
CN101918888B (zh) | 显示装置、其制造方法及溅射靶 | |
CN102741449B (zh) | 显示装置用Al合金膜 | |
KR20070001169A (ko) | 반투명ㆍ반사 전극 기판, 그의 제조 방법, 및 이러한반투과ㆍ반반사 전극 기판을 이용한 액정 표시 장치 | |
CN103069042A (zh) | Al合金膜、具有Al合金膜的配线结构以及Al合金膜的制造中使用的溅射靶 | |
KR20180038593A (ko) | 은 식각액 조성물 및 이를 이용한 표시 기판 | |
KR20100127290A (ko) | 표시 장치용 Al 합금막, 표시 장치 및 스퍼터링 타깃 | |
CN103403214B (zh) | 显示装置或半导体装置用Al合金膜、具备Al合金膜的显示装置或半导体装置、以及溅射靶 | |
JP2006194926A (ja) | 透明電極の製造方法 | |
CN106504987B (zh) | 用于银层的蚀刻溶液组合物、使用其制作金属图案的方法和制作显示基板的方法 | |
JP4655281B2 (ja) | 薄膜配線層 | |
TW201716632A (zh) | 銀蝕刻液組合物和使用了其的顯示基板 | |
JP4700352B2 (ja) | Tft基板及びその製造方法 | |
KR20190137193A (ko) | 박막 식각액 조성물 및 이를 이용한 금속 패턴 형성 방법 | |
JP5357515B2 (ja) | 表示装置用Al合金膜、表示装置およびスパッタリングターゲット | |
KR20070093098A (ko) | 투명 전극 및 그의 제조 방법 | |
CN105755472A (zh) | 银蚀刻液组合物和利用它的显示基板 | |
WO2007074628A1 (ja) | 透明電極膜及び電子機器 | |
JP2006210033A (ja) | Al配線を備えた透明導電膜積層回路基板及びその製造方法。 | |
JP2006196201A (ja) | 透明電極の製造方法 | |
CN111155092B (zh) | 银薄膜蚀刻液组合物、蚀刻方法及金属图案的形成方法 | |
KR20200054871A (ko) | 은 박막 식각액 조성물 및 이를 이용한 식각 방법 및 금속 패턴의 형성 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110928 Termination date: 20161220 |