CN101097977A - 一种白光led灯的制造方法及采用该方法的led灯 - Google Patents
一种白光led灯的制造方法及采用该方法的led灯 Download PDFInfo
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- CN101097977A CN101097977A CNA2007100273155A CN200710027315A CN101097977A CN 101097977 A CN101097977 A CN 101097977A CN A2007100273155 A CNA2007100273155 A CN A2007100273155A CN 200710027315 A CN200710027315 A CN 200710027315A CN 101097977 A CN101097977 A CN 101097977A
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- led lamp
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100273155A CN100508228C (zh) | 2007-03-26 | 2007-03-26 | 一种白光led灯的制造方法及采用该方法的led灯 |
PCT/CN2007/001751 WO2008116352A1 (fr) | 2007-03-26 | 2007-06-01 | Procédé de production d'une lampe del à lumière blanche et lampe del ainsi obtenue |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100273155A CN100508228C (zh) | 2007-03-26 | 2007-03-26 | 一种白光led灯的制造方法及采用该方法的led灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101097977A true CN101097977A (zh) | 2008-01-02 |
CN100508228C CN100508228C (zh) | 2009-07-01 |
Family
ID=39011601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100273155A Expired - Fee Related CN100508228C (zh) | 2007-03-26 | 2007-03-26 | 一种白光led灯的制造方法及采用该方法的led灯 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN100508228C (zh) |
WO (1) | WO2008116352A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101937963A (zh) * | 2010-08-19 | 2011-01-05 | 深圳市洲明科技股份有限公司 | Led发光单元及其封装方法 |
CN102064240A (zh) * | 2010-09-30 | 2011-05-18 | 福建省万邦光电科技有限公司 | 白光led光源模块的封装工艺 |
CN101749653B (zh) * | 2008-12-11 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 荧光粉涂布方法 |
WO2012051765A1 (zh) * | 2010-10-20 | 2012-04-26 | 福建中科万邦光电股份有限公司 | Led球泡灯 |
CN102537718A (zh) * | 2011-11-11 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | 光源与散热器一体式灯具及其制造方法 |
CN103606619A (zh) * | 2013-11-30 | 2014-02-26 | 中山达华智能科技股份有限公司 | 一种促进植物生长用近紫外发光二极管及其制备方法 |
CN104644117A (zh) * | 2015-02-17 | 2015-05-27 | 杭州爱光医疗器械有限公司 | 与一次性无菌阴道扩张器配合使用的医用冷光源及其应用 |
CN105304804A (zh) * | 2015-11-12 | 2016-02-03 | 深圳莱特光电股份有限公司 | 一种前段分光的led光源模组及其制备方法 |
CN110081323A (zh) * | 2018-05-23 | 2019-08-02 | 浙江山蒲照明电器有限公司 | Led灯丝及led球泡灯 |
CN111146324A (zh) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | 一种超高显色指数白光led器件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133595A (ja) * | 2001-10-24 | 2003-05-09 | Seiwa Electric Mfg Co Ltd | 発光ダイオードランプ、これに用いられる赤色蛍光体及びこれに用いられるフィルタ |
CN1208847C (zh) * | 2002-06-26 | 2005-06-29 | 诠兴开发科技股份有限公司 | 三波长白光发光二极管的制造方法 |
CN2713647Y (zh) * | 2004-07-27 | 2005-07-27 | 葛世潮 | 功率型白光发光二极管 |
KR100540848B1 (ko) * | 2004-01-02 | 2006-01-11 | 주식회사 메디아나전자 | 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법 |
US7598663B2 (en) * | 2005-08-04 | 2009-10-06 | Taiwan Oasis Technology Co., Ltd. | Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component |
-
2007
- 2007-03-26 CN CNB2007100273155A patent/CN100508228C/zh not_active Expired - Fee Related
- 2007-06-01 WO PCT/CN2007/001751 patent/WO2008116352A1/zh active Application Filing
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101749653B (zh) * | 2008-12-11 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 荧光粉涂布方法 |
CN101937963A (zh) * | 2010-08-19 | 2011-01-05 | 深圳市洲明科技股份有限公司 | Led发光单元及其封装方法 |
CN102064240A (zh) * | 2010-09-30 | 2011-05-18 | 福建省万邦光电科技有限公司 | 白光led光源模块的封装工艺 |
WO2012040958A1 (zh) * | 2010-09-30 | 2012-04-05 | 福建中科万邦光电股份有限公司 | 白光led光源模块的封装工艺 |
CN102064240B (zh) * | 2010-09-30 | 2016-01-27 | 福建省万邦光电科技有限公司 | 白光led光源模块的封装工艺 |
CN102454879B (zh) * | 2010-10-20 | 2015-06-24 | 福建省万邦光电科技有限公司 | Led球泡灯 |
CN102454879A (zh) * | 2010-10-20 | 2012-05-16 | 福建省万邦光电科技有限公司 | Led球泡灯 |
WO2012051765A1 (zh) * | 2010-10-20 | 2012-04-26 | 福建中科万邦光电股份有限公司 | Led球泡灯 |
CN102537718A (zh) * | 2011-11-11 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | 光源与散热器一体式灯具及其制造方法 |
CN103606619A (zh) * | 2013-11-30 | 2014-02-26 | 中山达华智能科技股份有限公司 | 一种促进植物生长用近紫外发光二极管及其制备方法 |
CN104644117A (zh) * | 2015-02-17 | 2015-05-27 | 杭州爱光医疗器械有限公司 | 与一次性无菌阴道扩张器配合使用的医用冷光源及其应用 |
CN105304804A (zh) * | 2015-11-12 | 2016-02-03 | 深圳莱特光电股份有限公司 | 一种前段分光的led光源模组及其制备方法 |
CN105304804B (zh) * | 2015-11-12 | 2018-09-14 | 深圳莱特光电股份有限公司 | 一种前段分光的led光源模组及其制备方法 |
CN110081323A (zh) * | 2018-05-23 | 2019-08-02 | 浙江山蒲照明电器有限公司 | Led灯丝及led球泡灯 |
CN111146324A (zh) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | 一种超高显色指数白光led器件 |
Also Published As
Publication number | Publication date |
---|---|
CN100508228C (zh) | 2009-07-01 |
WO2008116352A1 (fr) | 2008-10-02 |
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Effective date of registration: 20110117 Address after: High tech Zone of Guangdong city in Jiangmen province 529700 Keyuan Road No. 1 Patentee after: Guangdong Yinyu Chip Semiconductor Co., Ltd. Address before: 529728 Guangdong City, Heshan Province town of peace road, No. 301 Patentee before: Heshan Lide Electronic Industry Co., Ltd. |
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Granted publication date: 20090701 Termination date: 20160326 |