WO2012040958A1 - 白光led光源模块的封装工艺 - Google Patents

白光led光源模块的封装工艺 Download PDF

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Publication number
WO2012040958A1
WO2012040958A1 PCT/CN2010/078625 CN2010078625W WO2012040958A1 WO 2012040958 A1 WO2012040958 A1 WO 2012040958A1 CN 2010078625 W CN2010078625 W CN 2010078625W WO 2012040958 A1 WO2012040958 A1 WO 2012040958A1
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WIPO (PCT)
Prior art keywords
light source
source module
led light
base
color temperature
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Application number
PCT/CN2010/078625
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English (en)
French (fr)
Inventor
何文铭
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福建中科万邦光电股份有限公司
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Application filed by 福建中科万邦光电股份有限公司 filed Critical 福建中科万邦光电股份有限公司
Publication of WO2012040958A1 publication Critical patent/WO2012040958A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • the present invention relates to a packaging process for an LED, and more particularly to a packaging process for a white LED light source module.
  • LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various lighting devices. The potential of white LED light source in the field of lighting is even greater.
  • the manufacturing process of traditional white LED light source module such as the Chinese book with patent number 200710139584.0
  • the packaging method of a white LED surface light source module disclosed in the patent is composed of steps of manufacturing a circuit board, a solid crystal, a bonding wire, an encapsulant layer and a phosphor layer, although the process can be relatively The production cost is saved, and the heat dissipation problem of the high-power LED light source module is solved at the same time.
  • the white light LED light source module has high requirements for white light consistency
  • the above packaging method is adopted, and in the process of encapsulating the adhesive layer and the phosphor layer, the use thereof The amount of powder is pre-calculated and set, but since there is actually a difference between the individual of each LED chip, each white LED light source module manufactured according to the above method cannot guarantee that the color temperature can meet the requirements, and the qualified rate of the finished product is insufficient. High, often need to be filtered through the step of grading, eliminating products that do not meet the requirements, and therefore often cause a lot of waste. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a packaging method of a white LED light source module which can save production cost while maintaining a good yield.
  • the technical solution adopted by the invention is: a packaging process of a white LED light source module, comprising the following steps:
  • the aluminum substrate or the copper substrate is integrally molded into the base of the required LED light source module, and then the surface of the base is plated with a reflective layer, and the positive and negative circuit boards are attached to the preset position on the base. ;
  • the invention has the following advantages:
  • the above process steps can be used to adjust the color temperature of the LED light source module to meet the design requirements, and the process of performing spectroscopic screening after manufacturing the finished product is omitted. Therefore, the production cost can be saved, and each of the light source modules produced can be guaranteed to meet the range of the color temperature, which is advantageous for mass production of industrial production.
  • DETAILED DESCRIPTION A packaging process for a white LED light source module includes the following steps:
  • the aluminum substrate or the copper substrate is integrally molded into the base of the required LED light source module, and then the surface of the base is plated with a reflective layer, and the positive and negative circuit boards are attached to the preset position on the base. ;
  • Test the powder The above LED light source module is tested by the color temperature tester to see if it is within the required range. If the color temperature is low, the layer of blue phosphor is mixed until the color temperature meets the requirements. When the color temperature is high, the layer of yellow phosphor is added until the color temperature meets the requirements.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

