CN101086481B - 自动光学检查系统的示教方法及利用它的检查方法 - Google Patents

自动光学检查系统的示教方法及利用它的检查方法 Download PDF

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Publication number
CN101086481B
CN101086481B CN2007101099457A CN200710109945A CN101086481B CN 101086481 B CN101086481 B CN 101086481B CN 2007101099457 A CN2007101099457 A CN 2007101099457A CN 200710109945 A CN200710109945 A CN 200710109945A CN 101086481 B CN101086481 B CN 101086481B
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China
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mentioned
inspection
detail
zone
automatic visual
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CN101086481A (zh
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崔铉镐
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AJU HIGH TECH CORP
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AJU HIGH TECH CORP
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
CN2007101099457A 2006-06-09 2007-06-06 自动光学检查系统的示教方法及利用它的检查方法 Expired - Fee Related CN101086481B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2006-0051850 2006-06-09
KR1020060051850 2006-06-09
KR1020060051850A KR100772607B1 (ko) 2006-06-09 2006-06-09 자동 광학 검사 시스템의 티칭 방법 및 이를 이용하는 검사방법

Publications (2)

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CN101086481A CN101086481A (zh) 2007-12-12
CN101086481B true CN101086481B (zh) 2012-04-18

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CN2007101099457A Expired - Fee Related CN101086481B (zh) 2006-06-09 2007-06-06 自动光学检查系统的示教方法及利用它的检查方法

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JP (1) JP2007327957A (ja)
KR (1) KR100772607B1 (ja)
CN (1) CN101086481B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100940301B1 (ko) 2008-03-26 2010-02-05 호서대학교 산학협력단 마크 분할 검사 방법
KR101132792B1 (ko) * 2010-03-16 2012-04-02 주식회사 고영테크놀러지 기판 검사방법
DE102010029319B4 (de) 2009-05-27 2015-07-02 Koh Young Technology Inc. Vorrichtung zur Messung einer dreidimensionalen Form und Verfahren dazu
JP5661833B2 (ja) 2013-02-28 2015-01-28 ファナック株式会社 線状パターンを含む対象物の外観検査装置及び外観検査方法
KR101464174B1 (ko) 2013-03-25 2014-11-21 주식회사 미르기술 자동광학검사기의 티칭데이터 자동 생성 방법
KR101559941B1 (ko) 2015-05-06 2015-10-14 (주) 엠브이텍 인쇄패턴 불량 검사 시스템
KR102692769B1 (ko) * 2018-10-18 2024-08-08 삼성디스플레이 주식회사 표시 패널 검사 시스템, 표시 패널 검사 방법 및 이를 이용한 표시 패널.
CN111474180A (zh) * 2019-01-24 2020-07-31 联策科技股份有限公司 检测数据串接系统与方法
TW202209159A (zh) * 2020-08-19 2022-03-01 萬潤科技股份有限公司 電路板檢查設備及其圖層編修教導方法
CN113777113A (zh) * 2021-08-02 2021-12-10 景旺电子科技(珠海)有限公司 一种灯板的光学检测方法及灯板制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715890A (zh) * 2004-06-30 2006-01-04 Aju高技术公司 发光设备、自动光学检测系统以及检测pcb图案的方法
CN1732474A (zh) * 2002-12-24 2006-02-08 奥博泰克有限公司 自动光学检查系统和方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100286041B1 (ko) * 1998-06-30 2001-04-16 윤종용 Pcb자동검사장치의티칭데이타설정방법및장치
KR20000056739A (ko) * 1999-02-25 2000-09-15 윤종용 Ｐｃｂ검사장치와 ｐｃｂ 검사장치의 티칭방법 및 라이브러리 수정방법
KR100573698B1 (ko) * 1999-02-26 2006-04-26 삼성전자주식회사 부품장착 및 납땜검사 자동티칭장치 및 그 방법
JP2003209400A (ja) 2002-01-11 2003-07-25 Mitsubishi Electric Engineering Co Ltd 回路基板検査装置及び回路基板検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1732474A (zh) * 2002-12-24 2006-02-08 奥博泰克有限公司 自动光学检查系统和方法
CN1715890A (zh) * 2004-06-30 2006-01-04 Aju高技术公司 发光设备、自动光学检测系统以及检测pcb图案的方法
JP2006017726A (ja) * 2004-06-30 2006-01-19 Ajuhitek Inc 印刷回路基板の微細パターンを検査するための照明装置と、これを具備する自動光学検査システムおよびそれの検査方法

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Publication number Publication date
KR100772607B1 (ko) 2007-11-02
CN101086481A (zh) 2007-12-12
JP2007327957A (ja) 2007-12-20

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