CN101749653B - 荧光粉涂布方法 - Google Patents
荧光粉涂布方法 Download PDFInfo
- Publication number
- CN101749653B CN101749653B CN2008103061641A CN200810306164A CN101749653B CN 101749653 B CN101749653 B CN 101749653B CN 2008103061641 A CN2008103061641 A CN 2008103061641A CN 200810306164 A CN200810306164 A CN 200810306164A CN 101749653 B CN101749653 B CN 101749653B
- Authority
- CN
- China
- Prior art keywords
- film
- fluorescent
- coating method
- light source
- powder coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 32
- 239000000843 powder Substances 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 26
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical group OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000001458 anti-acid effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- CMXPERZAMAQXSF-UHFFFAOYSA-M sodium;1,4-bis(2-ethylhexoxy)-1,4-dioxobutane-2-sulfonate;1,8-dihydroxyanthracene-9,10-dione Chemical compound [Na+].O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=CC=C2O.CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC CMXPERZAMAQXSF-UHFFFAOYSA-M 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
- B05D1/20—Processes for applying liquids or other fluent materials performed by dipping substances to be applied floating on a fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (11)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103061641A CN101749653B (zh) | 2008-12-11 | 2008-12-11 | 荧光粉涂布方法 |
US12/504,800 US20100151122A1 (en) | 2008-12-11 | 2009-07-17 | Method for forming phosphor coating |
KR1020090116888A KR20100067609A (ko) | 2008-12-11 | 2009-11-30 | 형광체 도포방법 |
JP2009274728A JP2010141317A (ja) | 2008-12-11 | 2009-12-02 | 蛍光体の塗布方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103061641A CN101749653B (zh) | 2008-12-11 | 2008-12-11 | 荧光粉涂布方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101749653A CN101749653A (zh) | 2010-06-23 |
CN101749653B true CN101749653B (zh) | 2012-03-14 |
Family
ID=42240865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008103061641A Expired - Fee Related CN101749653B (zh) | 2008-12-11 | 2008-12-11 | 荧光粉涂布方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100151122A1 (zh) |
JP (1) | JP2010141317A (zh) |
KR (1) | KR20100067609A (zh) |
CN (1) | CN101749653B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2694923C2 (ru) | 2015-01-06 | 2019-07-18 | Филипс Лайтинг Холдинг Б.В. | Перенос электронных устройств путем погружения в жидкость |
CN108269899B (zh) * | 2016-12-30 | 2020-06-05 | 光宝光电(常州)有限公司 | 发光二极管封装结构及其制造方法 |
TWI766234B (zh) * | 2020-02-10 | 2022-06-01 | 台灣愛司帝科技股份有限公司 | 發光二極體晶片封裝結構及其製作方法 |
TWI710129B (zh) | 2020-02-10 | 2020-11-11 | 台灣愛司帝科技股份有限公司 | 發光二極體晶片封裝結構及其製作方法 |
TWI810518B (zh) * | 2021-01-29 | 2023-08-01 | 歆熾電氣技術股份有限公司 | 膜層塗覆方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1900186A (zh) * | 2006-07-27 | 2007-01-24 | 王晖 | 水溶性荧光粉涂覆胶及应用 |
CN1988188A (zh) * | 2005-12-23 | 2007-06-27 | 香港应用科技研究院有限公司 | 具有荧光层结构的发光二极管晶粒及其制造方法 |
CN101097977A (zh) * | 2007-03-26 | 2008-01-02 | 鹤山丽得电子实业有限公司 | 一种白光led灯的制造方法及采用该方法的led灯 |
CN101308884A (zh) * | 2007-05-14 | 2008-11-19 | 江苏日月照明电器有限公司 | 大功率白光led制作工艺 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000329899A (ja) * | 1999-05-21 | 2000-11-30 | Fuji Photo Film Co Ltd | 放射線像変換パネルの蛍光体層塗布液の調製方法、および放射線像変換パネルの製造方法 |
-
2008
- 2008-12-11 CN CN2008103061641A patent/CN101749653B/zh not_active Expired - Fee Related
-
2009
- 2009-07-17 US US12/504,800 patent/US20100151122A1/en not_active Abandoned
- 2009-11-30 KR KR1020090116888A patent/KR20100067609A/ko not_active Application Discontinuation
- 2009-12-02 JP JP2009274728A patent/JP2010141317A/ja not_active Ceased
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1988188A (zh) * | 2005-12-23 | 2007-06-27 | 香港应用科技研究院有限公司 | 具有荧光层结构的发光二极管晶粒及其制造方法 |
CN1900186A (zh) * | 2006-07-27 | 2007-01-24 | 王晖 | 水溶性荧光粉涂覆胶及应用 |
CN101097977A (zh) * | 2007-03-26 | 2008-01-02 | 鹤山丽得电子实业有限公司 | 一种白光led灯的制造方法及采用该方法的led灯 |
CN101308884A (zh) * | 2007-05-14 | 2008-11-19 | 江苏日月照明电器有限公司 | 大功率白光led制作工艺 |
Also Published As
Publication number | Publication date |
---|---|
JP2010141317A (ja) | 2010-06-24 |
CN101749653A (zh) | 2010-06-23 |
US20100151122A1 (en) | 2010-06-17 |
KR20100067609A (ko) | 2010-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101749653B (zh) | 荧光粉涂布方法 | |
CN1093928C (zh) | 光照明棒 | |
US8697458B2 (en) | Silicone coated light-emitting diode | |
KR102228997B1 (ko) | Led 응용들을 위한 무기 바인더 내의 형광체 | |
JP6732045B2 (ja) | 波長変換フィルムおよびバックライトユニット | |
KR20150079588A (ko) | 형광체 함유 수지 시트 및 발광 장치 | |
TW201712902A (zh) | 發光裝置的製造方法以及顯示裝置的製造方法 | |
CN102368496A (zh) | 一种光转换模块 | |
CN103872225A (zh) | 一种带微镜结构的led照明用发光薄膜及其制备方法 | |
TW201518088A (zh) | 積層體及使用其的發光裝置的製造方法 | |
US20100270574A1 (en) | Silicone coated light-emitting diode | |
CN100392879C (zh) | 发光装置及其制造方法和制造系统 | |
TW201435261A (zh) | 用於發光二極體燈之保護塗層 | |
CN104509526A (zh) | 一种高光效的led驱蚊灯 | |
CN102621607A (zh) | 一种微纳米膜、其制备方法及使用该微纳米膜的器件 | |
CN102869502A (zh) | 可剥离型光转换发光膜 | |
CN201284941Y (zh) | 具色温调整结构的光源 | |
CN1325607A (zh) | 场致发光器件与其制造方法 | |
CN100414701C (zh) | 发光系统、发光装置及其形成方法 | |
CN115666321A (zh) | 一种指甲贴、用于指甲贴的组合物及其制备方法 | |
TW201025664A (en) | A method for coating phosphor | |
KR101781905B1 (ko) | 난접착 실리콘 기재에 부착이 가능한 실리콘-아크릴레이트 반경화시트와 균일 광변환 시트 및 이의 제조방법 | |
CN114624800B (zh) | 量子点光学板及其制备方法、发光装置 | |
KR20140046970A (ko) | 입상물의 표면 코팅방법 | |
CN101270864A (zh) | 发光装置的制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20131211 |