白光 LED光源模块的封装工艺 技术领域
本发明涉及一种 LED的封装工艺， 尤其涉及一种白光 LED光源模 块的封装工艺。 背景技术 说
LED是一种低电压光源， 由于其省电、 寿命长， 现已被广泛应用于 各种照明装置， 而白光 LED光源在照明领域的应用潜力更为巨大，传统 的白光 LED光源模块的制造工艺， 如专利号为 200710139584.0的中国 书
专利中所披露的一种白光 LED面光源模块的封装方法，其工艺是由制作 线路板、 固晶、 键合引线、 封装胶层和荧光粉层等步骤组成， 尽管采用 该工艺可以在相对地节省生产成本，同时解决大功率 LED光源模块的散 热问题，但是由于白光 LED光源模块对于白光一致性的要求很高，采用 上述封装方法， 由于在封装胶层和荧光粉层的工序里， 其用粉量是预先 计算设定好的，但是由于实际上每个 LED芯片的个体间存在差异， 因此 按上述方法制造的每个白光 LED 光源模块无法保证其色温均能符合要 求， 成品的合格率不够高， 常常需要再通过分光的步骤进行筛选， 剔除 不符合要求的产品， 因此常常造成很大的浪费。 发明内容
本发明要解决的技术问题， 在于提供一种既能够节省生产成本， 又 可以保持较好的成品率的白光 LED光源模块的封装方法。
本发明采用的技术方案为： 一种白光 LED光源模块的封装工艺， 包 括以下步骤组成：
( 1 ) 制作底座： 将铝基板或者铜基板一体成型沖压成所需要的 LED光源模块的底座， 再将底座的表面电镀上反光层， 并在 底座上预设的位置上贴正负极线路板；
( 2 ) 固晶： 采用绝缘胶将 LED芯片粘结在底座上预置好的反光杯 内， 经烘烤后芯片被固定在底座上； ( 3 ) 焊线： 将 LED芯片之间按设计要求串联或者并联后， 引出到 底座上的正负极线路板上；
( 4 ) 封装胶水和荧光粉混合层： 在反光杯内灌注预先调配好的胶 水和荧光粉混合层， 经烘烤待其固化后得到 LED光源模块； ( 5 )测试补粉： 将上述 LED光源模块通过色温测试仪进行测试其 是否在符合要求的范围内， 若色温偏低时， 加混有蓝色荧光粉的胶层， 直至色温符合要求， 若色温偏高时， 加混有黄色荧光粉的胶层， 直至色 温符合要求。
与现有技术相比， 本发明具有如下优点： 采用上述工艺步骤， 可以 在 LED光源模块的生产过程中，调整其色温使其满足设计要求，省去在 制造出成品后进行分光筛选的工序， 因此可以节省生产成本， 并且可以 保证每生产出来的每一个光源模块均符合色温的范围要求， 有利于大批 量的工业化生产。 具体实施方式 一种白光 LED光源模块的封装工艺， 包括以下步骤组成：
( 1 ) 制作底座： 将铝基板或者铜基板一体成型沖压成所需要的 LED光源模块的底座， 再将底座的表面电镀上反光层， 并在 底座上预设的位置上贴正负极线路板；
( 2 ) 固晶： 采用绝缘胶将 LED芯片粘结在底座上预置好的反光杯 内， 经烘烤后芯片被固定在底座上；
( 3 ) 焊线： 将 LED芯片之间按设计要求串联或者并联后， 引出到 底座上的正负极线路板上；
( 4 ) 封装胶水和荧光粉混合层： 在反光杯内灌注预先调配好的胶 水和荧光粉混合层， 经烘烤待其固化后得到 LED光源模块；
( 5 )测试补粉： 将上述 LED光源模块通过色温测试仪进行测试其 是否在符合要求的范围内， 若色温偏低时， 加混有蓝色荧光粉的胶层， 直至色温符合要求， 若色温偏高时， 加混有黄色荧光粉的胶层， 直至色 温符合要求。

Claims

权 利 要 求 书
1、 一种白光 LED光源模块的封装工艺， 其特征在于： 包括以下步 骤组成：
(1) 制作底座： 将铝基板或者铜基板一体成型沖压成所需要的
LED光源模块的底座， 再将底座的表面电镀上反光层， 并在 底座上预设的位置上贴正负极线路板；
(2) 固晶： 采用绝缘胶将 LED芯片粘结在底座上预置好的反光杯 内， 经烘烤后芯片被固定在底座上；
(3) 焊线： 将 LED芯片之间按设计要求串联或者并联后， 引出到 底座上的正负极线路板上；
(4) 封装胶水和荧光粉混合层： 在反光杯内灌注预先调配好的胶 水和荧光粉混合层， 经烘烤待其固化后得到 LED光源模块；
(5)测试补粉： 将上述 LED光源模块通过色温测试仪进行测试其 是否在符合要求的范围内， 若色温偏低时， 加混有蓝色荧光粉的胶层， 直至色温符合要求， 若色温偏高时， 加混有黄色荧光粉的胶层， 直至色 温符合要求。
PCT/CN2010/078625 2010-09-30 2010-11-11 白光led光源模块的封装工艺 WO2012040958A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN102306690B (zh) * 2011-08-11 2013-05-01 郑州索兰电子科技有限公司 白光led色温检测修复机及其检测修复方法
CN104659183B (zh) * 2013-11-21 2017-10-20 莆田康布斯光电科技有限公司 一种led发光模组的结构及其制造工艺

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CN101300687A (zh) * 2005-10-28 2008-11-05 飞利浦拉米尔德斯照明设备有限责任公司 在led上层压包含磷光体的密封剂膜
CN101097977A (zh) * 2007-03-26 2008-01-02 鹤山丽得电子实业有限公司 一种白光led灯的制造方法及采用该方法的led灯
US20090231832A1 (en) * 2008-03-15 2009-09-17 Arturas Zukauskas Solid-state lamps with complete conversion in phosphors for rendering an enhanced number of colors
CN101404317A (zh) * 2008-11-12 2009-04-08 鹤山丽得电子实业有限公司 一种大功率白光led封装方法
CN101452985A (zh) * 2008-12-31 2009-06-10 广东昭信光电科技有限公司 一种白光发光二极管器件的封装结构和方法
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